CN202353916U - Improved structure of multilayer flexible printed circuit board - Google Patents
Improved structure of multilayer flexible printed circuit board Download PDFInfo
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- CN202353916U CN202353916U CN2011204431164U CN201120443116U CN202353916U CN 202353916 U CN202353916 U CN 202353916U CN 2011204431164 U CN2011204431164 U CN 2011204431164U CN 201120443116 U CN201120443116 U CN 201120443116U CN 202353916 U CN202353916 U CN 202353916U
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Abstract
An improved structure of a multilayer flexible printed circuit board comprises a first shielding layer, a second shielding layer and a plurality of line layers arranged between the first shielding layer and the second shielding layer, wherein the first shielding layer and the second shielding layer are arranged in a stacked manner; each line layer comprises a data signal wire and a grounding wire; the grounding wires of all of the line layers are communicated with one another; and the improved structure is characterized in that the first shielding layer is a copper foil layer, and the grounding wires are communicated with the first shielding layer and the second shielding layer. The improved structure of the multilayer flexible printed circuit board has better grounding and shielding effects and higher antistatic capability.
Description
Technical field:
The utility model relates to a kind of improvement structure of multi-layer flexible printed circuit board.
Background technology:
The design of present most of multi-layer flexible printed circuit board and manufacturing are to adopt the mode that is similar to the multilayer hardboard to realize, behind the layer flexible material mutual superposition pressure-sensitive adhesive, the circuit connection between each layer is to utilize the mode of the heavy copper of via hole to realize connecting; In addition, existing multi-layer flexible printed circuit board is through pasting silver foil ground connection.There is following defective in it: 1, because the silver foil conduction is poor, and unstable, so cause ground connection effect, antistatic effect and the shield effectiveness of multi-layer flexible printed circuit board all undesirable; For example; When it specifically was applied to clamshell phone, existing multi-layer flexible printed circuit board was through detecting; About its antistatic effect 8KV, antenna performance 60 minutes.2, since flexible material itself intrinsic material thermal expansion coefficient big; Exist between layer and the layer pressing via hole bad and the interlayer circuit to sink copper and be connected defectives such as open circuit; Cause the acceptance rate of multi-layer flexible printed circuit board lower, the reliability of finished product is also poor.
Summary of the invention:
The purpose of the utility model is to provide a kind of improvement structure of multi-layer flexible printed circuit board, and its ground connection effect, antistatic effect and shield effectiveness are comparatively desirable.
A kind of improvement structure of multi-layer flexible printed circuit board; Comprise first screen, the secondary shielding layer of range upon range of setting and be located at first screen and the secondary shielding layer between the several layers line layer; Said each layer line layer includes data signal line and earth connection; The earth connection of each line layer is interconnected, and it is characterized in that: said first screen is a copper foil layer, and said earth connection is communicated with first screen and secondary shielding layer.
Said secondary shielding layer is copper foil layer or silver foil layer.
Said several layers line layer comprise first line layer, second line layer from top to bottom at least and be located at first line layer or second line layer on input port and output port, first line layer and second line layer all are electrically connected with said input port and output port.
Be provided with first broken line between said first line layer and second line layer, first line layer and second line layer are folded to form stepped construction along this first broken line.
Be provided with second broken line between said first screen and first line layer, first screen and first line layer are folded to form stepped construction along this second broken line.
Be provided with the 3rd broken line between the said secondary shielding layer and second line layer, the secondary shielding layer and second line layer are folded to form stepped construction along the 3rd broken line.
The directly sticking bottom surface of being located at said second line layer of said silver foil layer.
Said input port and output port are located on second line layer; Second line layer directly is electrically connected with input port and output port; Said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected; Corresponding input port and output port place also are provided with stiffening plate on said second line layer, and stiffening plate is between first line layer and second line layer.
Also be provided with the double faced adhesive tape adhered layer between said first line layer and the stiffening plate, be provided with conduction double faced adhesive tape adhered layer between said first screen and first line layer.
Be provided with corresponding doubling location hole between said first line layer and second line layer, also be provided with corresponding doubling location hole between said first line layer and first screen.
