CN107438855B - Fingerprint chip packaging module, fingerprint identification module and packaging method - Google Patents
Fingerprint chip packaging module, fingerprint identification module and packaging method Download PDFInfo
- Publication number
- CN107438855B CN107438855B CN201780000471.4A CN201780000471A CN107438855B CN 107438855 B CN107438855 B CN 107438855B CN 201780000471 A CN201780000471 A CN 201780000471A CN 107438855 B CN107438855 B CN 107438855B
- Authority
- CN
- China
- Prior art keywords
- piezoresistive
- fingerprint identification
- piezoresistive sensor
- identification chip
- sensors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
Abstract
the embodiment of the application provides a fingerprint chip packaging module, a fingerprint identification module and a packaging method, and the fingerprint identification chip packaging module comprises: the fingerprint identification chip and the N piezoresistive sensors are arranged on the substrate; the first surface of the fingerprint identification chip is provided with a bonding pad, and the first surface is the upper surface or the lower surface of the fingerprint identification chip; part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip; each of the N piezoresistive sensors is connected to the pad. According to the technical scheme, the pressure of the user acting on the fingerprint identification chip can be acquired by using the piezoresistive sensor. In addition, the number of times the piezoresistive sensor is calibrated and noise may be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.
Description
Technical Field
The embodiment of the application relates to the technical field of chips, in particular to a fingerprint chip packaging module, a fingerprint identification module and a packaging method.
Background
more and more electronic devices utilize fingerprint identification technology to verify whether a user is a legitimate user. Fingerprint identification is realized through the fingerprint identification module. The fingerprint identification module can be connected to the motherboard through a Flexible Printed Circuit (FPC), and can transmit an output signal to other components on the motherboard through the FPC. Present fingerprint identification module can only realize discerning the function of fingerprint. If the fingerprint identification module can provide more functions, then can improve user experience greatly.
disclosure of Invention
the embodiment of the application provides a fingerprint chip packaging module, a fingerprint identification module and a packaging method, and can utilize the pressure of acquiring a user acting on a fingerprint identification chip.
in a first aspect, an embodiment of the present application provides a fingerprint identification chip package module, and this fingerprint identification chip package module includes: the fingerprint identification device comprises a fingerprint identification chip and N piezoresistive sensors, wherein N is a positive integer greater than or equal to 1; the first surface of the fingerprint identification chip is provided with a bonding pad, and the first surface is the upper surface or the lower surface of the fingerprint identification chip; part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip; each of the N piezoresistive sensors is connected to the pad.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint identification chip, where a first layer of piezoresistive sensors and a second layer of piezoresistive sensors in the two layers each include at least one piezoresistive sensor; the fingerprint identification chip packaging module further comprises an insulating layer positioned between the first lamination resistance type sensor and the second lamination resistance type sensor.
with reference to the first possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
With reference to the first aspect or any one of the foregoing possible implementation manners of the first aspect, in a third possible implementation manner of the first aspect, if the first surface is an upper surface of the fingerprint identification chip, the first surface has a fingerprint identification area, and part or all of the N piezoresistive sensors are attached to an area outside the fingerprint identification area.
In a second aspect, an embodiment of the present application provides a fingerprint identification module, and the fingerprint identification module includes: the packaging structure comprises a fingerprint identification chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, wherein N is a positive integer greater than or equal to 1, and the fingerprint identification chip is attached to the upper surface of the packaging substrate; the plastic packaging material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the plastic packaging material; the N piezoresistive sensors are positioned above or below the fingerprint identification chip.
With reference to the second aspect, in a first possible implementation manner of the second aspect, the N piezoresistive sensors are located inside the package substrate; the package substrate includes a pad to which each of the N piezoresistive sensors is connected.
With reference to the first possible implementation manner of the second aspect, in a second possible implementation manner of the second aspect, the package substrate includes a support layer, and the N piezoresistive sensors are located below the support layer.
with reference to the second possible implementation manner of the second aspect, in a third possible implementation manner of the second aspect, the N piezoresistive sensors are divided into two layers and attached to the lower surface of the supporting layer, where a first layer of piezoresistive sensors and a second layer of piezoresistive sensors in the two layers each include at least one piezoresistive sensor; the fingerprint identification module further comprises an insulating layer positioned between the first piezoresistive sensor and the second piezoresistive sensor.
With reference to the second aspect, in a fourth possible implementation manner of the second aspect, each of the N piezoresistive sensors is connected to the package substrate; and part or all of the N piezoresistive sensors are attached to the upper surface of the plastic packaging material.
With reference to the fourth possible implementation manner of the second aspect, in a fifth possible implementation manner of the second aspect, the upper surface of the plastic package material has a fingerprint identification area, and part or all of the N piezoresistive sensors are attached to an area outside the fingerprint identification area.
With reference to the fourth possible implementation manner of the second aspect or the fifth possible implementation manner of the second aspect, in a sixth possible implementation manner of the second aspect, the N piezoresistive sensors are divided into two layers and attached to the upper surface of the plastic package material, where a first piezoresistive sensor and a second piezoresistive sensor in the two layers each include at least one piezoresistive sensor; the fingerprint identification module further comprises an insulating layer positioned between the first piezoresistive sensor and the second piezoresistive sensor.
with reference to the third possible implementation manner of the second aspect or the sixth possible implementation manner of the second aspect, in a seventh possible implementation manner of the second aspect, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
In a third aspect, an embodiment of the present application provides a wafer-level fingerprint identification chip packaging method, where the method includes: arranging N piezoresistive sensors on a first surface of a fingerprint identification chip, wherein the first surface is the upper surface or the lower surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1; and the N piezoresistive sensors are connected with the bonding pads of the fingerprint chip through connecting lines.
with reference to the third aspect, in a first possible implementation manner of the third aspect, the arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the lower surface of the fingerprint chip; coating an insulating layer on the lower surface of the first piezoresistive sensor; and arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
With reference to the third aspect, in a second possible implementation manner of the third aspect, the arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the upper surface of the fingerprint chip; coating an insulating layer on the upper surface of the first piezoresistive sensor; a second piezoresistive sensor is arranged on the upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
with reference to the first possible implementation manner of the third aspect or the second possible implementation manner of the third aspect, in a third possible implementation manner of the third aspect, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
In a fourth aspect, an embodiment of the present application provides a method for packaging a fingerprint identification module, where the method includes: attaching the fingerprint identification chip to the upper surface of the packaging substrate through an adhesive layer; covering the fingerprint identification chip and the packaging substrate by using a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material; n piezoresistive sensors are arranged above or below the fingerprint identification chip, wherein N is a positive integer greater than or equal to 1.
With reference to the fourth aspect, in a first possible implementation manner of the fourth aspect, the arranging the N piezoresistive sensors above or below the fingerprint identification chip includes: arranging the N piezoresistive sensors inside the packaging substrate; and connecting the N piezoresistive sensors with the bonding pads of the packaging substrate through connecting lines.
with reference to the first possible implementation manner of the fourth aspect, in a second possible implementation manner of the fourth aspect, the arranging the N piezoresistive sensors inside the package substrate includes: the N piezoresistive sensors are arranged below a supporting layer of the package substrate.
With reference to the second possible implementation manner of the fourth aspect, in a third possible implementation manner of the fourth aspect, the arranging the N piezoresistive sensors below the supporting layer of the package substrate includes: arranging a first layer of piezoresistive sensors on the lower surface of the supporting layer of the packaging substrate; coating an insulating layer on the lower surface of the first piezoresistive sensor; and arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
With reference to the fourth aspect, in a fourth possible implementation manner of the fourth aspect, the arranging the N piezoresistive sensors above or below the fingerprint identification chip includes: and arranging the N piezoresistive sensors on the upper surface of the plastic packaging material, wherein the N piezoresistive sensors are connected with the packaging substrate through connecting channels.
With reference to the fourth possible implementation manner of the fourth aspect, in a fifth possible implementation manner of the fourth aspect, the arranging the N piezoresistive sensors on the upper surface of the plastic package material includes: arranging a first layer of piezoresistive sensors on the upper surface of the plastic packaging material; coating an insulating layer on the upper surface of the first piezoresistive sensor; a second piezoresistive sensor is arranged on the upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
with reference to the third possible implementation manner of the fourth aspect or the fifth possible implementation manner of the fourth aspect, in a sixth possible implementation manner of the fourth aspect, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
According to the technical scheme, the pressure of the user acting on the fingerprint identification chip can be acquired by using the piezoresistive sensor. The terminal device may perform corresponding operations using the obtained pressure. In addition, the piezoresistive sensor receives low pressure generated by the material attached above the piezoresistive sensor due to temperature change. In this way, the number of times the piezoresistive sensor is calibrated and noise can be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.
Drawings
Fig. 1 is a block diagram illustrating a conventional fingerprint recognition module.
Fig. 2 is a block diagram schematically illustrating a structure of a fingerprint chip package module according to an embodiment of the present disclosure.
Fig. 3 is a block diagram schematically illustrating a structure of another fingerprint chip package module according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of another fingerprint identification chip package module according to an embodiment of the present disclosure.
fig. 5 is a schematic structural diagram of another fingerprint identification chip package module according to an embodiment of the present disclosure.
Fig. 6 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present application.
Fig. 8 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present application.
FIG. 10 is a bottom view of a fingerprint identification chip package module.
Fig. 11 is a schematic flowchart of a wafer-level fingerprint identification chip packaging method according to an embodiment of the present application.
Fig. 12 is a schematic flowchart of a method for packaging a fingerprint identification module according to an embodiment of the present application.
fig. 13 is a schematic flowchart of a method for packaging a fingerprint identification module according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
in the description of the embodiments of the present application, the terms "upper", "lower", "upper surface", "lower surface", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings.
The fingerprint identification chip referred to in the embodiment of the present application may be a capacitive fingerprint identification chip, a photoelectric fingerprint identification chip, or other types of fingerprint identification chips, which is not limited in the embodiment of the present application.
Fig. 1 is a block diagram illustrating a conventional fingerprint recognition module. As shown in fig. 1, the lower surface of the fingerprint identification chip 101 in the fingerprint identification module 100 is adhered to the upper surface of the package substrate 104 through a glue layer 102. The plastic package material 103 covers the fingerprint identification chip 101, the adhesive layer 102 and the package substrate 104, and the lower surface of the package substrate 104 is not covered by the plastic package material 103.
The fingerprint recognition module 100 is usually located above a Flexible Printed Circuit (FPC). Place the pressure that can acquire when the user pressed the fingerprint identification module in FPC below with piezoresistive sensor. However, the FPC material is greatly affected by temperature. Specifically, the material for making the FPC may be deformed by the temperature. Thus, even if the user's finger does not press the fingerprint recognition module, the FPC applies pressure over the piezoresistive sensor, which causes a problem that malfunction or the like may occur.
Fig. 2 is a block diagram schematically illustrating a structure of a fingerprint chip package module according to an embodiment of the present disclosure. As shown in fig. 2, the fingerprint identification chip package module 200 includes: a fingerprint identification chip 201 and two piezoresistive sensors 202.
As shown in fig. 2, two piezoresistive sensors 202 are attached to the lower surface of the fingerprint identification chip 201.
the lower surface of the fingerprint recognition chip 201 may include pads (not shown). To which both piezoresistive sensors 202 are connected.
In addition, the fingerprint identification chip package module shown in fig. 2 may further include an insulating layer 203. The insulating layer 203 is located on the lower surface of the fingerprint identification chip and exposes the bonding pads on the lower surface of the fingerprint identification chip.
Fig. 3 is a block diagram schematically illustrating a structure of another fingerprint chip package module according to an embodiment of the present disclosure. As shown in fig. 3, the fingerprint identification chip package module 300 includes a fingerprint identification chip 301 and two piezoresistive sensors 302.
as shown in fig. 3, two piezoresistive sensors 302 are attached to the upper surface of the fingerprint identification chip 301.
The upper surface of the fingerprint recognition chip 301 may include pads (not shown). Both piezoresistive sensors 302 are connected to the pad.
Further, the fingerprint identification chip 301 includes a fingerprint identification area. The piezoresistive sensor 302 included in the fingerprint identification chip package module shown in fig. 3 may be attached to an area outside the fingerprint identification area.
In addition, the fingerprint identification chip package module shown in fig. 3 may further include an insulating layer 303. The insulating layer 303 is attached to the lower surface of the fingerprint identification chip and exposes the bonding pad on the lower surface of the fingerprint identification chip.
Fig. 4 is a schematic structural diagram of another fingerprint identification chip package module according to an embodiment of the present disclosure. As shown in fig. 4, the fingerprint identification chip package module 400 includes: fingerprint identification chip 401, first insulating layer 402, piezoresistive sensor 411, piezoresistive sensor 412, piezoresistive sensor 413 and piezoresistive sensor 414.
as shown in fig. 4, a piezoresistive sensor 411 and a piezoresistive sensor 412 are attached to the lower surface of the fingerprint recognition chip 401. The piezoresistive sensor 411 and the piezoresistive sensor 412 are attached to the upper surface of the first insulating layer 402. The piezoresistive sensors 413 and 414 are bonded to the lower surface of the first insulating layer 402.
The lower surface of the fingerprint recognition chip 401 may include pads (not shown). The piezoresistive sensor 411, the piezoresistive sensor 412, the piezoresistive sensor 413 and the piezoresistive sensor 414 are all connected to the pad.
In addition, the fingerprint identification chip package module shown in fig. 4 may further include a second insulating layer 403. The second insulating layer 403 is attached to the lower surface of the fingerprint identification chip and exposes the bonding pad on the lower surface of the fingerprint identification chip. The second insulating layer 403 may include a space in which the piezoresistive sensors and the insulating layer between the piezoresistive sensors are located.
Fig. 5 is a schematic structural diagram of another fingerprint identification chip package module according to an embodiment of the present disclosure. As shown in fig. 5, the fingerprint identification chip package module 500 includes: fingerprint identification chip 501, first insulating layer 502, piezoresistive sensor 511, piezoresistive sensor 512, piezoresistive sensor 513 and piezoresistive sensor 514.
As shown in fig. 5, piezoresistive sensor 511 and piezoresistive sensor 512 are attached to the upper surface of fingerprint identification chip 501. The piezoresistive sensors 511 and 512 are attached to the lower surface of the first insulating layer 502. The piezoresistive sensor 513 and the piezoresistive sensor 514 are attached to the upper surface of the first insulating layer 502.
The upper surface of the fingerprint recognition chip 501 may include pads. Piezoresistive sensors 511, 512, 513 and 514 are connected to the pads.
Further, the fingerprint recognition chip 501 includes a fingerprint recognition area. The piezoresistive sensor 511, the piezoresistive sensor 512, the piezoresistive sensor 513 and the piezoresistive sensor 514 are attached to a region other than the fingerprint identification region.
In addition, the fingerprint identification chip package module shown in fig. 5 may further include a second insulating layer 503. The second insulating layer 503 is attached to the lower surface of the fingerprint identification chip and exposes the bonding pads on the lower surface of the fingerprint identification chip.
the fingerprint identification chip package module shown in fig. 2 to 5 directly attaches the piezoresistive sensor to the surface of the fingerprint chip. In this way, the pressure of the user on the fingerprint recognition chip can be obtained by using the piezoresistive sensor. The terminal device may perform corresponding operations using the obtained pressure. In addition, the piezoresistive sensor is directly attached to the surface of the fingerprint chip, so that materials which are possibly easily affected by temperature and deformed do not exist between the piezoresistive sensor and the fingerprint identification chip. In this way, the piezoresistive sensor does not receive pressure from the material attached above the piezoresistive sensor due to temperature changes. In this way, the number of times the piezoresistive sensor is calibrated and noise can be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.
when the fingerprint identification chip and the package substrate shown in fig. 3 to 5 are packaged into a fingerprint identification module, the bonding pad connected with the piezoresistive sensor is connected with the package substrate, so that the fingerprint identification chip can be connected to a power supply and a processing module to determine pressure or pressure grade according to signals acquired by the piezoresistive sensor. More specifically, if the piezoresistive sensor is attached above the fingerprint identification chip, the bonding pad connected with the piezoresistive sensor can be connected with the substrate through the connecting channel. The connection channel may be a connection channel formed by using a Through Silicon Via (TSV) technology, or may be an electrical connection line directly used for connecting with a substrate, which is not limited in the embodiment of the present application.
Fig. 6 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application. As shown in fig. 6, the fingerprint identification module 600 includes a fingerprint identification chip 601, two piezoresistive sensors 602, and a package substrate 603.
The fingerprint identification chip 601 is attached to the upper surface of the package substrate 603 through a glue layer 604. Two piezoresistive sensors 602 are located inside the package substrate 603.
The package substrate 603 includes pads to which piezoresistive sensors are connected.
package substrate 603 includes a support layer 605. Optionally, in some embodiments, the piezoresistive sensor may be located below the support layer.
Fig. 7 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present application. As shown in fig. 7, the fingerprint identification module includes a fingerprint identification chip 701, a package substrate 702, an insulating layer 703, a piezoresistive sensor 711, a piezoresistive sensor 712, a piezoresistive sensor 713, and a piezoresistive sensor 714.
The fingerprint identification chip 701 is attached to the upper surface of the package substrate 702 through the adhesive layer 704.
the package substrate 702 includes a support layer 705. Alternatively, in some embodiments, piezoresistive sensor 711 and piezoresistive sensor 712 may be attached to the lower surface of support layer 705, insulating layer 703 is attached to the lower surface of piezoresistive sensor 711 and piezoresistive sensor 712, and piezoresistive sensor 713 and piezoresistive sensor 714 are attached to the lower surface of insulating layer 703.
The package substrate 702 includes pads to which piezoresistive sensors are connected.
the piezoresistive sensor shown in figures 6 and 7 is located inside the substrate. In this way, the pressure of the user on the fingerprint recognition chip can be obtained by using the piezoresistive sensor. The terminal device may perform corresponding operations using the obtained pressure. In addition, the piezoresistive sensor is positioned in the substrate, and the deformation of the substrate caused by the influence of temperature is small, so that the pressure of the piezoresistive sensor, which is applied to a material above the piezoresistive sensor due to the temperature change, is small. In this way, the number of times the piezoresistive sensor is calibrated and noise can be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.
Fig. 8 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application. As shown in fig. 8, the fingerprint identification module 800 includes a fingerprint identification chip 801, two piezoresistive sensors 802, a package substrate 803, and a molding compound 804.
The fingerprint identification chip 801 is attached to the upper surface of the package substrate 803 through a glue layer 805. The molding compound 804 covers the package substrate 803 and the fingerprint identification chip 801, and the lower surface of the package substrate 803 is not covered by the molding compound 804.
Two piezoresistive sensors 802 are attached to the upper surface of the molding compound 804.
Fig. 9 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present application. As shown in fig. 9, the fingerprint identification chip package module 900 includes: fingerprint identification chip 901, insulating layer 902, package substrate 903, molding compound 904, piezoresistive sensor 911, piezoresistive sensor 912, piezoresistive sensor 913, and piezoresistive sensor 914.
The fingerprint identification chip 901 is attached to the upper surface of the package substrate 903 through a glue layer 905. The plastic package material 904 covers the package substrate 903 and the fingerprint identification chip 901, and the lower surface of the package substrate 903 is not covered by the plastic package material 904.
The piezoresistive sensor 911 and the piezoresistive sensor 912 are attached to the upper surface of the plastic package 904. The piezoresistive sensor 911 and the piezoresistive sensor 912 are attached to the lower surface of the insulating layer 902. A piezoresistive sensor 913 and a piezoresistive sensor 914 are bonded to the upper surface of the insulating layer 902.
Further, the plastic packaging material comprises a fingerprint identification area. The piezoresistive sensors shown in fig. 8 and 9 may be attached to regions other than the fingerprint recognition region.
The piezoresistive sensor shown in fig. 8 and 9 is attached to a substrate. Specifically, the piezoresistive sensor is connected with a bonding pad on the upper surface of the plastic package material, and the bonding pad is connected with the substrate through a connecting channel. The connecting channel may be an electrical connecting channel inside the plastic package material. The connection channel may also be an electrical connection channel outside the encapsulation material.
In the fingerprint identification chip package module shown in fig. 8 and 9, the piezoresistive sensor is directly attached to the upper surface of the plastic package material. In this way, the pressure of the user on the fingerprint recognition chip can be obtained by using the piezoresistive sensor. The terminal device may perform corresponding operations using the obtained pressure. In addition, the piezoresistive sensor is directly attached to the upper surface of the plastic packaging material, so that materials which are likely to be affected by temperature and deform do not exist above the piezoresistive sensor. In this way, the piezoresistive sensor does not receive pressure from the material attached above the piezoresistive sensor due to temperature changes. In this way, the number of times the piezoresistive sensor is calibrated and noise can be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.
The piezoresistive sensors in the embodiments of fig. 2 to 9 may be connected to the pad by a Redistribution Layer (RDL). Of course, the piezoresistive sensor may be connected to the pad in other ways.
For example, fig. 10 is a schematic bottom view of a fingerprint identification chip package module. The fingerprint identification chip package module shown in fig. 10 is a schematic bottom view of the fingerprint identification chip package module shown in fig. 4. As shown in fig. 10, the piezoresistive sensor 411 is connected to a pad 421 of the fingerprint recognition chip 401, the piezoresistive sensor 412 is connected to a pad 422 of the fingerprint recognition chip 401, the piezoresistive sensor 413 is connected to a pad 423 of the fingerprint recognition chip 401, and the piezoresistive sensor 414 is connected to a pad 424 of the fingerprint recognition chip 401.
It will be appreciated that the lower surface of the fingerprint identification chip 401 may include other pads, in addition to the four pads shown in fig. 10, through which the fingerprint identification chip 401 may be connected to the package substrate. In addition, fig. 10 does not show the insulating layer between the two piezoresistive sensors for the sake of convenience in illustrating the connection relationship of the piezoresistive sensor of the first layer with the pad.
the connection relationship between the piezoresistive sensors and the pads shown in fig. 2, 3, 5 to 9 is similar to that shown in fig. 10, and thus, the description thereof is not repeated.
it will be understood that the shape of the pads, the connection of the pads to the piezoresistive sensors, and the shape of the piezoresistive sensors shown in fig. 10 are only schematic.
It is understood that the fingerprint identification chip package modules shown in fig. 2 to 9 are only for helping those skilled in the art to better understand the embodiments of the present application. For example, the number of piezoresistive sensors in the fingerprint identification chip package module of fig. 2, 3, 6 and 8 may also be 1 or more than 2. The number of resistive sensors per layer in the fingerprint identification chip package module shown in fig. 4, 5, 7 and 9 may also be 1 or more than 2.
The four piezoresistive sensors shown in figures 4, 5, 7 and 9 may form a bridge. Thus, the amount of the pressing Signal is doubled, the range of the pressure that can be detected is increased, and the Signal-to-Noise Ratio (SNR) can be increased.
The four piezoresistive sensors shown in figures 4, 5, 7 and 9 form a three-layer structure with an insulating layer, i.e. two piezoresistive sensors include an insulating layer therebetween. The insulating layer may be made of a material that deforms little under the influence of temperature, and may be, for example, green oil.
Fig. 11 is a schematic flowchart of a wafer-level fingerprint identification chip packaging method according to an embodiment of the present application.
and 1101, arranging N piezoresistive sensors on a first surface of the fingerprint identification chip, wherein the first surface is the upper surface or the lower surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1.
1102, connecting the N piezoresistive sensors with the pads of the fingerprint chip through connecting lines.
optionally, in some embodiments, the arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the lower surface of the fingerprint chip; coating an insulating layer on the lower surface of the first piezoresistive sensor; and arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
optionally, in some embodiments, the arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the upper surface of the fingerprint chip; coating an insulating layer on the upper surface of the first piezoresistive sensor; a second piezoresistive sensor is arranged on the upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
Further, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
The fingerprint identification chip package module packaged by the method shown in fig. 11 directly attaches the piezoresistive sensor to the surface of the fingerprint chip. The embodiment and the advantageous effects of the specific structure of the fingerprint identification chip package module manufactured according to the method shown in fig. 11 can refer to the fingerprint identification chip package module shown in fig. 2 to 5, and thus, the details are not repeated herein.
Fig. 12 is a schematic flowchart of a method for packaging a fingerprint identification module according to an embodiment of the present application.
1201, the fingerprint identification chip is attached to the upper surface of the packaging substrate through the glue layer.
And 1202, arranging N piezoresistive sensors inside the packaging substrate, wherein N is a positive integer greater than or equal to 1.
1203, connecting the N piezoresistive sensors with pads of the package substrate by connecting lines.
Optionally, in some embodiments, arranging the N piezoresistive sensors inside the package substrate includes: the N piezoresistive sensors are arranged below a supporting layer of the package substrate.
Optionally, in some embodiments, the arranging the N piezoresistive sensors below the supporting layer of the package substrate includes: arranging a first layer of piezoresistive sensors on the lower surface of the supporting layer of the packaging substrate; coating an insulating layer on the lower surface of the first piezoresistive sensor; and arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
The fingerprint recognition module packaged by the method shown in fig. 12 can place the piezoresistive sensor inside the package substrate. The embodiment and the advantageous effects of the specific structure of the fingerprint identification module manufactured according to the method shown in fig. 12 can refer to the fingerprint identification chip package module shown in fig. 6 to 7, which is not repeated herein.
fig. 13 is a schematic flowchart of a method for packaging a fingerprint identification module according to an embodiment of the present application.
1301, the fingerprint identification chip is attached to the upper surface of the packaging substrate through the glue layer.
1302, the fingerprint identification chip and the package substrate are covered with a plastic package material, wherein the lower surface of the package substrate is not covered by the plastic package material.
1303, arranging N piezoresistive sensors on the upper surface of the plastic package material, where the N piezoresistive sensors are connected to the package substrate through a connecting channel, and N is a positive integer greater than or equal to 1.
Optionally, in some embodiments, the arranging the N piezoresistive sensors on the upper surface of the plastic package material includes: arranging a first layer of piezoresistive sensors on the upper surface of the plastic packaging material; coating an insulating layer on the upper surface of the first piezoresistive sensor; a second piezoresistive sensor is arranged on the upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
further, the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
Further, when the fingerprint identification chip and the package substrate are covered by the plastic package material, an electrical connection channel can be formed in the plastic package material, and one end of the electrical connection channel is connected to the package substrate. The other end of the electric connection channel is exposed on the upper surface of the plastic package material or close to the upper surface of the plastic package material. If the electrical connection channel is not exposed on the upper surface of the plastic package material, the electrical connection channel can be exposed by polishing or laser engraving before the N piezoresistive sensors are arranged on the upper surface of the plastic package material.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application shall be covered by the scope of the present application, and therefore the scope of the present application shall be subject to the protection scope of the claims.
Claims (19)
1. The utility model provides a fingerprint identification chip package module which characterized in that, fingerprint identification chip package module includes: the fingerprint identification device comprises a fingerprint identification chip and N piezoresistive sensors, wherein N is a positive integer greater than or equal to 1;
The first surface of the fingerprint identification chip is provided with a bonding pad, and the first surface is the upper surface of the fingerprint identification chip;
Part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip;
Each piezoresistive sensor in the N piezoresistive sensors is connected with the bonding pad;
The N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint identification chip, wherein the first piezoresistive sensor and the second piezoresistive sensor in the two layers respectively comprise at least one piezoresistive sensor;
The fingerprint identification chip packaging module further comprises an insulating layer located between the first layer of piezoresistive sensor and the second layer of piezoresistive sensor.
2. The fingerprint identification chip package module of claim 1 wherein said first piezoresistive sensor and said second piezoresistive sensor form a bridge.
3. The package module of claim 1 or 2, wherein the first surface has a fingerprint recognition area, and part or all of the N piezoresistive sensors are attached to an area outside the fingerprint recognition area.
4. The utility model provides a fingerprint identification chip package module which characterized in that, fingerprint identification chip package module includes: the fingerprint identification device comprises a fingerprint identification chip and N piezoresistive sensors, wherein N is a positive integer greater than or equal to 1;
the first surface of the fingerprint identification chip is provided with a bonding pad, and the first surface is the lower surface of the fingerprint identification chip;
Part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip;
Each piezoresistive sensor in the N piezoresistive sensors is connected with the bonding pad;
the N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint identification chip, wherein the first piezoresistive sensor and the second piezoresistive sensor in the two layers respectively comprise at least one piezoresistive sensor;
The fingerprint identification chip packaging module further comprises an insulating layer located between the first layer of piezoresistive sensor and the second layer of piezoresistive sensor.
5. The fingerprint identification chip package module of claim 4 wherein said first piezoresistive sensor and said second piezoresistive sensor form a bridge.
6. the utility model provides a fingerprint identification module, its characterized in that, the fingerprint identification module includes: a fingerprint identification chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, wherein N is a positive integer greater than or equal to 1,
The fingerprint identification chip is attached to the upper surface of the packaging substrate;
the plastic packaging material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the plastic packaging material;
the N piezoresistive sensors are positioned inside the packaging substrate;
Each piezoresistive sensor in the N piezoresistive sensors is connected with the packaging substrate;
the package substrate comprises a bonding pad, and each piezoresistive sensor in the N piezoresistive sensors is connected with the bonding pad;
The packaging substrate comprises a supporting layer, and the N piezoresistive sensors are positioned below the supporting layer;
The N piezoresistive sensors are divided into two layers and attached to the lower surface of the supporting layer, wherein the first piezoresistive sensor and the second piezoresistive sensor in the two layers comprise at least one piezoresistive sensor;
the fingerprint identification module further includes an insulating layer between the first piezoresistive sensor and the second piezoresistive sensor.
7. the fingerprint identification module of claim 6 wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
8. The utility model provides a fingerprint identification module, its characterized in that, the fingerprint identification module includes: a fingerprint identification chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, wherein N is a positive integer greater than or equal to 1,
The fingerprint identification chip is attached to the upper surface of the packaging substrate;
The plastic packaging material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the plastic packaging material;
part or all of the N piezoresistive sensors are attached to the upper surface of the plastic packaging material;
Each piezoresistive sensor in the N piezoresistive sensors is connected with the packaging substrate;
The N piezoresistive sensors are divided into two layers and are attached to the upper surface of the plastic packaging material, wherein the first piezoresistive sensor and the second piezoresistive sensor in the two layers respectively comprise at least one piezoresistive sensor;
The fingerprint identification module further includes an insulating layer between the first piezoresistive sensor and the second piezoresistive sensor.
9. The fingerprint identification module of claim 8, wherein the top surface of the plastic encapsulant has a fingerprint identification area, and a portion or all of the N piezoresistive sensors are attached to an area outside the fingerprint identification area.
10. The fingerprint identification module of claim 8 or 9 wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
11. a wafer-level fingerprint identification chip packaging method is characterized by comprising the following steps:
arranging N piezoresistive sensors on a first surface of a fingerprint identification chip, wherein the first surface is the upper surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1;
Connecting the N piezoresistive sensors with a bonding pad of the fingerprint chip through a connecting circuit;
the first surface at fingerprint identification chip arranges N piezoresistive sensor, includes:
arranging a first layer of piezoresistive sensors on the upper surface of the fingerprint chip;
Coating an insulating layer on the upper surface of the first piezoresistive sensor;
arranging a second piezoresistive sensor on an upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
12. The method of claim 11, wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
13. A wafer-level fingerprint identification chip packaging method is characterized by comprising the following steps:
Arranging N piezoresistive sensors on a first surface of a fingerprint identification chip, wherein the first surface is the lower surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1;
Connecting the N piezoresistive sensors with a bonding pad of the fingerprint chip through a connecting circuit;
Wherein, it arranges N piezoresistive sensors at fingerprint identification chip's first surface, includes:
Arranging a first piezoresistive sensor layer on the lower surface of the fingerprint chip;
Coating an insulating layer on the lower surface of the first piezoresistive sensor;
And arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
14. The method of claim 13, wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
15. A method of packaging a fingerprint identification module, the method comprising:
Attaching the fingerprint identification chip to the upper surface of the packaging substrate through an adhesive layer;
Covering the fingerprint identification chip and the packaging substrate by using a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material;
arranging N piezoresistive sensors inside the packaging substrate, wherein N is a positive integer greater than or equal to 1;
Connecting the N piezoresistive sensors with a bonding pad of the packaging substrate through a connecting line;
wherein, arrange N piezoresistive sensors in the inside of packaging substrate, include:
Arranging a first layer of piezoresistive sensors on the lower surface of the supporting layer of the packaging substrate;
coating an insulating layer on the lower surface of the first piezoresistive sensor;
And arranging a second piezoresistive sensor on the lower surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor both comprise at least one piezoresistive sensor.
16. the method of claim 15, wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
17. A method of packaging a fingerprint identification module, the method comprising:
Attaching the fingerprint identification chip to the upper surface of the packaging substrate through an adhesive layer;
covering the fingerprint identification chip and the packaging substrate by using a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material;
Arranging N piezoresistive sensors on the upper surface of the plastic packaging material, wherein the N piezoresistive sensors are connected with the packaging substrate through connecting channels, and N is a positive integer greater than or equal to 1;
Arranging N piezoresistive sensors on the upper surface of the plastic packaging material, and the method comprises the following steps:
Arranging a first layer of piezoresistive sensors on the upper surface of the plastic packaging material;
Coating an insulating layer on the upper surface of the first piezoresistive sensor;
Arranging a second piezoresistive sensor on an upper surface of the insulating layer, wherein the first piezoresistive sensor and the second piezoresistive sensor each comprise at least one piezoresistive sensor.
18. The method of claim 17, wherein an upper surface of the molding compound has a fingerprint identification area,
Arranging N piezoresistive sensors on the upper surface of the plastic packaging material, and the method comprises the following steps:
And attaching part or all of the N piezoresistive sensors to the region outside the fingerprint identification region.
19. The method of claim 17 or 18, wherein the first piezoresistive sensor and the second piezoresistive sensor form a bridge.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/087024 WO2018218670A1 (en) | 2017-06-02 | 2017-06-02 | Fingerprint chip packaging module, fingerprint recognition module and packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107438855A CN107438855A (en) | 2017-12-05 |
| CN107438855B true CN107438855B (en) | 2019-12-06 |
Family
ID=60462021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780000471.4A Active CN107438855B (en) | 2017-06-02 | 2017-06-02 | Fingerprint chip packaging module, fingerprint identification module and packaging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107438855B (en) |
| WO (1) | WO2018218670A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107526474B (en) * | 2017-08-31 | 2021-12-28 | 京东方科技集团股份有限公司 | Pressure sensing module integrated with fingerprint identification function, driving method and display device |
| CN108764104A (en) * | 2018-05-22 | 2018-11-06 | 宇龙计算机通信科技(深圳)有限公司 | A kind of fingerprint recognition component and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850840A (en) * | 2015-05-19 | 2015-08-19 | 苏州晶方半导体科技股份有限公司 | Chip packaging method and chip packaging structure |
| CN105825209A (en) * | 2016-05-17 | 2016-08-03 | 广东欧珀移动通信有限公司 | Fingerprint identification module and terminal |
| CN206193606U (en) * | 2016-10-19 | 2017-05-24 | 广东欧珀移动通信有限公司 | Terminal |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106716438B (en) * | 2014-10-06 | 2020-11-13 | 深圳市汇顶科技股份有限公司 | Self-capacitance fingerprint sensor with active amplification pixels |
| KR20160053283A (en) * | 2014-11-03 | 2016-05-13 | 주식회사 바이오메트릭스 | Finger Print Recognition Sensor Module with Touch Motion Detection |
| TWI604384B (en) * | 2015-05-12 | 2017-11-01 | 友達光電股份有限公司 | Fingerprint identification system and method |
| TWI612626B (en) * | 2015-09-07 | 2018-01-21 | 矽品精密工業股份有限公司 | Package structure and method of fabricating the same |
| CN105843425A (en) * | 2016-03-23 | 2016-08-10 | 深圳市金立通信设备有限公司 | Key and terminal |
| CN105913012B (en) * | 2016-04-08 | 2018-09-04 | 广东欧珀移动通信有限公司 | A kind of preparation method of fingerprint module, mobile terminal and fingerprint module |
| WO2018049635A1 (en) * | 2016-09-17 | 2018-03-22 | 深圳市汇顶科技股份有限公司 | Touch pressure detection module and device |
-
2017
- 2017-06-02 WO PCT/CN2017/087024 patent/WO2018218670A1/en active Application Filing
- 2017-06-02 CN CN201780000471.4A patent/CN107438855B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850840A (en) * | 2015-05-19 | 2015-08-19 | 苏州晶方半导体科技股份有限公司 | Chip packaging method and chip packaging structure |
| CN105825209A (en) * | 2016-05-17 | 2016-08-03 | 广东欧珀移动通信有限公司 | Fingerprint identification module and terminal |
| CN206193606U (en) * | 2016-10-19 | 2017-05-24 | 广东欧珀移动通信有限公司 | Terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107438855A (en) | 2017-12-05 |
| WO2018218670A1 (en) | 2018-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7289956B2 (en) | Fingerprint sensing module and method | |
| US11119615B2 (en) | Fingerprint sensor and button combinations and methods of making same | |
| JP2020503606A5 (en) | ||
| US8104356B2 (en) | Pressure sensing device package and manufacturing method thereof | |
| US9731959B2 (en) | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | |
| US20170110416A1 (en) | Chip package having a protection piece compliantly attached on a chip sensing surface | |
| US9978673B2 (en) | Package structure and method for fabricating the same | |
| US9606141B2 (en) | Micromechanical sensor device | |
| WO2003010709A1 (en) | Apparatus for fingerprint image capture and method of making same | |
| US11455816B2 (en) | Fingerprint sensor module comprising a fingerprint sensor device and a substrate connected to the sensor device | |
| CN107438855B (en) | Fingerprint chip packaging module, fingerprint identification module and packaging method | |
| AU2009217526B2 (en) | Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die | |
| CN104766830A (en) | Fingerprint sensor packaging structure, packaging method and electronic equipment | |
| CN206040623U (en) | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope | |
| TW201711146A (en) | Package structure and method of fabricating the same | |
| CN206098378U (en) | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again | |
| CN214848629U (en) | Packaging structure and electronic equipment with blood pressure measurement and fingerprint identification functions | |
| TWI297463B (en) | Structure of integrated smart card and manufacturing method thereof | |
| TW200729431A (en) | Image sensor chip package | |
| JP2008122134A (en) | Acceleration sensor apparatus | |
| CN116761345A (en) | Fingerprint sensor packaging method | |
| KR100794865B1 (en) | Multi-memory card package structure and method for manufacturing the same | |
| KR102204765B1 (en) | Fingerprint sensor and button combinations and methods of making same | |
| CN106252305A (en) | The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again | |
| TW200614493A (en) | Low noise multi chip image sensor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |