TW200606744A - Fingerprint sensor package with electrostatic discharge on chip - Google Patents

Fingerprint sensor package with electrostatic discharge on chip

Info

Publication number
TW200606744A
TW200606744A TW093124052A TW93124052A TW200606744A TW 200606744 A TW200606744 A TW 200606744A TW 093124052 A TW093124052 A TW 093124052A TW 93124052 A TW93124052 A TW 93124052A TW 200606744 A TW200606744 A TW 200606744A
Authority
TW
Taiwan
Prior art keywords
fingerprint sensor
chip
electrostatic discharge
sensor chip
package body
Prior art date
Application number
TW093124052A
Other languages
Chinese (zh)
Other versions
TWI250465B (en
Inventor
Yung-Li Lu
Gwo-Liang Weng
Ying-Tsai Yeh
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93124052A priority Critical patent/TWI250465B/en
Publication of TW200606744A publication Critical patent/TW200606744A/en
Application granted granted Critical
Publication of TWI250465B publication Critical patent/TWI250465B/en

Links

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

A fingerprint sensor package with electrostatic discharge on chip mainly includes a substrate, a fingerprint sensor chip, an ESD (electrostatic discharge) bar, and a package body. The fingerprint sensor chip is attached to the substrate. The ESD bar protrudes from the active surface of the fingerprint sensor chip. The package body is formed on the substrate and surrounds the fingerprint sensor chip. The package body is higher than the active surface of the fingerprint sensor chip and partially covers a portion of the active surface so as to connect the ESD bar. Moreover the package body has an opening exposing at least the sensor region of the fingerprint sensor chip on the active surface. The ESD bar is also partially exposed out of the package body along the fringes of the opening to achieve electrostatic discharge on chip.
TW93124052A 2004-08-11 2004-08-11 Fingerprint sensor package with electrostatic discharge on chip TWI250465B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93124052A TWI250465B (en) 2004-08-11 2004-08-11 Fingerprint sensor package with electrostatic discharge on chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93124052A TWI250465B (en) 2004-08-11 2004-08-11 Fingerprint sensor package with electrostatic discharge on chip

Publications (2)

Publication Number Publication Date
TW200606744A true TW200606744A (en) 2006-02-16
TWI250465B TWI250465B (en) 2006-03-01

Family

ID=37433047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93124052A TWI250465B (en) 2004-08-11 2004-08-11 Fingerprint sensor package with electrostatic discharge on chip

Country Status (1)

Country Link
TW (1) TWI250465B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112240810A (en) * 2019-07-18 2021-01-19 美宸科技股份有限公司 Pressure sensing device and manufacturing method thereof
TWI723467B (en) * 2019-07-18 2021-04-01 美宸科技股份有限公司 Pressure sensing device and manufacturing method thereof
CN113284420A (en) * 2021-05-26 2021-08-20 武汉华星光电半导体显示技术有限公司 Display device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408782B (en) * 2007-08-31 2013-09-11 Chipbond Technology Corp Sliding type thin fingerprint sensor package
CN106326807B (en) 2015-06-24 2020-02-11 神盾股份有限公司 Fingerprint sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112240810A (en) * 2019-07-18 2021-01-19 美宸科技股份有限公司 Pressure sensing device and manufacturing method thereof
TWI723467B (en) * 2019-07-18 2021-04-01 美宸科技股份有限公司 Pressure sensing device and manufacturing method thereof
CN112240810B (en) * 2019-07-18 2022-05-10 美宸科技股份有限公司 Pressure sensing device and manufacturing method thereof
CN113284420A (en) * 2021-05-26 2021-08-20 武汉华星光电半导体显示技术有限公司 Display device
CN113284420B (en) * 2021-05-26 2022-12-06 武汉华星光电半导体显示技术有限公司 Display device
US11895813B2 (en) 2021-05-26 2024-02-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display device

Also Published As

Publication number Publication date
TWI250465B (en) 2006-03-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees