TWI243437B - Sliding type thin fingerprint sensor package - Google Patents

Abstract

A sliding type thin fingerprint sensor package mainly includes a semiconductor chip for fingerprint sensor, a conductive element, and a FPC (flexible printed circuit). The semiconductor chip has an active surface including a sensing region, and a backside surface. A plurality of bonding pads are located adjacent to a periphery of the active surface. The conductive element is disposed on the bonding pads. The FPC is bonded to the conductive element to electrically connect to the bonding pads. An electrically transmitting path is created from the active surface of the semiconductor chip without substrate under chip so as to eliminate wire-bonding process, to thin the fingerprint sensor package, and to avoid molding flash.

Description

1243437

FIELD OF THE INVENTION The present invention relates to a sensor ^ a type of contact on a semiconductor wafer, and more particularly to a prior art ... pattern recognition package structure. The fingerprint reader is used to identify the sliding type and the light-sensing type. Among them, the touch-sliding strip-shaped semiconductor chip (silicon substrate) type sensing element is connected to the semiconductor chip. The semiconductor chip can be installed in an appropriate mold sealing structure. The packaging structure of the touch-slip fingerprint reader produced by various electronic products and the touch-slip fingerprint reader can have a fingerprint reader package structure No. 2003-235830. Cai Yue, and Wen 'are mainly divided into pressure contact type and touch fingerprint reader. The package structure is made on the integrated circuit manufacturing process. The scanning system is attached to a substrate and electrically connected to the substrate. The touch-slip type On the seal of the fingerprint reader, the finger is in contact with the sensing area during use. Therefore, the touch-slip fingerprint has a small size. A conventional touch-slip type is disclosed in Japanese Patent Laid-Open Publication

Figure 1 is a front view of a package structure of a touch-slip fingerprint reader commonly used at present = w, Figure 2 is a schematic cross-sectional view of the package structure of the touch-slip fingerprint reader, and Figure 3 is The bottom view of the package structure of the touch-slip fingerprint reader. The package 100 of the touch-slip fingerprint reader mainly includes a substrate 110, a semiconductor wafer 120, a plurality of bonding wires 13 and a stamper. As shown in FIG. 2, the encapsulant 140 is adhered to the upper surface of the substrate 1 丨 0 and the back surface 12 of the semiconductor wafer 120 is electrically connected to the semiconductor wafer with the bonding wires 130. 120 to the substrate 11, the substrate ii where x is below the semiconductor wafer 120 is used as a medium for mechanical bonding and electrical connection of the semiconductor wafer 120, in order to cover the bonding wires

V. Description of the invention (2) 1 3 0 'The sealing colloid 1 4 0 is frosted 5t part of the periphery and side, but the active surface of X 嗲 — 晶 = 1 20 must be exposed 1 2 1 The sensing area 123, so The sealant ', 5 and X, ¥ of the active face of the human body chip 121 will cause the sealant 14 to overflow and expand; otherwise, these connections can be used for external electrical connection and mechanical combination. Because the total package thickness of the paste is inclusive of the substrate; the overall package thickness and size are not different from the thin thickness on the tomb 113, which is a concern. Inches are not easy to shrink any more, there is a problem of glue overflow on the 1st process [Content of the invention]: The main m is to provide a thin touch-sliding fingerprint reader. The two main straight = set in-fingerprint reader u conductive 70 The device is electrically connected to the enthusiast: the bottom thickness and outer point of the touch-slip fingerprint reader on the semiconductor crystal view. , Bu 'also has the advantage of reducing the printing, wire manufacturing process and preventing mold overflowing. The purpose is to provide a thin touch-sliding fingerprint recognition, f-installation & one end of a flexible circuit board is directly pressed. It is set on a fresh chip on the side of the active surface of a 15-fin 2 chip of a fingerprint. The soft circuit board is connected to the touch-slip fingerprint reader to connect the bonding wire between the chip and the substrate.