The utlity model has following advantage: 1, said first screen is a copper foil layer; Earth connection is with after first screen and secondary shielding layer are communicated with, and its ground connection effect, antistatic effect and shield effectiveness are comparatively desirable, for example; When it is applied to clamshell phone; Through detecting, about its antistatic property 12KV, antenna performance is compared with the data that background technology is carried and is improved 2db.2, said several layers line layer is folded to form sandwich construction along broken line, and is simple in structure, do not have the bad technical problem of range upon range of pressure-sensitive adhesive, can improve reliability of products and acceptance rate.3, input port and output port directly are electrically connected with second line layer; Said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected; The problem of open circuit when not existing the heavy copper of via hole to connect, electric performance stablity.4, the stickup of the setting of doubling location hole and double faced adhesive tape can make each folding conductive layer form stable stepped construction, and does not have the problem of the glue that overflows.
Description of drawings:
Fig. 1 is the folding back of the utility model front view.
Fig. 2 is the right view of Fig. 1.
Fig. 3 analyses and observe enlarged diagram for the A portion of Fig. 2.
Fig. 4 is the utility model embodiment one expanded view.
Fig. 5 is the utility model embodiment two expanded views.
Embodiment:
Embodiment one: extremely shown in Figure 4 like Fig. 1; A kind of improvement structure of multi-layer flexible printed circuit board; Comprise first screen 1, the secondary shielding layer 2 of range upon range of setting and be located at the several layers line layer between first screen 1 and the secondary shielding layer 2; Said each layer line layer includes the flexible insulation bearing substrate and is located on the flexible insulation bearing substrate or interior data signal line and earth connection, and the earth connection of each line layer is interconnected, and said first screen 1 is a copper foil layer; Said secondary shielding layer 2 is the silver foil layer, and said earth connection is communicated with first screen 1 and secondary shielding layer 2.
Said several layers line layer comprises first line layer 3, second line layer 4 from top to bottom at least and is located at input port 41 and the output port 42 on second line layer 4; Corresponding input port and output port place also are provided with stiffening plate 5 on second line layer 4; Be provided with first broken line 01 and corresponding doubling location hole 6 between said first line layer 3 and second line layer 4; First line layer 3 and second line layer 4 are folded to form stepped construction along this first broken line 01; And make stiffening plate 5 between first line layer 3 and second line layer 4; Wherein, Also be provided with double faced adhesive tape adhered layer 71 between first line layer 3 and the stiffening plate 5, said first line layer 3 walk around said first broken line 01 back directly be located at second line layer 4 on said input port 41 be electrically connected with output port 42, second line layer 4 then directly is electrically connected with input port 41 and output port 42.Be provided with second broken line 02 and corresponding doubling location hole 6 each other between said first screen 1 and first line layer 3; First screen 1 and first line layer 3 are folded to form stepped construction along this second broken line 02; Be provided with conduction double faced adhesive tape adhered layer 72 between said first screen 1 and first line layer 3; Make in first line layer 3 earth connection through the B point in the conduction double faced adhesive tape adhered layer 72 directly with first screen 1 in the realization of A point be electrically connected; Make between 2 of the A, B not have electrical potential difference, can be immediately with the direct earth shield of the extraneous signal of telecommunication.Said secondary shielding layer 2 is one deck silver foil layer independently, its directly sticking bottom surface of being located at said second line layer 4.
As shown in Figure 4; In the present embodiment; Said first line layer 3, second line layer 4 and first screen 1 are integrated; Second line layer 4 folds back to the back of first line layer 3 along first broken lines 01 earlier, and then with first screen 1 be folded to from top to bottom first line layer 3 above.When this multi-layer flexible printed circuit board is applied to clamshell phone; One end of said first screen 1 be provided with the clamshell phone host shell in the terminal 9 that is connected of the ground wire of circuit board, its other end is provided with the terminal 8 that is connected with the ground wire of circuit board in clamshell phone is renovated housing.
Embodiment two; As shown in Figure 5; Be with embodiment one difference: said secondary shielding layer 2 is copper foil layer; Be provided with the 3rd broken line 03 and corresponding doubling location hole 6 each other between secondary shielding layer 2 and second line layer 4, the secondary shielding layer 2 and second line layer 4 are folded to form stepped construction along the 3rd broken line 03.In the present embodiment; First line layer 3, second line layer 4, first screen 1 and secondary shielding layer 2 are integrated; Second line layer 3 folds back to the back of first line layer 3 along first broken line 01 earlier; And then with first screen 1 be folded to from top to bottom first line layer 3 above, again secondary shielding layer 2 is folded to from lower to upper at last the back of second line layer 4.
The above is merely the preferred embodiment of the utility model; Be not to be used for limiting the scope that the utility model is implemented; The utility model also can comprise tertiary circuit layer, the 4th line layer even multilayer line line layer more; Each line layer is folded to form stepped construction with reference to aforementioned structure and is coated by said screen, and all equal variation and modifications of being done according to the utility model claim all fall into the scope that the utility model patent contains.
Claims (10)
1. the improvement structure of a multi-layer flexible printed circuit board; Comprise first screen, the secondary shielding layer of range upon range of setting and be located at first screen and the secondary shielding layer between the several layers line layer; Said each layer line layer includes data signal line and earth connection; The earth connection of each line layer is interconnected, and it is characterized in that: said first screen is a copper foil layer, and said earth connection is communicated with first screen and secondary shielding layer.
2. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 1, it is characterized in that: said secondary shielding layer is copper foil layer or silver foil layer.
3. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 1 and 2; It is characterized in that: said several layers line layer comprise first line layer, second line layer from top to bottom at least and be located at first line layer or second line layer on input port and output port, first line layer and second line layer all are electrically connected with said input port and output port.
4. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 3; It is characterized in that: be provided with first broken line between said first line layer and second line layer, first line layer and second line layer are folded to form stepped construction along this first broken line.
5. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 4; It is characterized in that: be provided with second broken line between said first screen and first line layer, first screen and first line layer are folded to form stepped construction along this second broken line.
6. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 5; It is characterized in that: be provided with the 3rd broken line between the said secondary shielding layer and second line layer, the secondary shielding layer and second line layer are folded to form stepped construction along the 3rd broken line.
7. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 5 is characterized in that: the directly sticking bottom surface of being located at said second line layer of said silver foil layer.
8. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 7; It is characterized in that: said input port and output port are located on second line layer; Second line layer directly is electrically connected with input port and output port; Said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected; Corresponding input port and output port place also are provided with stiffening plate on said second line layer, and stiffening plate is between first line layer and second line layer.
9. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 8; It is characterized in that: also be provided with the double faced adhesive tape adhered layer between said first line layer and the stiffening plate, be provided with conduction double faced adhesive tape adhered layer between said first screen and first line layer.
10. the improvement structure of a kind of multi-layer flexible printed circuit board according to claim 9; It is characterized in that: be provided with corresponding doubling location hole between said first line layer and second line layer, also be provided with corresponding doubling location hole between said first line layer and first screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204431164U CN202353916U (en) | 2011-11-10 | 2011-11-10 | Improved structure of multilayer flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204431164U CN202353916U (en) | 2011-11-10 | 2011-11-10 | Improved structure of multilayer flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN202353916U true CN202353916U (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204431164U Expired - Fee Related CN202353916U (en) | 2011-11-10 | 2011-11-10 | Improved structure of multilayer flexible printed circuit board |
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| CN (1) | CN202353916U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404930A (en) * | 2011-11-10 | 2012-04-04 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN105636336A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
| US20170299635A1 (en) * | 2016-04-13 | 2017-10-19 | Audi Ag | Printed circuit board and motor vehicle equipped with such a printed circuit board |
| CN108765628A (en) * | 2018-05-04 | 2018-11-06 | 深圳佰维存储科技股份有限公司 | Black box |
-
2011
- 2011-11-10 CN CN2011204431164U patent/CN202353916U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102404930A (en) * | 2011-11-10 | 2012-04-04 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN102404930B (en) * | 2011-11-10 | 2015-06-03 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN105636336A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
| US20170299635A1 (en) * | 2016-04-13 | 2017-10-19 | Audi Ag | Printed circuit board and motor vehicle equipped with such a printed circuit board |
| US10488441B2 (en) * | 2016-04-13 | 2019-11-26 | Audi Ag | Printed circuit board and motor vehicle equipped with such a printed circuit board |
| CN108765628A (en) * | 2018-05-04 | 2018-11-06 | 深圳佰维存储科技股份有限公司 | Black box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20121110 |