CN204029787U - Fingerprint recognition chip-packaging structure - Google Patents
Fingerprint recognition chip-packaging structure Download PDFInfo
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- CN204029787U CN204029787U CN201420361350.6U CN201420361350U CN204029787U CN 204029787 U CN204029787 U CN 204029787U CN 201420361350 U CN201420361350 U CN 201420361350U CN 204029787 U CN204029787 U CN 204029787U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
A kind of fingerprint recognition chip-packaging structure, encapsulating structure comprises: have the substrate of first surface, the first surface of substrate has the first soldering pad layer; Be positioned at the induction chip of substrate first surface, induction chip has first surface and second surface, the second surface of induction chip is positioned at the first surface of substrate, and the first surface of induction chip has induction zone and external zones, and the induction chip surface of external zones has the second soldering pad layer; Some wires that two ends are electrically connected with the first soldering pad layer and the second soldering pad layer respectively, wire has to substrate surface apart from maximum summit, and summit has the first distance to induction chip first surface; Be positioned at the plastic packaging layer on substrate and induction chip surface, plastic packaging layer surrounds wire and induction chip, and plastic packaging layer surface has second distance to induction chip first surface, and second distance is greater than the first distance.Encapsulating structure can reduce the requirement of induction chip sensitivity, applies more extensive.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, relates in particular to a kind of fingerprint recognition chip-packaging structure.
Background technology
Along with the progress of modern society, the importance of person identification and personal information security progressively receives people's concern.Because somatic fingerprint has uniqueness and consistency, make fingerprint identification technology there is fail safe good, reliability is high, and feature easy to use makes fingerprint identification technology be widely used in protecting the various fields of personal information security.And along with scientific and technical development, the information security issue of each electronic product is one of concern main points of technical development all the time.Especially for mobile terminal, such as computer, the digital camera etc. of mobile phone, notebook computer, flat board, more outstanding for the demand of Information Security.
The sensing mode of existing fingerprint recognition device comprises condenser type (Electric field) and inductance type, and fingerprint recognition device passes through to extract user fingerprints, and user fingerprints is converted to signal of telecommunication output, thereby obtains user's finger print information.Concrete, as shown in Figure 1, Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art, comprising: substrate 100; Be coupled in the fingerprint recognition chip 101 on substrate 100 surfaces; Be covered in the glass substrate 102 on described fingerprint recognition chip 101 surfaces.
Taking capacitance type fingerprint identification chip as example, in described fingerprint recognition chip 101, there are one or more capacitor plates.Because epidermis or the hypodermic layer of user's finger have protruding ridge and the paddy of depression, in the time that user points the described glass substrate of 103 contact 102 surface, described ridge is different to the distance of fingerprint recognition chip 101 from paddy, therefore, it is different that user points capacitance between 103 ridges or paddy and capacitor plate, and fingerprint recognition chip 101 can obtain described different capacitance, and be translated into the output of the corresponding signal of telecommunication, and after fingerprint recognition device gathers the suffered signal of telecommunication, can obtain user's finger print information.
But, in existing fingerprint recognition device, the sensitivity of fingerprint recognition chip is had relatively high expectations, the manufacture of fingerprint recognition device and application are restricted.
Utility model content
The problem that the utility model solves is to provide a kind of fingerprint recognition chip-packaging structure, and described encapsulating structure can reduce the requirement of induction chip sensitivity, applies more extensive.
For addressing the above problem, the utility model provides a kind of fingerprint recognition chip-packaging structure, comprising: substrate, and described substrate has first surface, and the first surface of described substrate has some the first soldering pad layers; Be positioned at the induction chip of substrate first surface, described induction chip has first surface and the second surface relative with first surface, the second surface of described induction chip is positioned at the first surface of substrate, the first surface of described induction chip has induction zone and surrounds the external zones of described induction zone, and the induction chip surface of described external zones has some the second soldering pad layers; Some wires that two ends are electrically connected with described the first soldering pad layer and the second soldering pad layer respectively, wherein, being positioned on described wire and apart from the point of substrate first surface maximum is summit, described summit is the first distance to induction chip first surface; Be positioned at the plastic packaging layer on substrate and induction chip surface, the material of described plastic packaging layer is polymer, described plastic packaging layer surrounds described wire and induction chip, plastic packaging layer on described induction zone has an even surface, described plastic packaging layer surface has second distance to induction chip first surface, and described second distance is greater than the first distance.
Optionally, described first distance be 50 microns～80 microns; Described second distance is 100 microns～150 microns.
Optionally, also comprise: be positioned at the guard ring of substrate surface, described guard ring surrounds described induction chip, wire and plastic packaging layer.
Optionally, described guard ring is also positioned at described plastic packaging layer surface, and at least exposes the plastic packaging layer on surface, induction chip induction zone.
Optionally, also comprise: be positioned at the groove of induction zone plastic packaging layer around, the sidewall of described plastic packaging layer exposes described groove, and the part guard ring that is positioned at plastic packaging layer surface is positioned at described groove.
Optionally, substrate first surface is fixed in the bottom of described guard ring, and described guard ring is by described substrate ground connection.
Optionally, also comprise: surround the shell of described plastic packaging layer, wire, induction chip and guard ring, described shell at least exposes the plastic packaging layer on surface, induction zone.
Optionally, also comprise: the tack coat between induction chip and substrate, described tack coat is for being fixed on substrate first surface by induction chip.
Optionally, also comprise: be positioned at the glass cover-plate on described plastic packaging layer surface, described glass cover-plate at least covers the induction zone of described induction chip.
Optionally, also comprise: surround the shell of described plastic packaging layer, wire and induction chip, described shell exposes the plastic packaging layer on surface, induction zone.
Optionally, also comprise: be positioned at the connecting portion of one end of described substrate, described connecting portion is used for making induction chip to be electrically connected with external circuit.
Compared with prior art, the technical solution of the utility model has the following advantages:
In encapsulating structure of the present utility model, the second surface of described induction chip is positioned at substrate first surface, and the first surface of described induction chip has induction zone, and described induction zone is used for extracting user fingerprints.The plastic packaging layer that is positioned at substrate and induction chip surface is covered in the surface, induction zone of described induction chip, for the protection of described induction zone.In the time that user's finger is placed in the plastic packaging layer surface on induction zone, user fingerprints can be extracted in described induction zone, and induction chip can be converted to described user fingerprints signal of telecommunication output.Because the material of described plastic packaging layer is polymer, and polymeric material has good ductility and pliability, and covering power is good, therefore, the described thinner thickness that can make plastic packaging layer, and hardness is higher, thus make described plastic packaging layer there is enough large hardness with protection induction chip; Simultaneously, described plastic packaging layer surface reduces to the distance of induction chip, makes induction chip be easy to detect user fingerprints, correspondingly, described encapsulating structure can reduce the requirement to induction chip sensitivity, makes the application of encapsulating structure of fingerprint recognition chip more extensive.
Secondly, the material of described plastic packaging layer is polymer, adopts described plastic packaging layer protection induction zone can reduce the manufacturing cost of encapsulating structure.And described plastic packaging layer is also positioned at substrate and the region surface of induction chip except induction zone, for encapsulating described induction chip, described induction chip is fixed on to substrate surface, described fingerprint recognition chip-packaging structure is simple.
Again, the first surface of substrate has the first soldering pad layer, the first surface of described induction chip has the second soldering pad layer, and the second soldering pad layer is corresponding one by one with the first soldering pad layer, the two ends of some wires are electrically connected with described the first soldering pad layer and the second soldering pad layer respectively, for the coupling of induction chip and substrate.Because described the second soldering pad layer is positioned at the first surface of induction chip, make described encapsulating structure simple, the manufacturing cost of described encapsulating structure is lower.And the summit of described wire has the first distance to induction chip first surface, and plastic packaging layer surface has second distance to induction chip first surface, and therefore, described plastic packaging layer surrounds described wire completely, for making guardwire and isolating with extraneous electricity.
Further, described the first distance is 50 microns～80 microns.Described the first distance is the distance of wire summit to induction chip first surface, in the time that described summit is 50 microns～80 microns to the distance on induction chip surface, can be in ensureing between wire and the first soldering pad layer and the second soldering pad layer that electrical connection properties is good, make the plastic packaging layer electricity described wire of isolation and induction chip fully, avoid being short-circuited.Described second distance is 100 microns～150 microns.Described second distance is the distance of plastic packaging layer surface to induction chip surface, in the time that described plastic packaging layer surface is 100 microns～150 microns to the distance on induction chip surface, can make described plastic packaging layer cover completely and surround described wire, wire is isolated with outside electricity completely.And, described second distance is the distance of plastic packaging layer surface to induction chip induction zone, and therefore, the plastic packaging layer thickness that is positioned at surface, induction zone is thinner, make induction zone be easy to detect the user fingerprints on contact plastic packaging layer surface, reduced the requirement to induction chip sensitivity.And; the hardness of described plastic packaging layer is higher; even if it is thinner to be positioned at the plastic packaging layer thickness on surface, induction zone; described plastic packaging layer still has enough intensity to protect described induction zone; in the time that user's finger is placed in the plastic packaging layer surface on induction zone; described plastic packaging layer is difficult for deforming or wearing and tearing, thereby more accurate to the extraction result of user fingerprints.In addition; the dielectric constant of described plastic packaging layer is larger; make the electric isolation performance of described plastic packaging layer better; described plastic packaging layer is better to the protective capability of induction zone; even if it is thinner to be positioned at the plastic packaging layer thickness on surface, induction zone; also can make user point electric isolating power between induction zone stronger, the capacitance forming between user's finger and induction zone is larger, in the scope in being detected.
Further, substrate surface has guard ring, and described guard ring surrounds described induction chip, wire and plastic packaging layer.Described guard ring, for described induction chip is carried out to electrostatic defending, avoids the user fingerprints data accuracy that induction zone detects to decline; Described guard ring can also be eliminated the signal noise of induction chip output, makes the signal of data that induction chip detects and output more accurate.
Brief description of the drawings
Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art;
Fig. 2 to Fig. 7 is the schematic diagram of the encapsulating structure of the fingerprint recognition chip of the utility model embodiment.
Fig. 8 to Figure 11 is the cross-sectional view of the encapsulation process of the fingerprint recognition chip-packaging structure of the utility model embodiment.
Embodiment
As stated in the Background Art, in existing fingerprint recognition device, the sensitivity of fingerprint recognition chip is had relatively high expectations, the manufacture of fingerprint recognition device and application are restricted.