Good products can be repaired more heavily by providing a backside of the pattern recognizer semiconductor, and a plurality of soldering crimps are set on the side of the flexible electrical connection, as the reliability of the semiconductor connection and mechanical junction product. The method is based on the method of forming a contact type electrical connection to replace the packaging process of the conventional contact body, and the simplified packaging process of a touch-slip fingerprint recognition semiconductor wafer. A semiconductor wafer system includes a sensing area with multiple commissions. Electrical components with pads on the active surface of the body wafer between the semiconductor wafer surface and the back surface are described with electrical properties. (3) Reduction of electrical losses, and without another package structure of the present invention, the finger feels The active surface of the measurement area and one of the sides, a protective laminate is formed by using the outer surface of the semiconductor wafer to provide a separate electrical fingerprint reader package structure. On the back side, the bonding pad wires of the conductor chip are electrically connected and then the sensing area of the semiconductor wafer is encapsulated. According to the thin type of the present invention, a fingerprint reader and a flexible circuit board are included. The back side, the active side Tie lines 'the semiconductor wafer surface', the protective layer forms a semiconductor wafer, the active electrical element is provided on the semiconductor circuit board, and the semiconductor layer is pressed on the Up. A thin touch-slip fingerprint identification chip has a flexible circuit board including a sacrificial system formed on the active surface. The back of the semiconductor wafer is mechanically coupled to the outside to enhance the touch-slip type for a thin touch-slip fingerprint. Identifying a protective layer on the semiconductor, a flexible circuit board, and the semi-slip fingerprint reader can prevent the mold from overflowing to the package structure. It is a main protective layer, a conductive element has an active surface and a corresponding application. It is better to recognize the finger that touches slip, which is formed on the back of the active, and it is better to cover the side. The conductive pads are connected to the semiconductor chip.

1243437 5. The corresponding solder pads of the description of the invention (4), so it is not necessary to know the substrate under the semiconductor wafer and provide separate electrical connection and mechanical bonding paths, and to obtain a package with a thinner thickness and a smaller appearance size Type. [Performance Mode] Referring to the attached drawings, the present invention will enumerate the following embodiments. According to the first specific embodiment of the present invention, FIG. 4 is a schematic front view of a thin touch-slip fingerprint reader package structure, and FIG. 5 is a thin touch-slip fingerprint reader package structure along FIG. 5- Section 5 is a schematic cross-sectional view. The figure 6 is a schematic cross-sectional view of the package structure of the thin touch-slip fingerprint reader along the section 6-6 of FIG. 4. Please refer to FIGS. 4 and 5. The thin touch-slip fingerprint. The identifier package structure 200 series mainly includes a fingerprint reader semiconductor wafer 210, a protective layer 220, a conductive element 230, and a flexible circuit board 240 ', wherein the semiconductor wafer 210 has an active surface 211, a Corresponding back surface 212 and a plurality of side surfaces 215 between the active surface 211 and the back surface 212 (as shown in Figs. 5 and 6), the active surface 211 includes a sensing area 21 3 for identifying touch. In the present embodiment, the active fingerprint. The surface 2 11 is rectangular, which has two shorter sides 2 11 a and two longer sides 21 lb (as shown in FIG. 4). In addition, The semiconductor wafer 21 has a plurality of solder pads 214. In this embodiment, These lines are formed on pads 214 and 211 adjacent to one minor side of the main movable surface 2 lla, the plurality of bonding pads 2 H based line Lu permutations, which does not affect the arrangement direction line to slip a finger touch better. Please refer to FIG. 4, the protective layer 220 may be a printing adhesive layer or a molding compound, which is formed on the back surface 212 of the semiconductor wafer 210 and covers the semiconductor wafer 21 on the active surface. 211 with

