CN202888174U - LED light source module - Google Patents

Abstract

The utility model is suitable for the field of LED lighting, and provides an LED light source module, which includes a substrate and a circuit layer arranged on the substrate, and a plurality of LED chips are arranged on the circuit layer, and each LED chip is connected to the circuit through a conductive lead wire. Layers are electrically connected, and the substrate is provided with strip-shaped grooves along both sides of multiple LED chips. The circuit layer is sunken along with the grooves, and the grooves are filled with conductive glue. into the conductive glue. The utility model sets grooves along both sides of the LED chip, and fills the grooves with conductive glue, and connects multiple conductive leads to the circuit layer uniformly, without performing a glue dispensing process on each conductive lead as in the traditional method. Simplifies the process and improves efficiency; there is a bonding force between the conductive adhesive and the bottom and side surfaces of the groove, which is much greater than the bonding force with the bottom surface, making the connection between the conductive lead and the circuit layer more stable, and strengthening the light source module stability.

Description

A LED light source module

technical field

The utility model belongs to the field of LED lighting, in particular to an LED light source module.

Background technique

In recent years, LED lighting technology has developed rapidly, and there are many LED packaging technologies, among which COB (Chip-on-Board) technology has the advantages of high reliability, high luminous efficiency, high withstand voltage and low thermal resistance, and is a widely used packaging technology. One of the techniques.

In the field of LED lighting, it is the future development trend to replace point light sources with planar light sources. However, due to the high heat dissipation coefficient of COB ceramic substrates in COB technology, the heat is dissipated quickly during the process of heating and welding COB ceramics by wire bonding machines, and it is difficult for COB substrates to reach the temperature. Balanced, the individual points of the welding wire will cause insufficient residual gold due to the temperature of the substrate not meeting the requirements, making the welding wire unstable; in addition, during the process of copper foil wiring on the surface of the COB substrate, dust particles are easy to enter, and ceramic fragments are easy to remain on the surface These dust particles and ceramic debris are directly soldered without being cleaned up, which can easily cause the gold wire to become warped or falsely welded, and also cause the gold wire to be welded weakly. In the process of COB packaging wire bonding, the heat generated during the lighting process of the chip will cause the packaging colloid to expand and generate tension on the lead. If the lead itself is not welded firmly, it will be more likely to be broken. Because the COB planar light source directly sews multiple chips on the ceramic base in parallel and series through the lead wire, if a lead wire is pulled off, causing one chip to not light up, the entire group connected in series with this chip will The light will go out, and at the same time cause the flow of other parallel groups to increase, and over time cause the entire light source group to die.

The prior art proposes two solutions. The first one, as shown in Figures 1 and 2, increases the diameter of the lead wire 101. At present, the lead wires used in the LED market are all 99.99% pure gold with good ductility, and thickening the gold wire will inevitably lead to The cost is too high, and if the gold wire is too thick, it will exceed the electrode of the chip 102, resulting in electric leakage, so it is not suitable for use. The second method, as shown in Figures 3 and 4, is to place a drop of conductive silver glue 303 at the second soldering point of the lead wire 301 (the connection point between the lead wire 301 and the copper foil 302) to fix it, because the conductive silver glue 303 lights up and heats up the chip 304. The middle is easy to become brittle, and the contact area with copper platinum 302 is limited. Once the conductive silver glue 303 expands, it will cause the silver glue to loosen, and the lead wire 301 will be broken, resulting in dead light. The protective effect of this solution on the lead wire is also very limited.

Utility model content

The purpose of the utility model is to provide an LED light source module, aiming at strengthening the stability of the connection between the lead wire and the substrate, preventing the lead wire from being broken, and improving the reliability of the light source module.

The utility model is achieved in this way. An LED light source module includes a substrate and a circuit layer arranged on the substrate. A plurality of LED chips are arranged on the circuit layer, and each of the LED chips is electrically conductive. Leads are electrically connected to the circuit layer, and it is characterized in that the substrate is provided with strip-shaped grooves along both sides of the plurality of LED chips, and the circuit layer is sunken in along with the grooves, and the The groove is filled with conductive glue, one end of the conductive lead is connected to the LED chip, and the other end is buried in the conductive glue.

As the preferred technical solution of the utility model:

One end of the conductive lead buried in the conductive glue is in contact with the part of the circuit layer sunk in the bottom of the groove.

The plurality of LED chips are arranged in a line, and the grooves are in a line.

A dam surrounding the LED chip is also provided on the substrate, and the dam is filled with encapsulant for sealing the LED chip and the conductive lead.

The dam is integrated with the base plate.

The utility model sets grooves along both sides of a plurality of LED chips, leads the ends of the conductive leads into the grooves, fills the grooves with conductive glue, and uniformly connects the plurality of conductive leads to the circuit in the grooves. On the first layer, it is not necessary to perform a welding or dispensing process for each conductive lead as in the traditional method, which greatly simplifies the process, improves work efficiency, and reduces costs; Dispensing glue at the solder joints, the fixing effect only depends on the bonding force between the colloid and the bottom surface, and the fixing effect is very limited. The conductive leads in this embodiment are embedded in the conductive glue, and the conductive glue and the bottom surface and both sides of the groove There is a binding force on all three surfaces, which is much greater than the binding force with the bottom surface of the substrate, which makes the connection between the conductive lead and the circuit layer more stable, thereby enhancing the stability of the LED light source module.

Description of drawings

Fig. 1 is a first structural schematic diagram of an LED light source module in the prior art;

Fig. 2 is A-A direction view among Fig. 1;

Fig. 3 is a second structural schematic diagram of an LED light source module in the prior art;

Fig. 4 is B-B direction view among Fig. 3;

Fig. 5 is a schematic diagram of the first structure of the LED light source module according to the embodiment of the present invention;

Fig. 6 is a second structural schematic diagram of the LED light source module according to the embodiment of the present invention;

Fig. 7 is a view from direction C-C in Fig. 6 .

