TWI242851B - Fingerprint sensor package - Google Patents

Fingerprint sensor package Download PDF

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Publication number
TWI242851B
TWI242851B TW093111836A TW93111836A TWI242851B TW I242851 B TWI242851 B TW I242851B TW 093111836 A TW093111836 A TW 093111836A TW 93111836 A TW93111836 A TW 93111836A TW I242851 B TWI242851 B TW I242851B
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TW
Taiwan
Prior art keywords
fingerprint reader
substrate
package structure
fingerprint
item
Prior art date
Application number
TW093111836A
Other languages
Chinese (zh)
Other versions
TW200536075A (en
Inventor
Gwo-Liang Weng
Shih-Chang Lee
Original Assignee
Advanced Semiconductor Eng
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Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093111836A priority Critical patent/TWI242851B/en
Application granted granted Critical
Publication of TW200536075A publication Critical patent/TW200536075A/en
Publication of TWI242851B publication Critical patent/TWI242851B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

A fingerprint sensor package mainly includes a substrate, a semiconductor chip and a molding compound. Upper surface of the substrate includes a chip-attached region, a molded region and a fixing region. The semiconductor chip is attached to the chip-attached region of the substrate and is surrounded by the molding compound on the molded region. The semiconductor chip has an exposed fingerprint sensing surface for sensing fingerprint by sliding. The fixing region is formed around the molded region without covering of the molding compound for mounting or clamping a fixing component.

Description

1242851 五、發明說明（1) 【發明所屬之技術領域 本發明係有關於一種感測器封裝構造，特別係有關於 一種在半導體晶片上感應之指紋辨識器封裝構造。 【先前技術】 指紋辨識器係用於個人之辨認，主要區分為壓觸式、 觸滑式與光感式，該壓觸式指紋辨識器之封裝構造 數個壓感元件設在一玻璃基板，其係具有約略呈方形且較 大面積之指紋感測表面，以供手指直接按壓而感測^紋广 並且必須在該玻璃基板上裝設定址辨識之特殊應用積體電 ，曰=，其封裝組配步驟複雜且尺寸亦比觸滑式指紋辨 為更大。而觸滑式指紋辨識器之封裝構造係在一條形半導 〕上以積體電路製程製作出掃瞄式感測元 在^τ體晶片係貼設於—基板並與該基板電性連接， 膠之後’該觸滑式指紋辨識器之封裝構造可裝設 品上’使用時係將手指接觸該觸滑式指紋辨 感測表面並觸滑過該指紋感測表面，故該觸滑 =紋辨識器之封裝構造可以具有較小的尺寸且封裝：;己 公開=習r觸滑式指紋辨識器之封裝構造係已見於日本邊 器之ϊϋΐ特開2003-235830號所揭示者，該指紋辨識β Arra、/構4係為LGA封裝型態，LGA係為Land Grid 一半導/Λ格狀陣列〕之簡稱’其係在一 lga基板上貼設 板，由Ϊ = ί二並以複數個鮮線連接該半導體晶片與該基 、>成之封膠體將密封銲線並增加該半導體晶片1242851 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a sensor package structure, and more particularly, to a fingerprint reader package structure induced on a semiconductor wafer. [Previous technology] Fingerprint readers are used for personal identification, mainly divided into pressure-contact type, touch-slide type and light-sensing type. The pressure-sensitive fingerprint reader has a package structure in which several pressure-sensitive elements are arranged on a glass substrate. It has a fingerprint sensing surface that is approximately square and has a large area for direct finger pressing to sense ^ wide patterns and must be installed on the glass substrate for special application integrated circuit chip, said =, its package The assembling steps are complicated and the size is larger than the touch-slip fingerprint. The package structure of the touch-slip fingerprint reader is formed on a strip-shaped semiconductor], and a scanning sensor is produced by an integrated circuit manufacturing process. The scanning chip is attached to a substrate and electrically connected to the substrate. After the glue, the package structure of the touch-slip fingerprint reader can be mounted on the product. When using, the finger touches the touch-slip fingerprint recognition surface and slides over the fingerprint-sensing surface, so the touch-slip = texture The package structure of the identifier can have a smaller size and package :; has been disclosed = The package structure of the touch-slip fingerprint reader has been disclosed in Japanese Patent Publication No. 2003-235830, the fingerprint identification β Arra and / Architecture 4 are LGA package types, and LGA is Land Grid half-conductor / Λ lattice-shaped array.] It is short for 'a board is mounted on a lga substrate. The connection between the semiconductor wafer and the substrate will result in a sealed wire and increase the semiconductor wafer.

第7頁 1242851Page 7 1242851

發明說明（2) 之側面保護，但該封膠體必須顯露出該半導體晶片之指綵 $測表面’以辨識觸滑之指紋，由於該基板之下表面係以 =貧電性導通至外部電子裝置，若多次手指觸滑或施力過 ‘ t個封敦構造會搖動或鬆脫而造成斷路，無法辨識指 紋。 在一種習知觸滑式指紋辨識器之封裝構造如第1、2及 圖所示’第1圖係為該習知觸滑式指紋辨識器之封裝構造 之正面示意圖，第2圖係為該觸滑式指紋辨識器封裝構造 之截面不意圖，第3圖係為該觸滑式指紋辨識器封裝構造 之底面示意圖，該觸滑式指紋辨識器封裝構造1 〇〇係主要籲 包含一基板1 1 〇、一半導體晶片丨2〇、複數個銲線13〇以及 一壓模形成之封膠體140，該半導體晶片120之背面122係 可以一黏膠1 50黏貼在該基板]1〇之上表面丨丨1〔如第2圖所 示〕並以遺些銲線1 3 0電性連接該半導體晶片1 2 〇與該基 板110，該封膠體140係包覆該些銲線13〇以及該半導體晶 片1 2 0之^曰紋感測表面1 2 1部分周邊與側面，而顯露該半導 體晶片120之指紋感測表面121，而該基板11〇之下表面112 係設有複數個導接至該半導體晶片1 2〇之連接墊丨丨3，並以 銲膏〔圖未繪出〕電性連接至一外部電子裝置，由於該觸 滑式指紋辨識器封裝構造丨00僅以銲膏定位於外部電子裝馨 置，而該觸滑式指紋辨識器封裝構造丨〇〇係需要經常以^ 指觸滑該半導體晶片120之指紋感測表面121，因此容易造 成該觸滑式指紋辨識器封裝構造1〇〇搖動或鬆脫，而無法 辨識觸滑之指紋。此外，在壓觸式指紋辨識器之封裝構造Description of the invention (2) The side protection, but the encapsulant must show the fingerprint surface of the semiconductor wafer to identify the slippery fingerprints, because the lower surface of the substrate is conductive to the external electronic device with = poor electrical conductivity If the finger is slipped or force is applied for many times, the seal structure will be shaken or loosen, which will cause a disconnection, and the fingerprint cannot be identified. The package structure of a conventional touch-slip fingerprint reader is shown in Figs. 1, 2 and 'The first figure is a schematic front view of the package structure of the conventional touch-slip fingerprint reader, and the second figure is the The cross-section of the touch-slip fingerprint reader package structure is not intended. Figure 3 is a schematic diagram of the bottom surface of the touch-slip fingerprint reader package structure. The touch-slip fingerprint reader package structure 1 00 mainly calls for a substrate 1 10, a semiconductor wafer, 20, a plurality of bonding wires 13, and a sealant 140 formed by a stamper. The back surface 122 of the semiconductor wafer 120 can be adhered to the substrate with an adhesive 1 50] 1 10丨 丨 1 [as shown in FIG. 2] and electrically connecting the semiconductor wafer 1 2 0 and the substrate 110 with some bonding wires 130, and the sealing compound 140 covers the bonding wires 13 and the semiconductor The fingerprint sensing surface 1 2 1 of the chip 1 2 0 is partially peripheral and side, and the fingerprint sensing surface 121 of the semiconductor wafer 120 is exposed, and the lower surface 112 of the substrate 11 is provided with a plurality of leads. Connection pads for semiconductor wafers 1 2 and 3 and solder paste [not shown] It is electrically connected to an external electronic device. Since the touch-slip fingerprint reader package structure is only located on the external electronic device with solder paste, the touch-slip fingerprint reader package structure. ^ Finger-sliding the fingerprint sensing surface 121 of the semiconductor wafer 120, so it is easy to cause the touch-sliding fingerprint reader package structure to be shaken or loosened 100 times, and it is impossible to recognize the fingerprints that are slipping. In addition, the package structure of the pressure contact fingerprint reader

第8頁 1242851Page 8 1242851

亦會有因使用時壓觸施 器之封裝構搖動或鬆脫 問題。 力過當，而造成該壓觸式指紋辨識 而造成斷路，以致無法辨識指紋之 【發明内容】 本發明之主要目的传在於挺仰 ^ t 造，一美你夕p^ ^在楗供一種指紋辨識器封裝構 基板之上表面係包含有一黏一 位區·，該黏晶區係貼設有一半導_曰κ 封膠£及一定 有一封脒舯— 牛導體曰曰片，該封膠區係形成 元件Ϊ Γ系位於該封膠區外側，以供-定位 =叹置或失持，以達到增進該指紋辨識器封裝構造之上 =位功效’ I不因手指觸滑或壓觸施力過當導致搖 ^ ^發明之次一目的係在於提供一種指紋辨識器封裝構 ^ 4半導體晶片係貼設於基板之上表面，並電性導通至 該基板下表面之連接墊，該上表面係包含有一在周邊側翼 之定位區，以利穩固該基板之上板接合。 、 、，依本發明之指紋辨識器封裝構造，其係包含一基板、 一半導體晶片及一封膠體，其中該基板係具有一上表面及 一下表面，該上表面係包含有一黏晶區、一封膠區及一定 位區’該半導體晶片係貼設於該基板之該黏晶區並且電性 連接至該基板，該半導體晶片係可為觸滑式或壓觸式指紋_ 辨硪晶片’其係具有一指紋感測表面，用以感測觸滑或壓 觸之指紋’該封膠體係形成於該基板之該封膠區，且顯露 5亥半導體晶片之指紋感測表面，其中，該基板之定位區係 位於該封膠區外側且不被該封膠體覆蓋，以供一定位元件There may also be problems with the packaging structure of the applicator shaking or loosening during use. Excessive force, which caused the pressure-touch fingerprint identification to cause a disconnection, so that the fingerprint could not be identified. [Summary of the Invention] The main purpose of the present invention is to support the ^ t-made, a beautiful you Xi p ^ ^ for a fingerprint recognition The upper surface of the device packaging structure substrate includes a sticky region. The sticky crystal region is provided with a half-conductor sealer. There must be a seal—a cow conductor. The forming element Ϊ Γ is located outside the sealing area for-positioning = sighing or loss, so as to improve the package structure of the fingerprint reader = bit effect 'I do not apply excessive force due to sliding or pressing of the finger The second purpose of the invention is to provide a fingerprint reader package structure. 4 A semiconductor wafer is attached to the upper surface of a substrate and is electrically connected to a connection pad on the lower surface of the substrate. The upper surface includes a connection pad. In the positioning area of the peripheral flanks, it is used to stabilize the board-to-board bonding. The fingerprint reader package structure according to the present invention comprises a substrate, a semiconductor wafer and a colloid, wherein the substrate has an upper surface and a lower surface, and the upper surface includes a sticky crystal region, a Sealing area and a positioning area 'The semiconductor wafer is attached to the die-bonding area of the substrate and is electrically connected to the substrate. The semiconductor wafer can be a touch-slip or pressure-contact fingerprint_ identification chip' It has a fingerprint sensing surface for sensing fingerprints that are slippery or pressed. The sealant system is formed in the sealant area of the substrate, and the fingerprint sensing surface of the semiconductor chip is exposed, wherein the substrate The positioning area is located outside the sealing area and is not covered by the sealing body for a positioning element

1242851 五、發明說明（4) 設置或夾持。 【實施方式】 參閱所附圖式，本發明將列舉以下之實施例說明。 依本發明之一具體實施例，第4圖係為一種指紋辨識 器封裝構造之基板上表面示意圖，第5圖係為該指紋辨識 器封裂構造之正面示意圖，第6圖係為該指紋辨識器封裝 構造結合有一定位元件之截面示意圖，第7圖係為該指紋 辨識器封裝構造結合有該定位元件之底面示意圖，請參閱 第5及6圖，一指紋辨識器封裝構造2 〇〇係包含一基板、 一半導體晶片2 2 0、複數個銲線2 3 0及一封膠體2 4 0，該基餐 板210之材質係可為BT、fr-4或FR-5樹脂製成之印刷電路 板’請參閱第4圖，該基板210係具有一上表面211及一下 表面2 1 2 ’該基板2 1 〇之上表面2 1 1係包含有一黏晶區2 1 4、 一封膠區215及一定位區216，該封膠區215係圍繞該黏晶 區2 1 4，該定位區2 1 6係位於該封膠區2 1 5外側，較佳地， 該定位區2 1 6係環繞形成於該上表面2 11之周邊側翼，而該 黏晶區2 1 4係比該封膠區2 1 5較為下沉，以利固定該半導體 晶片220，請參閱第6及7圖，而該基板210之下表面21 2係 設有彳复數個連接墊2 1 3，以供外部電性連接，在本實施例 中，該些連接墊2 1 3係形成在該黏晶區2 1 4與該封膠區2 1 5❿ 下方之下表面2 1 2，即該定位區2 1 6下方不配設有可作為訊 號傳遞之連接塾2 1 3但可以設有無傳遞功能之虛鮮墊 (dummy pad) ° 請參閱第5及6圖，該半導體晶片220係可為觸滑式或1242851 V. Description of the invention (4) Setting or clamping. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. According to a specific embodiment of the present invention, FIG. 4 is a schematic diagram of the upper surface of a substrate of a fingerprint reader packaging structure, FIG. 5 is a schematic front view of the fingerprint reader sealing structure, and FIG. 6 is the fingerprint recognition A schematic cross-sectional view of a packaging device incorporating a positioning component. Figure 7 is a schematic bottom view of the fingerprint reader packaging structure incorporating the positioning component. Please refer to Figures 5 and 6 for a fingerprint reader packaging structure. A substrate, a semiconductor wafer 2 2 0, a plurality of bonding wires 2 3 0, and a colloid 2 4 0. The material of the base plate 210 can be a printed circuit made of BT, fr-4 or FR-5 resin. Please refer to FIG. 4, the substrate 210 has an upper surface 211 and a lower surface 2 1 2 'The substrate 2 1 〇 upper surface 2 1 1 includes a sticky crystal region 2 1 4 and an adhesive region 215 And a positioning area 216, the sealing area 215 surrounds the sticky crystal area 2 1 4 and the positioning area 2 1 6 is located outside the sealing area 2 1 5. Preferably, the positioning area 2 1 6 surrounds Formed on the peripheral flanks of the upper surface 2 11, and the sticky crystal region 2 1 4 is smaller than the sealant region 2 1 5 For sinking, in order to fix the semiconductor wafer 220, please refer to FIGS. 6 and 7. The lower surface 21 2 of the substrate 210 is provided with a plurality of connection pads 2 1 3 for external electrical connection. In the embodiment, the connection pads 2 1 3 are formed on the lower surface 2 1 2 of the viscous region 2 1 4 and the sealant region 2 1 5❿, that is, the positioning region 2 1 6 is not provided below the positioning region 2 1 6 and can be used as Connection for signal transmission 塾 2 1 3 but can be provided with dummy pad without transmission function ° Please refer to Figures 5 and 6, the semiconductor chip 220 can be touch-slip or

第10頁 1242851 五，、發明說明，（5) 壓觸式指紋辨識晶片，其係具有一指紋感測表面2 2 1及一 對應之背面2 2 2，該指紋感測表面2 2 1係具有複數個感測元 件〔圖未繪出〕，如掃瞄感測元件或是壓觸感測元件，及 複數個在該指紋感測表面2 2 1側邊之銲墊2 2 3，該指紋感測 表面221包含有該些感測元件之區域係不可被該封膠體24〇 覆蓋’用以感測觸滑或壓觸之指紋，該半導體晶片2 2 0之 背面222係可以一黏膠26 0貼設於該基板21〇之該黏晶區214 〔如第4圖所示〕，該些銲線230係連接該半導體晶片220 之知墊2 2 3至該基板2 1 0之導接指〔圖未縿出〕，以電性連 接該半導體晶片22 0至該基板210之連接墊213。 再請參閱第5及6圖，該封膠體240係形成於該基板21 〇 之該封膠區215，且環繞該半導體晶片220，該封膠體240 係密封該些銲線23 0並覆蓋該些銲墊223，但該封膠體240 係顯露该半導體晶片2 2 〇具有感測元件之指紋感測表面 22 1 ’該顯露之指紋感測表面22 1係為矩形，以利觸滑或壓 觸辨識指紋，此外，該封膠體24 〇係不覆蓋該基板2丨〇之定 位區216，以供一定位元件25〇設置或夾持。 睛參閱第6及7圖，在上述之指紋辨識器封裝構造2 〇〇 中’該定位元件250係能固定該基板210之定位區216或對 應=该定位區21 6之下表面2 12部位，且該定位元件25〇可 以是額外裝設之獨立元件或是固定裝設於在其下方連接之 外電路板之外部夾扣件，如扣勾、螺栓、夾具或虛銲球 (dummy bal 1 )等等，在本實施例中，該定位元件25〇係為 下方電路板之外部夾扣件’而該指紋辨識器封裝構”造Page 10, 1242851 V. Description of the invention, (5) A pressure-sensitive fingerprint recognition chip, which has a fingerprint sensing surface 2 2 1 and a corresponding back surface 2 2 2. The fingerprint sensing surface 2 2 1 has A plurality of sensing elements (not shown in the figure), such as a scanning sensing element or a pressure-sensing sensing element, and a plurality of solder pads 2 2 3 on the side of the fingerprint sensing surface 2 2 1, the fingerprint sensing The area where the sensing surface 221 contains the sensing elements cannot be covered by the sealant 24 ′ to sense fingerprints that are slippery or pressed, and the back surface 222 of the semiconductor wafer 2 2 0 can be an adhesive 26 0 The sticky crystal region 214 attached to the substrate 21 (as shown in FIG. 4), the bonding wires 230 are connected to the conductive pads 2 2 3 of the semiconductor wafer 220 to the conductive fingers of the substrate 2 10 [ (Not shown in the figure), the semiconductor wafer 220 is electrically connected to the connection pad 213 of the substrate 210. Please refer to FIGS. 5 and 6 again. The sealing compound 240 is formed in the sealing region 215 of the substrate 21 0 and surrounds the semiconductor wafer 220. The sealing compound 240 seals the bonding wires 23 0 and covers the bonding wires 240. The bonding pad 223, but the encapsulant 240 reveals the semiconductor wafer 2 2 0. The fingerprint sensing surface 22 1 with a sensing element is rectangular. The exposed fingerprint sensing surface 22 1 is rectangular to facilitate slipping or pressing. In addition to the fingerprint, the sealing body 24o does not cover the positioning area 216 of the substrate 2o for a positioning element 25o to be set or clamped. Referring to FIGS. 6 and 7, in the above-mentioned fingerprint reader package structure 2000, the positioning element 250 is capable of fixing the positioning region 216 of the substrate 210 or corresponding = the positioning surface 21 12 below the surface 2 12. And the positioning element 25 can be an additional independent component or an external clip fixedly mounted on the external circuit board connected below it, such as a hook, bolt, clamp or dummy bal 1 Wait, in this embodiment, the positioning element 25 is an external clip of the lower circuit board, and the fingerprint reader package structure is made of

1242851 五、發明說明（6) 2 0 0在該基板2 1 G之定位區21 6可設有對應之定位孔或扣合 槽，以供該定位兀件250之結合，使該定位元件25〇能扣接 至該基板210之定位區216，故該指紋辨識器封裝構造2〇〇 能承受更多次或更大不當施力之指紋觸滑操作，在另一告 施例中，該定位元件250係為獨立裝設之元件，其係由言/ 基板210之定位區216延伸並往下凸起於該基板21〇之下^ 面212，以增進該指紋辨識器封裝構造2〇〇在上板至一 電路板時具有良好之穩固性，不會影 ^ 球之結合性〔圖未纷出…= 杯材〔pre-solder〕或銲球，可達到上板前之安全 籲| 為準^月^保護範圍當視後附之申料利範圍戶斤界定者 鬥何熟知此項技藝者，在不脫離本發明之 圍内所作之任何變化與修改，均屬於本發明之保護Γ圍 1242851 圖式簡單說明 【圖式簡單說明】 第1圖：習知指紋辨識器封裝構造之正面矛音圖； 第2圖.習知指紋辨識器封裝構造之截面矛ς圖； 第3圖·…習知指紋辨識器封裝構造之底面亍ς圖； 圖丄：據本發明，一種指紋辨識器封裝：造之基板上 录面不思圖； 該指紋辨識器封裝構造之正面示意 该指紋辨識器封裝構造設置有一定 及 该指紋辨識器封裝構造設置有該定 第5圖：依據本發明 圖； 第6圖：依據本發明 位元件之載面示意圖 第7圖：依據本發明 位元件之底面示意圖1242851 V. Description of the invention (6) 2 0 0 In the positioning area 21 6 of the substrate 2 1 G, corresponding positioning holes or fastening grooves can be provided for the combination of the positioning element 250 to make the positioning element 25. Can be fastened to the positioning area 216 of the substrate 210, so the fingerprint reader package structure 2000 can withstand more or more improperly applied fingerprint touch-slip operations. In another embodiment, the positioning element 250 is an independently installed component, which extends from the positioning area 216 of the substrate 210 and projects downward below the substrate 21 ^ surface 212 to enhance the fingerprint reader package structure. Board to a circuit board has good stability, will not affect the combination of balls [not shown in the picture ... = cup [pre-solder] or solder balls, can reach the safety call before the board | as the standard month ^ The scope of protection shall be determined by the scope of the application materials attached below. Those who are familiar with this art, and any changes and modifications made without departing from the scope of the present invention are protected by the present invention. Brief description [Schematic description] Figure 1: Front side of the package structure of the conventional fingerprint reader Spear sound diagram; Figure 2. Cross-section spear diagram of a conventional fingerprint reader package structure; Figure 3 ... Map of the bottom face of a conventional fingerprint reader package structure; Figure 丄: A fingerprint reader according to the present invention Package: the surface of the manufactured substrate is recorded without thinking; the front side of the fingerprint reader packaging structure indicates that the fingerprint reader packaging structure is provided with a certain and the fingerprint reader packaging structure is provided with the fixed FIG. 5: a diagram according to the present invention; Fig. 6: Schematic diagram of the surface of a bit component according to the present invention Fig. 7: Schematic diagram of the bottom surface of a bit component according to the present invention

元件符號簡單說明： 100 指紋辨識 器封裝構造 110 基板 111 上 表 面 112 113 連接墊 120 半導體晶 片 121 指 紋 感 測 表面 122 130 銲線 140 封 膠 體 150 200 指紋辨識 器封裝構造 210 基板 211 上 表 面 212 213 連接墊 214 黏 晶 區 215 216 定位區 220 半導體晶 片 221 指 紋 感 湏丨J 表面 222 下表面 背面 黏膠 下表面 封膠區 背面Simple description of component symbols: 100 fingerprint reader package structure 110 substrate 111 upper surface 112 113 connection pad 120 semiconductor wafer 121 fingerprint sensing surface 122 130 bonding wire 140 sealant 150 200 fingerprint reader package structure 210 substrate 211 upper surface 212 213 connection Pad 214 Sticky crystal area 215 216 Positioning area 220 Semiconductor wafer 221 Fingerprint 湏 J surface 222 Lower surface back Adhesive bottom surface Adhesive area back

12428511242851

第14頁Page 14

Claims (1)

1242851 六、申請專利範圍 — '一 ---- 【申請專利範圍】 1、一種指紋辨識器封裝構造，包含·· 基板，其係具有一上表面及一下表面，該上表面係 包含有一黏晶區、一封膠區及一定位區； 一半導體晶片，其係貼設於該基板之該黏晶區並且電 性連接至該基板，該半導體晶片係具有一指紋感測表面； 及 •封膠體’其係形成於該基板之該封膠區，並包覆部 分之=半導體晶片且顯露該半導體晶片之指紋感測表面； #服ϊ I丄該基板之定位區係位於該封膠區外側且不被該丨 封膠體覆盍，以供該基板之對外定位。 ^如申叫專利範圍第丨項所述之指紋辨識器封裝構造， ’、β亥疋位區係環繞形成於該上表面之周邊側翼。 』中：：2?範圍第1項所述之指紋辨識器封裝構造， 、μ半導體晶片係一觸滑式指紋辨識器。 “ϋϊΠ'圍第1項所述之指紋辨識器封裝構造， 、Λ半導體日日片係一壓觸式指紋辨識器。 請專利範圍第1項所述之指紋辨識器封裝構造， 二口有：定位元件，其係設置於該基 於该定位區之下表面部位。 匕^釕應 下表面。表面側邊延伸而往下凸起於該基板之 ★申"月專利範圍第1或6 J員所述之指紋辨識器封裝構 12428511242851 VI. Scope of patent application-'一 ---- [Scope of patent application] 1. A fingerprint reader package structure, including a substrate, which has an upper surface and a lower surface, and the upper surface contains a sticky crystal Area, an adhesive area, and a positioning area; a semiconductor wafer attached to the die-bonding area of the substrate and electrically connected to the substrate, the semiconductor wafer having a fingerprint sensing surface; and a sealing compound 'It is formed in the sealing area of the substrate, and covers a part of the semiconductor wafer and exposes the fingerprint sensing surface of the semiconductor wafer; # 服 ϊ I 定位 The positioning area of the substrate is located outside the sealing area and It is not covered by the sealing gel for external positioning of the substrate. ^ According to the fingerprint reader package structure described in item 丨 of the claimed patent scope, the ′, β-Helium region surrounds the peripheral flanks formed on the upper surface. 『In: 2? The fingerprint reader package structure described in the first item in the 2? Range, the μ semiconductor chip is a touch-slip fingerprint reader. "ΫϊΠ'around the fingerprint reader package structure described in the first item, Λ semiconductor daily film is a pressure contact fingerprint reader. Please refer to the fingerprint reader package structure described in the first item of patent scope, the two have: The positioning element is arranged on the surface area based on the lower surface of the positioning area. The ruthenium should be the lower surface. The side of the surface extends and protrudes downward from the substrate. Package structure of the fingerprint reader 1242551 六、申請專利範圍 造，其中該基 8、 如申請專 其中該些連接 之該基板下表 9、 如申請專 其中該定位元 10、 如申請專 其中該些連接 元件係往下凸 11、 如申請專 其中該基板之 12、 如申請專 其中該半導體 13、 如申請專 造’其另包含 些銲墊至該基 14、 如申請專 其中該封膠體 15、 如申請專 其中該半導體 形0 板之下表面 利範圍第7 墊係形成在 面0 利範圍第5 件係往下凸 利範圍第9 墊上設有一 起於該預銲 利範圍第1 定位區係設 利範圍第1 晶片係具有 利範圍第1 2 有複數個銲 板。 利範圍第1 3 係覆蓋至該 利範圍第1 晶片顯露於 係設有複數個連接墊。 項所述之指紋辨識器封裝構造， 對應於該黏晶區與該封膠區下方 項所述之指紋辨識器封裝構造， 起於該些連接墊。 項所述之指紋辨識器封裝構造， 預銲材〔pre-solder〕，該定位 材。 ~ 項所述之指紋辨識器封裝構造，着 有複數個定位孔。 項所述之指紋辨識器封裂構造， 複數個銲墊。 項所述之指紋辨識器封跋構 線，其係連接該半導體晶片之该 項所述之指紋辨識器封裝構造， 些銲墊且密封該些銲線。 項所述之指紋辨識器封裝構造’丨 該封膠體之指紋感測表面係為竣6. The scope of the application for the patent, where the base 8. If the application is dedicated to the connection of the substrate, the following table 9, if the application is dedicated, the positioning element 10, if the application is dedicated, the connection elements are downward convex 11, such as Apply for the substrate 12, or apply for the semiconductor 13, or apply for the fabrication 'It also includes some pads to the base 14, if apply for the encapsulation 15, or apply for the semiconductor-shaped 0 plate The 7th pad of the lower surface of the profit range is formed on the surface of the 0th profit range. The 5th part is a downward convex range. The 9th pad is provided with the pre-welding profit range. The 1st positioning area is the profit range. The 1st wafer is advantageous. Range 1 2 has a plurality of welding plates. The first range of the range 1 to 3 covers the first range of the range of the first range of wafers. The plurality of connection pads are provided. The fingerprint reader package structure described in the item corresponds to the fingerprint reader package structure described in the item below the sticky crystal region and the sealing area, and starts from the connection pads. The fingerprint reader package structure described in the item, pre-solder, the positioning material. The fingerprint reader package structure described in ~ has a plurality of positioning holes. The fingerprint reader cracking structure described in the item, a plurality of welding pads. The fingerprint reader seal line described in the above item is a package structure of the fingerprint reader according to the item connected to the semiconductor wafer, the bonding pads and the bonding wires are sealed. Encapsulation structure of the fingerprint reader described in item 丨 丨 The fingerprint sensing surface of the sealant is complete 第16頁Page 16
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681454A (en) * 2015-02-28 2015-06-03 苏州科阳光电科技有限公司 Packaging technology for novel fingerprint lock device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681454A (en) * 2015-02-28 2015-06-03 苏州科阳光电科技有限公司 Packaging technology for novel fingerprint lock device
CN104681454B (en) * 2015-02-28 2017-10-13 苏州科阳光电科技有限公司 The packaging technology of device is locked for novel finger print

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