CN206098377U - Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again - Google Patents
Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again Download PDFInfo
- Publication number
- CN206098377U CN206098377U CN201621029439.8U CN201621029439U CN206098377U CN 206098377 U CN206098377 U CN 206098377U CN 201621029439 U CN201621029439 U CN 201621029439U CN 206098377 U CN206098377 U CN 206098377U
- Authority
- CN
- China
- Prior art keywords
- cutting
- chip
- ultra
- system level
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The utility model provides an ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again, including sensing chip, tin ball, packing glue, base plate, plastic -sealed body, there is a cutting at the sensing chip back, and it has the silicon through -hole to run through at the cutting position. The utility model has the characteristics of the structure is ultra -thin, sensitivity is high.
Description
Technical field
This utility model is related to integrated circuit fields, and the ultra-thin fingerprint of the naked core plastic packaging that specifically a kind of first cutting is punched again is known
Other system in package part.
Background technology
As the intelligence degree of end product is improved constantly, various sensor chips emerge in an endless stream.For sensing chip,
Its maximum is characterised by that its chip surface has induction region, and the region environmental stimuli to be identified with it is had an effect,
Produce the signal of telecommunication that chip can be recognized and processed.The region is as short as possible with the distance of environmental stimuli, so that produce
Signal can be detected.Current many chip technologies, chip bonding pad also typically is located at same surface, will according to bonding wire mode
Chip bonding pad is drawn, the bonding wire height inevitably extraneous distance of lifting induction region and packaging body.
For the problems referred to above, bonding wire craft is replaced using silicon perforation technology, electrically connected using silicon perforation structure chip and
Base plate for packaging, but easily cause wafer damage when so boring a hole to chip.
Meanwhile, general components and parts, functional chip and sensing chip are all single device or packaging part, are lacked integrated
Degree.
Utility model content
In order to solve the problems, such as above-mentioned technology, by making the thickness of cutting thinned die, then silicon hole is made, can
To significantly reduce to wafer damage, so as to improve product reliability.Meanwhile, by components and parts, functional chip and induction chip in the lump
It is integrated on the same substrate, the over all Integration degree of packaging part, optimization processing structure can be improved.
The ultra-thin fingerprint recognition system level packaging part of naked core plastic packaging that a kind of first cutting is punched again, includes sensing chip, stannum
There is cutting at ball, filling glue, substrate, plastic-sealed body, the sensing chip back side, and running through in scored position has silicon hole.
The censorchip surface is exposed.
The packaging part has components and parts, components and parts and substrate connection, itself and sensing chip side by side on the same substrate, and by
Plastic-sealed body is wrapped up.
The functional chip of the packaging part, functional chip has filling glue, function core by stannum ball and substrate connection between stannum ball
Piece and sensing chip side by side on the same substrate, and are wrapped up by plastic-sealed body.
The functional chip can also reconnect functional chip and substrate, function by viscose glue and substrate connection, metal wire
Chip and sensing chip side by side on the same substrate, and are wrapped up by plastic-sealed body.
The packaging part can remove filling glue, directly be wrapped up by plastic-sealed body.
Description of the drawings
Fig. 1 is that cutting processes silicon hole and element packaging part schematic diagram integrated side by side；
Fig. 2 is that cutting processes the schematic diagram that silicon hole is applied to the packaging part that functional chip is lead connection；
Fig. 3 is that cutting processes the schematic diagram that silicon hole is applied to flip-chip and removes the packaging part of filling glue；
Fig. 4 is that cutting processes the signal that silicon hole is applied to the packaging part that functional chip is lead connection and removal filling glue
Figure.
In figure：1- functional chips, 2- sensing chips, 3- substrates, 4- plastic-sealed bodies, 5- components and parts, 6- filling glue, 7- silicon leads to
Hole, 8- metal wires, 801- stannum balls, 802- stannum balls, 9- cuttings.
Specific embodiment
The ultra-thin fingerprint recognition system level packaging part of naked core plastic packaging that a kind of first cutting is punched again, includes sensing chip 2, stannum
There is cutting 9 at ball 801, filling glue 6, substrate 3, plastic-sealed body 4, the back side of the sensing chip 2, and running through at the position of cutting 9 has silicon hole
7.The packaging part has components and parts 5, and components and parts 5 are connected with substrate 3, and it is with sensing chip 2 and comes on same substrate 3, and by
Plastic-sealed body 4 is wrapped up.The functional chip 1 of the packaging part, functional chip 1 is connected with substrate 3 by stannum ball 802, is had between stannum ball 802
Filling glue 6, functional chip 1 and sensing chip 2 are simultaneously come on same substrate 3, and wrapped up by plastic-sealed body 4.The functional chip 1 is also
Can be connected with substrate 3 by viscose glue 6, metal wire 8 reconnects functional chip 1 and substrate 3, and functional chip 1 and sensing chip 2 are simultaneously
Come on same substrate 3, and wrapped up by plastic-sealed body 4.The packaging part removes filling glue 6, is directly wrapped up by plastic-sealed body 4.
Claims (3)
1. the ultra-thin fingerprint recognition system level packaging part of naked core plastic packaging that a kind of first cutting is punched again, includes sensing chip (2), stannum
Ball (801), filling glue (6), substrate (3), plastic-sealed body (4), functional chip (1), components and parts (5), it is characterised in that the sensing
There is cutting (9) at chip (2) back side, at cutting (9) position through there is a silicon hole (7), functional chip (1) by stannum ball (802) with
Substrate (3) connects, and has filling glue (6), functional chip (1) and sensing chip (2) between stannum ball (802) and comes same substrate (3)
On, components and parts (5) are connected with substrate (3), and the components and parts (5) and sensing chip (2) simultaneously come on same substrate (3) and by moulding
Envelope body (4) parcel.
2. the ultra-thin fingerprint recognition system level packaging part of naked core plastic packaging that a kind of first cutting according to claim 1 is punched again,
It is characterized in that：Sensing chip (2) surface exposure.
3. the ultra-thin fingerprint recognition system level packaging part of naked core plastic packaging that a kind of first cutting according to claim 1 is punched again,
It is characterized in that：The functional chip (1) is connected by metal lead wire (8) with substrate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621029439.8U CN206098377U (en) | 2016-08-31 | 2016-08-31 | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621029439.8U CN206098377U (en) | 2016-08-31 | 2016-08-31 | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206098377U true CN206098377U (en) | 2017-04-12 |
Family
ID=58475729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621029439.8U Active CN206098377U (en) | 2016-08-31 | 2016-08-31 | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206098377U (en) |
-
2016
- 2016-08-31 CN CN201621029439.8U patent/CN206098377U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1237187A3 (en) | Resin-encapsulated semiconductor device and method for manufacturing the same | |
| CN104779223A (en) | Fingerprint identification chip packaging structure provided with unilateral groove and manufacturing method | |
| CN105428339A (en) | Antistatic fingerprint sensor chip packaging structure and manufacturing method | |
| CN104485320A (en) | Embedded sensing chip encapsulation structure with vertical through hole and manufacturing method thereof | |
| MY139752A (en) | Encapsulated chip scale package having flip-chip on lead frame structure and method | |
| CN104600055A (en) | Fingerprint recognition sensor | |
| US20160172264A1 (en) | Package structure and fabrication method thereof | |
| EP3346492A3 (en) | Semiconductor chip package and fabrication method thereof | |
| CN206098377U (en) | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again | |
| CN206098378U (en) | Ultra -thin fingerprint identification system level packaging spare of naked core plastic envelope that elder generation's cutting was punched again | |
| CN108573200B (en) | Package structure and method for fabricating the same | |
| CN206040623U (en) | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope | |
| CN104576563A (en) | Embedded sensor chip system packaging structure | |
| CN107481979B (en) | The encapsulating structure and packaging method of fingerprint recognition chip | |
| CN107438855B (en) | Fingerprint chip packaging module, fingerprint identification module and packaging method | |
| CN206134670U (en) | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope | |
| CN106252304A (en) | A kind of ultra-thin fingerprint recognition system level packaging part using silicon through hole and naked core plastic packaging | |
| CN201829490U (en) | Chip area punching integrated circuit lead frame | |
| CN106449544A (en) | Naked-core plastic package ultrathin fingerprint recognition system-level package element capable of grooving first and then punching | |
| CN107275239B (en) | Fingerprint identification chip packaging method and packaging structure | |
| CN106252305A (en) | The naked core plastic packaging ultra-thin fingerprint recognition system level packaging part that a kind of first cutting is punched again | |
| CN113629023A (en) | Packaging structure and packaging method thereof | |
| CN205810780U (en) | A kind of TSV chip package based on dew core plastic package process | |
| CN106252306A (en) | A kind of ultra-thin fingerprint recognition system level packaging part using silicon through hole and naked core plastic packaging | |
| US10468376B2 (en) | Semiconductor device and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: An ultra thin fingerprint identification system level package of bare core plastic packaging with grooves and holes Granted publication date: 20170412 License type: Common License Record date: 20210526 |
|
| EE01 | Entry into force of recordation of patent licensing contract |