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

The concrete realization of the present utility model is described in detail below in conjunction with specific embodiment:

FIG. 5 shows a schematic structural diagram of an LED light source module according to an embodiment of the present invention. For convenience of description, only parts related to this embodiment are shown.

The LED light source module includes a substrate 1 and a circuit layer 2 arranged on the substrate 1. The circuit layer 2 can be formed by etching copper foil according to a preset circuit pattern, and a plurality of LED chips 3 are arranged on the circuit layer 2. The LED chips 3 are usually connected in parallel or in series, and this embodiment does not limit the specific connection. Each LED chip 3 is electrically connected to the circuit layer 2 through a conductive lead 4 . On the substrate 1, there are strip-shaped grooves 5 along both sides of a plurality of LED chips 3, and the circuit layer 2 on the substrate 1 is sunken along with the grooves 5, and the grooves 5 are filled with conductive glue 6, Figure 7. Moreover, one end of each conductive lead 4 is connected to an LED chip 3 , while the other end extends into the groove 5 and is buried in the conductive glue 6 . In this way, the LED chips 3 connected by the conductive leads 4 whose ends extend into the same groove 5 form a parallel relationship. To realize parallel and series hybrid connection, the number of grooves 5 can be set according to actual needs. For example, for a group of LED chips arranged in-line and parallel to each other, a line of in-line grooves can be opened along both sides of the group of LED chips. grooves, and then embed the two ends of the two conductive leads connected to the same LED chip into the grooves on both sides. If you want to achieve a combination of series and parallel connections, you can open multiple grooves. This implementation is specific to the specific development The slot mode is not limited.

In this embodiment, grooves 5 are provided along both sides of a plurality of LED chips 3, the ends of the conductive leads 4 are led into the grooves 5, and conductive glue 6 is filled in the grooves 5 to unify the plurality of conductive leads 4. Connected to the circuit layer 2 in the groove 5, it is not necessary to perform a welding or dispensing process for each conductive lead as in the traditional method, which greatly simplifies the process, improves work efficiency, and reduces costs; in addition , the traditional solution is directly dispensing glue at the second welding point of the conductive lead, the fixing effect only depends on the bonding force between the colloid and the bottom surface, the fixing effect is very limited, the conductive lead 4 in this embodiment is embedded in the conductive glue 6, However, there is a bonding force between the conductive adhesive 6 and the bottom surface and the two sides of the groove 5, which is much greater than the bonding force with the bottom surface of the substrate, so that the connection between the conductive lead 4 and the circuit layer 2 is more stable, and then Enhanced the stability of the LED light source module.

Referring to FIG. 7, since one end of the conductive lead 4 is embedded in the conductive glue 6, the conductive glue 6 is in direct contact with the circuit layer 2, so even if the conductive lead 4 is not in contact with the circuit layer 2, it will be connected to the circuit layer 2 through the conductive glue 6. Indirect electrical connection, so this embodiment further reduces the difficulty and accuracy of fixing the conductive lead 4 . However, as a preferred implementation of this embodiment, the end of the conductive lead 4 is preferably connected to the part of the circuit layer 2 that sinks into the bottom of the groove 5, and then strengthened and fixed by the conductive glue 6 to make the fixing effect better.

In this embodiment, LED chips 3 can be arranged in various ways, specifically, it can be arranged in a straight line, in a zigzag shape, in a rectangular shape, etc., and the present embodiment is preferably arranged in a straight line, as shown in Figures 5 and 6. When the groove 5 is in the shape of a line along the arrangement direction of the LED chips 3, it is convenient for manufacturing, wiring and potting. Of course, if multiple rows of LED chips need to be manufactured, grooves can be formed on both sides of each row of LED chips.

Further referring to FIGS. 6 and 7 , in this embodiment, a dam 7 can also be arranged on the substrate 1 and around the LED chip 3 , so that it is convenient to pour encapsulant 8 into the dam 7 to seal the LED chip 3 and the conductive lead 4 At the same time, the inner surface of the dam 7 can be used as a reflective surface to reflect the light emitted by the LED chip 3 to the outside to control the direction of the light.

Further, the dam 7 can be independently manufactured on the surface of the substrate 1, or it can be integrally formed with the same material as the substrate 1. In this embodiment, it is preferably integrally formed. Even if it is easy to manufacture, it can also enhance the sealing performance of the package and prevent moisture Gas infiltrates from the bottom of the dam 7 to corrode the LED chip 3, further improving the reliability of the LED light source module.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (5)

1. A LED light source module, comprising a substrate and a circuit layer arranged on the substrate, a plurality of LED chips are arranged on the circuit layer, and each of the LED chips is connected to the circuit layer through conductive leads. For electrical connection, it is characterized in that the substrate is provided with strip-shaped grooves along both sides of the plurality of LED chips, the circuit layer is sunken along with the grooves, and the grooves are filled with conductive glue, one end of the conductive lead is connected to the LED chip, and the other end is buried in the conductive glue. 2 . The LED light source module according to claim 1 , wherein one end of the conductive lead embedded in the conductive glue is in contact with a part of the circuit layer sunk in the bottom of the groove. 3 . 3. The LED light source module according to claim 1 or 2, wherein the plurality of LED chips are arranged in a line, and the grooves are in a line. 4. The LED light source module according to claim 1 or 2, wherein the substrate is further provided with a dam surrounding the LED chip, and the dam is filled with a Encapsulants for conductive lead sealing. 5 . The LED light source module according to claim 4 , wherein the dam is integrated with the substrate.

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