Page 10 1243437 V. Description of the invention (5) The side surface 2 1 5 between the back surface 2 1 2 is preferred. In this embodiment, the protective layer 2 2 0 can be used to attach a film to the semiconductor wafer 2 The active surface 2 u of j 〇, the method of forming the protective layer 220 by stamping, so that the protective layer 2 2 0 is formed at the wafer level or the wafer level, and the active surface 211 of the semiconductor wafer 21 〇 is completely exposed. Its welding pad 214. Please refer to FIGS. 4 and 6, the protective layer 220 is provided with at least one electrostatic conductive strip 221 (ESD bar), which is located on one of the longer sides of the active surface 2 1 1 of the semiconductor wafer 2 1 0 The periphery of the side 211 b and the electrostatic conducting strip 221 are formed on the same sliding surface with the sensing region 2 1 3 of the semiconductor wafer 210 to guide the static electricity generated when the finger touches the sliding surface. Please refer to FIGS. 4 and 5 again, the conductive element 230 is disposed on the pads 2 14 of the active surface 211. In this embodiment, the conductive element 230 is selected from anisotropic conductive adhesive (Anisotr One of the conductive layers is a conductive layer of pjc Conductive Paste (ACP), Anisotropic Conductive Film (ACF), and heat-sealable conductive adhesive to electrically connect the flexible circuit board 240. One end of the flexible circuit board 240 is pressed on the conductive element 2 3 0 ′ to electrically connect to the corresponding solder pads 214 of the semiconductor wafer 2 1 0, and the other end of the flexible circuit board 24 0 is used as The semiconductor wafer 2 0 is electrically transmitted to the outside, so the thin touch-slip fingerprint reader package structure 20 0 does not require the use of a conventional substrate under the semiconductor wafer to provide a separate electrical connection and mechanical bonding path. In this embodiment, the flexible circuit board 240 has another ground lead (not shown in the figure), which is connected to the electrostatic guide bar 22 1 to guide the static electricity generated when the finger touches the slide. In addition, the The flexible circuit board 2 40 may be equipped with appropriate passive components 241 to enhance

Page 11 1243437

5. Description of the invention (6) Electrical characteristics. Therefore, the touch-slip fingerprint reader 2000 does not require a substrate under the semiconductor wafer and a sealing gel protruding from the active surface of the wafer to cover the bonding wire, as is known, to effectively reduce the package of the touch-slip fingerprint reader. Thickness and appearance dimensions, in addition, it has the advantages of reducing the wire bonding process and preventing mold sealing = glue.

According to the manufacturing method of the thin touch-slip fingerprint reader package structure 2000 of the present invention, referring to FIG. 7A, firstly, a plurality of fingerprint reader semiconductor wafers 210 or wafers containing the semiconductor wafers 210 are adhered. On an adhesive film 300, the active surfaces 211 of the semiconductor wafers 21 are attached to the adhesive film 300 to protect the sensing areas 21 3 of the active surfaces 2u, and a plurality of electrostatic guide bars 2 2 1 is also adhered to the adhesive film 3 00,

The electrostatic guide 221 is formed on the periphery of the longer sides 2 1 ib of the active surfaces 21 1; next, referring to FIG. 7B, the protective layer 22 is formed on the back surface 212 of the semiconductor wafers 210. The protective layer 22 0 can be formed by stamping, printing or deposition; after that, please refer to FIG. 7C. After cutting and separating, remove the adhesive film 3 00 to fully expose the activeness of the semiconductor wafers 2 0 Surface 2 11 and pads 21 4 and the electrostatic conductive strip 22 1; then, referring to FIG. 7D, a plurality of conductive elements 23 are mounted on the pads 2 14 of the active surfaces 211, and then One end of the flexible circuit board 24 is pressed on the conductive element 230 to electrically connect the flexible circuit board 24 and the semiconductor wafer 210. Therefore, in the manufacturing method, the protective layer 22 is not contaminated with the active surface 211 of the semiconductor wafers 210, and the semiconductor wafers 210 are electrically connected to the corresponding ones through the conductive element 23. The flexible circuit board 240 is directly connected to the external circuit using the flexible circuit board 240.

1243437___. One. V. Description of the invention (7) The bonding wire formed by bonding and the substrate under the wafer can simplify the bonding and die bonding process and have reworkability. According to a second specific embodiment of the present invention, please refer to FIG. 8. A thin touch-slip fingerprint reader package structure 400 mainly includes a fingerprint reader semiconductor chip 410, a plurality of conductive elements 430, and a flexible circuit board. 440, the semiconductor wafer 410 has an active surface 411 and a corresponding back surface 412. The active surface 4 11 includes a sensing area 413 for identifying touch-slip fingerprints. Pad 414 is formed in the

The active surface 411 and a protective layer 420 can be formed on the back surface 4 1 2 of the semiconductor wafer 41 0 by sputtering, such as a protective metal layer. The conductive elements 43 0 are selected from gold bumps and pre-soldering materials. One of the conductive blocks is provided on the bonding pads 414 that gray the active surface 411 of the semiconductor wafer 410, and one end of the flexible circuit board 440 is pressed on the conductive element 43 and is electrically connected to the conductive element 43. The corresponding solder pads 414 and the conductive elements of the semiconductor wafer 410 are thin, so the thin touch-slip finger mount structure has a thinner package thickness and a smaller appearance size in the 400 series. The scope of protection of the present invention is subject to the attached application patent & gj m $. Any changes and modifications made by those skilled in the art within the bounds of the "boundary" shall belong to / Shenhe ^ Shu is within the scope of the present invention.

1243437 ~ ---- Brief description of the drawings [Simplified illustration of the drawings 1 Figure: Figure 1 of the Ming; Figure 2; Figure 3; L4 made: surface; ^ invention, a thin touch-slip fingerprint reader seal L2 = According to the present invention, 'The thin touch-slip fingerprint reader package structure le / port Figure 4-5 cross-sectional schematic diagram of Figure 5-5; According to Ni Nidi, the thin_type fingerprint reader package I建 xe Figure 4-Sectional cross-section schematic diagram of Figure 6-6; Figure = Figure: Schematic diagram of the load-bearing surface of the ㈣-type touch-slip fingerprint reader in the manufacturing process according to the present invention; and Figure 8 according to the present invention, another A schematic cross-sectional view of a thin touch-slip fingerprint recognition package structure. Brief description of the component symbols: I. Front view of the seal structure of the touch-slip fingerprint reader: Cross-section audio diagram of the package structure of the conventional touch-slip fingerprint reader: Black bottom of the package structure of the conventional touch-slip fingerprint reader , 100 touch-slip fingerprint reader package structure 110 113 substrate 111 connection pad upper surface 112 lower surface 120 123 semiconductor wafer 121 active area of the sensing area 122 back «

Page 14 1243437

Brief description of the drawing 130 Welding wire 140 Sealing gel 200 Thin touch-slip fingerprint reader package structure 210 Semiconductor wafer 211 Active surface 211a Short side 211b Long side 212 Back surface 213 Sensing area 214 Pad 215 Side 220 Protective layer 221 Electrostatic conductive strip 230 Conductive element 240 Flexible circuit board 241 Passive element 300 Adhesive film 400 Thin touch-slip fingerprint reader package structure 410 Semiconductor wafer 411 Active surface 412 Back surface 413 Sensing area 414 Pad 420 Protective layer 430 Conductive element 431 Non-conductive adhesive 440 flexible circuit board

Claims (1)

