CN112240810B - Pressure sensing device and manufacturing method thereof - Google Patents
Pressure sensing device and manufacturing method thereof Download PDFInfo
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- CN112240810B CN112240810B CN201910650240.9A CN201910650240A CN112240810B CN 112240810 B CN112240810 B CN 112240810B CN 201910650240 A CN201910650240 A CN 201910650240A CN 112240810 B CN112240810 B CN 112240810B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Abstract
A pressure sensing device comprises a substrate, at least one pressure sensing module and a packaging layer. The pressure sensing module is arranged on the substrate and comprises a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit has a first electrode and a second electrode. The pressure sensing blocks are respectively arranged on the conductive units, and each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees. Each buffer unit is arranged between each corresponding conductive unit and each pressure sensing block, and each buffer unit comprises a plurality of buffer salient points which are arranged on the first electrodes and the second electrodes of the corresponding conductive units in an array mode. The packaging layer is bonded on the substrate, the conductive unit and the pressure sensing block. Therefore, each pressure sensing block in the packaged pressure sensing device is ensured to be kept in a preset non-stressed state, and more accurate pressure sensing sensitivity is achieved.
Description
Technical Field
The present invention relates to a pressure sensing device, and more particularly, to a pressure sensing device and a method for manufacturing the same.
Background
With the development of science and technology, products to which the pressure sensing device can be applied are more and more diversified, and for example, chair cushions, mattresses, medical equipment, even clothes, insoles, equipment for VR virtual reality and the like can see the shadow of the pressure sensing device. At present, the common manufacturing method of the thin pressure sensing device mainly adopts a screen printing process, which usually prints a conductive circuit on a substrate, sets a plurality of pressure sensing blocks electrically connected to the conductive circuit on the conductive circuit, and finally forms the pressure sensing device by utilizing hot pressing or roller hot pressing to form a layer of sealing film on the substrate and the pressure sensing blocks. However, in the process of hot-pressing the film, the pressure sensing blocks are also hot-pressed by the roller, so that the positions of the circuit structures in some of the pressure sensing blocks may generate excessive relative offsets, and further, the sensitivity of the pressure sensing device after the film sealing is easily subjected to an error.
Disclosure of Invention
One objective of the present invention is to provide a pressure sensing device that can ensure that each pressure sensing block in a packaged pressure sensing device can be kept in a predetermined non-pressurized state.
In some embodiments, the pressure sensing device of the present invention is adapted to sense pressure and is adapted to be electrically connected to a processing unit. The pressure sensing device comprises a substrate, at least one pressure sensing module and a packaging layer. The pressure sensing module is arranged on the substrate and comprises a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit is provided with a first electrode and a second electrode which are arranged on the substrate at intervals, a first lead which is connected with the first electrode and used for grounding, and a second lead which is connected with the second electrode and suitable for being electrically connected with the processing unit. The pressure sensing blocks are respectively arranged on the conductive units, and each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees. Each buffer unit is arranged between each corresponding conductive unit and each pressure sensing block, and each buffer unit comprises a plurality of buffer salient points which are arranged on the first electrodes and the second electrodes of the corresponding conductive units in an array mode. The packaging layer is combined with the substrate and the conductive unit and the pressure sensing block of the pressure sensing module.
In some embodiments, each buffer bump has a height of 0.01 mm to 0.05 mm.
In some embodiments, each buffer bump has a diameter of 0.1 mm to 0.5 mm.
In some embodiments, the distance between every two buffer bumps is between 1 mm and 3 mm.
In some embodiments, the material of each buffer bump is insulating ink.
In some embodiments, each buffer unit further includes a buffer wall covering the corresponding conductive unit and surrounding the buffer bump, the first electrode, and the second electrode.
In some embodiments, the buffer wall is a hollow square.
In some embodiments, the material of each buffer wall is insulating ink.
In some embodiments, the pressure sensing device further includes a release layer disposed on the encapsulation layer and having a hardness greater than that of the encapsulation layer.
In some embodiments, the pressure sensing module further includes a plurality of adhesion units disposed on the substrate and respectively corresponding to the conductive units, each adhesion unit having a plurality of adhesion bodies disposed around the first electrode and the second electrode for adhering to a lower surface of the pressure sensing block.
In some embodiments, the conductive units of each pressure sensing module are arranged at intervals along the left-right direction, the first electrode and the second electrode of each conductive unit are spaced along the front-back direction, and the pressure sensing device includes a plurality of pressure sensing modules.
It is another object of the present invention to provide another pressure sensing device that can ensure that each pressure sensing block in a packaged pressure sensing device is maintained in a predetermined non-stressed state.
In some embodiments, the pressure sensing device of the present invention is adapted to sense pressure and is adapted to be electrically connected to a processing unit. The pressure sensing device comprises a substrate, at least one pressure sensing module and a packaging layer. The pressure sensing module is arranged on the substrate and comprises a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit is provided with a first electrode and a second electrode which are arranged on the substrate at intervals, a first lead which is connected with the first electrode and used for grounding, and a second lead which is connected with the second electrode and suitable for being electrically connected with the processing unit. The pressure sensing blocks are respectively arranged on the conductive units, and each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees. Each buffer unit is arranged between each corresponding conductive unit and each pressure sensing block, and each buffer unit comprises a buffer wall which is annularly arranged on the corresponding conductive unit. The packaging layer is combined with the substrate and the conductive unit and the pressure sensing block of the pressure sensing module.
In some embodiments, the height of the buffer wall is between 0.01 mm and 0.05 mm.
In some embodiments, the buffer wall is a hollow square.
In some embodiments, the material of each buffer wall is insulating ink.
In some embodiments, the pressure sensing device further includes a release layer disposed on the encapsulation layer and having a hardness greater than that of the encapsulation layer.
In some embodiments, the pressure sensing module further includes a plurality of adhesion units disposed on the substrate and respectively corresponding to the conductive units, each adhesion unit having a plurality of adhesion bodies disposed around the first electrode and the second electrode for adhering to a lower surface of the pressure sensing block.
In some embodiments, each pressure sensing block further has an insulating layer, and the circuit structure is a plurality of conductive particles dispersed in the insulating layer.
In some embodiments, the conductive units of each pressure sensing module are arranged at intervals along the left-right direction, the first electrode and the second electrode of each conductive unit are spaced along the front-back direction, and the pressure sensing device includes a plurality of pressure sensing modules.
In addition, one of the objectives of the present invention is to provide a method for manufacturing a pressure sensing device.
In some embodiments, the method for manufacturing a pressure sensing device includes forming a plurality of conductive units on a substrate by screen printing, each conductive unit having a first electrode and a second electrode spaced apart from each other and disposed on the substrate; forming a plurality of buffer units on the conductive units in a screen printing mode, wherein each buffer unit comprises a plurality of buffer salient points which are arranged on the first electrodes and the second electrodes of the corresponding conductive units in an array mode; providing a plurality of pressure sensing blocks which are respectively arranged on the buffer unit, wherein each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees; and bonding a packaging layer to the substrate, the conductive unit and the pressure sensing block in a hot pressing manner.
In some embodiments, after the step of screen printing the buffer bumps, a step of forming a plurality of buffer walls surrounding the buffer bumps, the first electrode and the second electrode on the conductive unit by screen printing is further included.
In some embodiments, the encapsulation layer is thermally compression bonded to the substrate, the conductive unit and the pressure sensing block together with a release layer having a hardness greater than that of the encapsulation layer.
Another object of the present invention is to provide another method for manufacturing a pressure sensing device.
In some embodiments, the method for manufacturing a pressure sensing device includes forming a plurality of conductive units on a substrate by screen printing, each conductive unit having a first electrode and a second electrode spaced apart from each other and disposed on the substrate; forming a plurality of buffer units on the conductive units in a screen printing mode, wherein each buffer unit comprises a buffer wall which is annularly arranged on the corresponding conductive unit; providing a plurality of pressure sensing blocks which are respectively arranged on the buffer unit, wherein each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees; and bonding a packaging layer to the substrate, the conductive unit and the buffer unit in a hot pressing mode.
In some embodiments, the encapsulation layer is thermally compression bonded to the substrate, the conductive unit and the pressure sensing block together with a release layer having a hardness greater than that of the encapsulation layer.
The invention has the beneficial effects that: the pressure sensing blocks are respectively and electrically connected with the first electrodes and the second electrodes of the conductive units, when a pressure sensing module of the pressure sensing device is pressed, the circuit structure of the pressure sensing blocks generates resistance change, so that currents with different magnitudes flow through the first electrodes and the second electrodes, and the processing unit can further judge the magnitude of the pressure; in addition, by arranging the buffer unit on the conductive unit, no matter the buffer unit is a plurality of buffer bumps arranged on the first electrode and the second electrode in an array manner or a buffer wall annularly arranged on the first electrode and the second electrode, the pressure sensing blocks can be prevented from being excessively and tightly connected to the first electrode and the second electrode of the conductive unit when the pressure sensing blocks are packaged by the packaging layer, and each pressure sensing block in the packaged pressure sensing device is ensured to be kept in a preset non-stressed state, so that the accurate pressure sensing sensitivity is achieved.
Drawings
Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a schematic top view of a pressure sensing device according to a first embodiment of the present invention;
FIG. 2 is a schematic side view of the first embodiment; illustrating a packaging layer of the first embodiment encapsulated in a substrate of the first embodiment;
FIG. 3 is a schematic top view, not shown, of the encapsulation layer, illustrating the pressure sensing modules of the first embodiment;
FIG. 4 is a block diagram illustrating the pressure sensing device of the first embodiment adapted to be electrically connected to a processing unit;
FIG. 5 is a schematic top view illustrating one of the conductive units of each pressure sensing module and one of the adhesive units of each pressure sensing module;
FIG. 6 is a schematic top view illustrating that one of the buffer units of each pressure sensing module is disposed on the conductive unit, and the buffer unit includes a plurality of buffer bumps arranged in an array on the corresponding conductive unit;
FIG. 7 is a schematic top view illustrating one of the pressure sensing blocks of each pressure sensing module being disposed on the conductive elements such that each buffer element is located between each corresponding conductive element and each pressure sensing block;
FIG. 8 is a cross-sectional view of the pressure sensing block having an insulating layer and a circuit structure disposed on the insulating layer, wherein the circuit structure is a plurality of conductive particles uniformly dispersed in the insulating layer;
FIG. 9 is a schematic top view of a portion of a second embodiment of the pressure sensing apparatus of the present invention, illustrating that each buffer unit of the second embodiment includes a buffer wall surrounding the corresponding conductive unit;
FIG. 10 is a schematic top view of a portion of a third embodiment of a pressure sensing device according to the present invention, illustrating that each buffer unit of the third embodiment includes a plurality of buffer bumps arranged in an array on the corresponding conductive unit, and a buffer wall surrounding the corresponding conductive unit and surrounding the buffer bumps;
FIG. 11 is a schematic side view of a pressure sensing device according to a fourth embodiment of the present invention, illustrating a release layer of the fourth embodiment disposed on a package layer of the fourth embodiment, wherein the release layer has a hardness greater than that of the package layer;
FIG. 12 is a flow chart of a method of manufacturing the first embodiment of the pressure sensing apparatus of the present invention;
FIG. 13 is a flowchart of a method of manufacturing the second embodiment of the pressure sensing device of the present invention;
FIG. 14 is a flow chart of a method of manufacturing the third embodiment of the pressure sensing device of the present invention; and
FIG. 15 is a flowchart of a method for manufacturing the fourth embodiment of the pressure sensing device of the present invention.
Detailed Description
Before the present invention is described in detail, it should be noted that in the following description, like elements are represented by like reference numerals.
Referring to fig. 1 and 4, the pressure sensing apparatus 100 of the present invention is suitable for sensing pressure and electrically connecting to a processing unit 4. In this embodiment, the pressure sensing device 100 is illustrated as being disposed in a seat cushion (not shown), the processing unit 4 may be a processor disposed in a seat back (not shown) connected to the seat cushion, and when the processing unit 4 receives a signal transmitted by the pressure sensing device 100, the processing unit 4 sends another signal to a terminal device (such as a smart phone, a tablet computer, a desktop computer, etc.) for an operator to observe and evaluate the pressure on the seat cushion and the pressure values of different areas on the seat cushion when the seat cushion bears a user. In an alternative implementation, the pressure sensing device 100 may be disposed in a mattress, an insole or other equipment, and the processing unit 4 may also be a remote device that receives the signal transmitted by the pressure sensing device 100 by wireless transmission, which is not limited to any of the above embodiments.
Referring to fig. 1 to 4, a pressure sensing device according to a first embodiment of the present invention includes a substrate 1, a plurality of pressure sensing modules 2, and an encapsulation layer 3. In the present embodiment, the substrate 1 is made of polyethylene terephthalate (PET), and has a rectangular sheet shape. Each pressure sensing module 2 is disposed on the surface of the substrate 1 in a long shape extending along a left-right direction D1, and the pressure sensing modules 2 are arranged on the surface of the substrate 1 at intervals along a front-back direction D2, so that the pressure sensing modules 2 are uniformly disposed on the substrate 1, and pressure values of each region on the substrate 1 can be completely measured as much as possible.
Referring to fig. 5 and 6, each pressure sensing module 2 includes a plurality of conductive units 21, a plurality of adhesion units 22, a plurality of pressure sensing blocks 23, and a plurality of buffer units 24. The conductive elements 21 are arranged at intervals along the left-right direction D1, and each conductive element 21 has a first electrode 211 and a second electrode 212 disposed on the substrate 1 at intervals along the front-back direction D2, a first conductive line 213 connected to the first electrode 211 and grounded, and a second conductive line 214 connected to the second electrode 212 and adapted to be electrically connected to the processing unit 4. The first electrode 211 and the second electrode 212 are mirror-symmetric T-shaped structures, and in this embodiment, the length of the first side T1 of the first electrode 211 and the second electrode 212 is 7.9 mm, the length of the second side T2 of the first electrode 211 and the second electrode 212 is 2 mm, the length of the third side T3 of the first electrode 211 and the second electrode 212 is 1.7 mm, and the length of the fourth side T4 of the first electrode 211 and the second electrode 212 is 1.7 mm, so that the size of the first electrode 211 and the second electrode 212 of each conductive unit 21 can be miniaturized, but is not limited by the above values. The first wires 213 of the conductive elements 21 respectively extend upward from the upper sides of the corresponding first electrodes 211 for a short distance and then are connected along the left-right direction D1, and then extend to the right to be grounded. The second wires 214 of the conductive elements 21 extend downward from the lower side of the corresponding second electrode 212 for a certain distance and then extend to the right side by side to the side edge of the substrate 1.
Referring to fig. 5, the adhesion units 22 are disposed on the substrate 1 and respectively correspond to the conductive units 21 for respectively adhering the pressure sensing blocks 23. Each of the adhesive units 22 has four adhesive bodies 221 disposed around the first electrode 211 and the second electrode 212. In the present embodiment, the adhesion bodies 221 are respectively located at four concave included angles of the T-shaped structure of the first electrode 211 and the second electrode 212, and the diameter R1 of each adhesion body 221 is 1.5 mm. The miniaturization of the pressure sensing module 2 is also facilitated by the arrangement positions of the first electrode 211, the second electrode 212 and the adhesive 221 and the diameter of the adhesive 221.
Referring to fig. 3, 5 to 8, the pressure sensing blocks 23 are respectively disposed on the conductive units 21, and each of the pressure sensing blocks 23 can generate different resistance values corresponding to different compression degrees so that different currents flow through the first electrode 211 and the second electrode 212. Specifically, each pressure sensing block 23 has an insulating layer 231, and a circuit structure 232 disposed on the insulating layer 231. The lower surface of the insulating layer 231 is adhered to the adhesive body 221 of each adhesive unit 22, so that the lower surface of the pressure sensing block 23 can be mechanically connected to the substrate 1 through the adhesive body 221 and the circuit structure 232 is electrically connected to the corresponding first electrode 211 and the second electrode 212 of the conductive unit 21. In this embodiment, the insulating layer 231 is made of rubber material, the circuit structure 232 is a plurality of conductive particles 232a uniformly dispersed in the insulating layer 231 in an up-down direction D3, and a plurality of portions of the conductive particles 232a are exposed on the lower surface of the insulating layer 231 to be electrically connected to the corresponding first electrode 211 and the second electrode 212 of the conductive unit 21, so that the pressure sensing block 23 becomes a pressure sensing conductive elastomer. In detail, when the pressure sensing block 23 is in a normal state without being pressed, the distance between the conductive particles 232a is large, so that the resistance of the pressure sensing block 23 approaches infinity, current cannot flow through the conductive particles 232a to the first electrode 211 and the second electrode 212, when the pressure sensing module 2 is pressed along the up-down direction D3, so that part or all of the pressure sensing block 23 is in a pressed state, the insulating layer 231 of the pressure sensing block 23 is elastically deformed, and as the pressure applied to the pressure sensing block 23 increases, the distance between the conductive particles 232a decreases, the resistance value of the pressure sensing block 23 also decreases, and thus current can flow through the conductive particles 232a to the first electrode 211 and the second electrode 212, and different current values are formed corresponding to different resistance values, further, the processing unit 4 provides different signals for the operator to evaluate the magnitude of the pressure value. In an alternative embodiment, the pressure sensing block 23 may also be a conductive block of another embodiment, and the circuit structure 232 may also be made of another piezoelectric structure, which is not limited to this embodiment.
Referring to fig. 2, 3 and 6, each buffer unit 24 is disposed between each corresponding conductive unit 21 and each corresponding pressure sensing block 23 for buffering a pressure caused by a roller (not shown) when the package layer 3 is thermally pressed on the substrate 1 and the pressure sensing module 2 to the pressure sensing block 23. Specifically, in the present embodiment, each buffer unit 24 includes a plurality of buffer bumps 241 arranged in an array on the first electrode 211 and the second electrode 212 of the corresponding conductive unit 21, and each buffer bump 241 is made of insulating ink. The material of the encapsulation layer 3 is Thermoplastic Polyurethane (TPU), and the encapsulation layer is bonded to the substrate 1 and the conductive unit 21 and the buffer unit 24 of the pressure sensing module 2 by hot pressing with a roller in the manufacturing process of the pressure sensing device 100, so as to complete the encapsulation of the pressure sensing device 100. Therefore, by pre-disposing the buffer bumps 241 on the first electrode 211 and the second electrode 212 of the conductive unit 21, the buffer bumps 241 can absorb the pressure generated by the roller hot-pressing the pressure sensing block 23 during the hot-press packaging process of the pressure sensing apparatus 100, so as to prevent the pressure sensing block 23 from being too tightly connected with the first electrode 211 and the second electrode 212 when the roller is pressed, thereby preventing the pressure sensing sensitivity from being misaligned, and ensure that each pressure sensing block 23 in the packaged pressure sensing apparatus is kept in a preset non-pressed state before use, so as to achieve a more accurate pressure sensing sensitivity. In the present embodiment, each of the buffer bumps 241 has a height between 0.01 mm and 0.05 mm, a diameter between 0.1 mm and 0.5 mm, and a distance between every two buffer bumps 241 is between 1 mm and 3 mm, and the buffer bumps can be correspondingly disposed on the miniaturized pressure sensing module 2, but the numerical range is not limited thereto.
The pressure sensing device 100 of the present invention can be implemented in different ways, and the following embodiments are only described with reference to the differences from the first embodiment.
Referring to fig. 9, a second embodiment of the pressure sensing apparatus 100 according to the present invention is shown, in which each buffer unit 24 of the second embodiment includes a buffer wall 242 surrounding the corresponding conductive unit 21. Specifically, the buffer wall 242 is made of insulating ink, and surrounds the first electrode 211 and the second electrode 212 in a hollow square shape. The height of the buffer wall 242 is 0.01 mm, the inner perimeter is 24 mm (i.e. each inner side is 6 mm), and the outer perimeter can be between 32 mm and 56 mm (i.e. each outer side can be 8 mm, 10 mm, 12 mm or 14 mm). By pre-arranging the buffer wall 242 on the conductive unit 21, the pressure sensing apparatus can also achieve the effect of preventing the pressure sensing block 23 from being too tightly connected to the first electrode 211 and the second electrode 212 after being rolled by a roller to cause misalignment of the pressure sensing sensitivity in the hot pressing process.
Referring to fig. 10, in a third embodiment of the pressure sensing apparatus 100 of the present invention, each buffer unit 24 of the third embodiment includes the buffer bump 241 according to the first embodiment and the buffer wall 242 according to the second embodiment, that is, each buffer unit 24 includes a plurality of buffer bumps 241 arranged in an array on the first electrode 211 and the second electrode 212 of the corresponding conductive unit 21, and a buffer wall 242 surrounding the corresponding buffer bump 241, the first electrode 211 and the second electrode 212 on the corresponding conductive unit 21.
Referring to fig. 11, a fourth embodiment of the pressure sensing device 100 according to the present invention is shown, in which the pressure sensing device 100 further includes a release layer 5 disposed on the encapsulation layer 3 and having a hardness greater than that of the encapsulation layer 3. The release layer 5 plays a role corresponding to the buffer unit 24 (see fig. 6). That is, the release layer 5 is bonded to the package layer 3 in advance, so that the release layer 5 can assist in absorbing the pressure generated when the pressure sensing device 100 is hot-pressed on the pressure sensing block 23 by a roller in the hot-press packaging process, the pressure sensing block 23 is prevented from being too tightly connected to the first electrode 211 and the second electrode 212 after being rolled by the roller to cause misalignment of the pressure sensing sensitivity, each pressure sensing block 23 in the packaged pressure sensing device 100 is ensured to be kept in a preset unstressed state, and the release layer 5 is peeled off after the hot-press packaging is completed, thereby completing the pressure sensing device 100.
Referring to fig. 12, the method for manufacturing the pressure sensing device 100 of the first embodiment includes steps S1 through S4, which are as follows:
in step S1, a plurality of conductive elements 21 are formed on a substrate 1 by screen printing. Each conductive unit 21 is made of conductive silver paste, and has a first electrode 211 and a second electrode 212 disposed on the substrate 1 at intervals, a first wire 213 connected to the first electrode 211, and a second wire 214 connected to the second electrode 212.
In step S2, a plurality of buffer units 24 are formed on the conductive unit 21 by screen printing. Each buffer unit 24 includes a plurality of buffer bumps 241 arranged in an array on the first electrode 211 and the second electrode 212 of the corresponding conductive unit 21.
In step S3, a plurality of pressure sensing blocks 23 are provided and respectively disposed on the conductive units 21, and each pressure sensing block 23 has a circuit structure 232 electrically connected to the corresponding first electrode 211 and the second electrode 212 of the conductive unit 21 and capable of generating different resistances at different degrees of compression. In this step, the pressure sensing block 23 and the substrate 1 are bonded by disposing the adhesive 221 around the first electrode 211 and the second electrode 212, so that the pressure sensing block 23 is mechanically and electrically connected to the first electrode 211 and the second electrode 212.
Step S4, a package layer 3 is bonded to the substrate 1, the conductive element 21 and the buffer element 24 by thermal pressing, so as to complete the pressure sensing device 100 of the first embodiment.
The manufacturing method of each of the following embodiments will be described only with respect to differences from the first embodiment.
Referring to fig. 13, a difference between the manufacturing method of the pressure sensing device 100 of the second embodiment and the manufacturing method of the pressure sensing device 100 of the first embodiment is that in step S2 of the second embodiment, a plurality of buffer units 24 are formed on the conductive unit 21 by screen printing, and each buffer unit 24 includes a buffer wall 242 surrounding the corresponding conductive unit 21 and surrounding the first electrode 211 and the second electrode 212 in a hollow square shape.
Referring to fig. 14, a manufacturing method of the pressure sensing device 100 of the third embodiment is different from the manufacturing method of the pressure sensing device 100 of the first embodiment in that the third embodiment further includes a step S2' of forming a plurality of buffer walls 242 surrounding the buffer bumps 241, the first electrodes 211 and the second electrodes 212 on the conductive elements 21 by screen printing after the step S2 of screen printing the buffer bumps.
Referring to fig. 15, a manufacturing method of the pressure sensing device 100 of the fourth embodiment is different from the manufacturing method of the pressure sensing device 100 of the first embodiment in that step S4 of the fourth embodiment is to thermally bond an encapsulation layer 3 and a release layer 5 having a hardness greater than that of the encapsulation layer 3 to the substrate 1, the conductive elements 21 and the pressure sensing blocks 23. Of course, in a modified embodiment, step S4 of the manufacturing method of the second embodiment and the third embodiment may be changed to step S4 of the manufacturing method of the fourth embodiment, and the embodiment is not limited thereto.
In summary, in the pressure sensing apparatus 100 of the present invention, the plurality of pressure sensing blocks 23 are respectively and electrically connected to the first electrodes 211 and the second electrodes 212 of the plurality of conductive units 21, when the pressure sensing module 2 of the pressure sensing apparatus 100 is pressed, the circuit structure 232 of the pressure sensing block 23 generates resistance changes, so that currents with different magnitudes flow through the first electrodes 211 and the second electrodes 212, and the processing unit 4 can further determine the magnitude of the pressure for the operator to observe; in addition, by disposing the buffer unit 24 on the conductive unit 21, no matter the buffer unit 24 is a plurality of buffer bumps 241 arranged in an array on the first electrode 211 and the second electrode 212, or a buffer wall 242 annularly disposed on the first electrode 211 and the second electrode 212, it is able to prevent the pressure sensing block 23 from being excessively tightly connected to the first electrode 211 and the second electrode 212 of the conductive unit 21 when the pressure sensing block 23 is packaged by the packaging layer 3, so as to ensure that each pressure sensing block 23 in the packaged pressure sensing device is kept in a predetermined non-pressed state, so as to achieve a more precise pressure sensing sensitivity, and thus the object of the present invention can be achieved.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and the invention is still within the scope of the present invention by simple equivalent changes and modifications made according to the claims and the contents of the specification.
Claims (25)
1. A pressure sensing device adapted for sensing pressure and adapted for electrically connecting to a processing unit, the pressure sensing device comprising:
a substrate, a first electrode and a second electrode,
at least one pressure sensing module disposed on the substrate, the pressure sensing module including
A plurality of conductive units, each conductive unit having a first electrode and a second electrode disposed on the substrate at intervals, a first conductive line connected to the first electrode and grounded, and a second conductive line connected to the second electrode and adapted to be electrically connected to the processing unit,
the pressure sensing blocks are respectively arranged on the conductive units, and each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees;
each buffer unit is arranged between each corresponding conductive unit and each pressure sensing block and comprises a plurality of buffer salient points which are arranged on the first electrode and the second electrode of the corresponding conductive unit in an array mode so as to ensure that the pressure sensing blocks are kept in a preset non-stressed state before use; and
and the packaging layer is bonded with the substrate, the conductive unit of the pressure sensing module and the pressure sensing block.
2. The pressure sensing device of claim 1, wherein: the height of each buffer bump is between 0.01 mm and 0.05 mm.
3. The pressure sensing device of claim 1, wherein: the diameter of each buffer bump is between 0.1 mm and 0.5 mm.
4. The pressure sensing device of claim 1, wherein: the distance between every two buffer bumps is between 1 mm and 3 mm.
5. The pressure sensing device of claim 1, wherein: the material of each buffering salient point is insulating ink.
6. The pressure sensing device of claim 1, wherein: each buffer unit also comprises a buffer wall which is covered on the corresponding conductive unit and surrounds the buffer salient point, the first electrode and the second electrode.
7. The pressure sensing device of claim 6, wherein: the buffer wall is hollow and square.
8. The pressure sensing device of claim 6, wherein: the material of each buffer wall is insulating ink.
9. The pressure sensing device of claim 1, wherein: the packaging structure also comprises a release layer which is arranged on the packaging layer and has hardness larger than that of the packaging layer.
10. The pressure sensing device of claim 1, wherein: the pressure sensing module further comprises a plurality of adhesion units which are arranged on the substrate and respectively correspond to the conductive units, and each adhesion unit is provided with a plurality of adhesion bodies which are positioned on the periphery of the first electrode and the second electrode and used for adhering to the lower surface of the pressure sensing block.
11. The pressure sensing device of claim 1, wherein: each pressure sensing block is also provided with an insulating layer, and the circuit structure is a plurality of conductive particles dispersed in the insulating layer.
12. The pressure sensing device of claim 1, wherein: the conductive units of each pressure sensing module are arranged at intervals along the left-right direction, the first electrode and the second electrode of each conductive unit are spaced in the front-back direction, and the pressure sensing device comprises a plurality of pressure sensing modules.
13. A pressure sensing device adapted to sense pressure and electrically connected to a processing unit, the pressure sensing device comprising:
a substrate, a first electrode and a second electrode,
at least one pressure sensing module disposed on the substrate, the pressure sensing module including
A plurality of conductive units, each conductive unit having a first electrode and a second electrode disposed on the substrate at intervals, a first conductive line connected to the first electrode and grounded, and a second conductive line connected to the second electrode and electrically connected to the processing unit,
a plurality of pressure sensing blocks respectively arranged on the conductive units, each pressure sensing block having a circuit structure electrically connected with the first electrode and the second electrode of the corresponding conductive unit and capable of generating different resistances at different compression degrees, an
Each buffer unit is arranged between each corresponding conductive unit and each pressure sensing block and comprises a buffer wall annularly arranged on the corresponding conductive unit so as to ensure that the pressure sensing blocks are kept in a preset non-stressed state before use; and
and the packaging layer is bonded with the substrate, the conductive unit of the pressure sensing module and the pressure sensing block.
14. The pressure sensing device of claim 13, wherein: the height of the buffer wall is between 0.01 mm and 0.05 mm.
15. The pressure sensing device of claim 13, wherein: the buffer wall is hollow and square.
16. The pressure sensing device of claim 13, wherein: the material of each buffer wall is insulating ink.
17. The pressure sensing device of claim 13, wherein: the packaging structure also comprises a release layer which is arranged on the packaging layer and has hardness larger than that of the packaging layer.
18. The pressure sensing device of claim 13, wherein: the pressure sensing module further comprises a plurality of adhesion units which are arranged on the substrate and respectively correspond to the conductive units, and each adhesion unit is provided with a plurality of adhesion bodies which are positioned on the periphery of the first electrode and the second electrode and used for adhering to the lower surface of the pressure sensing block.
19. The pressure sensing device of claim 13, wherein: each pressure sensing block is also provided with an insulating layer, and the circuit structure is a plurality of conductive particles dispersed in the insulating layer.
20. The pressure sensing device of claim 13, wherein: the conductive units of each pressure sensing module are arranged at intervals along the left-right direction, the first electrode and the second electrode of each conductive unit are spaced in the front-back direction, and the pressure sensing device comprises a plurality of pressure sensing modules.
21. A method of manufacturing a pressure sensing device, the method comprising:
forming a plurality of conductive units on a substrate in a screen printing mode, wherein each conductive unit is provided with a first electrode and a second electrode which are arranged on the substrate at intervals;
forming a plurality of buffer units on the conductive units in a screen printing mode, wherein each buffer unit comprises a plurality of buffer salient points which are arranged on the first electrodes and the second electrodes of the corresponding conductive units in an array mode;
providing a plurality of pressure sensing blocks which are respectively arranged on the buffer unit, wherein each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees; and
and the packaging layer is bonded to the substrate, the conductive unit and the pressure sensing block in a hot pressing mode, and the buffer unit ensures that the pressure sensing block is kept in a preset non-pressed state before use during hot pressing.
22. The manufacturing method according to claim 21, characterized in that: after the step of screen printing the buffer bumps, the method further comprises the step of forming a plurality of buffer walls which respectively surround the buffer bumps, the first electrodes and the second electrodes on the conductive units in a screen printing mode.
23. The manufacturing method according to claim 21, characterized in that: the packaging layer and a release layer with hardness larger than that of the packaging layer are thermally pressed and bonded together on the substrate, the conductive unit and the pressure sensing block.
24. A method of manufacturing a pressure sensing device, the method comprising:
forming a plurality of conductive units on a substrate in a screen printing mode, wherein each conductive unit is provided with a first electrode and a second electrode which are arranged on the substrate at intervals;
forming a plurality of buffer units on the conductive units in a screen printing mode, wherein each buffer unit comprises a buffer wall which is annularly arranged on the corresponding conductive unit;
providing a plurality of pressure sensing blocks which are respectively arranged on the buffer unit, wherein each pressure sensing block is provided with a circuit structure which is electrically connected with the first electrode and the second electrode of the corresponding conductive unit and can generate different resistances at different compression degrees; and
and the packaging layer is bonded to the substrate, the conductive unit and the pressure sensing block in a hot pressing mode, and the buffer unit ensures that the pressure sensing block is kept in a preset non-pressed state before use during hot pressing.
25. The manufacturing method according to claim 24, characterized in that: the packaging layer and a release layer with the hardness larger than that of the packaging layer are thermally pressed and bonded together on the substrate, the conductive unit and the pressure sensing block.
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| US8669952B2 (en) * | 2011-06-09 | 2014-03-11 | Sharp Laboratories Of America, Inc. | Metallic nanoparticle pressure sensor |
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| JPH10256311A (en) * | 1997-03-17 | 1998-09-25 | Hitachi Chem Co Ltd | Multi-chip mounting method |
| KR20030040763A (en) * | 2001-11-16 | 2003-05-23 | 가부시키가이샤 히타치세이사쿠쇼 | Multi-chip module |
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