CN204179070U - Fingerprint recognition chip-packaging structure - Google Patents
Fingerprint recognition chip-packaging structure Download PDFInfo
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- CN204179070U CN204179070U CN201420524949.7U CN201420524949U CN204179070U CN 204179070 U CN204179070 U CN 204179070U CN 201420524949 U CN201420524949 U CN 201420524949U CN 204179070 U CN204179070 U CN 204179070U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
A kind of fingerprint recognition chip-packaging structure, comprising: substrate; Be coupled in the induction chip of substrate surface, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip comprises induction zone, and the second surface of described induction chip is positioned at substrate surface; Be positioned at the plastic packaging layer of substrate surface, described plastic packaging layer surrounds described induction chip, and the surface of described plastic packaging layer flushes with the first surface of described induction chip; Be positioned at the cover layer of described plastic packaging layer and induction chip first surface.Described encapsulating structure can reduce the requirement of induction chip sensitivity, applies more extensive.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of fingerprint recognition chip-packaging structure.
Background technology
Along with the progress of modern society, the importance of person identification and personal information security progressively receives the concern of people.Because somatic fingerprint has uniqueness and consistency, make fingerprint identification technology have fail safe good, reliability is high, feature easy to use, makes fingerprint identification technology be widely used in protecting the various fields of personal information security.And along with the development of science and technology, the information security issue of each electronic product is one of concern main points of technical development all the time.Especially for mobile terminal, such as mobile phone, notebook computer, dull and stereotyped computer, digital camera etc., the demand for Information Security is more outstanding.
The sensing mode of existing fingerprint recognition device comprises condenser type (Electric field) and inductance type, and user fingerprints by extracting user fingerprints, and is converted to signal of telecommunication output by fingerprint recognition device, thus obtains the finger print information of user.Concrete, as shown in Figure 1, Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art, comprising: substrate 100; Be coupled in the fingerprint recognition chip 101 on substrate 100 surface; Be covered in the glass substrate 102 on described fingerprint recognition chip 101 surface.
For capacitance type fingerprint identification chip, in described fingerprint recognition chip 101, there is one or more capacitor plate.The epidermis pointed due to user or hypodermic layer have protruding ridge and the paddy of depression, when user points 103 contact described glass substrate 102 surface, described ridge is different to the distance of fingerprint recognition chip 101 from paddy, therefore, user points 103 ridges or the capacitance between paddy from capacitor plate is different, and fingerprint recognition chip 101 can obtain described different capacitance, and be translated into the output of the corresponding signal of telecommunication, and after fingerprint recognition device gathers the suffered signal of telecommunication, the finger print information of user can be obtained.
But, in existing fingerprint recognition device, higher to the sensitivity requirement of fingerprint recognition chip, the manufacture of fingerprint recognition device and application are restricted.
Utility model content
The problem that the utility model solves is to provide a kind of fingerprint recognition chip-packaging structure, and described encapsulating structure can reduce the requirement of induction chip sensitivity, applies more extensive.
For solving the problem, the utility model provides a kind of fingerprint recognition chip-packaging structure, comprising: substrate; Be coupled in the induction chip of substrate surface, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip comprises induction zone, and the second surface of described induction chip is positioned at substrate surface; Be positioned at the plastic packaging layer of substrate surface, described plastic packaging layer surrounds described induction chip, and the surface of described plastic packaging layer flushes with the first surface of described induction chip; Be positioned at the cover layer of described plastic packaging layer and induction chip first surface, described tectal thickness is less than 100 microns.
Optionally, the first surface of described induction chip also comprises the external zones surrounding described induction zone.
Optionally, described induction chip also comprises the edge groove being positioned at described external zones, and the sidewall of described induction chip exposes described edge groove; Be positioned at the chip circuit of induction chip external zones, described chip circuit is positioned at the surface, external zones of induction chip and the sidewall of edge groove and lower surface.
Optionally, described edge groove is surround the continuous groove of induction zone; Or described edge groove is surround the some discrete groove of induction zone.
Optionally, also comprise: be positioned at the first weld pad bottom described edge groove, described chip circuit is connected with described first weld pad.
Optionally, described plastic packaging layer is also positioned at described edge groove, and described plastic packaging layer flushes with the surface, induction zone of induction chip.
Optionally, described substrate has first surface, and described induction chip is coupled in the first surface of substrate, and the first surface of described substrate has the second weld pad.
Optionally, also comprise: conductor wire, described conductor wire two ends are connected with the second weld pad with the first weld pad respectively.
Optionally, described conductor wire is summit to substrate first surface apart from maximum point, and described summit is lower than described plastic packaging layer surface.
Optionally, also comprise: the conductive layer being positioned at induction chip sidewall surfaces, substrate first surface and edge groove, described conductive layer two ends are connected with the first weld pad and the second weld pad respectively.
Optionally, also comprise: the first tack coat between induction chip and substrate.
Optionally, described tectal thickness is 20 microns ~ 100 microns.
Optionally, at described cover layer and the second tack coat between described plastic packaging layer and induction chip first surface.
Optionally, described cover layer is glass substrate, and the dielectric constant of described glass substrate is 6 ~ 10, and thickness is 100 ~ 300 microns; Or described cover layer is ceramic substrate, the dielectric constant of described ceramic substrate is 20 ~ 100, and thickness is 100 ~ 200 microns.
Optionally, form color layer in described second tie layer surface, described cover layer is formed at described color layer surface.
Optionally, also comprise: the guard ring being positioned at substrate surface, described guard ring surrounds described induction chip, plastic packaging layer and cover layer.
Optionally, also comprise: the shell surrounding described plastic packaging layer, induction chip, cover layer and guard ring, described shell exposes the cover layer on surface, induction zone.
Optionally, also comprise: surround described plastic packaging layer, induction chip and tectal shell, described shell exposes the cover layer on surface, induction zone.
Optionally, one end of described substrate has connecting portion, and described connecting portion is used for induction chip is electrically connected with external circuit.
Compared with prior art, the technical solution of the utility model has the following advantages:
In encapsulating structure of the present utility model, substrate surface surrounds the plastic packaging layer of induction chip, and the first surface of described plastic packaging layer and induction chip has cover layer.Described plastic packaging layer is used for fixing described cover layer, and enable described cover layer directly fit in the first surface of described induction chip, described cover layer instead of traditional glass substrate, can directly and user's finger contacts, for the protection of induction chip.And, compared to traditional glass substrate, described tectal thinner thickness and hardness is higher; Described tectal hardness is higher, makes when described overburden cover is thinner, and described cover layer also can be made to have enough large hardness to protect the first surface of induction chip; And adopt described cover layer can reduce the distance of first surface to cover surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, make the application of fingerprint recognition chip-packaging structure more extensive, and structure is simple, be easier to assembling, can reduce production cost.
Further, described tectal thickness is 20 microns ~ 100 microns.Described tectal thinner thickness, makes the induction zone of described induction chip the user fingerprints being placed in cover surface more easily be detected, reduces the requirement to induction chip sensitivity; When described tectal hardness is larger, even if described tectal thinner thickness, also there is the first surface being enough to protect induction chip.
Further, described substrate surface also has the guard ring surrounding described induction chip, cover layer and plastic packaging layer.Described guard ring is used for carrying out electrostatic defending to described induction chip; the user fingerprints data accuracy avoiding induction zone to detect declines; or can eliminate the signal noise that induction chip exports, the signal of the data making induction chip detect and output is more accurate.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art;
Fig. 2 to Fig. 7 is the schematic diagram of the encapsulating structure of the fingerprint recognition chip of the utility model embodiment.
Embodiment
As stated in the Background Art, in existing fingerprint recognition device, higher to the sensitivity requirement of fingerprint recognition chip, the manufacture of fingerprint recognition device and application are restricted.
Find through research; please continue to refer to Fig. 1; fingerprint recognition chip 101 surface coverage has glass substrate 102; described glass substrate 102 is for the protection of fingerprint recognition chip 101; and the finger 103 of user directly contacts with described glass substrate 102; therefore, in order to ensure that described glass substrate 102 has enough protective capabilities, the thickness of described glass substrate 102 is thicker.But, because the thickness of described glass substrate 102 is thicker, therefore require that fingerprint recognition chip 101 has higher sensitivity, to guarantee accurately to extract user fingerprints.But highly sensitive fingerprint recognition chip manufacturing difficulty is comparatively large, manufacturing cost is higher, then causes the application of fingerprint recognition chip and popularization to be restricted.
Concrete, continue for capacitance type fingerprint recognition means, when user's finger puts 103 when glass substrate 102 is surperficial, user points between the capacitor plate in 103 and fingerprint recognition chip 101 can form electric capacity; Wherein, described user point 103 and capacitor plate be the two poles of the earth of electric capacity, described glass substrate 102 is the dielectric between electric capacity the two poles of the earth.But, because the thickness of described glass substrate 102 is thicker, the capacitance that user is pointed between 103 and capacity substrate is larger, and the difference in height that user points between the ridge of 103 and paddy is less, therefore, capacitance between described ridge and capacitor plate, minimum relative to the difference between the capacitance between described paddy and capacitor plate, in order to the difference of described capacitance accurately can be detected, require that described fingerprint recognition chip 101 has higher sensitivity.
In order to solve the problem, the utility model proposes a kind of fingerprint recognition chip-packaging structure.Wherein, substrate surface surrounds the plastic packaging layer of induction chip, and the first surface of described plastic packaging layer and induction chip has cover layer.Described plastic packaging layer is used for fixing described cover layer, and enable described cover layer directly fit in the first surface of described induction chip, described cover layer instead of traditional glass substrate, can directly and user's finger contacts, for the protection of induction chip.And, compared to traditional glass substrate, described cover layer can thinner thickness, adopt described cover layer can reduce the distance of first surface to cover surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.
For enabling above-mentioned purpose of the present utility model, feature and advantage more become apparent, and are described in detail specific embodiment of the utility model below in conjunction with accompanying drawing.
Fig. 2 to Fig. 7 is the schematic diagram of the encapsulating structure of the fingerprint recognition chip of the utility model embodiment.
Please refer to Fig. 2, the encapsulating structure of described fingerprint recognition chip comprises:
Substrate 200;
Be coupled in the induction chip 201 on substrate 200 surface, described induction chip 201 has first surface 210 and the second surface 220 relative with first surface 210, the first surface 210 of described induction chip 201 comprises induction zone 211, and the second surface 220 of described induction chip 201 is positioned at substrate 200 surface;
Be positioned at the plastic packaging layer 202 on substrate 200 surface, described plastic packaging layer 202 surrounds described induction chip 201, and the surface of described plastic packaging layer 202 flushes with the first surface 210 of described induction chip 201;
Be positioned at the cover layer 203 of described plastic packaging layer 202 and induction chip 201 first surface 210, the thickness of described cover layer 203 is less than 100 microns.
Be described in detail to the encapsulating structure of above-mentioned fingerprint recognition chip below.
The induction zone 211 being positioned at induction chip 201 first surface 210, for detecting and receive the finger print information of user, has the capacitance structure for obtaining user fingerprints information or induction structure in described induction zone 211.
In the present embodiment, the first surface 210 of described induction chip 201 also comprises the external zones 212 surrounding described induction zone 211, the external zones 212 of described induction chip 201 first surface 210 has chip circuit 215, described chip circuit 215 is electrically connected with the capacitance structure in induction zone 211 or induction structure, processes for the signal of telecommunication exported capacitance structure or induction structure.
In the present embodiment, in described induction zone 211, there is at least one capacitor plate, when user's finger is placed in cover layer 203 surface, described capacitor plate, cover layer 203 and user point formation capacitance structure, and described induction zone 211 can obtain user's finger surface ridge and the capacitance difference between paddy and capacitor plate, and export after described capacitance difference is processed by chip circuit 215, obtain user fingerprints data with this.
Described induction chip 201 also comprises: the edge groove 204 being positioned at described external zones 212, and the sidewall of described induction chip 201 exposes described edge groove 204; The bottom of described edge groove 204 has the first weld pad 205.Described edge groove 204 is for the formation of the output of chip circuit 215, i.e. described first weld pad 205, by being connected with substrate 200 surface electrical by the first weld pad 205, can realize being coupled of induction chip 201 and substrate 200.
In the present embodiment, the chip circuit 215 being positioned at induction chip 201 external zones 212 is covered in sidewall and the lower surface of described edge groove 204, and the chip circuit 215 be positioned at bottom described edge groove 204 is connected with described first weld pad 205.
In one embodiment, described edge groove 204 is surround the continuous groove of induction zone 211, and described continuous print edge groove 204 lower surface has one or several first weld pad 205.In another embodiment, described edge groove 204 is surround the some discrete groove of induction zone 211, and has one or several first weld pad 205 in each edge groove 204.The quantity of described first weld pad 205 and distribution need design according to the physical circuit wiring of chip circuit 215.
In the present embodiment, the sidewall of described edge groove 204 tilts relative to the surface of induction chip 201, and angle between the sidewall of described edge groove 204 and bottom in obtuse angle.Edge groove 204 sidewall surfaces of described inclination is conducive to forming chip circuit 215, and the deposition of the formation chip circuit 215 made and etching technics are easy to carry out.
Described substrate 200 for fixing described induction chip 201, and makes described induction chip 201 be electrically connected with other device or circuit.In the present embodiment, described fingerprint recognition chip-packaging structure also comprises the first tack coat 208 between induction chip 201 and substrate 200, and described induction chip 201 is fixed on described substrate 200 surface by described first tack coat 208.
Described substrate 200 is rigid substrate or flexible base plate, can according to the demand of the device or terminal that are provided with induction chip 201, and adjusting described substrate 200 is rigid substrate or flexible base plate.In the present embodiment, described substrate 200 is rigid substrate, and described rigid substrate is PCB substrate, glass substrate, metal substrate, semiconductor substrate or polymeric substrates.
Described substrate 200 has first surface 230, and described induction chip 201 is coupled in the first surface 230 of substrate 200.The first surface 230 of described substrate 200 has wiring layer (not shown) and the second weld pad 206, described wiring layer is connected with described second weld pad 206, and described second weld pad 206 is for being connected with the chip circuit 215 of induction chip 201 first surface 210.
In the present embodiment, one end of described substrate 200 has connecting portion 240, the material of described connecting portion 240 comprises electric conducting material, connecting portion 240 is electrically connected with described wiring layer, make the chip circuit 215 on described induction chip 201 by the wiring layer of substrate 200 first surface 230 and connecting portion 240, be electrically connected with external circuit or device, thus the transmission of the signal of telecommunication can be realized.
In the present embodiment, described fingerprint recognition chip-packaging structure also comprises conductor wire 207, described conductor wire 207 end is connected with the second weld pad 206 with the first weld pad 205 respectively, chip circuit 215 is electrically connected with the wiring layer on substrate 200 surface, and described wiring layer is electrically connected with connecting portion 240, thus make the chip circuit on induction chip 201 surface and induction zone 211 can carry out the transmission of the signal of telecommunication with external circuit or device.The material of described conductor wire 207 is metal, and described metal is copper, tungsten, aluminium, gold or silver-colored.
And described conductor wire 207 is wrapped up by described plastic packaging layer, to make between described conductor wire 207 and induction chip 201 and electric isolution between conductor wire 207 and external environment condition.Because described conductor wire 207 is connected between the first weld pad 205 and the second weld pad 206, therefore described conductor wire 207 bends, described conductor wire 207 is summit to substrate 200 first surface 230 apart from maximum point, described summit is also higher than the lower surface of described edge groove 204, and described summit is lower than the first surface 210 of described induction chip 201, because the surface of described plastic packaging layer 203 flushes with the first surface 210 of described induction chip 201, therefore described plastic packaging layer 203 can surround described conductor wire 207 completely, avoids described conductor wire 207 exposed.
Described plastic packaging layer 202 is positioned at substrate 200 surface, and surround described induction chip 201 and conductor wire 207, the first surface 230 of described plastic packaging layer 202 for making induction chip 201 be fixed on substrate 200, can also be used for making electric isolution between described conductor wire 207 and described induction chip 201, between described conductor wire 207 and external environment condition.
The material of described plastic packaging layer 202 is polymeric material, described polymeric material has good pliability, ductility and covering power, described polymeric material is epoxy resin, polyethylene, polypropylene, polyolefin, polyamide, polyurethane, and described plastic packaging layer 202 can also adopt other suitable capsulation material.Described plastic packaging layer 202 can with Shooting Technique (injection molding), turn and mould technique (transfermolding) or silk-screen printing technique and formed.
In the present embodiment, the surface of described plastic packaging layer 202 flushes with the first surface 210 of induction chip 201, make described cover layer 203 directly can be covered in the first surface 210 of described plastic packaging layer 202 and induction chip 201, make the structure of formed fingerprint recognition chip simple, and be easy to assembling.
And, because part of covering layer 203 is positioned at described plastic packaging layer 202 surface, described plastic packaging layer 202 can be used in fixing described cover layer 203, make described cover layer 203 can fit tightly first surface 210 in described induction chip 201, and damage can not be caused to the first surface 210 of described induction chip 201, the testing result that the induction zone 211 of induction chip 201 is obtained is more accurate.
In the present embodiment, also have edge groove 204 in the external zones 212 due to described induction chip 201, described plastic packaging layer 202 is also positioned at described edge groove 204, and described plastic packaging layer 202 flushes with the surface, induction zone 211 of induction chip 201.
The material of described cover layer 203 is polymeric material, inorganic nano material or ceramic material.In the present embodiment, the material of described cover layer 203 is inorganic nano material, and described inorganic nano material comprises aluminium oxide or cobalt oxide; Described cover layer 203 can be formed with typography, spraying coating process or spin coating proceeding.
In another embodiment, the material of described cover layer 203 is polymeric material, and described polymeric material is epoxy resin, polyimide resin, benzocyclobutane olefine resin, polybenzoxazoles resin, polybutylene terephthalate, Merlon, PETG, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer, polyvinyl alcohol or other suitable polymeric materials; Described cover layer 203 can be formed with typography, spraying coating process or spin coating proceeding.
The Mohs' hardness of described cover layer 203 is more than or equal to 8H.The hardness of described cover layer 203 is higher; therefore, even if the thinner thickness of described cover layer 203, described cover layer 203 is also enough to the induction zone 211 protecting induction chip 201; when user's finger is when described cover layer 203 surface is mobile, damage can not be caused to induction chip 201 surface.And, because the hardness of described cover layer 203 is higher, therefore described cover layer 203 is difficult to deformation occurs, even if user's finger presses is in described cover layer 203 surface, the thickness of described cover layer 203 is also difficult to change, thus ensure that the testing result accuracy of induction zone 211.
The dielectric constant of described cover layer 203 is more than or equal to 7.Because the dielectric constant of described cover layer 203 is comparatively large, make the electric isolution ability of described cover layer 203 comparatively strong, then the protective capability of described cover layer 203 pairs of induction zones 211 is stronger.
The thickness of described cover layer 203 is 20 microns ~ 100 microns.The thinner thickness of described cover layer 203, when user's finger is placed in described cover layer 203 surface, described finger reduces to the distance of induction zone 211, therefore, described induction zone 211 more easily detects the fingerprint that user points, thus reduces the highly sensitive requirement of induction chip 201.
Due to the thinner thickness of cover layer 203, and capacitance between user's finger with capacitor plate and the thickness of cover layer 203 are inversely proportional to, be directly proportional to the dielectric constant of cover layer 203, therefore, when the thinner thickness of cover layer 203, and dielectric constant larger time, user can be made to point capacitance between capacitor plate in the scope that induction zone 211 can be detected, avoid capacitance excessive or too small and the detection of induction zone 211 was lost efficacy.
And, when the thickness of cover layer 203 is in the scope of 20 microns ~ 100 microns, and dielectric constant in the scope being more than or equal to 7 time, the thickness of described cover layer 203 is increased, the then dielectric constant of described cover layer 203 also corresponding increase, user can be made to point capacitance between capacitor plate comparatively large, then described capacitance is easier to sensed district 211 and detects.
In another embodiment, please refer to Fig. 3, described fingerprint recognition chip-packaging structure also comprises: at described cover layer 203 and the second tack coat 209 between described plastic packaging layer 202 and induction chip 201 first surface 210.In this embodiment, described cover layer 203 is the poor material of ductility and suppleness, such as ceramic substrate or glass substrate, and described second tack coat 209 is for being fixed on the first surface 210 of described plastic packaging layer 203 and induction chip 201 by described cover layer 203.
When described cover layer 203 is glass substrate, the dielectric constant of described glass substrate is 6 ~ 10, and thickness is 100 microns ~ 300 microns; When described cover layer 203 is ceramic substrate, the dielectric constant of described ceramic substrate is 20 ~ 100, and thickness is 100 microns ~ 200 microns.
In other embodiments, can also form color layer in described second tie layer surface, described cover layer is formed at described color layer surface, and the color of described color layer comprises black or white; In other embodiment, described color layer can also be other color.
In another embodiment, please refer to Fig. 4, the encapsulating structure of fingerprint recognition chip also comprises: the conductive layer 211 being positioned at induction chip 201 sidewall surfaces, substrate 200 first surface 230 and edge groove 204, described conductive layer 211 two ends are connected with the first weld pad 205 and the second weld pad 206 respectively, to realize induction zone 211 and the electrical connection between chip circuit 215 and substrate 200 surface wiring layer.
In another embodiment, please refer to Fig. 5, the encapsulating structure of fingerprint recognition chip also comprises: the guard ring 212 being positioned at substrate 200 surface, and described guard ring 212 surrounds described induction chip 201, plastic packaging layer 202 and cover layer 203.
The material of described guard ring 212 is metal, and described guard ring 212 is by described substrate 200 ground connection, and described guard ring 212 is fixed on the first surface 230 of substrate 200.
In the present embodiment, described guard ring 212 is positioned at around described induction chip 201, cover layer 203 and plastic packaging layer 202, and part guard ring 212 also to extend to above described cover layer 203 and exposes part of covering layer 203 surface be positioned on induction zone 211.In another embodiment, guard ring is only positioned at induction chip 201 and plastic packaging layer 202 around, and exposes described cover layer 203 surface completely.
The material of described guard ring 212 is metal, and described metal is copper, tungsten, aluminium, silver or golden.Described guard ring 212 is for carrying out electrostatic defending to described induction chip 201; Because described guard ring 212 is metal; described guard ring 212 can conduct electricity; when user's finger produces electrostatic when contacting cover layer 203; then first electrostatic charge can reach substrate 200 from described guard ring 212; thus avoid cover layer 203 to be punctured by excessive electrostatic potential, protect induction chip 201 with this, improve the accuracy of fingerprint detection; eliminate the signal noise that induction chip exports, the signal that induction chip is exported is more accurate.
In another embodiment; please refer to Fig. 6; the encapsulating structure of fingerprint recognition chip also comprises: the shell 213 surrounding described plastic packaging layer 202, induction chip 201, cover layer 203 and guard ring 212, and described shell 213 exposes the cover layer 203 on surface, induction zone 211.Described shell 213 can, for being provided with the described device of fingerprint recognition chip or the shell of terminal, can also be the shell of the encapsulating structure of described fingerprint recognition chip.
In another embodiment, please refer to Fig. 7, the encapsulating structure of fingerprint recognition chip also comprises: the shell 213 surrounding described plastic packaging layer 202, induction chip 201 and cover layer 203, and described shell 213 exposes the cover layer 203 on surface, induction zone 211.
In the present embodiment, substrate surface surrounds the plastic packaging layer of induction chip, and the first surface of described plastic packaging layer and induction chip has cover layer.Described plastic packaging layer is used for fixing described cover layer, and enable described cover layer directly fit in the first surface of described induction chip, described cover layer instead of traditional glass substrate, can directly and user's finger contacts, for the protection of induction chip.And, compared to traditional glass substrate, described tectal thinner thickness and hardness is higher; Described tectal hardness is higher, makes when described overburden cover is thinner, and described cover layer also can be made to have enough large hardness to protect the first surface of induction chip; And adopt described cover layer can reduce the distance of first surface to cover surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.
Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection range of the present utility model should be as the criterion with claim limited range.
Claims (19)
1. a fingerprint recognition chip-packaging structure, is characterized in that, comprising:
Substrate;
Be coupled in the induction chip of substrate surface, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip comprises induction zone, and the second surface of described induction chip is positioned at substrate surface;
Be positioned at the plastic packaging layer of substrate surface, described plastic packaging layer surrounds described induction chip, and the surface of described plastic packaging layer flushes with the first surface of described induction chip;
Be positioned at the cover layer of described plastic packaging layer and induction chip first surface, described tectal thickness is less than 100 microns.
2. fingerprint recognition chip-packaging structure as claimed in claim 1, it is characterized in that, the first surface of described induction chip also comprises the external zones surrounding described induction zone.
3. fingerprint recognition chip-packaging structure as claimed in claim 2, it is characterized in that, described induction chip also comprises the edge groove being positioned at described external zones, and the sidewall of described induction chip exposes described edge groove; Be positioned at the chip circuit of induction chip external zones, described chip circuit is positioned at the surface, external zones of induction chip and the sidewall of edge groove and lower surface.
4. fingerprint recognition chip-packaging structure as claimed in claim 3, is characterized in that, described edge groove is surround the continuous groove of induction zone, or described edge groove is surround the some discrete groove of induction zone.
5. fingerprint recognition chip-packaging structure as claimed in claim 3, it is characterized in that, described plastic packaging layer is also positioned at described edge groove, and described plastic packaging layer flushes with the surface, induction zone of induction chip.
6. fingerprint recognition chip-packaging structure as claimed in claim 3, it is characterized in that, also comprise: be positioned at the first weld pad bottom described edge groove, described chip circuit is connected with described first weld pad.
7. fingerprint recognition chip-packaging structure as claimed in claim 6, it is characterized in that, described substrate has first surface, and described induction chip is coupled in the first surface of substrate, and the first surface of described substrate has the second weld pad.
8. fingerprint recognition chip-packaging structure as claimed in claim 7, it is characterized in that, also comprise: conductor wire, described conductor wire two ends are connected with the second weld pad with the first weld pad respectively.
9. fingerprint recognition chip-packaging structure as claimed in claim 8, is characterized in that, described conductor wire is summit to substrate first surface apart from maximum point, and described summit is surperficial lower than described plastic packaging layer.
10. fingerprint recognition chip-packaging structure as claimed in claim 7, it is characterized in that, also comprise: the conductive layer being positioned at induction chip sidewall surfaces, substrate first surface and edge groove, described conductive layer two ends are connected with the first weld pad and the second weld pad respectively.
11. fingerprint recognition chip-packaging structures as described in claim 8 or 10, is characterized in that, also comprise: the first tack coat between induction chip and substrate.
12. fingerprint recognition chip-packaging structures as claimed in claim 1, is characterized in that, described tectal thickness is 20 microns ~ 100 microns.
13. fingerprint recognition chip-packaging structures as claimed in claim 1, is characterized in that, at described cover layer and the second tack coat between described plastic packaging layer and induction chip first surface.
14. fingerprint recognition chip-packaging structures as claimed in claim 13, it is characterized in that, described cover layer is glass substrate, and the dielectric constant of described glass substrate is 6 ~ 10, and thickness is 100 ~ 300 microns; Or described cover layer is ceramic substrate, the dielectric constant of described ceramic substrate is 20 ~ 100, and thickness is 100 ~ 200 microns.
15. fingerprint recognition chip-packaging structures as claimed in claim 13, is characterized in that, form color layer in described second tie layer surface, and described cover layer is formed at described color layer surface.
16. fingerprint recognition chip-packaging structures as claimed in claim 1, it is characterized in that, also comprise: the guard ring being positioned at substrate surface, described guard ring surrounds described induction chip, plastic packaging layer and cover layer.
17. fingerprint recognition chip-packaging structures as claimed in claim 16, is characterized in that, also comprise: the shell surrounding described plastic packaging layer, induction chip, cover layer and guard ring, described shell exposes the cover layer on surface, induction zone.
18. fingerprint recognition chip-packaging structures as claimed in claim 1, is characterized in that, also comprise: surround described plastic packaging layer, induction chip and tectal shell, described shell exposes the cover layer on surface, induction zone.
19. fingerprint recognition chip-packaging structures as claimed in claim 1, it is characterized in that, one end of described substrate has connecting portion, and described connecting portion is used for induction chip is electrically connected with external circuit.
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| CN201420524949.7U CN204179070U (en) | 2014-09-12 | 2014-09-12 | Fingerprint recognition chip-packaging structure |
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| CN201420524949.7U CN204179070U (en) | 2014-09-12 | 2014-09-12 | Fingerprint recognition chip-packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016037574A1 (en) * | 2014-09-12 | 2016-03-17 | 苏州晶方半导体科技股份有限公司 | Chip packaging method and package structure |
| WO2016184151A1 (en) * | 2015-10-19 | 2016-11-24 | 中兴通讯股份有限公司 | Wearable device with electrostatic protection function |
| WO2016183978A1 (en) * | 2015-05-19 | 2016-11-24 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| CN106886256A (en) * | 2017-03-13 | 2017-06-23 | 广东欧珀移动通信有限公司 | display module and terminal device |
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2014
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2016037574A1 (en) * | 2014-09-12 | 2016-03-17 | 苏州晶方半导体科技股份有限公司 | Chip packaging method and package structure |
| US10090217B2 (en) | 2014-09-12 | 2018-10-02 | China Wafer Level Csp Co., Ltd. | Chip packaging method and package structure |
| WO2016183978A1 (en) * | 2015-05-19 | 2016-11-24 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
| WO2016184151A1 (en) * | 2015-10-19 | 2016-11-24 | 中兴通讯股份有限公司 | Wearable device with electrostatic protection function |
| CN106886256A (en) * | 2017-03-13 | 2017-06-23 | 广东欧珀移动通信有限公司 | display module and terminal device |
| CN106886256B (en) * | 2017-03-13 | 2020-03-03 | Oppo广东移动通信有限公司 | Display module and terminal equipment |
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