CN204538011U - High reliability fingerprint lock device - Google Patents
High reliability fingerprint lock device Download PDFInfo
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- CN204538011U CN204538011U CN201520119795.8U CN201520119795U CN204538011U CN 204538011 U CN204538011 U CN 204538011U CN 201520119795 U CN201520119795 U CN 201520119795U CN 204538011 U CN204538011 U CN 204538011U
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- blind hole
- fingerprint recognition
- recognition chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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Abstract
The utility model discloses a kind of high reliability Fingerprint Lock device, comprise fingerprint recognition chip, ceramic cover plate, pcb board and data processing chip, be provided with high dielectric constant layer between the induction zone of described fingerprint recognition chip and ceramic cover plate, described pcb board and data processing chip are all electrically connected fingerprint recognition chip; Fingerprint recognition chip lower surface also has the first tapered blind hole, the second tapered blind hole successively with blind hole opposite region ecto-entad, second tapered blind hole is positioned at the bottom of the first tapered blind hole, the cross section of described first tapered blind hole, the second tapered blind hole is taper, the opening of the second tapered blind hole is less than the opening of the first tapered blind hole, it is the aluminum pad of fingerprint recognition chip bottom this second tapered blind hole, triconic blind hole runs through described aluminum pad, and extends to the middle part of pad thickened section.The utility model forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole Technology Integration, decrease thickness, product gross thickness is reduced greatly, and the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, has increased substantially product reliability.
Description
Technical field
The utility model relates to a kind of high reliability Fingerprint Lock device, belongs to technical field of semiconductor encapsulation.
Background technology
In the advanced package technologies of fingerprint chip, after the iPhone5S and the issue of supporting Touch ID fingerprint identification technology thereof of American apple company, after it discloses the issue of a kind of brand-new fingerprint identification technology, it discloses a kind of brand-new fingerprint recognition chip, which employs and first use Wafer level packaging to carry out grooving at the side of every chips, and weld pad of reforming, later stage uses known low camber (low loop height) wire soldering technology to complete module packaging, to reduce module height, it is the bridge technology being mixed with wafer-level packaging and conventional package.The Touch ID encapsulating structure that Apple's patent text is announced, bonding wire mode is adopted to realize, just carry out grooving on the chip surface, to reduce module height after bonding wire, therefore, in the encapsulation technology of advanced fingerprint chip, real the fingerprint recognition chip package form and the patent that adopt wafer scale TSV encapsulation technology is not also seen in the market.
How by the Wafer level packaging of existing image sensor dice, again for the concrete specification requirement of fingerprint recognition chip package, develop brand-new complete packaging technology, the new technique direction for fingerprint recognition chip package application extension, become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The utility model object is to provide a kind of high reliability Fingerprint Lock device, this high reliability Fingerprint Lock device forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, be conducive to meeting industrial design moulding and realize enough product strengths, finally having increased substantially product reliability.
For achieving the above object, the technical solution adopted in the utility model is: a kind of high reliability Fingerprint Lock device, comprise fingerprint recognition chip, ceramic cover plate, pcb board and data processing chip, be provided with high dielectric constant layer between the induction zone of described fingerprint recognition chip and ceramic cover plate, described pcb board and data processing chip are all electrically connected fingerprint recognition chip;
This fingerprint recognition chip upper surface is distributed with several blind holes, in the blind hole of described fingerprint recognition chip, there is aluminum pad, this aluminum pad extends in the middle part of blind hole from blind via bottom, in blind hole, aluminium welding pad surface is filled with nickel metal layer, this nickel metal layer extends to fingerprint recognition chip upper surface and forms projection in the middle part of blind hole, forms pad thickened section;
Described fingerprint recognition chip lower surface also has the first tapered blind hole, the second tapered blind hole successively with blind hole opposite region ecto-entad, second tapered blind hole is positioned at the bottom of the first tapered blind hole, the cross section of described first tapered blind hole, the second tapered blind hole is taper, the opening of the second tapered blind hole is less than the opening of the first tapered blind hole, is the aluminum pad of fingerprint recognition chip bottom this second tapered blind hole;
Described fingerprint recognition chip lower surface, first tapered blind hole, second tapered blind hole surface has insulating barrier, several triconic blind holes are offered bottom described second tapered blind hole, be positioned at fingerprint recognition chip, first tapered blind hole, above second tapered blind hole and triconic blind hole, there is titanium conductive pattern layer successively, copper metallic conductive pattern layer, this titanium conductive pattern layer, copper metallic conductive pattern layer is positioned at insulating barrier and the opposing surface of fingerprint recognition chip, one welding resisting layer is positioned at copper metallic conductive pattern layer and the opposing surface of titanium conductive pattern layer, this welding resisting layer has several through holes, one soldered ball is electrically connected with copper metallic conductive pattern layer by described through hole,
Described pcb board and data processing chip are all electrically connected the soldered ball of fingerprint recognition chip, and described triconic blind hole runs through described aluminum pad, and extend to the middle part of pad thickened section.
