TWI250465B - Fingerprint sensor package with electrostatic discharge on chip - Google Patents
Fingerprint sensor package with electrostatic discharge on chip Download PDFInfo
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- TWI250465B TWI250465B TW93124052A TW93124052A TWI250465B TW I250465 B TWI250465 B TW I250465B TW 93124052 A TW93124052 A TW 93124052A TW 93124052 A TW93124052 A TW 93124052A TW I250465 B TWI250465 B TW I250465B
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五、發明說明(1) 【發明所屬之技術領域 裡感測|§封裝播、生 種晶片上靜電放電之指奸她4」衣構造, ?日紋辨識器封奘搌、生 先前技術】 了裝構造 係能將於辨 微小化,故 、筆記型電 紋,習知指 容觸滑感測 封裝構造係 製程製作出 並與該基板 滑式指紋辨 裝設在各式 紋辨識器並 指紋辨識器 紋辨識器封 識元件製作於一半導 能附加裝設於各式之 腦或PDA掌上電腦等 紋辨識器之感測方式 與光學感測等等,其 在一長條形半導體晶 感測元件,該指紋辨 電性連接,在適當壓 識器之封裝構造,習 電子產品上,使用時 觸滑過其感測區,以 封裝構造可以具有較 裝構造係已可見於歐 由於目前指紋辨識器、 體晶片或玻璃基板而達至,j 電子產品,例如行動電話 等,用以辨認使用者之指 主要區分為壓觸感測、電 中習知觸滑式指紋辨識器 片(矽基板)上以積體電路 識Is晶片係貼設於一基板 模封膠之後,以組成一觸 知指紋辨識器封裝構造可 係將手指接觸該觸滑式指 辨認指紋,因此該觸滑式 小的尺寸。相關習知之指 洲專利第EP 1 3390 09號。 請參閱第1、2及3圖,一種習知之指紋辨識器封裝構 造100係主要包含有一基板1 10、一指紋辨識器晶片120、 複數個銲線130以及一壓模形成之封膠體14〇,該指紋辨識 器晶片1 2 0係為一種製作有指紋感測元件之半導體晶片, 該指紋辨識器晶片1 2 0係具有一主動面1 21、一背面丨2 2以 及在該主動面1 2 1與該背面1 22之間的兩對應之較長側面V. INSTRUCTIONS (1) [Resistance in the technical field of the invention] § Encapsulation, electrostatic discharge on the seed wafer, her 4" clothing structure, the daily pattern recognizer, and the prior art] The structure of the structure can be miniaturized, so the note type electric pattern is prepared by the conventional touch-sensing package structure system and the slide-type fingerprint is arranged on the pattern identifier and fingerprint identification. The pattern recognition device is made up of a half-conductance sensor attached to various types of brain or PDA handheld computer such as the sensing mode and optical sensing, etc., in a long strip-shaped semiconductor crystal sensing element The fingerprint electrical connection is in the package structure of the appropriate pressure corrector, and the electronic product is used to slide over the sensing area when used, and the package structure can have a comparative structure that has been visible in Europe due to the current fingerprint identifier. , body wafer or glass substrate to reach, j electronic products, such as mobile phones, etc., to identify the user's finger is mainly divided into pressure touch sensing, electrical on the traditional touch-slip fingerprint reader sheet (矽 substrate) Integral After passage identification chip is attached Is provided on a substrate encapsulant mold, to form a tactile fingerprint reader system may be configured to package a finger contacts the fingerprint contact sliding-type identification means, so that the sliding contact type small size. The related art refers to the patent EP 1 3390 09. Referring to FIGS. 1, 2 and 3, a conventional fingerprint identifier package structure 100 mainly includes a substrate 110, a fingerprint identifier wafer 120, a plurality of bonding wires 130, and a stamper formed by a stamper. The fingerprint identifier wafer 120 is a semiconductor wafer fabricated with a fingerprint sensing device, and the fingerprint identifier wafer 120 has an active surface 1 21, a back surface 22, and an active surface 1 2 1 Two corresponding longer sides between the back side 1 22