Find through research; please continue to refer to Fig. 1; fingerprint recognition chip 101 surface coverage have glass substrate 102; described glass substrate 102 is for the protection of fingerprint recognition chip 101; and user's finger 103 directly contacts with described glass substrate 102; therefore,, in order to ensure that described glass substrate 102 has enough protective capabilities, the thickness of described glass substrate 102 is thicker.But, because the thickness of described glass substrate 102 is thicker, therefore require fingerprint recognition chip 101 to there is higher sensitivity, to guarantee accurately to extract user fingerprints.But highly sensitive fingerprint recognition chip manufacturing difficulty is large, manufacturing cost is higher, then causes the application of fingerprint recognition chip and popularization to be restricted.
Concrete, continue taking capacitance type fingerprint recognition means as example, when user's finger puts 103 during in glass substrate 102 surface, user points 103, and fingerprint recognition chip 101 in capacitor plate between can form electric capacity; Wherein, described user points 103 and the capacitor plate the two poles of the earth that are electric capacity, and described glass substrate 102 is the dielectric between electric capacity the two poles of the earth.But, because the thickness of described glass substrate 102 is thicker, make user point 103 and capacity substrate between capacitance larger, and that user points difference in height between 103 ridge and paddy is less, therefore, capacitance between described ridge and capacitor plate, minimum with respect to the difference between the capacitance between described paddy and capacitor plate, in order the difference of described capacitance accurately to be detected, requires described fingerprint recognition chip 101 to have higher sensitivity.
In order to address the above problem, the utility model proposes a kind of encapsulating structure of fingerprint recognition chip.Wherein, in described encapsulating structure, the induction zone surface coverage of induction chip has plastic packaging layer, and the plastic packaging layer on surface, described induction zone has substituted traditional glass substrate, can be directly and user's finger contacts, and for the protection of induction chip.Because the material of described plastic packaging layer is polymer, and polymeric material has good ductility and pliability, can make thinner thickness and the hardness of described plastic packaging layer higher, when described plastic packaging layer is enough to protect induction chip, described plastic packaging layer surface reduced to the distance of induction chip, thereby make induction chip be easy to detect user fingerprints; Correspondingly, described encapsulating structure has reduced the requirement to induction chip sensitivity, makes the application of encapsulating structure of fingerprint recognition chip more extensive.
For above-mentioned purpose of the present utility model, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiment of the utility model is described in detail.
Fig. 2 to Fig. 7 is the schematic diagram of the encapsulating structure of the fingerprint recognition chip of the utility model embodiment.
Please refer to Fig. 2, the encapsulating structure of described fingerprint recognition chip comprises:
Substrate 200, described substrate 200 has first surface 230, and the first surface 230 of described substrate 200 has some the first soldering pad layers 205;
Be positioned at the induction chip 201 of substrate 200 first surfaces 230, described induction chip 201 has first surface 210 and the second surface 220 relative with first surface 210, the second surface 220 of described induction chip 201 is positioned at the first surface 210 of substrate 200, the first surface 210 of described induction chip 201 has induction zone 211 and surrounds the external zones 212 of described induction zone 211, induction chip 201 surfaces of described external zones 212 have some the second soldering pad layers 207, and described the second soldering pad layer 207 is corresponding one by one with position and the quantity of the first soldering pad layer 205;
Some wires 208 that two ends are electrically connected with described the first soldering pad layer 205 and the second soldering pad layer 207 respectively, wherein, being positioned on described wire 208 and apart from the point of substrate 200 first surface 230 maximums is summit A, and described summit is the first distance to induction chip first surface 210;
Be positioned at the plastic packaging layer 203 on substrate 200 and induction chip 201 surfaces, the material of described plastic packaging layer 203 is polymer, described plastic packaging layer 203 surrounds described wire 208 and induction chip 201, plastic packaging layer 203 on described induction zone 201 has an even surface, described plastic packaging layer 203 surface have second distance to induction chip 201 first surfaces 210, and described second distance is greater than the first distance.
To the encapsulating structure of above-mentioned fingerprint recognition chip be elaborated below.
Described substrate 200 is for fixing described induction chip 201, and described induction chip 201 is electrically connected with other device or circuit.Described substrate 200 is rigid substrate or flexible base plate, and device or terminal that described induction chip 201 can be set are as required adjusted; In the present embodiment, described substrate 200 is rigid substrate, and described rigid substrate is PCB substrate, glass substrate, metal substrate, semiconductor substrate or polymeric substrates.
Described substrate 200 has first surface 230, and described induction chip 201 is coupled in the first surface 230 of substrate 200.The first surface 230 of described substrate 200 has wiring layer (not shown), and described wiring layer is connected with the second link 205 that is positioned at substrate 200 first surfaces 230, described the second link 205 is for being connected with the chip circuit on induction chip 201 surfaces.
In the present embodiment, one end of described substrate 200 has connecting portion 204, and described connecting portion 204 is for making induction chip 201 be electrically connected with external circuit.The material of described connecting portion 204 comprises electric conducting material, connecting portion 204 is electrically connected with described wiring layer, thereby described chip circuit can be electrically connected with external circuit or device by wiring layer and the connecting portion 204 of substrate 200 first surfaces 230, thereby realize the transmission of the signal of telecommunication.
The induction zone 211 that is positioned at induction chip 201 first surfaces 210 for detection of with the finger print information that receives user, in described induction zone 211, can have capacitance structure or have induction structure, described capacitance structure or induction structure can be used in the user fingerprints information of obtaining.
Owing to being connected by wire 208 between the first soldering pad layer 205 and the second soldering pad layer 207, therefore, between described induction chip 201 and substrate 200, there is the first tack coat 301, for induction chip 201 being fixed on to the first surface 230 of substrate 200.
In the present embodiment, in described induction zone 211, there is at least one capacitor plate, in the time that user's finger is placed in plastic packaging layer 203 surface on induction zone 211, described capacitor plate, plastic packaging layer 203 and user point formation capacitance structure, and described induction zone 211 can obtain the capacitance difference between user's finger surface ridge and paddy and capacitor plate, and output after described capacitance difference is processed by chip circuit, obtain user fingerprints data with this.
The first surface 210 of described induction chip 201 also comprises the external zones 212 that surrounds described induction zone 211, the external zones 212 of described induction chip 201 first surfaces 210 has chip circuit (not shown), described chip circuit is electrically connected with capacitance structure or induction structure in induction zone 211, for the signal of telecommunication of capacitance structure or induction structure output is processed.
The surface of described induction chip 201 external zoness 212 also has the second soldering pad layer 207, described the second soldering pad layer 207 is for being electrically connected with first soldering pad layer 205 on substrate 200 surfaces, and, described chip circuit is connected with described the first link 207, thereby the induction zone 211 of realizing induction chip 201 is electrically connected with substrate 200, and wiring layer by substrate surface and connecting portion 204 and external circuit are realized the transmission of the signal of telecommunication.
Described the second soldering pad layer 207 is positioned at the first surface 210 of induction chip 201, and described the second soldering pad layer 207 can be connected with the first soldering pad layer 205 by wire 208, therefore, before described induction chip 201 is fixed on to substrate 200 surfaces, without the structure of described induction chip 201 is changed, can realize being electrically connected between induction chip 201 and substrate 200, therefore, described encapsulating structure is simple, and manufacturing cost is lower.
And, because described the second soldering pad layer 207 is positioned at the external zones 212 of induction chip 201, and external zones 212 surrounds induction zone 211, therefore, described the second soldering pad layer 207 is positioned at the region near induction chip 201 edges, to occupy effective coverage (having the region of induction zone 211 and the chip circuit) ratio at described induction chip 201 centers less for described the second soldering pad layer 207 and the wire 208 that is connected in the second soldering pad layer 207, the chip space utilance of described induction chip 201 is improved, thereby reduced the manufacturing cost of encapsulating structure.In addition; because described the second soldering pad layer 207 and wire 208 are positioned at the region near induction chip 201 edges; surrounding the opening size size that the shell 400 (as shown in Figure 3) of described induction chip 201 or guard ring 209 (as shown in Figure 4) expose induction zone 211 can regulate and control according to technical need; even if described opening is larger, can not have influence on the accuracy that induction zone 211 is detected user fingerprints yet.
The two ends of described wire 208 are connected with the second soldering pad layer 207 with the first soldering pad layer 205 respectively, thereby chip circuit is electrically connected with the wiring layer on substrate 200 surfaces, and described wiring layer is electrically connected with connecting portion 204, thereby make the chip circuit on induction chip 201 surfaces and induction zone 211 carry out the transmission of the signal of telecommunication with external circuit or device.The material of described conductor wire 208 is metal, and described metal is copper, tungsten, aluminium, gold or silver-colored.
Described wire 208 is connected between the first soldering pad layer 205 and the second soldering pad layer 207, therefore described wire 208 bendings, described wire 208 has to the summit A of substrate 200 surface distance maximums, and described summit A is also higher than the first surface 210 of described induction chip 201, thus can make described plastic packaging layer 203 completely described wire 208 be surrounded and with induction chip 201 electricity isolation.In the present embodiment, the distance between described the first soldering pad layer 205 to second soldering pad layers 207 and the thickness of described induction chip 201, described summit A is 50 microns～80 microns to the first distance of the first surface 210 of induction chip 201.
In order to make described plastic packaging layer 203 can surround described wire 208 completely, described wire is not had to be exposed to outside surface, the surface of described plastic packaging layer 203 need to be greater than described the first distance to the second distance of the first surface 210 of induction chip 201.In the present embodiment, described second distance is 100 microns～150 microns.
Described plastic packaging layer 203 is positioned at substrate 200 surfaces; and surround described induction chip 201 and wire 208; for induction chip 201 is fixed on to substrate 200 surfaces, protects described induction chip 201 and wire 208, and make described induction chip 201 and wire 208 and outside electricity isolation.
And described plastic packaging layer 203 is also positioned at 211 surfaces, induction zone of induction chip 201, described plastic packaging layer 203 can be protected described induction zone 211, user's finger can directly contact with the plastic packaging layer 203 on 211 surfaces, described induction zone.Because described plastic packaging layer 203 can be in protection fixing induction chip 201; the induction zone 211 of protection induction chip 201, and can point directly and contact with user, therefore; the encapsulating structure of the fingerprint recognition chip of the present embodiment is simple, can reduce manufacturing cost.
The material of described plastic packaging layer 203 is polymeric material, described polymeric material has good pliability, ductility and covering power, can make to be positioned at plastic packaging layer 203 thinner thickness on 211 surfaces, induction zone, thereby strengthen the sensing capability of induction chip 201 to user's finger print.Meanwhile, by selecting and adjust the kind of described polymeric material, can make the plastic packaging layer 203 that is positioned at 211 surfaces, induction zone there is higher hardness, thereby ensure that 203 pairs of induction zone 211 of plastic packaging layer have enough protective capabilities.
Plastic packaging layer 203 thickness that are positioned at 211 surfaces, induction zone are 100 microns～150 microns, described thinner thickness, when user's finger is placed in plastic packaging layer 203 surface on described induction zone 211, described finger is less to the distance of induction zone 211, therefore, induction zone 211 more easily detects the fingerprint that user points, thereby has reduced the highly sensitive requirement of induction chip 201.
In the present embodiment, in described induction zone 211, there is capacitor plate, owing to being positioned at the thinner thickness of plastic packaging layer 203 on 211 surfaces, induction zone, in the time that user's finger is placed in plastic packaging layer 203 surface on induction zone 211, it is shorter that user points the distance of capacitor plate, and the capacitance between user's finger and capacitor plate is less; Accordingly, capacitance between ridge (projection) and the capacity substrate of user's finger surface, differ greatly with respect to the capacitance between paddy (depression) and capacity substrate, therefore, described induction zone 211 is easy to the finger print information that detects that user points.
The Mohs' hardness of described plastic packaging layer 203 is more than or equal to 8H; the hardness of described plastic packaging layer 203 is higher; even if be positioned at plastic packaging layer 203 thinner thickness on 211 surfaces, induction zone; described plastic packaging layer 203 is also enough to protect the induction zone 211 of induction chip 201; in the time that user points surperficial movement of plastic packaging layer 203 on described induction zone 211, can not cause damage to induction chip 201.And, because the hardness of described plastic packaging layer 203 is higher, therefore described plastic packaging layer 203 is difficult to occur deformation, even user's finger presses and described plastic packaging layer 203 surface, the thickness of described plastic packaging layer 203 is also difficult to change, thereby has ensured the testing result accuracy of induction zone 211.
The dielectric constant of described plastic packaging layer 203 is 7～9, and the electric isolating power of described plastic packaging layer 203 is stronger, and the protective capability of 203 pairs of described induction zone 211 of plastic packaging layer that is positioned at 211 surfaces, induction zone is stronger.
In the present embodiment, be positioned at plastic packaging layer 203 thinner thickness on 211 surfaces, induction zone, and capacitance between user finger and capacitor plate and the thickness of described plastic packaging layer 203 are inversely proportional to, be directly proportional to the dielectric constant of plastic packaging layer 203, therefore, when plastic packaging layer 203 thinner thickness on 211 surfaces, induction zone and dielectric constant are when larger, in the scope that user finger and the capacitance between capacitor plate can detect in induction zone 211, avoid capacitance excessive or too small and the induction of induction zone 211 was lost efficacy.
And, plastic packaging layer 203 thickness on 211 surfaces, induction zone in 20 microns～100 micrometer ranges, dielectric constant is being more than or equal in 7 scope, the selected material dielectric constant of plastic packaging layer 203 is larger, the thickness that is positioned at the plastic packaging layer 203 on 211 surfaces, induction zone also should corresponding increase, can be in a stable and detectable scope in induction zone 211 to make user point capacitance between capacitor plate.
The material of described plastic packaging layer 203 is epoxy resin, polyimide resin, benzocyclobutane olefine resin, polybenzoxazoles resin, polybutylene terephthalate, Merlon, PETG, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer, polyvinyl alcohol or other suitable polymeric materials.
In one embodiment, please refer to Fig. 3, described encapsulating structure also comprises: surround the shell 400 of described plastic packaging layer 203, wire 208 and induction chip 201, described shell 400 exposes the plastic packaging layer 203 on 211 surfaces, induction zone, the solid colour of the color of described plastic packaging layer 203 and described shell 400.For example, in the time that shell 400 colors are black, the color of described plastic packaging layer 203 is black, and in the time that shell 400 colors are white, described plastic packaging layer 203 color are white, and the encapsulating structure overall appearance of fingerprint recognition chip is coordinated.
In one embodiment, please refer to Fig. 4, described encapsulating structure also comprises: be positioned at the guard ring 209 on substrate 200 surfaces, described guard ring 209 surrounds described induction chip 201, wire 208 and plastic packaging layer 203.The first surface 230 of substrate 200 is fixed in the bottom of described guard ring 209, and described guard ring 209 is by described substrate 200 ground connection.
In this embodiment, described guard ring 209 is also positioned at described plastic packaging layer 203 surface, and at least exposes the plastic packaging layer 203 on 211 surfaces, induction zone of induction chip 201.In other embodiments, guard ring is only positioned at induction chip 201, wire 208 and plastic packaging layer 203 around, and exposes the surface of plastic packaging layer 203.
The material of described guard ring 209 is metal, and described metal is copper, tungsten, aluminium, silver or golden.Described guard ring 209 is for carrying out electrostatic defending to described induction chip 201; because described guard ring 209 is metal; described guard ring 209 can conduct electricity; when user's finger produces static in the time contacting plastic packaging layer 203; first electrostatic charge can reach substrate 200 from described guard ring 209; thereby avoid plastic packaging layer 203 to be punctured by excessive electrostatic potential; protect induction chip 201 with this; improve the accuracy of fingerprint detection; eliminate the signal noise that induction chip 201 is exported, the signal that induction chip 201 is exported is more accurate.
In one embodiment; please refer to Fig. 5; described encapsulating structure also comprises: the groove that is positioned at induction zone 211 plastic packaging layer 203 around; the sidewall of described plastic packaging layer 203 exposes described groove; the part guard ring 209 that is positioned at plastic packaging layer 203 surface is positioned at described groove; make the top surface of described guard ring 209 and the surface of described plastic packaging layer 203 comparatively smooth, the size that is conducive to dwindle encapsulating structure.And, because the plastic packaging layer 203 beyond induction zone 211 need to form groove by etching, therefore only need to ensure that the plastic packaging layer 203 that is positioned at 211 surfaces, induction zone has an even surface, the technique that forms described plastic packaging layer 203 is more easily accurately controlled, made to be positioned at the more accurate easily control of plastic packaging layer 203 thickness on 211 surfaces, induction zone.
In one embodiment; please refer to Fig. 6; described encapsulating structure also comprises: the shell 400 that surrounds described plastic packaging layer 203, wire 208, induction chip 201 and guard ring 209; described shell 400 at least exposes the plastic packaging layer 203 on 211 surfaces, induction zone, the solid colour of the color of described plastic packaging layer 203 and described shell 400.
In one embodiment, please refer to Fig. 7, described encapsulating structure also comprises: be positioned at the glass cover-plate 500 on described plastic packaging layer 203 surface, described glass cover-plate 500 at least covers the induction zone 211 of described induction chip 201.In this embodiment; described plastic packaging layer 203, induction chip 201 and wire 208 are also surrounded by guard ring 209 around; described guard ring 209 exposes the surface of plastic packaging layer 203, and described glass cover-plate 500 is positioned at described plastic packaging layer 203 surface, makes the more attractive in appearance of encapsulating structure.
Described glass cover-plate 500 is for the further induction zone 211 of protection induction chip 201, and the plastic packaging layer 203 on 203 surfaces, induction zone protects, and avoids described plastic packaging layer 203 to be worn.In this embodiment; because having had plastic packaging layer 203,211 surfaces, described induction zone cover; therefore described glass cover-plate 500 is without the effect of playing protection induction zone 211; the thinner thickness of described glass cover-plate 500; only be advisable can protect plastic packaging layer 203 to avoid wearing and tearing; therefore, still can improve the sensing capability of induction chip 201, reduce the highly sensitive requirement of induction chip 201.
In the present embodiment, the second surface of described induction chip is positioned at substrate first surface, and the first surface of described induction chip has induction zone, and described induction zone is used for extracting user fingerprints.The plastic packaging layer that is positioned at substrate and induction chip surface is covered in the surface, induction zone of described induction chip, for the protection of described induction zone.In the time that user's finger is placed in the plastic packaging layer surface on induction zone, user fingerprints can be extracted in described induction zone, and induction chip can be converted to described user fingerprints signal of telecommunication output.Because the material of described plastic packaging layer is polymer, and polymeric material has good ductility and pliability, and covering power is good, therefore, the described thinner thickness that can make plastic packaging layer, and hardness is higher, thus make described plastic packaging layer there is enough large hardness with protection induction chip; Simultaneously, described plastic packaging layer surface reduces to the distance of induction chip, makes induction chip be easy to detect user fingerprints, correspondingly, described encapsulating structure can reduce the requirement to induction chip sensitivity, makes the application of encapsulating structure of fingerprint recognition chip more extensive.
Accordingly, the utility model embodiment also provides a kind of method for packing that forms above-mentioned fingerprint recognition chip-packaging structure, as shown in Figs. 8 to 11.
Please refer to Fig. 8, substrate 200 is provided, described substrate 200 has first surface 230, and the first surface 230 of described substrate 200 has some the first soldering pad layers 205.
The first surface 230 of described substrate 200 is for the follow-up induction chip that is coupled.Form wiring layer and the first soldering pad layer 205 at the first surface 230 of described substrate 200, and described wiring layer is connected with described the first soldering pad layer 205.Described the first soldering pad layer 205 is for being electrically connected with the follow-up induction chip that is fixed on substrate 200 surfaces.
In the present embodiment, form connecting portion 204 in one end of substrate 200, the material of described connecting portion 204 comprises electric conducting material, and described wiring layer is connected to described connecting portion 204, thereby wiring layer and the first soldering pad layer 205 can be electrically connected with external circuit or device.
Please refer to Fig. 9, at the fixing induction chip 201 of first surface 230 of substrate 200, described induction chip 201 has first surface 211, and the second surface 212 relative with first surface 211, the second surface 212 of described induction chip 201 is positioned at the first surface 230 of substrate 200, the first surface 210 of described induction chip 201 has induction zone 211, and surround the external zones 212 of described induction zone 211, induction chip 201 surfaces of described external zones 212 have some the second soldering pad layers 207, and described the second soldering pad layer 207 is corresponding one by one with position and the quantity of the first soldering pad layer 205.
Described induction chip 201 is fixed on the first surface 230 of substrate 200 by tack coat, follow-uply by wire, the second soldering pad layer 207 is connected with the first soldering pad layer 205.By wire, the first soldering pad layer 205 is connected due to follow-up with the second soldering pad layer 207, therefore, without the technique by extra, the structure of described induction chip 201 is changed, to adapt to the wiring between the second soldering pad layer 207 and the first soldering pad layer 205, first surface 210 and the second surface 220 of described induction chip 201 are all smooth.Therefore, the packaging technology of the present embodiment is simplified, and reduces the manufacturing cost of encapsulating structure.
Described induction chip 201 is for identifying user fingerprints.The induction zone 211 of described induction chip 201 is for responding to user's finger print information, in described induction zone 211, can there is capacitance structure or there is induction structure, for detection of and obtain user fingerprints information, and be converted to signal of telecommunication output.
In the present embodiment, in described induction zone 211, be formed with at least one capacitor plate, in the time that user's finger is placed in plastic packaging layer 203 surface on induction zone 211, described capacitor plate, plastic packaging layer 203 and user point formation capacitance structure, and described induction zone 211 can obtain the capacitance difference between user's finger surface ridge and paddy and capacitor plate, and output after described capacitance difference is processed by chip circuit, obtain user fingerprints data with this.
Please refer to Figure 10, form some wires 208, the two ends of described wire 208 are electrically connected with described the first soldering pad layer 205 and the second soldering pad layer 207 respectively, described wire 208 has to the maximum summit A of substrate 200 first surface 230 distance, and described summit has the first distance to induction chip 201 first surfaces 210.
The technique that forms described wire 208 is routing technique, and the material of described wire 208 is metal, and described metal comprises copper, tungsten, aluminium, silver or golden.Described wire 208 bendings, and described wire 208 has to the summit A of substrate 200 surface distance maximums, described summit A is 50 microns～80 microns to the first distance of the first surface 210 of induction chip 201, the plastic packaging layer surface of follow-up formation need to be greater than described the first distance to the distance on induction chip 201 surfaces, to ensure that described plastic packaging layer 203 can surround described wire 208 and induction chip 201 completely.
Please refer to Figure 11, at the plastic packaging layer 203 on substrate 200 and induction chip 201 surfaces, the material of described plastic packaging layer 203 is polymer, described plastic packaging layer 203 surrounds described wire 208 and induction chip 201, plastic packaging layer 203 on described induction zone 211 has an even surface, described plastic packaging layer 203 surface have second distance to the first surface 210 of induction chip 201, and described second distance is greater than the first distance.
The material of described plastic packaging layer 203 is epoxy resin, polyimide resin, benzocyclobutane olefine resin, polybenzoxazoles resin, polybutylene terephthalate, Merlon, PETG, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer, polyvinyl alcohol or other suitable polymeric materials.
The formation technique of described plastic packaging layer 203 is Shooting Technique (injection molding), turns and mould technique (transfer molding) or silk-screen printing technique.The described envelope bed of material 400 can also adopt other suitable technique to form.Described plastic packaging layer 203 is formed at substrate 200 surfaces, surrounds described induction chip 201 and wire 208, and is covered in 211 surfaces, induction zone.Described plastic packaging layer 203 is not only for being fixed on induction chip on substrate 200 surfaces; protect and isolate described induction chip 201 and wire 208; can also be for the protection of described induction zone 211, user's finger can directly contact with the plastic packaging layer 203 on 211 surfaces, described induction zone.Therefore, the technique of the encapsulating structure of the fingerprint recognition chip of formation the present embodiment is simple, can reduce process time and manufacturing cost.
The thickness that is formed at the plastic packaging layer 203 on 211 surfaces, induction zone is 100 microns～150 microns, described thinner thickness, when user's finger is placed in plastic packaging layer 203 surface on described induction zone 211, described finger is less to the distance of induction zone 211, therefore, induction zone 211 more easily detects the fingerprint that user points, thereby has reduced the highly sensitive requirement of induction chip 201.And described thickness is greater than first distance of wire 208 summit A to induction chip 201 first surfaces 210, therefore described plastic packaging layer 203 can surround described wire 208 completely.
The Mohs' hardness of described plastic packaging layer 203 is more than or equal to 8H.The hardness of described plastic packaging layer 203 is higher; even if be positioned at plastic packaging layer 203 thinner thickness on 211 surfaces, induction zone; described plastic packaging layer 203 is also enough to protect the induction zone 211 of induction chip 201; in the time that user points surperficial movement of plastic packaging layer 203 on described induction zone 211, can not cause damage to induction chip 201.The dielectric constant of described plastic packaging layer 203 is more than or equal to 7, and the electric isolating power of described plastic packaging layer 203 is stronger, and the protective capability of 203 pairs of described induction zone 211 of plastic packaging layer that is positioned at 211 surfaces, induction zone is stronger.
In one embodiment, after forming encapsulated layer 203, can also form guard ring on substrate 200 surfaces, described guard ring surrounds described induction chip 201, wire 208 and plastic packaging layer 203.The material of described guard ring is metal, and described metal is copper, tungsten, aluminium, silver or golden.Described guard ring passes through described substrate 200 ground connection, thereby the electrostatic charge on plastic packaging layer 203 surface is derived.
In another embodiment, after forming plastic packaging layer 203, the interior formation groove of plastic packaging layer 203 around described induction zone 211, the sidewall of described plastic packaging layer 203 exposes described groove; Substrate 200 surfaces around plastic packaging layer 203, wire 208 and induction chip 201 form guard ring; part guard ring is positioned at plastic packaging layer 203 surface; and the part plastic packaging layer 203 that at least exposes 211 surfaces, induction chip 201 induction zone, the part guard ring that is positioned at plastic packaging layer 203 surface is positioned at described groove.
In the present embodiment; the first surface of described induction chip has induction zone; the plastic packaging layer that is formed at substrate and induction chip surface is also covered in surface, induction zone; described plastic packaging layer can be in the described induction chip of encapsulation; for the protection of the induction zone of induction chip; in the time that user's finger is placed in the plastic packaging layer surface on induction zone, can carry out fingerprint detection.Because the material of described plastic packaging layer is polymer, and polymeric material has good ductility and pliability, and covering power is good, can make to be formed at that the plastic packaging layer thickness on surface, induction zone is thin and hardness is high, therefore the plastic packaging layer, forming has enough large hardness with protection induction chip; And described plastic packaging layer surface reduces to the distance of induction chip, makes induction zone more easily obtain user fingerprints data, the encapsulating structure forming reduces the requirement of induction chip sensitivity, and the scope of application of described method for packing is more extensive.In addition,, because formed plastic packaging layer can be protected induction zone in encapsulation induction chip, the method that encapsulates induction chip is simplified; and; the material of described plastic packaging layer is polymer, and the cost that forms described plastic packaging layer is low, and then has reduced the cost of packaging technology.
Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection range of the present utility model should be as the criterion with claim limited range.
Claims (11)
1. a fingerprint recognition chip-packaging structure, is characterized in that, comprising:
Substrate, described substrate has first surface, and the first surface of described substrate has some the first soldering pad layers;
Be positioned at the induction chip of substrate first surface, described induction chip has first surface and the second surface relative with first surface, the second surface of described induction chip is positioned at the first surface of substrate, the first surface of described induction chip has induction zone and surrounds the external zones of described induction zone, and the induction chip surface of described external zones has some the second soldering pad layers;
Some wires that two ends are electrically connected with described the first soldering pad layer and the second soldering pad layer respectively, wherein, being positioned on described wire and apart from the point of substrate first surface maximum is summit, described summit is the first distance to induction chip first surface;
Be positioned at the plastic packaging layer on substrate and induction chip surface, the material of described plastic packaging layer is polymer, described plastic packaging layer surrounds described wire and induction chip, plastic packaging layer on described induction zone has an even surface, described plastic packaging layer surface has second distance to induction chip first surface, and described second distance is greater than the first distance.
2. fingerprint recognition chip-packaging structure as claimed in claim 1, is characterized in that, described the first distance is 50 microns～80 microns; Described second distance is 100 microns～150 microns.
3. fingerprint recognition chip-packaging structure as claimed in claim 1, is characterized in that, also comprises: be positioned at the guard ring of substrate surface, described guard ring surrounds described induction chip, wire and plastic packaging layer.
4. fingerprint recognition chip-packaging structure as claimed in claim 3, is characterized in that, described guard ring is also positioned at described plastic packaging layer surface, and at least exposes the plastic packaging layer on surface, induction chip induction zone.
5. fingerprint recognition chip-packaging structure as claimed in claim 4; it is characterized in that; also comprise: be positioned at the groove of induction zone plastic packaging layer around, the sidewall of described plastic packaging layer exposes described groove, and the part guard ring that is positioned at plastic packaging layer surface is positioned at described groove.
6. fingerprint recognition chip-packaging structure as claimed in claim 3, is characterized in that, substrate first surface is fixed in the bottom of described guard ring, and described guard ring is by described substrate ground connection.
7. fingerprint recognition chip-packaging structure as claimed in claim 3, is characterized in that, also comprises: surround the shell of described plastic packaging layer, wire, induction chip and guard ring, described shell at least exposes the plastic packaging layer on surface, induction zone.
8. fingerprint recognition chip-packaging structure as claimed in claim 1, is characterized in that, also comprises: the tack coat between induction chip and substrate, described tack coat is for being fixed on substrate first surface by induction chip.
9. fingerprint recognition chip-packaging structure as claimed in claim 1, is characterized in that, also comprises: be positioned at the glass cover-plate on described plastic packaging layer surface, described glass cover-plate at least covers the induction zone of described induction chip.
10. fingerprint recognition chip-packaging structure as claimed in claim 1, is characterized in that, also comprises: surround the shell of described plastic packaging layer, wire and induction chip, described shell exposes the plastic packaging layer on surface, induction zone.
11. fingerprint recognition chip-packaging structures as claimed in claim 1, is characterized in that, also comprise: be positioned at the connecting portion of one end of described substrate, described connecting portion is used for making induction chip to be electrically connected with external circuit.
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| CN201420361350.6U CN204029787U (en) | 2014-07-01 | 2014-07-01 | Fingerprint recognition chip-packaging structure |
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| CN104051367A (en) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
| CN105529308A (en) * | 2015-11-09 | 2016-04-27 | 华天科技（西安）有限公司 | Fingerprint chip package structure with cushion block employing underfill technology and manufacturing method |
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| CN107103274A (en) * | 2016-02-19 | 2017-08-29 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacture method |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
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| CN104051367A (en) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
| US10096643B2 (en) | 2014-07-01 | 2018-10-09 | China Wafer Level Csp Co., Ltd. | Fingerprint recognition chip packaging structure and packaging method |
| CN105529308A (en) * | 2015-11-09 | 2016-04-27 | 华天科技（西安）有限公司 | Fingerprint chip package structure with cushion block employing underfill technology and manufacturing method |
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| CN107103274A (en) * | 2016-02-19 | 2017-08-29 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacture method |
| CN105932017A (en) * | 2016-05-19 | 2016-09-07 | 苏州捷研芯纳米科技有限公司 | Ultrathin 3D-packaged semiconductor device and processing method thereof and semi-finished product in processing method |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
| US10395087B2 (en) | 2016-05-30 | 2019-08-27 | Shenzhen Xinwei Technology Co, Ltd. | Biometric sensing chip and electronic device using same |
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