In technique scheme, further improved plan is as follows:
1., in such scheme, the upper surface that described lug boss contacts with transparent cover plate circumferentially offers v-depression.
2., in such scheme, described guard metal layer is nickel-gold layer or nickel palladium layers.
3., in such scheme, the thickness of described fingerprint recognition chip is 150 ~ 300 microns.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
1. the utility model high reliability Fingerprint Lock device, it forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole technology Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, is conducive to meeting industrial design moulding and realizes enough product strengths, finally having increased substantially product reliability.
2. the utility model high reliability Fingerprint Lock device, its fingerprint recognition chip, ceramic cover plate, pcb board and data processing chip, high dielectric constant layer is provided with between the induction zone of described fingerprint recognition chip and ceramic cover plate, described pcb board and data processing chip are all electrically connected fingerprint recognition chip, data processing chip is directly mounted this kind of module group assembling structure on fingerprint chip more simple in manufacturing process, data processing chip is directly directly connected with fingerprint chip and strengthens data processing speed and electrical stability.
3. the utility model high reliability Fingerprint Lock device, its aluminum pad extends in the middle part of blind hole from blind via bottom, in blind hole, aluminium welding pad surface is filled with nickel metal layer, this nickel metal layer extends to fingerprint recognition chip upper surface and forms projection in the middle part of blind hole, form pad thickened section, triconic blind hole runs through described aluminum pad, and extend to the middle part of pad thickened section, wafer aluminium PAD is avoided to be directly exposed in air, increase interconnecting lead contact area and improve wire connective stability and reliability, adopt the advanced technology of WLCSP-TSV, overcome the deficiency that traditional fingerprint recognition chip package is thicker, achieve low-power consumption, small size and high efficiency integral fingerprint recognition.
4. the utility model high reliability Fingerprint Lock device, its fingerprint recognition chip lower surface, the first tapered blind hole, the second tapered blind hole surface have insulating barrier, several triconic blind holes are offered bottom described second tapered blind hole, be positioned at above fingerprint recognition chip, the first tapered blind hole, the second tapered blind hole and triconic blind hole and there is titanium conductive pattern layer, copper metallic conductive pattern layer successively, both the adhesion of metal level and Si substrate had been added, by the electron transfer prevented between copper and silicon.
Accompanying drawing explanation
Accompanying drawing 1 is the utility model high reliability Fingerprint Lock device partial structurtes schematic diagram one;
Accompanying drawing 2 is the utility model high reliability Fingerprint Lock device partial structurtes schematic diagram two;
Accompanying drawing 3 is A place partial structurtes enlarged diagram in accompanying drawing 2;
Accompanying drawing 4 is A place partial structurtes enlarged diagram in accompanying drawing 1;
Accompanying drawing 5 is the utility model high reliability Fingerprint Lock device architecture schematic diagram.
In above accompanying drawing: 1, fingerprint recognition chip; 2, blind hole; 3, aluminum pad; 4, nickel metal layer; 5, pad thickened section; 6, the first tapered blind hole; 7, the second tapered blind hole; 8, insulating barrier; 9, triconic blind hole; 10, titanium conductive pattern layer; 11, copper metallic conductive pattern layer; 12, welding resisting layer; 13, through hole; 14, soldered ball; 15, ceramic cover plate; 16, pcb board; 17, data processing chip; 18, high dielectric constant layer.