第8頁 1250465 五、發明說明(2)Page 8 1250465 V. Description of invention (2)
12^與兩對應之較短侧面124,該主動面121係包含有一感 測^ 125 ’複數個以壓力感測或電容感測之指紋感測元件 係設於該主動面1 2 1之感測區1 25,該基板11 〇之一上表面 111係形成有複數個連接指113,請參閱第2圖,該基板110 之一下表面1 1 2係形成有複數個電性連接至對應連接指n 3 之連接塾114,該指紋辨識器晶片12〇之該背面122係以一 如膠帶或環氧液膠之黏晶膠丨丨5黏貼在該基板丨丨〇之該上表 面111上’並以該些銲線130連接該指紋辨識器晶片12〇之 複數個銲墊126至該基板11()之該些連接指113,該封膠體 140係包覆該些銲線13〇,並固定該指紋辨識器晶片12〇, 其係形成於該基板11 〇之上表面111並圍繞該指紋辨識器晶 片120之較長侧面123與較短侧面124,該封膠體140係具有 一開口141,以顯露出該指紋辨識器晶片12〇之該感測區 125 ,就供手指觸滑之方向而言,目前該封膠體14〇係有幾 種已知之構成型態,其中一種習知之指紋辨識器封裝構造 之一封膠體形成型態,其係為該封膠體14〇對應在該指紋 辨識器晶片1 20較長側面123之封膠體侧邊丨42係稍高於該 指紋辨識器晶片1 2 0之主動面1 21 (圖未繪出),以包覆該指 紋辨識器晶片1 2 0之主動面1 21之外周邊與尖角邊緣,但此 種封膠體形成型態易產生陰影作用,無法獲得正確之辨識 效果。另一種較為常見得型態為,請參閱第2及3圖,該封 膠體140對應在該指紋辨識器晶片12〇較長側面123(即供指 紋滑動側邊)之封膠體侧邊142係低於該指紋辨識器晶片' 120之主動面121,以利操作者之手指滑動並防止陰影作用12^ and the corresponding shorter side 124, the active surface 121 includes a sensing ^ 125 'a plurality of sensing devices with pressure sensing or capacitive sensing are provided on the active surface 1 2 1 The upper surface 111 of the substrate 11 is formed with a plurality of connecting fingers 113. Referring to FIG. 2, one of the lower surfaces of the substrate 110 is formed with a plurality of electrical connections to the corresponding connecting fingers. a connection port 114 of the fingerprint identifier, the back surface 122 of the fingerprint identifier wafer 12 is adhered to the upper surface 111 of the substrate by an adhesive tape 5 such as a tape or epoxy glue. The bonding wires 130 are connected to the plurality of pads 126 of the fingerprint reader chip 12 to the connecting fingers 113 of the substrate 11 , and the sealing body 140 covers the bonding wires 13 固定 and fix the fingerprint The identifier wafer 12 is formed on the upper surface 111 of the substrate 11 and surrounds the longer side 123 and the shorter side 124 of the fingerprint identifier wafer 120. The encapsulant 140 has an opening 141 to expose The sensing area 125 of the fingerprint identifier wafer 12 is in the direction of the finger sliding The encapsulant 14 has several known constitutive forms, one of which is a colloidal formation of a conventional fingerprint identifier package structure, which is that the encapsulant 14 〇 corresponds to the fingerprint identifier wafer 120 The side edge 42 of the long side 123 is slightly higher than the active surface 1 21 of the fingerprint identifier wafer 120 (not shown) to cover the active surface of the fingerprint identifier wafer 120. The outer periphery and the sharp edge, but the formation of the sealant is easy to produce a shadow effect, and the correct identification effect cannot be obtained. Another common type is that, referring to Figures 2 and 3, the encapsulant 140 corresponds to the side of the encapsulant 142 of the longer side 123 of the fingerprint reader wafer 12 (i.e., for the sliding side of the fingerprint). The active surface 121 of the fingerprint identifier chip '120 is used to slide the finger of the operator and prevent shadows.
1250465 五、發明說明(3) 發生,以能獲得正確之辨識效果。但因此亦造成該指紋辨 識器晶片120之主動面121之尖角邊緣127缺乏適當之保護 (如第3圖所示)’在重複地滑動操作過程,在該主動面 121上之晶片保護層(passivation layer,圖未繪出)容易 與該指紋辨識器晶片1 2 0剝離(pe e 1 — 〇f f )且因手指滑動時 靜電會集中在該指紋辨識器晶片120之該主動面121之尖角 邊緣’導致感測元件受損;此外,習知該封膠體丨4 〇係以 壓模(molding)形成,該較高之封膠體14〇形成時容易產生 有廢膠(mold flash)污染該指紋辨識器晶片12〇之感測區 125之情事。 【發明内容】 本發明之主要目的係在於提供一種晶片上靜電放電之 指紋辨識器封裝構造’主要包含有一基板、一指紋辨識器 日日片 靜電放電導條(ESD bar, (electrostatic discharge bar))及一封膠體,該指紋辨識器晶片係設於 。亥基板上’該靜電放電導條係突設於該指紋辨識器晶片之 ^動面上,該稣膠體係形成於該基板上且圍繞該指紋辨識 器f曰片,且該封膠體係高於該指紋辨識器晶片之主動面並 局部覆蓋至該主動面之一部位,例如該主動面在具有銲墊 之區域’該封膠體並連接至該靜電放電條,該靜電放電條 係部份顯露於該封膠體開口之邊緣,以達到晶片上靜電放 電’並且不會有封膠體之廢膠污染與保護層剝離之問題。 b本發明之次一目的係在於提供一種晶片上靜電放電之 曰、、、文辨識斋封裝構造,其包含有一突設有一靜電放電導條1250465 V. Description of invention (3) Occurs to obtain the correct identification effect. However, the sharp edge 127 of the active surface 121 of the fingerprint reader wafer 120 is also lacking proper protection (as shown in FIG. 3). The wafer protection layer on the active surface 121 during the repeated sliding operation ( The passivation layer (not shown) is easily stripped from the fingerprint reader wafer 120 (pe e 1 - 〇 ff ) and the static electricity is concentrated on the sharp corner of the active surface 121 of the fingerprint reader wafer 120 as the finger slides. The edge 'causes the sensing element to be damaged; in addition, it is known that the sealing body 丨4 〇 is formed by molding, and the higher sealing body 14 容易 is easily formed with a mold flash to contaminate the fingerprint. The sensing region 125 of the identifier wafer 12 is the case. SUMMARY OF THE INVENTION The main object of the present invention is to provide a fingerprint identifier package structure for electrostatic discharge on a wafer, which mainly includes a substrate and a fingerprint identifier (ESD bar, electrostatic discharge bar). And a gel, the fingerprint identifier chip is set. The electrostatic discharge bar is protruded on the moving surface of the fingerprint identifier chip, and the rubber system is formed on the substrate and surrounds the fingerprint reader f, and the sealing system is higher than The active surface of the fingerprint identifier wafer is partially covered to a portion of the active surface, for example, the active surface is in a region with a pad and the encapsulant is connected to the electrostatic discharge strip, and the electrostatic discharge strip portion is exposed The edge of the sealant opening is used to achieve electrostatic discharge on the wafer and there is no problem of waste rubber contamination of the sealant and peeling of the protective layer. The second object of the present invention is to provide a package for electrostatic discharge on a wafer, and a package structure comprising an electrostatic discharge bar.
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五、發明說明(4) 之指紋辨識器晶片以及一圍繞該指紋曰 較長侧面與兩對應之較短側面之封膠體二;:之兩對應 於該些較長侧面且具有一不高於該靜電放;條‘:包f 以防止封膠體之廢膠污染至該指紋辨識器晶J = 依據本發明,一種晶片上靜電放電 構造係主要包含有一 扣紋辨識器封裝 有基板 才曰紋辨識器晶片、一靜雷姑 電條(ESD bar)及一封膠體,該指紋辨識 靜電放 基板之-上表面並與該基板電性連接辨 有:",動面及一對應,背面,該主動:係包 /、品,該靜電放電條係突設於該指紋辨識器晶片: =,該封膠體係形成於該基板之該上表面且圍繞該指紋 識器晶片,該封膠體係局部覆蓋至該主動面包含 墊 一部位而連接至該靜電放電條,此外,該 體且 開口,以至少顯露出該指紋辨識器晶片之感測區,^靜 電放電條係部份顯露於該開口之邊緣。 【實施方式】 參閱所附圖式,本發明將列舉以下之實施例說明。 〇 依本發明之一具體實施例,第4圖係為一種指紋辨識 器封裝構造200之頂面示意圖,該5圖係為該指紋辨識器曰封 裝構造200沿第4圖5-5線之截面示意圖,該6圖係為該^紋 辨識器封裝構造20 0沿第4圖6-6線之截面示意圖,請參閱 第4及5圖,該指紋辨識器封裝構造2〇〇係主要包含一基板 21〇、一指紋辨識器晶片220、一靜電放電條230 (ESD ^ar) Ι^βΠΗΙ 第11頁 1250465 五、發明說明(5) 及一封膠體250。 请參閱第5圖’該基板210係可為一種雙面電性導通之 硬質電路板,如多層印刷電路板或多層陶瓷電路板,其係 具有一上表面211及一下表面212,在本實施例中,該基板 210係為一種LGA(Land Grid Array,平面格狀陣列)封裝 基板’該上表面2 1 1係形成有複數個連接指2 1 3,該下表面 21 2係形成有複數個連接墊2 1 4,該些連接指21 3係以該基 板2 1 0之内部線路電性導接對應之該些連接墊2丨4 (圖未繪 出)。 請參閱第4、5及6圖,該指紋辨識器晶片22 〇係設於該 基板2 1 0之該上表面211上,該指紋辨識器晶片2 1 〇係具有 一主動面221、一對應之背面222以及複數個在該主動面 221與該背面222之間之兩對應之較長側面223與兩對應之 較短侧面224,請參閱第7圖,該主動面221係包含有一感 測區225,其設有複數個指紋感測元件(圖未繪出),複數 個銲墊2 2 6係形成於該主動面2 21之該感測區2 2 5之外側, 在本實施例中,該些銲墊226係鄰近該較短侧面224並包含 有至少一接地銲墊。該指紋辨識器晶片22〇之背面222係以 一黏晶膠215貼設於該基板2 1〇之上表面211,利用複數個 銲線240或其它如TAB引線之習知電性連接元件,連接該指 紋辨識器晶片220之該些銲墊226與該基板21〇之該些連接日 ^213,以電性連接該指紋辨識器晶片22〇與該基板2丨〇。 請參閱第8圖,在進行封裝作業之前,該指紋辨識器曰曰 220之主動面221係定義有一顯露區邊界227,以界& =指5. The fingerprint identifier wafer of the invention (4) and a sealant 2 surrounding the longer side of the fingerprint and the corresponding shorter side; the two correspond to the longer sides and have a higher than Electrostatic discharge; strip ': package f to prevent the waste glue of the sealant from contaminating to the fingerprint identifier crystal J = According to the present invention, an on-wafer electrostatic discharge structure mainly comprises a buckle identifier encapsulating the substrate to the crepe recognizer The wafer, an ESD bar and a gel, the fingerprint identifies the upper surface of the electrostatic discharge substrate and is electrically connected to the substrate: ", the moving surface and a corresponding, the back, the active : a package/product, the electrostatic discharge strip is protruded from the fingerprint identifier wafer: =, the encapsulation system is formed on the upper surface of the substrate and surrounds the fingerprint reader wafer, and the encapsulation system is partially covered to The active surface includes a pad portion connected to the electrostatic discharge strip. Further, the body is open to expose at least the sensing region of the fingerprint reader chip, and the electrostatic discharge strip portion is exposed at the edge of the opening. [Embodiment] The present invention will be described by way of the following examples. According to an embodiment of the present invention, FIG. 4 is a top plan view of a fingerprint identifier package structure 200, which is a cross section of the fingerprint identifier package structure 200 along line 5-5 of FIG. FIG. 6 is a schematic cross-sectional view of the package structure 20 0 along the line 6-6 of FIG. 4 . Referring to FIGS. 4 and 5 , the fingerprint identifier package structure 2 includes a substrate. 21〇, a fingerprint identifier wafer 220, an electrostatic discharge strip 230 (ESD ^ar) Ι^βΠΗΙ page 11 1250465 5. Invention description (5) and a colloid 250. Referring to FIG. 5, the substrate 210 can be a double-sided electrically conductive hard circuit board, such as a multilayer printed circuit board or a multilayer ceramic circuit board, having an upper surface 211 and a lower surface 212, in this embodiment. The substrate 210 is an LGA (Land Grid Array) package substrate. The upper surface 21 1 is formed with a plurality of connection fingers 2 1 3 , and the lower surface 21 2 is formed with a plurality of connections. Pads 2 1 4, the connecting fingers 21 3 are electrically connected to the connecting pads 2丨4 (not shown) corresponding to the internal lines of the substrate 210. Referring to Figures 4, 5 and 6, the fingerprint identifier wafer 22 is disposed on the upper surface 211 of the substrate 210. The fingerprint identifier wafer 2 1 has an active surface 221 and a corresponding surface. The back surface 222 and the plurality of longer side surfaces 223 and the corresponding shorter side surfaces 224 between the active surface 221 and the back surface 222, refer to FIG. 7 , the active surface 221 includes a sensing region 225 . a plurality of fingerprint sensing elements (not shown) are disposed, and a plurality of pads 2 26 are formed on the outer side of the sensing area 2 2 5 of the active surface 21, in this embodiment, The pads 226 are adjacent to the shorter side 224 and include at least one ground pad. The back surface 222 of the fingerprint identifier wafer 22 is attached to the upper surface 211 of the substrate 2 by a die bond 215, and is connected by a plurality of bonding wires 240 or other conventional electrical connecting components such as TAB wires. The pads 226 of the fingerprint reader chip 220 and the connection pads 213 of the substrate 21 are electrically connected to the fingerprint identifier wafer 22 and the substrate 2 . Referring to FIG. 8, before the encapsulation operation, the active surface 221 of the fingerprint identifier 曰曰 220 defines a revealing area boundary 227, bounded & =
第12頁 1250465 五、發明說明(6) 紋辨識器晶片220主動面221之顯露區域與被該封膠體250 覆蓋之區域,在該顯露區邊界227内之顯露區域係至少包 含該感測區2 2 5,在該顯露區邊界2 2 7之外之覆蓋區域係包 含該些銲墊226,以使該封膠體250局部覆蓋該主動面221 之一預定部位’即,覆蓋該些銲塾2 2 6而顯露該感測區 2 2 5。該靜電放電條2 3 0係預先突設於該指紋辨識器晶片 220之该主動面221上,在本實施例中,該靜電放電條230 係為金質導條(Au bar),其突出於該主動面221之高度以 介於15〜25 /zm為較佳,並且該靜電放電條23()係係沿著該顯 路£邊界227而J衣繞配置於該主動面221周圍,其可為突出' 於該主動面2 21之封閉環狀,以圈繞該感測區2 2 5 ;或者, 在不同實施例中,該靜電放電條230亦可為直條狀或其它 不連續狀幾何圖形,以配置於該指紋辨識器晶片22 〇之供 手指滑動之兩較長對應侧邊。請再參閱第8圖,在本實施 例中,該指紋辨識器晶片220係另製造有複數個如金質之 金屬凸點231,該些金屬凸點231係透過該主動面221上之 其中一接地銲墊226電性耦合於該基板21〇之接地墊,以供 導除該感測區225周邊之靜電,關於該靜電放電條23〇係與 該指紋辨識器晶片220之複數個如金質之金屬凸點231之製 =,其係在一晶圓之電鍍製程中將該靜電放電條23〇與該 $金屬凸點231同時設於該指紋辨識器晶片22〇之主動面 之制你可*在1 &罩製程中同步形成,故該靜電放電條230 、’不額外增加該指紋辨識器晶片220之成本,其 乂佳地,在同一晶圓之製程中,一靜電放電條23〇可跨Page 12 1250465 V. Description of the Invention (6) The exposed area of the active surface 221 of the reticle disc 220 and the area covered by the encapsulant 250, the exposed area within the exposed area boundary 227 includes at least the sensing area 2 2 5, the coverage area outside the boundary of the exposed area 2 2 7 includes the pads 226 such that the encapsulant 250 partially covers a predetermined portion of the active surface 221 'that is, covering the solder pads 2 2 6 reveals the sensing area 2 2 5 . The electrostatic discharge strip 230 is preliminarily disposed on the active surface 221 of the fingerprint identifier wafer 220. In the embodiment, the electrostatic discharge strip 230 is a gold bar (Au bar) protruding from Preferably, the height of the active surface 221 is between 15 and 25 /zm, and the electrostatic discharge strip 23() is disposed around the active surface 221 along the display path 227. To highlight the closed loop of the active surface 2 21 to circle the sensing region 2 2 5 ; or, in various embodiments, the electrostatic discharge strip 230 may also be a straight strip or other discontinuous geometry The pattern is disposed on the two longer corresponding sides of the fingerprint reader chip 22 for the finger to slide. Referring to FIG. 8 again, in the embodiment, the fingerprint identifier chip 220 is further fabricated with a plurality of metal bumps 231 such as gold, and the metal bumps 231 are transmitted through one of the active surfaces 221 . The grounding pad 226 is electrically coupled to the ground pad of the substrate 21 to discharge static electricity around the sensing region 225. The electrostatic discharge bar 23 and the fingerprint identifier chip 220 are plural, such as gold. The metal bump 231 is formed in the electroplating process of a wafer, and the electrostatic discharge strip 23 and the metal bump 231 are simultaneously disposed on the active surface of the fingerprint identifier wafer 22 * Synchronously formed in the 1 & mask process, so the electrostatic discharge strip 230, 'does not increase the cost of the fingerprint identifier wafer 220, and preferably, in the same wafer process, an electrostatic discharge strip 23〇 Cross
iMi 第13頁 1250465 五、發明說明(7) 過晶圓之切割線而形成在兩相鄰指紋辨識器晶片2 2 〇之 間’在晶圓切割之後該靜電放電條2 3 〇將可延伸至該指紋 辨識器晶片2 2 0之較長侧面2 2 3之上側邊,以達到製作簡單 之目的。 明再參閱弟4及5圖,該封膠體250係形成於該基板210 之上表面211上並且圍繞該指紋辨識器晶片2 2 〇,該封膠體 250係可以壓模(m〇iding)方式形成,該封膠體25〇係覆蓋 至4些較長側面2 2 3與較短侧面2 2 4,並且該封膠體2 5 0係 較高於該指紋辨識器晶片220之主動面221,以局部覆蓋在 該主動面221中所包含有該些銲墊226之一部位並形成有一 在該主動面221上之開口251。請參閱第5圖,該封膠體25〇 係包覆於該些較短侧面224且具有一高於該主動面221之短 邊之高度253,其係高於該主動面221之高度差係約介於5〇 〜1〇〇 ,以覆蓋密封該些銲墊214與該些銲線24〇 ;請參閱 第6圖,該封膠體2 50係包覆於該些較長侧面223且具有三 不高於該靜電放電條230之長邊高度252,以避免一/用以形 成該封膠體2 50之壓模廢膠污染至該感測區225,但該封膠 體250之長邊高度252仍應稍高於該主動面221,以防止手/ 指在多次滑動之後該指紋辨識器晶片22〇主動面221上之保 護層剝離。此外,該封膠體25Q係連接至該靜電放電條’、 230,且該封膠體250之開口251係對應於上述之顯露區邊 界227,以至少顯露該指紋辨識器晶片22〇之感測區以巧, 該開口251之形成方式可在壓模時先在該指紋辨識器晶片 220之感測區225上貼附一離形膜(release f Um)(圖未繪iMi Page 13 1250465 V. INSTRUCTIONS (7) The dicing line of the wafer is formed between two adjacent fingerprint reader wafers 2 2 ' 'The electrostatic discharge strip 2 3 〇 will be extended to after the wafer is diced The upper side of the longer side 2 2 3 of the fingerprint reader wafer 220 is used for the purpose of simple fabrication. Referring to the drawings 4 and 5, the encapsulant 250 is formed on the upper surface 211 of the substrate 210 and surrounds the fingerprint identifier wafer 2 2 〇, and the encapsulant 250 can be formed by stamping. The encapsulant 25 is covered to the four longer sides 2 2 3 and the shorter side 2 2 4 , and the encapsulant 250 is higher than the active surface 221 of the fingerprint reader wafer 220 to partially cover A portion of the pads 226 is included in the active surface 221 and an opening 251 is formed in the active surface 221. Referring to FIG. 5 , the encapsulant 25 is coated on the shorter sides 224 and has a height 253 higher than the short side of the active surface 221 , which is higher than the height difference of the active surface 221 . Between 5 〇 and 1 〇〇, to cover the solder pads 214 and the bonding wires 24 〇; referring to FIG. 6 , the encapsulant 2 50 is coated on the longer sides 223 and has three The height 252 of the electrostatic discharge strip 230 is higher than the height 252 of the electrostatic discharge strip 230 to avoid contamination of the sensing strip 225 by the stamper 200, but the long side height 252 of the sealant 250 should still be Slightly above the active surface 221 to prevent the protective layer on the active surface 221 of the fingerprint reader wafer 22 from peeling off after a plurality of slidings of the hand/finger. In addition, the encapsulant 25Q is connected to the electrostatic discharge strip '230, and the opening 251 of the encapsulant 250 corresponds to the exposed area boundary 227 to expose at least the sensing area of the fingerprint identifier wafer 22 In any case, the opening 251 is formed by attaching a release film to the sensing region 225 of the fingerprint reader wafer 220 during compression molding.
1250465 五、發明說明(8) 出),以避免壓模模具壓傷該感測區225並有利於脫模,在 壓模之後去除該離形膜,即可形成該封膠體25〇之開口 250,而該靜電放電條230係部份顯露於該開口251之邊 緣。而在壓模形成該封膠體2 5 0之過程係可以使該靜電放 電條230與該些金屬凸點231相導接,進而將該靜電放電條 230透過该主動面221上之一接地鲜塾226電性搞合於該基' 板210之接地墊。 11250465 V. Inventive Note (8), to prevent the stamper mold from crushing the sensing area 225 and facilitating demolding, and removing the release film after the stamper to form the opening 250 of the sealant 25 And the electrostatic discharge strip 230 is partially exposed at the edge of the opening 251. In the process of forming the encapsulant 250 by the stamper, the electrostatic discharge strip 230 can be connected to the metal bumps 231, and the electrostatic discharge strip 230 can be grounded through the active surface 221. 226 is electrically coupled to the ground pad of the base plate 210. 1
因此,在上述之指紋辨識器封裝構造2〇〇中,利用上 述突設於該指紋辨識器晶片220之主動面221上靜電放電條 230,並且,該封膠體250係局部覆蓋至該主動面221之一^ 預疋。卩位(直到該顯露區邊界227)而連接至該靜電放電條 2 3 0 ’使得該靜電放電條2 3 〇部份顯露於該開口 2 5 1之邊Therefore, in the above-mentioned fingerprint identifier package structure 2, the electrostatic discharge strip 230 protruded from the active surface 221 of the fingerprint identifier wafer 220, and the encapsulant 250 partially covers the active surface 221 One of them ^ preview. The clamping position (up to the exposed area boundary 227) is connected to the electrostatic discharge strip 2 3 0 ' such that the electrostatic discharge strip 2 3 〇 portion is exposed on the side of the opening 2 5 1
緣,達到該指紋辨識器晶片220之主動面221上靜電放電之 功效,在每一次的手指觸滑以辨識指紋之過程,任何不當 I集在该指紋辨識器晶片2 2 0上之引發靜電均可由該靜電 放電條2 3 0順利導出。此外,在該指紋辨識器晶片2 2 〇之主 動面221上局顯路之保護層(passivati〇n iayer)因在該 主動面221邊緣之側邊係被該封膠體25〇包覆,不易有剝離 之$象。再者’利用該靜電放電條2 3 0係突設於該指紋辨 識器晶片220之主動面221上,使得該封膠體25〇即使包覆 至该主動面2 21之邊緣但其壓模廢膠在該靜電放電條230之 阻擋下仍不易溢流污染至該指紋辨識器晶片22〇之感測區 225。 本發明之保護範圍當視後附之申請專利範圍所界定者The edge reaches the electrostatic discharge effect on the active surface 221 of the fingerprint identifier wafer 220. During each finger touch to identify the fingerprint, any improper I set on the fingerprint identifier wafer 220 generates static electricity. The electrostatic discharge strip 230 can be smoothly derived. In addition, a protective layer on the active surface 221 of the fingerprint reader chip 2 2 is covered by the encapsulant 25 on the side of the edge of the active surface 221, which is not easy to be covered. Stripped $ icon. Furthermore, the electrostatic discharge strip 203 is protruded from the active surface 221 of the fingerprint identifier wafer 220, so that the sealant 25 〇 is coated on the edge of the active surface 21, but the stamper is pressed. Under the blockage of the electrostatic discharge strip 230, it is still not easy to overflow the sensing area 225 of the fingerprint identifier wafer 22A. The scope of protection of the present invention is defined by the scope of the appended patent application.
第15頁 1250465Page 15 1250465
第16頁 1250465 圖式簡單説明 【圖式簡單說明 第1圖··習知指紋辨識器封裝構造之 第2圖··習知指紋辨識器封裴構造沿 意圖; 第3圖·習知指紋辨識器封裝構造沿 意圖; 第4圖:依據本發明 意圖; 第5圖:依據本發明 線之截面示意圖; 第6圖·依據本發明 線之截面示意圖; 第7圖:依據本發明 51曰Η去制a y 喝如狄辨識器 裔曰日片未I作靜電放電條之前其 第8圖:依據本發明,該指紋辨識器 器晶片在製作靜電放電條之後其主I元件符號簡單說明: 10 0指紋辨識器封裝構造 110基板 111上表面 113連接指 114連接墊 120指紋辨識器晶片121 ^動面 122背面 123較長侧面 124較短侧面 頂面示意圖, 第1圖2-2線之截面示 第1圖3-3線之截面示 一種指紋辨識器封裝構造之頂面示 該指紋辨識器封裝構造沿第4圖5-5 5亥指紋辨識器封裝構造沿第4圖6-6 該指紋辨識器 封裝構造之指紋辨識 面示意圖;及 封裝構造之指紋辨識 面示意圖。 11 2下表面 11 5黏晶膠 1 2 5 感測區 第17頁 1250465 圖式簡單說明 126鲜塾 127 尖角邊緣 140 封膠體 141 開口 200指紋辨識器封裝構造 210 基板 211 上表面 213連接指 214連接墊 220指紋辨識器晶片 221 主動面 222 背面 1 3 0銲線 142側邊 212 下表面 2 1 5黏晶膠 223較長側面 2 2 6 鲜塾 230 靜電放電條 250 封膠體 2 5 3 短邊高度 224 較短側面 227 顯露區邊界 2 31 金屬凸點 251 開口 225感測區 240銲線 252長邊高度Page 16 1250465 Brief description of the drawing [Simplified description of the drawing Figure 1] The second figure of the conventional fingerprint identifier package structure. The conventional fingerprint identifier sealing structure is intentional; Figure 3 · Conventional fingerprint identification Illustrated in accordance with the present invention; FIG. 5 is a schematic cross-sectional view of a line according to the present invention; FIG. 6 is a schematic cross-sectional view of a line according to the present invention; According to the invention, the main identifier of the main identifier of the fingerprint identifier wafer after the electrostatic discharge strip is fabricated is as follows: 10 0 fingerprint Identifier package structure 110 substrate 111 upper surface 113 connection finger 114 connection pad 120 fingerprint identifier wafer 121 ^ movable surface 122 back surface 123 long side surface 124 short side top surface schematic view, the first Figure 2-2 line section shows the first 3-3 is a cross-sectional view showing a fingerprint identifier package structure showing the fingerprint identifier package structure along the fourth figure 5-5 5H fingerprint identifier package structure along the fourth figure 6-6 of the fingerprint identifier package Constructed fingerprint identification surface It is intended; fingerprint surface and the package structure of FIG. 11 2 lower surface 11 5 adhesive glue 1 2 5 sensing area page 17 1250465 simple illustration 126 fresh 塾 127 sharp edge 140 encapsulant 141 opening 200 fingerprint identifier package construction 210 substrate 211 upper surface 213 connection finger 214 Connection pad 220 fingerprint identifier wafer 221 active surface 222 back 1 3 0 wire 142 side 212 lower surface 2 1 5 adhesive 223 longer side 2 2 6 fresh 塾 230 electrostatic discharge strip 250 sealant 2 5 3 short side Height 224 shorter side 227 exposed area boundary 2 31 metal bump 251 opening 225 sensing area 240 bond line 252 long side height
第18頁Page 18
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TWI408782B (en) * | 2007-08-31 | 2013-09-11 | Chipbond Technology Corp | Sliding type thin fingerprint sensor package |
US9642231B2 (en) | 2015-06-24 | 2017-05-02 | Egis Technology Inc. | ESD protection for fingerprint sensor |
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CN112240810B (en) * | 2019-07-18 | 2022-05-10 | 美宸科技股份有限公司 | Pressure sensing device and manufacturing method thereof |
TWI723467B (en) * | 2019-07-18 | 2021-04-01 | 美宸科技股份有限公司 | Pressure sensing device and manufacturing method thereof |
CN113284420B (en) * | 2021-05-26 | 2022-12-06 | 武汉华星光电半导体显示技术有限公司 | Display device |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI408782B (en) * | 2007-08-31 | 2013-09-11 | Chipbond Technology Corp | Sliding type thin fingerprint sensor package |
US9642231B2 (en) | 2015-06-24 | 2017-05-02 | Egis Technology Inc. | ESD protection for fingerprint sensor |
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