CN105977214A - TSV chip packaging element based on open molding technology and production method thereof - Google Patents

TSV chip packaging element based on open molding technology and production method thereof Download PDF

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Publication number
CN105977214A
CN105977214A CN201610466594.4A CN201610466594A CN105977214A CN 105977214 A CN105977214 A CN 105977214A CN 201610466594 A CN201610466594 A CN 201610466594A CN 105977214 A CN105977214 A CN 105977214A
Authority
CN
China
Prior art keywords
tsv chip
tsv
chip
solder mask
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610466594.4A
Other languages
Chinese (zh)
Inventor
谢建友
李涛涛
郭雁冰
马晓波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huatian Technology Xian Co Ltd
Original Assignee
Huatian Technology Xian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huatian Technology Xian Co Ltd filed Critical Huatian Technology Xian Co Ltd
Priority to CN201610466594.4A priority Critical patent/CN105977214A/en
Publication of CN105977214A publication Critical patent/CN105977214A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

The invention discloses a TSV chip packaging element based on an open molding technology and a production method thereof. The packaging element mainly is composed of a TSV chip, a solder mask layer, bonding pads, adhesive, a cover board and a packaging body. A solder mask layer is arranged at the upper part of the TSV chip. The bonding pads are arranged on the solder mask layer. Sensing areas are arranged at the lower part of the TSV chip. The TSV chip is connected with the cover board through the adhesive. The TSV chip is partially packaged by the packaging body. The method comprises the steps of mounting the chip and carrying out open molding. The packaging element and the method are characterized in simple process and saving cost.

Description

A kind of TSV chip package based on dew core plastic package process and manufacture method thereof
Technical field
The present invention relates to sensor chip encapsulation technology field, specifically a kind of based on dew core plastic packaging The TSV chip package of technique and manufacture method thereof.
Background technology
Current finger print identification encapsulation technology predominant package configuration is with over molding and open Molding is in the majority.For over molding encapsulating structure, it is mainly adjusted by sensor core Sheet surface meets fingerprint inductive effects to plastic-sealed body surface distance, it is desirable to high-k plastic packaging Material, low tolerance bond medium；For open molding encapsulating structure, it is desirable to complete Cover sheet attachment process is being carried out, to protect sensor surface injury-free after becoming encapsulation.Two The whole flow process of person is complicated, relatively costly.Cover is supported by bonding agent on sensor, Easily run-off the straight, affects recognition effect.
Summary of the invention
The problem existed for above-mentioned prior art, the present invention provides a kind of based on dew core plastic packaging work The TSV chip package of skill and manufacture method thereof, possess that flow process is simple, the spy of cost savings Point.
A kind of based on dew core plastic package process TSV chip package, mainly by TSV chip, Solder mask, pad, bonding agent, cover plate, plastic-sealed body form.Described TSV chip top has One layer of solder mask, pad is on solder mask, and induction region is arranged at TSV chip bottom, and by viscous Connect agent to be connected with cover plate, plastic-sealed body portion envelops TSV chip.
The manufacture method of a kind of TSV chip package based on dew core plastic package process, specifically presses Carry out according to following steps:
The first step: prepare TSV chip；
Second step: upper core, by TSV chip attachment on cover plate；
3rd step: dew core plastic packaging.
The invention have the advantages that
1, TSV technique combines Open molding (dew core plastic packaging) technique, simplifies flow process；
2, directly cover sheet is mounted on induction chip surface, promotes inductive effects；
3, need not substrate, common capsulation material can complete encapsulation, cost-effective.
Accompanying drawing explanation
Fig. 1 is TSV chip figure；
Fig. 2 is upper core figure；
Fig. 3 is plastic packaging figure.
In figure, 1 be TSV chip, 2 for solder mask, 3 for pad, 4 for bonding agent, 5 For cover plate, 6 be plastic-sealed body, 7 for induction region
Detailed description of the invention
A kind of based on dew core plastic package process TSV chip package, mainly by TSV chip 1, Solder mask 2, pad 3, bonding agent 4, cover plate 5, plastic-sealed body 6 form.Described TSV core One layer of solder mask 2 is arranged at sheet 1 top, and pad 3 is on solder mask 2, and TSV chip 1 bottom has Induction region 7, and be connected with cover plate 5 by bonding agent 4, plastic-sealed body 6 portion envelops TSV Chip 1.
The manufacture method of a kind of TSV chip package based on dew core plastic package process, specifically presses Carry out according to following steps:
The first step: prepare TSV chip 1；
Second step: upper core, is mounted on TSV chip 1 on cover plate 5；
3rd step: dew core plastic packaging.

Claims (2)

1. a TSV chip package based on dew core plastic package process, it is characterised in that main Will by TSV chip (1), solder mask (2), pad (3), bonding agent (4), cover plate (5), Plastic-sealed body (6) forms, and one layer of solder mask (2) is arranged at described TSV chip (1) top, weldering Dish (3) is on solder mask (2), and induction region (7) is arranged at TSV chip (1) bottom, and It is connected with cover plate (5) by bonding agent (4), plastic-sealed body (6) portion envelops TSV chip (1)。
2. a manufacture method for TSV chip package based on dew core plastic package process, it is special Levy and be, specifically follow the steps below:
The first step: prepare TSV chip (1)；
Second step: upper core, is mounted on TSV chip (1) on cover plate (5)；
3rd step: dew core plastic packaging.
CN201610466594.4A 2016-06-23 2016-06-23 TSV chip packaging element based on open molding technology and production method thereof Pending CN105977214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610466594.4A CN105977214A (en) 2016-06-23 2016-06-23 TSV chip packaging element based on open molding technology and production method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610466594.4A CN105977214A (en) 2016-06-23 2016-06-23 TSV chip packaging element based on open molding technology and production method thereof

Publications (1)

Publication Number Publication Date
CN105977214A true CN105977214A (en) 2016-09-28

Family

ID=57019008

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610466594.4A Pending CN105977214A (en) 2016-06-23 2016-06-23 TSV chip packaging element based on open molding technology and production method thereof

Country Status (1)

Country Link
CN (1) CN105977214A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107316818A (en) * 2017-06-20 2017-11-03 上海图正信息科技股份有限公司 The preparation method and encapsulating structure of chip package module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245598B1 (en) * 1999-05-06 2001-06-12 Vanguard International Semiconductor Corporation Method for wire bonding a chip to a substrate with recessed bond pads and devices formed
CN101221930A (en) * 2007-01-10 2008-07-16 日月光半导体制造股份有限公司 Chip packaging structure and its packaging method
US20080251875A1 (en) * 2007-04-13 2008-10-16 Hon Hai Precision Industry Co., Ltd. Semiconductor package
CN102117817A (en) * 2010-01-05 2011-07-06 昆山鸿荣电子有限公司 Ultrathin packaging structure and packaging method of image sensing chip
CN204538011U (en) * 2015-02-28 2015-08-05 苏州科阳光电科技有限公司 High reliability fingerprint lock device
CN205810780U (en) * 2016-06-23 2016-12-14 华天科技（西安）有限公司 A kind of TSV chip package based on dew core plastic package process

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6245598B1 (en) * 1999-05-06 2001-06-12 Vanguard International Semiconductor Corporation Method for wire bonding a chip to a substrate with recessed bond pads and devices formed
CN101221930A (en) * 2007-01-10 2008-07-16 日月光半导体制造股份有限公司 Chip packaging structure and its packaging method
US20080251875A1 (en) * 2007-04-13 2008-10-16 Hon Hai Precision Industry Co., Ltd. Semiconductor package
CN102117817A (en) * 2010-01-05 2011-07-06 昆山鸿荣电子有限公司 Ultrathin packaging structure and packaging method of image sensing chip
CN204538011U (en) * 2015-02-28 2015-08-05 苏州科阳光电科技有限公司 High reliability fingerprint lock device
CN205810780U (en) * 2016-06-23 2016-12-14 华天科技（西安）有限公司 A kind of TSV chip package based on dew core plastic package process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107316818A (en) * 2017-06-20 2017-11-03 上海图正信息科技股份有限公司 The preparation method and encapsulating structure of chip package module

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Application publication date: 20160928

RJ01 Rejection of invention patent application after publication