Embodiment
Below in conjunction with embodiment, the utility model is further described:
Embodiment 1: a kind of high reliability Fingerprint Lock device, comprise fingerprint recognition chip 1, ceramic cover plate 15, pcb board 16 and data processing chip 17, be provided with high dielectric constant layer 18 between the induction zone of described fingerprint recognition chip 1 and ceramic cover plate 2, described pcb board 16 and data processing chip 17 are all electrically connected fingerprint recognition chip 1;
This fingerprint recognition chip 1 upper surface is distributed with several blind holes 2, in the blind hole 2 of described fingerprint recognition chip 1, there is aluminum pad 3, this aluminum pad 3 extends in the middle part of blind hole 2 bottom blind hole 2, in blind hole 2, aluminium welding pad 3 surface is filled with nickel metal layer 4, this nickel metal layer 4 extends to fingerprint recognition chip 1 upper surface and forms projection in the middle part of blind hole 2, forms pad thickened section 5;
Described fingerprint recognition chip 1 lower surface also has the first tapered blind hole 6, second tapered blind hole 7 successively with blind hole 2 opposite region ecto-entad, second tapered blind hole 7 is positioned at the bottom of the first tapered blind hole 6, the cross section of described first tapered blind hole 6, second tapered blind hole 7 is taper, the opening of the second tapered blind hole 7 is less than the opening of the first tapered blind hole 6, is the aluminum pad 3 of fingerprint recognition chip 1 bottom this second tapered blind hole 7;
Described fingerprint recognition chip 1 lower surface, first tapered blind hole 6, second tapered blind hole 7 surface has insulating barrier 8, several triconic blind holes 9 are offered bottom described second tapered blind hole 7, be positioned at fingerprint recognition chip 1, first tapered blind hole 6, above second tapered blind hole 7 and triconic blind hole 9, there is titanium conductive pattern layer 10 successively, copper metallic conductive pattern layer 11, this titanium conductive pattern layer 10, copper metallic conductive pattern layer 11 is positioned at insulating barrier 8 surface opposing with fingerprint recognition chip 1, one welding resisting layer 12 is positioned at copper metallic conductive pattern layer 11 surface opposing with titanium conductive pattern layer 10, this welding resisting layer 12 has several through holes 13, one soldered ball 14 is electrically connected with copper metallic conductive pattern layer 11 by described through hole 13,
Described pcb board 16 and data processing chip 17 are all electrically connected the soldered ball 14 of fingerprint recognition chip 1, and described triconic blind hole 9 runs through described aluminum pad 3, and extends to the middle part of pad thickened section 5; Above-mentioned pad thickened section 5 thickness is 2 microns.The thickness of above-mentioned fingerprint recognition chip 1 is 180 ~ 200 microns.
Embodiment 2: a kind of high reliability Fingerprint Lock device, comprise fingerprint recognition chip 1, ceramic cover plate 15, pcb board 16 and data processing chip 17, be provided with high dielectric constant layer 18 between the induction zone of described fingerprint recognition chip 1 and ceramic cover plate 2, described pcb board 16 and data processing chip 17 are all electrically connected fingerprint recognition chip 1;
This fingerprint recognition chip 1 upper surface is distributed with several blind holes 2, in the blind hole 2 of described fingerprint recognition chip 1, there is aluminum pad 3, this aluminum pad 3 extends in the middle part of blind hole 2 bottom blind hole 2, in blind hole 2, aluminium welding pad 3 surface is filled with nickel metal layer 4, this nickel metal layer 4 extends to fingerprint recognition chip 1 upper surface and forms projection in the middle part of blind hole 2, forms pad thickened section 5;
Described fingerprint recognition chip 1 lower surface also has the first tapered blind hole 6, second tapered blind hole 7 successively with blind hole 2 opposite region ecto-entad, second tapered blind hole 7 is positioned at the bottom of the first tapered blind hole 6, the cross section of described first tapered blind hole 6, second tapered blind hole 7 is taper, the opening of the second tapered blind hole 7 is less than the opening of the first tapered blind hole 6, is the aluminum pad 3 of fingerprint recognition chip 1 bottom this second tapered blind hole 7;
Described fingerprint recognition chip 1 lower surface, first tapered blind hole 6, second tapered blind hole 7 surface has insulating barrier 8, several triconic blind holes 9 are offered bottom described second tapered blind hole 7, be positioned at fingerprint recognition chip 1, first tapered blind hole 6, above second tapered blind hole 7 and triconic blind hole 9, there is titanium conductive pattern layer 10 successively, copper metallic conductive pattern layer 11, this titanium conductive pattern layer 10, copper metallic conductive pattern layer 11 is positioned at insulating barrier 8 surface opposing with fingerprint recognition chip 1, one welding resisting layer 12 is positioned at copper metallic conductive pattern layer 11 surface opposing with titanium conductive pattern layer 10, this welding resisting layer 12 has several through holes 13, one soldered ball 14 is electrically connected with copper metallic conductive pattern layer 11 by described through hole 13,
Described pcb board 16 and data processing chip 17 are all electrically connected the soldered ball 14 of fingerprint recognition chip 1, and above-mentioned triconic blind hole 9 runs through described aluminum pad 3, and extends to the middle part of pad thickened section 5.
Above-mentioned pad thickened section 5 thickness is 3.2 microns.In above-mentioned second tapered blind hole 7, there are four triconic blind holes 9.The thickness of above-mentioned fingerprint recognition chip 1 is 250 ~ 260 microns.
When adopting above-mentioned high reliability Fingerprint Lock device, it forms a set of new technological process by after wafer stage chip encapsulation and silicon through hole technology Technology Integration, directly save conventional package routing step, decrease holder and FPC equal thickness, product gross thickness is reduced greatly, the use of this technology makes the solid that can have 0.4mm in the packaging body of 0.5mm, is conducive to meeting industrial design moulding and realizes enough product strengths, finally having increased substantially product reliability.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.
Claims (4)
1. a high reliability Fingerprint Lock device, it is characterized in that: comprise fingerprint recognition chip (1), ceramic cover plate (15), pcb board (16) and data processing chip (17), be provided with high dielectric constant layer (18) between the induction zone of described fingerprint recognition chip (1) and ceramic cover plate (2), described pcb board (16) and data processing chip (17) are all electrically connected fingerprint recognition chip (1);
This fingerprint recognition chip (1) upper surface is distributed with several blind holes (2), in the blind hole (2) of described fingerprint recognition chip (1), there is aluminum pad (3), this aluminum pad (3) extends to blind hole (2) middle part from blind hole (2) bottom, blind hole (2) interior aluminium welding pad (3) surface is filled with nickel metal layer (4), this nickel metal layer (4) extends to fingerprint recognition chip (1) upper surface from blind hole (2) middle part and forms projection, forms pad thickened section (5);
Described fingerprint recognition chip (1) lower surface also has the first tapered blind hole (6), the second tapered blind hole (7) successively with blind hole (2) opposite region ecto-entad, second tapered blind hole (7) is positioned at the bottom of the first tapered blind hole (6), the cross section of described first tapered blind hole (6), the second tapered blind hole (7) is taper, the opening of the second tapered blind hole (7) is less than the opening of the first tapered blind hole (6), and this second tapered blind hole (7) bottom is the aluminum pad (3) of fingerprint recognition chip (1);
Described fingerprint recognition chip (1) lower surface, first tapered blind hole (6), second tapered blind hole (7) surface has insulating barrier (8), described second tapered blind hole (7) bottom offers several triconic blind holes (9), be positioned at fingerprint recognition chip (1), first tapered blind hole (6), second tapered blind hole (7) and triconic blind hole (9) top have titanium conductive pattern layer (10) successively, copper metallic conductive pattern layer (11), this titanium conductive pattern layer (10), copper metallic conductive pattern layer (11) is positioned at insulating barrier (8) surface opposing with fingerprint recognition chip (1), one welding resisting layer (12) is positioned at copper metallic conductive pattern layer (11) surface opposing with titanium conductive pattern layer (10), this welding resisting layer (12) has several through holes (13), one soldered ball (14) is electrically connected with copper metallic conductive pattern layer (11) by described through hole (13), described pcb board (16) and data processing chip (17) are all electrically connected the soldered ball (14) of fingerprint recognition chip (1),
Described triconic blind hole (9) runs through described aluminum pad (3), and extends to the middle part of pad thickened section (5).
2. high reliability Fingerprint Lock device according to claim 1, is characterized in that: described pad thickened section (5) thickness is 3 ~ 4 microns.
3. high reliability Fingerprint Lock device according to claim 1, is characterized in that: have at least three triconic blind holes (9) in described second tapered blind hole (7).
4. high reliability Fingerprint Lock device according to claim 1, is characterized in that: the thickness of described fingerprint recognition chip (1) is 150 ~ 300 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520119795.8U CN204538011U (en) | 2015-02-28 | 2015-02-28 | High reliability fingerprint lock device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520119795.8U CN204538011U (en) | 2015-02-28 | 2015-02-28 | High reliability fingerprint lock device |
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| CN204538011U true CN204538011U (en) | 2015-08-05 |
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| CN201520119795.8U Active CN204538011U (en) | 2015-02-28 | 2015-02-28 | High reliability fingerprint lock device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977214A (en) * | 2016-06-23 | 2016-09-28 | 华天科技（西安）有限公司 | TSV chip packaging element based on open molding technology and production method thereof |
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2015
- 2015-02-28 CN CN201520119795.8U patent/CN204538011U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977214A (en) * | 2016-06-23 | 2016-09-28 | 华天科技（西安）有限公司 | TSV chip packaging element based on open molding technology and production method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215143, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee after: Suzhou Keyang Semiconductor Co., Ltd Address before: 215143, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee before: SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |