CN106252305A - The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again - Google Patents
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again Download PDFInfo
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- CN106252305A CN106252305A CN201610795838.3A CN201610795838A CN106252305A CN 106252305 A CN106252305 A CN 106252305A CN 201610795838 A CN201610795838 A CN 201610795838A CN 106252305 A CN106252305 A CN 106252305A
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- Prior art keywords
- cutting
- chip
- packaging part
- substrate
- recognition system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again, includes sensing chip, stannum ball, fills glue, substrate, plastic-sealed body, and described sensing chip is backed with cutting, and running through at scored position has silicon through hole.The present invention has the advantages that structure is ultra-thin, highly sensitive.
Description
Technical field
The present invention relates to integrated circuit fields, a kind of first cutting is punched again naked core plastic packaging ultra-thin fingerprint recognition system
Irrespective of size packaging part.
Background technology
Along with the intelligence degree of end product improves constantly, various sensor chips emerge in an endless stream.For sensing chip,
Its maximum is characterised by that its chip surface exists induction region, and this region environmental stimuli to be identified with it is had an effect,
Produce the signal of telecommunication that chip can identify and process.This region is the shortest with the distance of environmental stimuli, so that produce
Signal can be detected.The most a lot of chip technologies, chip bonding pad also typically is located at same surface, will according to bonding wire mode
Chip bonding pad is drawn, the distance that bonding wire height inevitably lifting induction region is extraneous with packaging body.
For the problems referred to above, use silicon puncturing technique to replace bonding wire craft, utilize silicon perforation structure to electrically connect chip and
Base plate for packaging, but easily cause wafer damage when so chip being bored a hole.
Meanwhile, general components and parts, functional chip and sensing chip are all single device or packaging part, lack integrated
Degree.
Summary of the invention
In order to solve the problem that above-mentioned technology exists, by making the thickness of cutting thinned die, then make silicon through hole, can
To significantly reduce wafer damage, thus improve product reliability.Meanwhile, by components and parts, functional chip and induction chip in the lump
Integrated can improve the over all Integration degree of packaging part on the same substrate, optimization processes structure.
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again, includes sensing chip, stannum
Ball, filling glue, substrate, plastic-sealed body, described sensing chip is backed with cutting, and running through at scored position has silicon through hole.
Described packaging part has components and parts, components and parts to be connected with substrate, itself and sensing chip the most on the same substrate, and by
Plastic-sealed body wraps up.
Described packaging part has functional chip, functional chip space between induction chip back and substrate, passes through stannum
Ball is connected with substrate, fills glue covering function chip and stannum ball.
Described functional chip can also be connected with substrate by viscose glue, and metal wire reconnects functional chip and substrate, fills
Glue covering function chip and metal wire.
Described packaging part can remove filling glue, is directly wrapped up by plastic-sealed body.
Accompanying drawing explanation
Fig. 1 is that cutting processes silicon through hole and element embeds integrated packaging part schematic diagram；
Fig. 2 is that cutting processes silicon via-hole applications in the schematic diagram that functional chip is the packaging part that lead-in wire connects；
Fig. 3 is that cutting processes silicon via-hole applications in flip-chip and the schematic diagram of the packaging part removing filling glue；
Fig. 4 is that cutting processes silicon via-hole applications in the signal that functional chip is lead-in wire connection and the packaging part removing filling glue
Figure.
In figure: 1-functional chip, 2-sensing chip, 3-substrate, 4-stannum ball, 5-components and parts, 6-plastic-sealed body, 7-silicon through hole,
8-metal wire, 9-fills glue, 10-cutting.
Detailed description of the invention
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again, includes sensing chip 2, stannum
Ball 4, filling glue 9, substrate 3, plastic-sealed body 6, described sensing chip 2 is backed with cutting 10, and running through at cutting 10 position has silicon through hole
7.Described packaging part has components and parts 5, components and parts 5 to be connected with substrate 3, and itself and sensing chip 2 also come on same substrate 3, and by
Plastic-sealed body 6 wraps up.Described packaging part has functional chip 1, the functional chip 1 sky between induction chip 2 back and substrate 3
Between, it is connected with substrate 3 by stannum ball 4, fills glue 9 covering function chip 1 and stannum ball 4.Described functional chip 1 also by viscose glue with
Substrate 3 connects, and metal wire 8 reconnects functional chip 1 and substrate 3, fills and encapsulates described in glue 9 covering function chip 1 and metal wire 8
Part is removed and is filled glue 9, is directly wrapped up by plastic-sealed body 6.
Claims (5)
1. the naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that first cutting is punched again, includes sensing chip (2), stannum
Ball (4), filling glue (9), substrate (3), plastic-sealed body (6), described sensing chip (2) is backed with cutting (10), in cutting (10) portion
Position is run through silicon through hole (7).
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting the most according to claim 1 is punched again,
It is characterized in that, described packaging part has components and parts (5), components and parts (5) to be connected with substrate (3), and itself and sensing chip (2) also come
On same substrate (3), and wrapped up by plastic-sealed body (6).
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting the most according to claim 1 is punched again,
It is characterized in that, described packaging part have functional chip (1), functional chip (1) be positioned at induction chip (2) back and substrate (3) it
Between space, be connected with substrate (3) by stannum ball (4), fill glue (9) covering function chip (1) and stannum ball (4).
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting the most according to claim 3 is punched again,
It is characterized in that, described functional chip (1) is connected with substrate (3) also by viscose glue, and metal wire (8) reconnects functional chip (1)
With substrate (3), fill glue (9) covering function chip (1) and metal wire (8).
The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting the most according to claim 3 is punched again,
It is characterized in that, described packaging part is removed and is filled glue (9), is directly wrapped up by plastic-sealed body (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795838.3A CN106252305A (en) | 2016-08-31 | 2016-08-31 | The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795838.3A CN106252305A (en) | 2016-08-31 | 2016-08-31 | The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106252305A true CN106252305A (en) | 2016-12-21 |
Family
ID=58081444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610795838.3A Pending CN106252305A (en) | 2016-08-31 | 2016-08-31 | The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106252305A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060278989A1 (en) * | 2005-06-14 | 2006-12-14 | John Trezza | Triaxial through-chip connection |
| US20100200957A1 (en) * | 2009-02-06 | 2010-08-12 | Qualcomm Incorporated | Scribe-Line Through Silicon Vias |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN205406516U (en) * | 2016-01-23 | 2016-07-27 | 重庆三峡学院 | Sensor chip encapsulates module |
-
2016
- 2016-08-31 CN CN201610795838.3A patent/CN106252305A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060278989A1 (en) * | 2005-06-14 | 2006-12-14 | John Trezza | Triaxial through-chip connection |
| US20100200957A1 (en) * | 2009-02-06 | 2010-08-12 | Qualcomm Incorporated | Scribe-Line Through Silicon Vias |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN205406516U (en) * | 2016-01-23 | 2016-07-27 | 重庆三峡学院 | Sensor chip encapsulates module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161221 |