CN204808355U - Chip packaging arrangement - Google Patents

Chip packaging arrangement Download PDF

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Publication number
CN204808355U
CN204808355U CN201520323888.2U CN201520323888U CN204808355U CN 204808355 U CN204808355 U CN 204808355U CN 201520323888 U CN201520323888 U CN 201520323888U CN 204808355 U CN204808355 U CN 204808355U
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CN
China
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described
surface
chip
induction
cover plate
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CN201520323888.2U
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Chinese (zh)
Inventor
王之奇
杨莹
喻琼
王蔚
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苏州晶方半导体科技股份有限公司
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Priority to CN201520323888.2U priority Critical patent/CN204808355U/en
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Publication of CN204808355U publication Critical patent/CN204808355U/en

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Abstract

The utility model provides a chip packaging arrangement includes: the base plate, the coupling in substrate surface sensing chip, sensing chip has first surface and the second surface relative with the first surface, sensing chip's first surface includes the induction zone, sensing chip's second surface is located the substrate surface, be located the apron on sensing chip's induction zone surface, the apron has surperficial and surperficial relative with the third fourth surface of the third that contacts with the induction zone, be located the plastic envelope layer of substrate surface, the plastic envelope layer surrounds sensing chip, the plastic envelope layer covers the partial lateral wall of apron, just the surface on plastic envelope layer is higher than third surface of lapping and the fourth surface that is less than the apron. Packaging structure can strengthen the cohesion between apron and the sensing chip, improves packaging structure's reliability.

Description

Chip-packaging structure

Technical field

The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of chip-packaging structure.

Background technology

Along with the progress of modern society, the importance of person identification and personal information security progressively receives the concern of people.Because somatic fingerprint has uniqueness and unchangeability, make fingerprint identification technology have security good, reliability is high, feature easy to use, makes fingerprint identification technology be widely used in protecting the various fields of personal information security.And along with the development of science and technology, the information security issue of each electronic product is one of concern main points of technical development all the time.Especially for mobile terminal, such as mobile phone, notebook computer, dull and stereotyped computer, digital camera etc., the demand for Information Security is more outstanding.

The sensing mode of existing fingerprint recognition device comprises condenser type (Electric field) and inductance type, and user fingerprints by extracting user fingerprints, and is converted to electric signal output by fingerprint recognition device, thus obtains the finger print information of user.Concrete, as shown in Figure 1, Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art, comprising: substrate 100; Be coupled in the fingerprint recognition chip 101 on substrate 100 surface; Be covered in the glass substrate 102 on described fingerprint recognition chip 101 surface.

For capacitance type fingerprint identification chip, in described fingerprint recognition chip 101, there is one or more capacitor plate.The epidermis pointed due to user or hypodermic layer have protruding ridge and the paddy of depression, when user points 103 contact described glass substrate 102 surface, described ridge is different to the distance of fingerprint recognition chip 101 from paddy, therefore, user points 103 ridges or the capacitance between paddy from capacitor plate is different, and fingerprint recognition chip 101 can obtain described different capacitance, and be translated into the output of corresponding electric signal, and after fingerprint recognition device gathers suffered electric signal, the finger print information of user can be obtained.

But, in existing fingerprint recognition device, higher to the sensitivity requirement of fingerprint recognition chip, the manufacture of fingerprint recognition device and application are restricted.

Utility model content

The problem that the utility model solves is to provide a kind of chip-packaging structure, and described encapsulating structure can strengthen the adhesion between cover plate and induction chip, improves the reliability of encapsulating structure.

For solving the problem, the utility model provides a kind of chip-packaging structure, comprising:

Substrate;

Be coupled in described substrate surface induction chip, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip comprises induction zone, and the second surface of described induction chip is positioned at substrate surface;

Be positioned at the cover plate on the surface, induction zone of described induction chip, described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone;

Be positioned at the plastic packaging layer of described substrate surface, described plastic packaging layer surrounds described induction chip, and described plastic packaging layer covers the partial sidewall of described cover plate, and the surface of described plastic packaging layer higher than described cover plate the 3rd surface and lower than cover plate the 4th surface.

Optionally, also comprise: the first surface of described induction chip has the external zones surrounding described induction zone; Induction zone and the surface, external zones of described induction chip have chip circuit; Be positioned at first weldering on surface, described induction chip external zones; Described chip circuit is connected with described first weld pad.

Optionally, also comprise: described substrate has the 5th surface, described induction chip is coupled in the 5th surface of substrate, and the 5th surface of described substrate has the second weld pad.

Optionally, also comprise: conductor wire, described conductor wire two ends are connected with the second weld pad with the first weld pad respectively.

Optionally, described conductor wire has to substrate surface apart from maximum point, on described conductor wire is summit to substrate surface apart from maximum point, and described plastic packaging layer surface is higher than described summit and lower than described lid surface.

Optionally, also comprise: the first tack coat being positioned at the second surface of described substrate surface or induction chip, make described induction chip be fixed on described substrate surface by described first tack coat.

Optionally, also comprise: the second tack coat being positioned at the first surface of described induction chip; Be positioned at the cover plate of described second tie layer surface.

Compared with prior art, the technical solution of the utility model has the following advantages:

In structure of the present utility model, the surface, induction zone of described induction chip has cover plate, and described substrate surface has the plastic packaging layer surrounding described induction chip, and described plastic packaging layer covers the partial sidewall of described cover plate.Wherein, described cover plate can directly and user's finger contacts, for the protection of described induction chip.And, compared to traditional glass substrate, described cover plate can select the material of thinner thickness, adopt described cover plate can reduce the distance of first surface to lid surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.Described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone, and the surface of described plastic packaging layer higher than described cover plate the 3rd surface and lower than cover plate the 4th surface, therefore, cover plate can be fixed on the first surface of described induction chip by described plastic packaging layer, make the combination between described cover plate and induction chip tightr, avoid the problem of described cover plate relative to induction chip layering or stripping, improve the reliability of encapsulating structure.Meanwhile, described plastic packaging layer exposes lid surface, then described plastic packaging layer can not counteract the sensitivity of the induction zone of induction chip, and the induction recognition performance of the induction zone of described induction chip is higher.

Further, described induction chip is fingerprint recognition chip or affects sensing chip.When described induction chip is image sensing chip, because the surface of described plastic packaging layer is surperficial lower than the 4th of described cover plate, described cover plate is exposed out, then light directly can to enter in described cover plate and to be delivered to the induction zone of induction chip, described plastic packaging layer can not weaken the light entering induction zone, then the sensing quality of described image sensing chip is better, sensitivity is higher.

Accompanying drawing explanation

Fig. 1 is the cross-sectional view of a kind of fingerprint recognition device of prior art;

Fig. 2 is the cross-sectional view of another kind of fingerprint recognition chip structure;

Fig. 3 to Fig. 7 is the section knot schematic diagram of the chip package process of the utility model embodiment.

Embodiment

As stated in the Background Art, in existing fingerprint recognition device, higher to the sensitivity requirement of fingerprint recognition chip, the manufacture of fingerprint recognition device and application are restricted.

Find through research; please continue to refer to Fig. 1; fingerprint recognition chip 101 surface coverage has glass substrate 102; described glass substrate 102 is for the protection of fingerprint recognition chip 101; and the finger 103 of user directly contacts with described glass substrate 102; therefore, in order to ensure that described glass substrate 102 has enough protective capabilities, the thickness of described glass substrate 102 is thicker.But, because the thickness of described glass substrate 102 is thicker, higher to the sensitivity requirement of fingerprint recognition chip 101, guarantee accurately to extract user fingerprints with this.But highly sensitive fingerprint recognition chip manufacturing difficulty is comparatively large, manufacturing cost is higher, then causes the application of fingerprint recognition chip and popularization to be restricted.

In order to reduce the requirement to the sensitivity of fingerprint recognition chip, proposing another kind of fingerprint recognition chip structure, please refer to Fig. 2, comprising: substrate 200; Be coupled in the induction chip 201 on substrate 200 surface, described induction chip 201 has first surface 210 and the second surface 220 relative with first surface 210, the first surface 210 of described induction chip 201 comprises induction zone 211, and the second surface 220 of described induction chip 201 is positioned at substrate 200 surface; Be positioned at the plastic packaging layer 202 on substrate 200 surface, described plastic packaging layer 202 surrounds described induction chip 201, and the surface of described plastic packaging layer 202 flushes with the first surface 210 of described induction chip 201; Be positioned at the overlayer 203 of described plastic packaging layer 202 and induction chip 201 first surface 210.

Wherein, the material of described overlayer 203 is polymeric material, inorganic nano material or stupalith; The thickness of described overlayer 203 is less than 100 microns.

Described overlayer 203 instead of traditional glass substrate, can directly and user's finger contacts, for the protection of induction chip 201.And, because the surface of described plastic packaging layer 202 flushes with the first surface 210 of described induction chip 201, make described overlayer 203 can be directly fixed on the first surface 210 of described plastic packaging layer 202 and induction chip 201.Compared to traditional glass substrate, the thinner thickness of described overlayer 203 and hardness is higher, described overlayer 203 has enough large hardness to protect the first surface 210 of induction chip.And described overlayer 203 can reduce the distance of first surface 210 to overlayer 203 surface of induction chip 201, and make induction chip 201 be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip 201 sensitivity.

But, fingerprint chip structure is comparatively strict for the thickness requirement of overlayer 203 as shown in Figure 2, and described overlayer 203 needs to be combined with plastic packaging layer 202 and induction chip 201 first surface 210 by cementing layer, adhesion then between overlayer 203 and induction chip 201 is more weak, easily there is the problem such as layering or stripping relative to induction chip 201 and plastic packaging layer 203 in overlayer 203, causes the sensitivity decrease of fingerprint recognition chip, reliability decrease.

In order to solve the problem, the utility model provides a kind of chip-packaging structure.Wherein, in encapsulating structure, the surface, induction zone of described induction chip has cover plate, and described substrate surface has the plastic packaging layer surrounding described induction chip, and described plastic packaging layer covers the partial sidewall of described cover plate.Wherein, described cover plate can directly and user's finger contacts, for the protection of described induction chip.And, compared to traditional glass substrate, described cover plate can select the material of thinner thickness, adopt described cover plate can reduce the distance of first surface to lid surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.Described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone, and the surface of described plastic packaging layer higher than described cover plate the 3rd surface and lower than cover plate the 4th surface, therefore, cover plate can be fixed on the first surface of described induction chip by described plastic packaging layer, make the combination between described cover plate and induction chip tightr, avoid the problem of described cover plate relative to induction chip layering or stripping, improve the reliability of encapsulating structure.Meanwhile, described plastic packaging layer exposes lid surface, then described plastic packaging layer can not counteract the sensitivity of the induction zone of induction chip, and the induction recognition performance of the induction zone of described induction chip is higher.

For enabling above-mentioned purpose of the present utility model, feature and advantage more become apparent, and are described in detail specific embodiment of the utility model below in conjunction with accompanying drawing.

Fig. 3 to Fig. 7 is the cross-sectional view of the chip package process of the utility model embodiment.

Please refer to Fig. 3, substrate 300 is provided.

Described substrate 300 is rigid substrate or flexible base plate.In the present embodiment, described substrate 200 is rigid substrate, and described rigid substrate is PCB substrate, glass substrate, metal substrate, semiconductor substrate or polymeric substrates.

In the present embodiment, described substrate 300 has the 5th surface 350, and the 5th surface 350 of described substrate 300 is for inductive coupling chip.5th surface 350 of described substrate 300 has wiring layer (not shown) and the second weld pad 351, and described wiring layer is connected with described second weld pad 351, and described second weld pad 351 is for being connected with the chip circuit on induction chip surface.

In the present embodiment, form connecting portion 306 in one end of described substrate 300, described connecting portion 306 is electrically connected with external circuit for making induction chip.The material of described connecting portion 306 comprises conductive material, described connecting portion 306 is electrically connected with described wiring layer, enable the chip circuit on described induction chip realize being electrically connected with external circuit or device by the wiring layer on substrate 200 the 5th surface 350 and connecting portion 360, transmit electric signal with this.

Afterwards, at the surperficial inductive coupling chip of described substrate 300, be described to the step at the surperficial inductive coupling chip of substrate 300 below.

Please refer to Fig. 4, at the fixing induction chip 301 in described substrate 300 surface, described induction chip 301 has first surface 310 and the second surface 320 relative with first surface 310, the first surface 310 of described induction chip 301 comprises induction zone 311, and the second surface 320 of described induction chip 301 is positioned at substrate 300 surface.

In the present embodiment, the first tack coat 302 is adhered at the second surface 320 of described induction chip 301, and described first adhesion layer 302 is pasted on the 5th surface 350 of described substrate 300, thus described induction chip 301 is made to be fixed on the first surface 350 of substrate 300.Subsequently through routing technique, described induction chip 301 can be made to be coupled with described substrate 300, even if realize between described induction chip 301 and the wiring layer on substrate 300 surface being electrically connected.

In another embodiment, the first adhesion layer can also be formed on the 5th surface 350 of described substrate 300, induction chip 301 is pasted on described first adhesion layer surface, make induction chip 301 be fixed on substrate 300 surface.

In the present embodiment, described induction chip 301 is fingerprint recognition chip.In the induction zone 311 of described induction chip 301, being formed with the electric capacity for obtaining user fingerprints information or induction structure, making described induction zone 311 can detect and receive the finger print information of user.In the present embodiment, the first surface 310 of described induction chip 301 also comprises the external zones 312 surrounding described induction zone 311, chip circuit is formed in the external zones 312 of described induction chip 301 first surface 310, described chip circuit is electrically connected with the capacitance structure in induction zone 311 or induction structure, processes for the electric signal exported capacitance structure or induction structure.

In the present embodiment, at least one capacitor plate is formed in described induction zone 311, when user's finger is placed in the lid surface of follow-up formation, described capacitor plate, cover plate and user point formation capacitance structure, and described induction zone 311 can obtain user's finger surface ridge and the capacitance difference between paddy and capacitor plate, and export after described capacitance difference is processed by chip circuit, obtain user fingerprints data with this.

The first surface 310 of described induction chip 301 also has the first weld pad 313 being positioned at surface, described induction chip external zones 312; Described chip circuit is connected with described first weld pad 313, subsequently through routing technique, the first weld pad 313 can be made to realize being electrically connected with the wiring layer on substrate 300 surface.

In another embodiment, described induction chip 301 is image sensing chip.In the induction zone 311 of described induction chip 301, be formed with the sensor for external image information, the cover plate of follow-up formation is positioned at surface, described induction zone 311, for the protection of the Optical Region in induction zone 311.

Please refer to Fig. 5, form cover plate 303 on surface, the induction zone 311 of described induction chip 301, described cover plate 303 has the 3rd surface 330 and four surface 340 relative with the 3rd surface 330 that contact with induction zone 311.

Described cover plate 303 is for the protection of induction zone 311, and when the finger of user is placed in cover plate 303 surface on described induction zone 311, described induction zone 311 can obtain the finger print information of user, and meanwhile, the friction of user's finger can not cause damage to induction zone 311.

In the present embodiment, the material of described cover plate 303 is sapphire, ceramic substrate or glass substrate, and described cover plate 303 is fixed on the first surface 310 of induction chip 301 by the second tack coat; The surface of described second tack coat has viscosity.In one embodiment, adhere to the second tack coat at the first surface 310 of described induction chip 301, adhere to cover plate 303 in described second tie layer surface.In another embodiment, at described cover plate 303 surface adhesion second tack coat, described second tack coat is adhered to the first surface 310 of described induction chip 301.

In one embodiment, described cover plate 303 is glass substrate, and the specific inductive capacity of described glass substrate is 6 ~ 10, and thickness is more than or equal to 100 microns.Because the specific inductive capacity of described cover plate 303 is comparatively large, the electric isolution ability of described cover plate 303 is comparatively strong, then the protective capability of described cover plate 303 pairs of induction zones 311 is stronger.

In another embodiment, described cover plate 303 is ceramic substrate, and the specific inductive capacity of described ceramic substrate is 20 ~ 100, and thickness is 100 ~ 200 microns.The specific inductive capacity of described cover plate 303 is more than or equal to 20; because the specific inductive capacity of described ceramic substrate is larger than glass substrate; the cover plate 303 of described ceramic substrate has stronger electric isolution ability; then the protective capability of cover plate 303 pairs of induction zones 311 of described ceramic substrate is stronger; and the thickness of the cover plate 303 of described ceramic substrate can be corresponding thinning compared with the cover plate 303 of glass substrate, size and the thickness of formed encapsulating structure can be reduced with this.

