CN203661410U - Capacitive screen type flexible circuit board - Google Patents
Capacitive screen type flexible circuit board Download PDFInfo
- Publication number
- CN203661410U CN203661410U CN201420018995.XU CN201420018995U CN203661410U CN 203661410 U CN203661410 U CN 203661410U CN 201420018995 U CN201420018995 U CN 201420018995U CN 203661410 U CN203661410 U CN 203661410U
- Authority
- CN
- China
- Prior art keywords
- capacitance plate
- flexible pcb
- welding
- plate class
- rete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000002788 crimping Methods 0.000 claims abstract description 15
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 206010023204 Joint dislocation Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Abstract
The utility model relates to a flexible circuit board. A capacitive screen type flexible circuit board is disclosed. The stacked structure of the capacitive screen type flexible circuit board comprises a flexible insulating base material layer, copper layers on the upper surface and the lower surface of the flexible insulating base material layer, and upper and lower covering film layers for covering the upper and lower copper layers respectively. Reinforcing sheets are bonded through glue. The capacitive screen type flexible circuit board comprises a device welding portion for welding an IC and elements, an insertion and connection finger portion for being connected with connection terminals or a connection bonding pad portion for welding connectors, and a crimping finger portion for being crimped with a capacitive screen body. The improved structure is that the capacitive screen type flexible circuit board is located on a bending region located between the device welding portion and the crimping finger portion, the ground wire wiring of the copper layers are designed to be close to the middle region, the covering film layers are provided with closed windows, the upper and lower covering film layers are attached with an electromagnetic wave protective film separately, and the ground wires of the copper layers are in contact with the attached electromagnetic wave protective films through the windows formed in the covering film layers. The capacitive screen type flexible circuit board of the utility model is used in capacitive screen type electronic products.
Description
Technical field
The utility model relates to flexible PCB (FPC), relates in particular to capacitance plate class flexible PCB.
Background technology
Flexible PCB is that the one of making as base material take polyimides or polyester film has height reliability, and excellent flexible printed circuit, is called for short soft board or FPC, has that distribution density is high, lightweight, the feature of thin thickness.Therefore, flexible PCB is widely used in all kinds of portable electric appts, to make it have the frivolous advantage of volume mass.At existing capacitance plate series products, as mobile phone, panel computer etc., use in a large number flexible PCB.
But mainly there is following some problem in the capacitance plate class flexible PCB that existing conventional class is made:
A, existing conventional class is made the each one deck electromagnetic wave proof film attaching in the positive back side of capacitance plate class flexible circuit panel products can have fracture hidden danger in the time that Product Assembly bends;
B, existing conventional class is made capacitance plate class flexible circuit panel products and is prone to breakage problem in bending region;
C, existing conventional class is made capacitance plate class flexible circuit panel products and is prone to the device problem that comes off;
D, existing conventional class is made capacitance plate class flexible circuit panel products and is often occurred the few tin of IC pad and affect product reliability;
E, in addition, existing conventional class is made capacitance plate class flexible circuit panel products and is had antarafacial finger structure, also has an antarafacial binding finger dislocation and causes the problem of binding screen body off normal.
Utility model content
Therefore, the weak point existing in order to overcome prior art, the utility model proposes a kind of improved capacitance plate class flexible PCB, can address the above problem, and makes properties of product more stable.
The utility model adopts following technical scheme to realize:
A kind of capacitance plate class flexible PCB, its stepped construction is: the upper and lower layer that is equipped with the copper layer of line layout in the above and below of a flexible insulation substrate layer and covers respectively the copper layer of upper and lower layer covers rete, at the another side that is welded with IC and element by the gluing reinforcing chip that has; This capacitance plate class flexible PCB includes: for weld the device weld part of IC and element, for the connection welding disk of the inserting terminal finger section that is connected with splicing ear or solder connector and for the crimping finger section of capacitance plate body crimping.Improvement structure is: this capacitance plate class flexible PCB is on the bending region between device weld part and crimping finger section, the ground wire of copper layer is near zone line, covering the window of offering sealing on rete, and being pasted with respectively electromagnetic wave proof film on the covering rete of upper and lower layer, the ground wire of copper layer contacts with the electromagnetic wave proof film attaching by covering the window of offering on rete.
Wherein, other improvement structure is: the position that upper and lower layer covers the electromagnetic wave proof film attaching on rete is upper-lower position dislocation.
Wherein, other improvement structure is: the periphery size of reinforcing chip is to exceed the IC that welds on weld part and at least 0.5mm of peripheral scope of element.
Wherein, improvement structure is in addition: be multiple covering rete in the welding window offered of welding IC position, and be respectively the strip window of offering corresponding to the IC pad locations of each row's IC pin.
The architecture advances of capacitance plate class flexible PCB of the present utility model can solve the existing several problems of capacitance plate class flexible circuit board structure that above-mentioned existing conventional class is made, and is a kind of reliable and stable capacitance plate class flexible PCB.
Accompanying drawing explanation
Fig. 1 is the folded composition of capacitance plate class flexible PCB one series products;
Fig. 2 a is the front schematic view of the specific embodiment of a capacitance plate class flexible PCB;
Fig. 2 b is the side schematic view of this embodiment;
Fig. 2 c is the schematic rear view of this embodiment;
Fig. 3 a is the schematic diagram that the covering rete in existing conventional class making capacitance plate class flexible PCB front is windowed;
The front schematic view that the covering rete in the capacitance plate class flexible PCB front of this embodiment of Fig. 3 b is windowed;
The existing conventional class of Fig. 4 a is made the front schematic view of capacitance plate class flexible PCB attaching electromagnetic wave proof film;
The existing conventional class of Fig. 4 b is made the schematic rear view of capacitance plate class flexible PCB attaching electromagnetic wave proof film;
The front schematic view of the attaching electromagnetic wave proof film of the capacitance plate class flexible PCB of this embodiment of Fig. 5 a;
The schematic rear view of the attaching electromagnetic wave proof film of the capacitance plate class flexible PCB of this embodiment of Fig. 5 b;
Fig. 6 a is the front schematic view of the reinforcing chip back gauge size marking of the capacitance plate class flexible PCB of embodiment;
Fig. 6 b is the side schematic view of the reinforcing chip back gauge size marking of the capacitance plate class flexible PCB of embodiment;
Fig. 6 c is the schematic rear view of the reinforcing chip back gauge size marking of the capacitance plate class flexible PCB of embodiment;
Fig. 7 a is the schematic diagram that the covering rete in existing conventional class making capacitance plate class flexible PCB front is offered welding window;
Fig. 7 b is the schematic diagram that the positive covering rete of the capacitance plate class flexible PCB of embodiment is offered welding window.
Embodiment
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
Consulting shown in Fig. 1, is the folded composition of capacitance plate class flexible PCB one series products; And consult shown in Fig. 2 a, 2b, 2c, be the specific embodiment form of one of them capacitance plate class flexible PCB. simultaneouslyThe main body 1 of this capacitance plate class flexible PCB is similar to conventional flexible PCB, generally comprise: flexible insulation substrate layer 11, cover the copper layer 12 of flexible insulation substrate layer 11 above and below and cover respectively the covering rete (welding resisting layer) 13 of the copper layer 12 of upper and lower layer, at the another side (back side) that is welded with IC and element by glue 16 reinforcing chip 15 that bonds; In addition this class capacitance plate class flexible PCB generally also includes: for welding the device weld part 101 of IC and element, for the inserting terminal finger section 102(that is connected with splicing ear as this embodiment) or the connection welding disk of solder connector and for the crimping finger section 103 of capacitance plate body crimping.
Consult shown in Fig. 3 a and Fig. 3 b, make for existing conventional class capacitance plate class flexible circuit panel products appearance problem A specifically: capacitance plate class flexible circuit panel products is for improving anti-electromagnetic interference capability, can be at the two-sided attaching electromagnetic wave proof of main body 1 film 14 of capacitance plate class flexible PCB, be on covering rete 13, to attach electromagnetic wave proof film 14(to consult Fig. 4 a, 4b), offer one or more windows 131 at the certain position that covers rete 13 simultaneously, thereby the ground wire of copper layer 12 can be contacted by this window 131 with electromagnetic wave proof film 14, and there is anti-electromagnetic interference effect.But the reason that existing capacitance plate class flexible PCB as shown in Figure 3 is not usually considered because of wiring, and make ground line position approach board edge, to close on the non-closed window that edge is offered thereby make to cover the window 131 of offering on rete 13, and this region is the bending region between device weld part 101 and crimping finger section 103 just, thereby be prone to phenomenon of rupture.For improving this problem A, consult shown in 3b, this embodiment is on the bending region between device weld part 101 and crimping finger section 103, must be near zone line by the ground wire wires design of the copper layer 12 of circuit board, thus the window 131 of offering on ensuring coverage rete 13 is strict closed windows.
Consult shown in Fig. 4 a, 4b and Fig. 5 a, 5b, make for existing conventional class capacitance plate class flexible circuit panel products appearance problem B specifically: capacitance plate class flexible circuit panel products is for improving anti-electromagnetic interference capability, at the two-sided attaching electromagnetic wave proof of main body 1 film 14 of capacitance plate class flexible PCB.But existing conventional class making capacitance plate class flexible PCB is as shown in Fig. 4 a, 4b for the sticking position of two-sided electromagnetic wave proof film 14, the position of the electromagnetic wave proof film 14 that the front and back of the main body 1 of capacitance plate class flexible PCB attaches is completely corresponding consistent, this will easily cause stress to concentrate, therefore can have fracture hidden danger when Product Assembly bends.For improving this problem B, consult shown in Fig. 5 a, 5b, this embodiment is to adopt dislocation design at the two-sided attaching electromagnetic wave proof of main body 1 film 14 of capacitance plate class flexible PCB, and the position of the electromagnetic wave proof film 14 that positive and negative two sides attaches is that non-upper-lower position is overlapping.Like this, just can avoid stress to concentrate and cause capacitance plate class flexible PCB Product Assembly when bending to produce the possibility of fracture.
Consult shown in Fig. 6 a, 6b, 6c, make for existing conventional class capacitance plate class flexible circuit panel products appearance problem C specifically: capacitance plate class flexible circuit panel products is the intensity that improves welding IC and element, can be at the another side (back side) that is welded with IC and element by glue 16 reinforcing chip 15 that bonds.But existing conventional class make the shape design of capacitance plate class flexible PCB to reinforcing chip 15 and with device weld part 101 on the IC of welding and quite (or it is following only slightly to exceed 0.2mm scope) of the peripheral scope of element, can easily cause like this device generation that comes off.For improving this problem C, consult shown in Fig. 6 a, 6b, 6c, this embodiment is to exceed the IC of welding on weld part 101 and at least 0.5mm of peripheral scope of element being welded with the another side of IC and element (back side) by the bond periphery size of a reinforcing chip 15 of glue 16.Like this, just can avoid the IC of welding and the possibility that element comes off.
Consult shown in Fig. 7 a, 7b, make for existing conventional class capacitance plate class flexible circuit panel products appearance problem D specifically: the covering rete 13 of capacitance plate class flexible circuit panel products on the copper layer 12 of the one side of device weld part 101 offered a welding window 132 in welding IC position, so that scolding tin can be soldered to IC pin on the IC pad of copper layer 12.But existing conventional class is made capacitance plate class flexible PCB, for covering rete 13, offer a welding window 132 in welding IC position are window shape relative with IC periphery, often in the time having windowed wire traction between IC pad and ground, on pad, tin can be pulled to ground connection by wire and windows on PAD, thereby cause the few tin of this pad welding, thereby affect product reliability.For improving this problem D, consult shown in Fig. 7 a, 7b, this embodiment is being multiple for covering rete 13 in the welding window 132 offered of welding IC position, and is respectively the strip window of offering corresponding to the IC pad locations of each row's IC pin.Like this, just can avoid the generation of the few tin of above-mentioned pad welding, the reliability of product is provided.
In addition, make capacitance plate class flexible circuit panel products for existing conventional class and there is the problem that the occurs E of antarafacial finger structure, can on the processing procedure of capacitance plate class flexible circuit panel products, overcome, solve as expose by increase positioning sleeve pin target and y target detect the means such as dislocation.
To sum up, the architecture advances of capacitance plate class flexible PCB of the present utility model, has solved some problems of the capacitance plate class flexible PCB existence of conventional class making.Conclude, the stepped construction of capacitance plate class flexible PCB of the present utility model is: the upper and lower layer that is equipped with the copper layer 12 of line layout in the above and below of a flexible insulation substrate layer 11 and covers respectively the copper layer 12 of upper and lower layer covers rete (welding resisting layer) 13, is bonded with reinforcing chip 15 at the another side that is welded with IC and element by glue 16; This capacitance plate class flexible PCB includes: for welding the device weld part 101 of IC and element, for the inserting terminal finger section 102(that is connected with splicing ear as this embodiment) or the connection welding disk of solder connector and for the crimping finger section 103 of capacitance plate body crimping.Improving structure A is: this capacitance plate class flexible PCB is on the bending region between device weld part 101 and crimping finger section 103, must be near zone line by the ground wire wires design of copper layer 12, covering the window 131 of offering strict sealing on rete 13, and being pasted with respectively electromagnetic wave proof film 14 on the covering rete 13 of upper and lower layer, the ground wire of copper layer 12 contacts with the electromagnetic wave proof film 14 attaching by covering the window 131 of offering on rete 13.Improving structure B is: the position that upper and lower layer covers the electromagnetic wave proof film 14 attaching on rete 13 is upper-lower position dislocation.Improvement structure C is: the periphery size of reinforcing chip 15 is to exceed the IC of welding on weld part 101 and at least 0.5mm of peripheral scope of element.Improving structure D is: be multiple covering the welding window 132 that rete 13 offers in welding IC position, and be respectively the strip window of offering corresponding to the IC pad locations of each row's IC pin.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (5)
1. a capacitance plate class flexible PCB, its stepped construction is: the upper and lower layer that is equipped with the copper layer of line layout in the above and below of a flexible insulation substrate layer and covers respectively the copper layer of upper and lower layer covers rete, at the another side that is welded with IC and element by the gluing reinforcing chip that has; This capacitance plate class flexible PCB includes: for weld the device weld part of IC and element, for the connection welding disk of the inserting terminal finger section that is connected with splicing ear or solder connector and for the crimping finger section of capacitance plate body crimping; It is characterized in that: this capacitance plate class flexible PCB is on the bending region between device weld part and crimping finger section, the ground wire of copper layer is near zone line, covering the window of offering sealing on rete, and being pasted with respectively electromagnetic wave proof film on the covering rete of upper and lower layer, the ground wire of copper layer contacts with the electromagnetic wave proof film attaching by covering the window of offering on rete.
2. capacitance plate class flexible PCB according to claim 1, is characterized in that: the position that upper and lower layer covers the electromagnetic wave proof film attaching on rete is upper-lower position dislocation.
3. capacitance plate class flexible PCB according to claim 1 and 2, is characterized in that: the periphery size of reinforcing chip is to exceed the IC that welds on weld part and at least 0.5mm of peripheral scope of element.
4. capacitance plate class flexible PCB according to claim 1 and 2, it is characterized in that: be multiple covering rete in the welding window offered of welding IC position, and be respectively the strip window of offering corresponding to the IC pad locations of each row's IC pin.
5. capacitance plate class flexible PCB according to claim 3, is characterized in that: be multiple covering rete in the welding window offered of welding IC position, and be respectively the strip window of offering corresponding to the IC pad locations of each row's IC pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018995.XU CN203661410U (en) | 2014-01-14 | 2014-01-14 | Capacitive screen type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420018995.XU CN203661410U (en) | 2014-01-14 | 2014-01-14 | Capacitive screen type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203661410U true CN203661410U (en) | 2014-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420018995.XU Expired - Lifetime CN203661410U (en) | 2014-01-14 | 2014-01-14 | Capacitive screen type flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203661410U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661426A (en) * | 2015-01-28 | 2015-05-27 | 珠海市超赢电子科技有限公司 | Circuit board adopting steel sheet tin filling grounding |
| CN105578720A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105873359A (en) * | 2016-06-13 | 2016-08-17 | 惠州Tcl移动通信有限公司 | Flexible circuit board for capacitive touch screen and detection method of electromagnetic shielding film of flexible circuit board for capacitive touch screen |
| CN106163080A (en) * | 2015-04-14 | 2016-11-23 | 常熟精元电脑有限公司 | Flexible circuit board |
| CN107291311A (en) * | 2017-06-27 | 2017-10-24 | 长沙市宇顺显示技术有限公司 | A kind of preparation method of the anti-injureds of capacitor touch-control display screen FPC |
| CN108877545A (en) * | 2018-06-29 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | Display device |
-
2014
- 2014-01-14 CN CN201420018995.XU patent/CN203661410U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661426A (en) * | 2015-01-28 | 2015-05-27 | 珠海市超赢电子科技有限公司 | Circuit board adopting steel sheet tin filling grounding |
| CN106163080A (en) * | 2015-04-14 | 2016-11-23 | 常熟精元电脑有限公司 | Flexible circuit board |
| CN106163080B (en) * | 2015-04-14 | 2018-08-31 | 常熟精元电脑有限公司 | Flexible circuit board |
| CN105578720A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105578720B (en) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
| CN105873359A (en) * | 2016-06-13 | 2016-08-17 | 惠州Tcl移动通信有限公司 | Flexible circuit board for capacitive touch screen and detection method of electromagnetic shielding film of flexible circuit board for capacitive touch screen |
| CN105873359B (en) * | 2016-06-13 | 2018-12-25 | 惠州Tcl移动通信有限公司 | For the flexible circuit board of capacitance touch screen and its detection method of electromagnetic shielding film |
| CN107291311A (en) * | 2017-06-27 | 2017-10-24 | 长沙市宇顺显示技术有限公司 | A kind of preparation method of the anti-injureds of capacitor touch-control display screen FPC |
| CN108877545A (en) * | 2018-06-29 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140618 |