1243437 6. Scope of patent application [Scope of patent application] 1. A thin touch-slip fingerprint reader package structure, including a fingerprint reader semiconductor chip, which has an active surface and a corresponding back surface. The active surface includes There is a sensing area, the semiconducting semiconductor has a plurality of welding pads, the welding pads are formed on the active surface; a protective layer is formed on the back surface of the semiconductor wafer; a conductive element is provided On the active surface pad of the semiconductor wafer; and "two fresh and one flexible circuit board, which are arranged on the conductive element and the corresponding solder pads of the semiconductor wafer. In the thin touch-slip fingerprint recognition package structure, the conductive element is selected from anisotropic conductive paste (Acp), anisotropic conductive film (ACF), and heat seal. The two conductive layers in the conductive adhesive package. 3. The thin touch-slip fingerprint reader package structure described in item 1 of the patent application scope, where the conductive element is selected To gold bumps, wherein the / pre-conductive masses of material front. 4. The thin touch-slip fingerprint reader package structure as described in item 1 of Shenyan's patent scope, wherein the active surface is rectangular, and the pads are formed on one of the short sides of the active surface which is really close to the active surface. 5. The thin touch-slip fingerprint reader package structure described in item 1 of the scope of patent application, which further includes an electrostatic conductive strip (ESD bar), which is provided in the protection area. 1243437 Scope of patent application The thin structure described in item 5 of the scope of patent application, wherein the electrostatic guide bar is located on the periphery of the longer side. The mounting structure described in item 5 of the scope of patent application, wherein the electrostatic guide bar is connected to the wire. The thin package structure as described in claim 5 of the patent application scope, wherein the electrostatic guide bar is on the same sliding surface as the half. 3. The thin-walled structure as described in item 1 of the scope of patent application, wherein the protective layer covers the side surface between the surface and the back surface. 10. The thin sealing structure according to item 1 of the scope of patent application, wherein the flexible circuit board is provided with 11. The thin package structure according to item 1 of the scope of patent application 'wherein the protective layer is selected from Print them in /. 1 2. The thin package structure described in item 1 of the scope of the patent application, wherein the protective layer is a protection 1 3, a thin touch-slip fingerprint reader packages a fingerprint reader semiconductor wafer, which is the back side of the application, The active surface system includes a sensing pad having a plurality of pads, the pads are formed on a conductive element, and the active surface touch-slide fingerprint reader is provided on the semiconductor-type touch-slip fingerprint reader semiconductor chip. The touch-slip fingerprint reader semiconductor chip of the grounded touch-slip fingerprint reader of the flexible circuit board is a passive component of the active touch-slip fingerprint reader semiconductor chip. Type touch-slip type fingerprint reader Brush-type layer and mold-molding gel type touch-slip type fingerprint reader Metal layer. Structure, with a region, the active wafer mainly includes: an active surface and a pair of semiconductor wafer systems; the solders on the active surface Page 17 1243437 VI. Application for patent coverage; and a soft electric to the half 14, such as the device package, the active 15 'device package (Ani so (An i so one of the conductor crystal application for a special structure, surface and adjacent application) Special structure, tropic tropic conductive layer 16, such as applying for special device sealing structure, one of them 17, such as applying for special device packaging structure, 18, a thin type containing: providing a finger active surface and a semiconductor wafer forming a Bao Pei is installed on the top; and the road board is pressed on the conductive element, and the corresponding soldering pads of the electrical conductive tab are used. The thin touch-slip fingerprint identification described in item 13 of the scope of benefit is the active one. The surface is rectangular, and the fresh pads are formed near one of the shorter sides. = The thin touch-slip fingerprint identification described in item 1 3 _ of Qianwei, the medium A conductive element is selected from anisotropic Conductive Paste (Acp), anisotropic conductive film. (: Onductive Film, ACF) and heat-sealable conductive adhesive, the thin contact sliding fingerprint identification method described in item 13 of the range # 8, the conductive element is It is selected from gold bumps and pre-electric blocks. The thin touch-slip fingerprint identification according to item 13 of the scope of interest, wherein the flexible circuit board is provided with a passive component. A method for manufacturing a touch-slip fingerprint reader package structure, enveloping a semiconductor wafer of the identifier, the semiconductor wafer has Corresponding to the back surface, the active surface includes a sensing area having a plurality of pads formed on the active surface; a protective layer on the back surface of the semiconductor wafer; conductive pads on the active surface of the semiconductor wafer. pad 1243437 VI. Scope of patent application: A flexible circuit board is provided on the conductive element to electrically connect the flexible circuit board to the corresponding solder pads of the semiconductor wafer. 19. The manufacturing method of the thin touch-slip fingerprint reader package structure as described in item 18 of the scope of the patent application, wherein the conductive element is selected from the group consisting of anisotropic conductive paste (ACP), One of the conductive layers of Anisotropic Conductive Film (ACF) and electronic glue. ..., 20, The manufacturing method of the thin touch-slip fingerprint reader package structure described in item 18 of the scope of patent application, wherein the conductive element is selected from gold bumps, pre-fresh materials One of them is a conductive block. 21. The manufacturing method of the thin touch-slip type finger-level identifier package structure described in item 18 of the scope of patent application, wherein the protective layer is a protective adhesive layer, and is simultaneously set in the step of forming the protective layer. An electrostatic bar (E bar) is on the protective layer. 2. The manufacturing method of the thin touch-slip fingerprint reader package structure described in item 21 of the patent scope, wherein in the pressing step of the flexible circuit board, the electrostatic guide bar is connected to the flexible circuit board. Ground lead. 2j. The manufacturing method of the thin touch-slip fingerprint reader package structure as described in item 21 of the patent application scope, wherein the electrostatic conductive strip is formed on the same touch-slip surface as the sensing region of the semiconductor wafer. As described in claim 18, the thin touch-slip fingerprint identification: manufacturing method of a package structure, wherein the protective layer covers the side surface of the semiconductor chip between the active surface and the back surface. 25 Thin touch-slip fingerprint identification as described in claim 18 of the patent scope 1243437 6. Scope of patent application Manufacturing method of device package structure, wherein the flexible circuit board is provided with a passive component. Φ Ο Page 20