And the thinner thickness of described cover plate 303, when user's finger is placed in described cover plate 303 surface, described finger reduces to the distance of induction zone 311, therefore, described induction zone 311 more easily detects the fingerprint that user points, thus reduces the highly sensitive requirement of induction chip 301.

The color of described second tack coat comprises black or white.In another embodiment, can also form color layer in described second tie layer surface, described overlayer is formed at described color layer surface, and the color of described color layer comprises black or white.In other embodiments, described color layer can also be other color.

Please refer to Fig. 6, described induction chip 301 is coupled with substrate 300.

Before the described plastic packaging layer of formation, form conductor wire 304, described conductor wire 304 two ends are connected with the second weld pad 351 with the first weld pad 313 respectively.

Namely described induction chip 301 is coupled with substrate 300 is make described induction chip 301 can realize electrical interconnection with described substrate 300.In the present embodiment, by routing technique, described induction chip 301 is coupled with substrate 300.

In the present embodiment, before follow-up formation plastic packaging layer, form conductor wire 304 by routing technique, described conductor wire 304 two ends are connected with the second weld pad 351 with the first weld pad 313 respectively, make electrical interconnection between described induction chip 301 and substrate 300.Described conductor wire 304 can make chip circuit be electrically connected with the wiring layer on substrate 300 surface, and described wiring layer is electrically connected with connecting portion 306, make the chip circuit on induction chip 301 surface and induction zone 311 can carry out the transmission of electric signal with external circuit or device.The material of described conductor wire 304 is metal, and described metal is copper, tungsten, aluminium, gold or silver-colored.The technique adopting routing technique that induction chip 301 is electrically connected with substrate 300 is simple, and process costs is cheap.

Described routing technique comprises: provide conductor wire 304; Described conductor wire 304 two ends are connected with the second weld pad 314 with the first weld pad 313 respectively by welding technology.The material of described conductor wire 304 is metal, and described metal is copper, tungsten, aluminium, gold or silver-colored.

Because described conductor wire 304 is connected between the first weld pad 313 and the second weld pad 314, therefore described conductor wire 307 bends; Described conductor wire 304 have to the maximum point of substrate 300 surface distance, the point maximum to substrate 300 surface distance on described conductor wire 304 is summit, described summit is higher than first surface 310 surface of described induction chip 301, and described summit is lower than described cover plate 303 surface.Because the follow-up needs of described conductor wire 304 are wrapped up by plastic packaging layer, to make between described conductor wire 304 and induction chip 301 and electric isolution between conductor wire 304 and external environment condition, therefore, described summit also needs the plastic packaging layer surface lower than follow-up formation, the plastic packaging layer of follow-up formation is enable to wrap up described conductor wire 304 completely, make conductor wire 304 can and induction chip 301 between electric isolution, and avoid described conductor wire 304 exposed.

Please refer to Fig. 7, plastic packaging layer 305 is formed on described substrate 300 surface, described plastic packaging layer 305 surrounds described induction chip 301, described plastic packaging layer 305 covers the partial sidewall of described cover plate 303, and the surface of described plastic packaging layer 305 higher than described cover plate 303 the 3rd surface 330 and lower than the 4th surface 340 of cover plate 303.

Described plastic packaging layer 305 for fixing and protecting described induction chip 301, cover plate 303 and conductor wire 304, and to make between described conductor wire 304 and induction chip 301, between described conductor wire 304 and external environment condition and electric isolution between described induction chip 301 and external environment condition.

In the present embodiment, summit on described conductor wire 304 is higher than the first surface 310 of described induction chip 301, the surface of described plastic packaging layer 305 is higher than the summit of described conductor wire 304, make described plastic packaging layer 305 can wrap up described conductor wire 304 completely, make described conductor wire 304 and external environment condition electric isolution.

The material of described plastic packaging layer 305 is polymeric material, described polymeric material has good pliability, ductility and covering power, described polymeric material is epoxy resin, tygon, polypropylene, polyolefin, polyamide, polyurethane, and described plastic packaging layer 305 can also adopt other suitable capsulation material.

The surface of described plastic packaging layer 305 is higher than the 3rd surface 330 of described cover plate 303, namely higher than the first surface 310 of described induction chip 301, the then first surface 310 of described plastic packaging layer 305 cover part induction chip 301 and the sidewall of partial cover plate 303, described plastic packaging layer 305 can improve the adhesion between cover plate 303 and induction chip 301, avoid, between described cover plate 303 and induction chip 301, the problem such as layering or stripping occurs, improve the induction sensitivity of induction chip 301.

The surface of described plastic packaging layer 305 is lower than the 4th surface 340 of described cover plate 303, namely described plastic packaging layer 305 exposes described cover plate 303, thus the sensing capability avoiding described plastic packaging layer 305 pairs of induction zone 311 counteracts, be conducive to the recognition performance improving induction chip 301.

In one embodiment, described induction chip 301 is fingerprint recognition chip, and described plastic packaging layer 305 exposes described cover plate 303, avoids the distance between plastic packaging layer 305 adding users finger and induction zone 311, thus improves the recognition capability of induction chip 301.

In another embodiment, described induction chip 301 is image sensing chip, and described plastic packaging layer 305 exposes described cover plate 303, thus avoids the transmittance that plastic packaging layer 305 weakens cover plate 303, and the sensing quality of induction zone 311 is improved.

In the present embodiment, the formation process of described plastic packaging layer 305 is fluid plastic package process; In described fluid plastic package process, capsulation material for plastic packaging is provided to substrate 300 and induction chip 301 surface with form that is liquid or flowable state, and when the thickness of described capsulation material reach summit higher than conductor wire 304 and lower than described cover plate 303 surface after, capsulation material is cured, to form described plastic packaging layer 305.Adopt described fluid plastic package process, can be formed plastic packaging layer 305 thickness strictly be controlled, to ensure that plastic packaging layer 305 is while wrapping up conductor wire 304 completely, make the surface of described plastic packaging layer 305 lower than described cover plate 303 surface.The fluid plastic package process of described plastic packaging layer 305 comprises drip irrigation technique (potting).

In one embodiment, the formation process of described plastic packaging layer 305 is drip irrigation technique, comprise: adopt liquid distributor by low viscous capsulation material drip irrigation on substrate 300 and induction chip 301 surface, after the thickness of capsulation material reaches preset thickness, capsulation material is heating and curing, to form plastic packaging layer 305.

In the present embodiment, described plastic packaging layer 305 has preset thickness, and described preset thickness and described plastic packaging layer 305 need the design thickness reached; Described preset thickness demand fulfillment plastic packaging layer 305 covers the 3rd surface 330 of substrate 300, induction chip 301, conductor wire 304 and cover plate 303 completely, and described plastic packaging layer 305 needs the 4th surface 340 exposing described cover plate 303.

Because described plastic packaging layer 305 adopts fluid plastic package process to be formed, the thickness of described plastic packaging layer 305 accurately can be controlled, make formed plastic packaging layer 305 actual (real) thickness scope between 110% of 90% to the preset thickness of preset thickness.

In one embodiment, be also included in substrate 300 surface and form protection ring, described protection ring surrounds described induction chip 301, plastic packaging layer 305 and cover plate 303.The material of described protection ring is metal, and described protection ring is by described substrate 300 ground connection, and described protection ring is fixed on the 5th surface 350 of substrate 300.

Described protection ring is positioned at around described induction chip 301, cover plate 303 and plastic packaging layer 305, and part protection ring also to extend to above described plastic packaging layer 305 and exposes cover plate 303 surface be positioned on induction zone 311.In another embodiment, protection ring is only positioned at induction chip 301 and plastic packaging layer 305 around, and exposes described cover plate 303 surface completely.

The material of described protection ring is metal, and described metal is copper, tungsten, aluminium, silver or golden.Described protection ring is used for carrying out electrostatic defending to described induction chip 301; Because described protection ring is metal; described protection ring can conduct electricity; when user's finger produces electrostatic when contacting cover plate 303; then first electrostatic charge can reach substrate 300 from described protection ring; thus avoid cover plate 303 to be punctured by excessive electrostatic potential, protect induction chip 301 with this, improve the degree of accuracy of fingerprint detection; eliminate the signal noise that induction chip 301 exports, the signal that induction chip is exported is more accurate.

In another embodiment, also comprise the shell being formed and surround described plastic packaging layer 305, induction chip 301, cover plate 303 and protection ring, described shell exposes the cover plate 303 on surface, induction zone 301.Described shell can be need to arrange the device of fingerprint recognition chip or the shell of terminal, can also be the shell of the encapsulating structure of described fingerprint recognition chip.

In another embodiment, also comprise the shell being formed and surround described plastic packaging layer 305, induction chip 301 and overlayer 303, described shell exposes the overlayer 305 on surface, induction zone 311.

To sum up, in the present embodiment, form cover plate on surface, the induction zone of described induction chip, form the plastic packaging layer surrounding described induction chip at described substrate surface, and described plastic packaging layer covers the partial sidewall of described cover plate.Wherein, described cover plate can directly and user's finger contacts, for the protection of described induction chip.And, compared to traditional glass substrate, described cover plate can select the material of thinner thickness, adopt described cover plate can reduce the distance of first surface to lid surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.Described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone, and formed plastic packaging layer surface higher than described cover plate the 3rd surface and lower than cover plate the 4th surface, therefore, cover plate can be fixed on the first surface of described induction chip by described plastic packaging layer, make the combination between described cover plate and induction chip tightr, avoid the problem of described cover plate relative to induction chip layering or stripping, improve the reliability of encapsulating structure.Meanwhile, described plastic packaging layer exposes lid surface, then described plastic packaging layer can not counteract the sensitivity of the induction zone of induction chip, and the induction recognition performance of the induction zone of described induction chip is higher.

Accordingly, the utility model embodiment also provides a kind of chip-packaging structure adopting said method to be formed, and please continue to refer to Fig. 7, comprising:

Substrate 300;

Be coupled in described substrate 300 surface induction chip 301, described induction chip 301 has first surface 310 and the second surface 320 relative with first surface 310, the first surface 310 of described induction chip 301 comprises induction zone 311, and the second surface 320 of described induction chip 301 is positioned at substrate 300 surface;

Be positioned at the cover plate 303 on the surface, induction zone 311 of described induction chip 301, described cover plate 303 has the 3rd surface 330 and four surface 340 relative with the 3rd surface 330 that contact with induction zone 311;

Be positioned at the plastic packaging layer 305 on described substrate 300 surface, described plastic packaging layer 305 surrounds described induction chip 301, described plastic packaging layer 305 covers the partial sidewall of described cover plate 303, and the surface of described plastic packaging layer 305 higher than described cover plate 303 the 3rd surface 330 and lower than the 4th surface 340 of cover plate 303.

Below will be described in detail to said structure.

The material of described plastic packaging layer 305 is polymeric material; Described plastic packaging layer 305 has preset thickness; The actual (real) thickness scope of described plastic packaging layer 305 is 110% of 90% to preset thickness of preset thickness.

Described induction chip 301 is fingerprint recognition chip or image sensing chip.In the present embodiment, described chip-packaging structure also comprises: the first surface 310 of described induction chip 301 has the external zones 312 surrounding described induction zone 311; Induction zone 311 and the surface, external zones 312 of described induction chip 301 have chip circuit; Be positioned at first weldering 313 on surface, described induction chip 301 external zones 312; Described chip circuit is connected with described first weld pad 313.

Described substrate 300 has the 5th surface 350, and described induction chip 310 is coupled in the 5th surface 350 of substrate 300, and the 5th surface 350 of described substrate 300 has the second weld pad 351.

Described chip-packaging structure also comprises conductor wire 304, and described conductor wire 304 two ends are connected with the second weld pad 351 with the first weld pad 313 respectively, to realize being coupled between induction chip 301 with substrate 300.Described conductor wire 304 have to the maximum point of substrate 300 surface distance, the point maximum to substrate 300 surface distance on described conductor wire 304 is summit, described summit is higher than first surface 310 surface of described induction chip 301, and described summit is lower than described cover plate 303 surface.

Described chip-packaging structure also comprises: the first tack coat 302 being positioned at the second surface 320 of described substrate 300 surface or induction chip 301, makes described induction chip 301 be fixed on the first surface 310 of described substrate 300 by described first tack coat 302.In addition, in one embodiment, can also be interfixed by the second tack coat between the first surface 310 of described induction chip 301 and cover plate 303.

To sum up, in the present embodiment, the surface, induction zone of described induction chip has cover plate, and described substrate surface has the plastic packaging layer surrounding described induction chip, and described plastic packaging layer covers the partial sidewall of described cover plate.Wherein, described cover plate can directly and user's finger contacts, for the protection of described induction chip.And, compared to traditional glass substrate, described cover plate can select the material of thinner thickness, adopt described cover plate can reduce the distance of first surface to lid surface of induction chip, induction chip is made to be easy to user fingerprints be detected, correspondingly, described encapsulating structure reduces the requirement to induction chip sensitivity, makes the application of the encapsulating structure of fingerprint recognition chip more extensive.Described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone, and the surface of described plastic packaging layer higher than described cover plate the 3rd surface and lower than cover plate the 4th surface, therefore, cover plate can be fixed on the first surface of described induction chip by described plastic packaging layer, make the combination between described cover plate and induction chip tightr, avoid the problem of described cover plate relative to induction chip layering or stripping, improve the reliability of encapsulating structure.Meanwhile, described plastic packaging layer exposes lid surface, then described plastic packaging layer can not counteract the sensitivity of the induction zone of induction chip, and the induction recognition performance of the induction zone of described induction chip is higher.

Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection domain of the present utility model should be as the criterion with claim limited range.

Claims (7)

1. a chip-packaging structure, is characterized in that, comprising:
Substrate;
Be coupled in described substrate surface induction chip, described induction chip has first surface and the second surface relative with first surface, and the first surface of described induction chip comprises induction zone, and the second surface of described induction chip is positioned at substrate surface;
Be positioned at the cover plate on the surface, induction zone of described induction chip, described cover plate has the 3rd surface and four surface relative with the 3rd surface that contact with induction zone;
Be positioned at the plastic packaging layer of described substrate surface, described plastic packaging layer surrounds described induction chip, and described plastic packaging layer covers the partial sidewall of described cover plate, and the surface of described plastic packaging layer higher than described cover plate the 3rd surface and lower than cover plate the 4th surface.
2. chip-packaging structure as claimed in claim 1, is characterized in that, also comprise: the first surface of described induction chip has the external zones surrounding described induction zone; Induction zone and the surface, external zones of described induction chip have chip circuit; Be positioned at first weldering on surface, described induction chip external zones; Described chip circuit is connected with described first weld pad.
3. chip-packaging structure as claimed in claim 2, is characterized in that, also comprise: described substrate has the 5th surface, and described induction chip is coupled in the 5th surface of substrate, and the 5th surface of described substrate has the second weld pad.
4. chip-packaging structure as claimed in claim 3, it is characterized in that, also comprise: conductor wire, described conductor wire two ends are connected with the second weld pad with the first weld pad respectively.
5. chip-packaging structure as claimed in claim 4, it is characterized in that, described conductor wire has to substrate surface apart from maximum point, on described conductor wire is summit to substrate surface apart from maximum point, and described plastic packaging layer surface is higher than described summit and lower than described lid surface.
6. chip-packaging structure as claimed in claim 1, is characterized in that, also comprise: the first tack coat being positioned at the second surface of described substrate surface or induction chip, make described induction chip be fixed on described substrate surface by described first tack coat.
7. chip-packaging structure as claimed in claim 1, is characterized in that, also comprise: the second tack coat being positioned at the first surface of described induction chip; Be positioned at the cover plate of described second tie layer surface.
CN201520323888.2U 2015-05-19 2015-05-19 Chip packaging arrangement CN204808355U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104850840A (en) * 2015-05-19 2015-08-19 苏州晶方半导体科技股份有限公司 Chip packaging method and chip packaging structure
CN107539943A (en) * 2016-06-23 2018-01-05 黄卫东 The hybrid package structure and its method for packing of mems chip and IC chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104850840A (en) * 2015-05-19 2015-08-19 苏州晶方半导体科技股份有限公司 Chip packaging method and chip packaging structure
WO2016183979A1 (en) * 2015-05-19 2016-11-24 苏州晶方半导体科技股份有限公司 Chip packaging method and chip packaging structure
CN107539943A (en) * 2016-06-23 2018-01-05 黄卫东 The hybrid package structure and its method for packing of mems chip and IC chip

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