CN206134670U - Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope - Google Patents
Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope Download PDFInfo
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- CN206134670U CN206134670U CN201621029543.7U CN201621029543U CN206134670U CN 206134670 U CN206134670 U CN 206134670U CN 201621029543 U CN201621029543 U CN 201621029543U CN 206134670 U CN206134670 U CN 206134670U
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Abstract
The utility model discloses an adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope, including sensing chip (2), tin ball (801), packing gluey (6), base plate (3), plastic -sealed body (4), function chip (1), components and parts (5), its characterized in that, it has silicon through -hole (7) to run through on sensing chip (2), and sensing chip (2) are connected through tin ball (801) and base plate (3), and the packing is glued between (6) packing tin balls (801) regionally, and plastic -sealed body (4) are wrapped up sensing chip (2), are filled the major part of gluey (6) and base plate (3), and function chip (1) flip -chip is placed on base plate (3), is connected through tin ball (8) and base plate (3). The utility model discloses can improve the whole integrated level of packaging part, optimization processing structure.
Description
Technical field
The utility model is related to the ultra-thin fingerprint of integrated circuit fields, specifically a kind of employing silicon hole and naked core plastic packaging to be known
Other system in package part.
Background technology
As the intelligence degree of end product is improved constantly, various sensor chips emerge in an endless stream.For sensing chip,
Its maximum is characterised by that its chip surface has induction region, and the region environmental stimuli to be identified with it is had an effect,
Produce the electric signal that chip can be recognized and processed.The region is as short as possible with the distance of environmental stimuli, so that produce
Signal can be detected.Current many chip technologies, chip bonding pad also typically is located at same surface, will according to bonding wire mode
Chip bonding pad is drawn, the bonding wire height inevitably extraneous distance of lifting induction region and packaging body.
Meanwhile, general components and parts, functional chip and sensing chip are all single device or packaging part, are lacked integrated
Degree.
Utility model content
In order to solve the problems, such as above-mentioned prior art, the utility model replaces bonding wire craft using silicon perforation technology,
The pad of censorchip surface is caused into chip back, i.e., chip and base plate for packaging are electrically connected using silicon perforation structure, while
Induction zone surface exposure so that product sensitivity is higher, encapsulates thinner.Meanwhile, by components and parts, functional chip and induction chip one
And it is integrated on the same substrate, the over all Integration degree of packaging part, optimization processing structure can be improved.Meanwhile, by components and parts, function
Chip and induction chip in the lump it is integrated on the same substrate, the over all Integration degree of packaging part, optimization processing structure can be improved.Work(
Energy chip and sensing chip side by side on the same substrate, reduce package dimension.
The ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole and naked core plastic packaging, includes sensing chip, tin
Ball, filling glue, substrate, plastic-sealed body；Through there is silicon hole on the sensing chip, sensing chip passes through tin ball and substrate connection,
Filling glue filling tin Interglobular Domain, the major part of plastic-sealed body parcel sensing chip, filling glue and substrate.
The censorchip surface is exposed.
The packaging part has components and parts, components and parts and substrate connection, itself and sensing chip side by side on the same substrate, and by
Plastic-sealed body is wrapped up.
The functional chip of the packaging part, functional chip upside-down mounting is positioned on substrate, by tin ball and substrate connection, tin ball
Between have filling glue, functional chip and sensing chip side by side on the same substrate, and are wrapped up by plastic-sealed body.
The functional chip can also pass through metal lead wire and substrate connection, functional chip and sensing chip and come same
On substrate, and wrapped up by plastic-sealed body.
The packaging part can remove filling glue, directly be wrapped up by plastic-sealed body.
Description of the drawings
Fig. 1 is with silicon hole and element packaging part schematic diagram integrated side by side；
Fig. 2 be element it is integrated side by side in, functional chip for the packaging part of lead connected mode schematic diagram；
Fig. 3 is the schematic diagram for not adopting filling glue and functional chip for the packaging part of lead connected mode；
Fig. 4 is the packaging part schematic diagram for not adopting filling glue and functional chip to connect for upside-down mounting.
In figure：1- functional chips, 2- sensing chips, 3- substrates, 4- plastic-sealed bodies, 5- components and parts, 6- filling glue, 7- silicon lead to
Hole, 8- tin balls, 801- tin balls, 802- metal lead wires.
Specific embodiment
Below in conjunction with the accompanying drawings, the utility model is further described.
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and specifically
Embodiment, is further elaborated to the utility model.It should be appreciated that specific embodiment described herein is only used
To explain the utility model, it is not used to limit the utility model.
The ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole and naked core plastic packaging, includes sensing chip 2, tin
Ball 801, filling glue 6, substrate 3, plastic-sealed body 4；Through there is silicon hole 7 on the sensing chip 2, sensing chip 2 passes through tin ball 801
Connect with substrate 3,801 regions of the filling filling tin ball of glue 6, plastic-sealed body 4 wraps up the big of sensing chip 2, filling glue 6 and substrate 3
Part.The packaging part has components and parts 5, and components and parts 5 are connected with substrate 3, and it is with sensing chip 2 and comes on same substrate 3, and
Wrapped up by plastic-sealed body 4.The functional chip 1 of the packaging part, the upside-down mounting of functional chip 1 is positioned on substrate 3, by tin ball 8 and base
Plate 3 connects, and has filling glue 6, functional chip 1 and sensing chip 2 between tin ball 8 and comes on same substrate 3, and is wrapped by plastic-sealed body 4
Wrap up in.The functional chip 1 can also be connected by metal lead wire 802 with substrate 3, and functional chip 1 and sensing chip 2 simultaneously come same
On one substrate 3, and wrapped up by plastic-sealed body 4.The packaging part can remove filling glue 6, directly be wrapped up by plastic-sealed body 4.
The above, only to illustrate the technical solution of the utility model and unrestricted, those of ordinary skill in the art couple
Other modifications or equivalent that the technical solution of the utility model is made, without departing from technical solutions of the utility model
Spirit and scope, all should cover in the middle of right of the present utility model.
Claims (5)
1. the ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole and naked core plastic packaging, includes sensing chip (2), tin
Ball (801), filling glue (6), substrate (3), plastic-sealed body (4), functional chip (1), components and parts (5), it is characterised in that the sensing
Through there is silicon hole (7) on chip (2), sensing chip (2) is connected by tin ball (801) and substrate (3), filling glue (6) filling
Region between tin ball (801), the major part of plastic-sealed body (4) parcel sensing chip (2), filling glue (6) and substrate (3), functional chip
(1) upside-down mounting is positioned on substrate (3), is connected with substrate (3) by tin ball (8), there is filling glue (6) between tin ball (8)；Functional chip
(1) and sensing chip (2) and come on same substrate (3), components and parts (5) are connected with substrate (3), and are wrapped up by plastic-sealed body (4).
2. the ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole according to claim 1 and naked core plastic packaging,
It is characterized in that：Sensing chip (2) surface exposure.
3. the ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole according to claim 1 and naked core plastic packaging,
It is characterized in that：The components and parts (5) and sensing chip (2) are simultaneously come on same substrate (3), and are wrapped up by plastic-sealed body (4).
4. the ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole according to claim 1 and naked core plastic packaging,
It is characterized in that：The functional chip (1) is connected by metal lead wire (802) with substrate (3).
5. the ultra-thin fingerprint recognition system level packaging part of a kind of employing silicon hole according to claim 1 and naked core plastic packaging,
It is characterized in that：The packaging part removes filling glue (6), is directly wrapped up by plastic-sealed body (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621029543.7U CN206134670U (en) | 2016-08-31 | 2016-08-31 | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621029543.7U CN206134670U (en) | 2016-08-31 | 2016-08-31 | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206134670U true CN206134670U (en) | 2017-04-26 |
Family
ID=58568753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621029543.7U Active CN206134670U (en) | 2016-08-31 | 2016-08-31 | Adopt ultra -thin fingerprint identification system level packaging spare of silicon through -hole and naked core plastic envelope |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206134670U (en) |
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2016
- 2016-08-31 CN CN201621029543.7U patent/CN206134670U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: An ultra thin fingerprint identification system level package with silicon via and bare core plastic packaging Granted publication date: 20170426 License type: Common License Record date: 20210526 |