CN205429359U - Type -c interface and integrative encapsulation memory disc structure of USB interface - Google Patents
Type -c interface and integrative encapsulation memory disc structure of USB interface Download PDFInfo
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- CN205429359U CN205429359U CN201620182577.3U CN201620182577U CN205429359U CN 205429359 U CN205429359 U CN 205429359U CN 201620182577 U CN201620182577 U CN 201620182577U CN 205429359 U CN205429359 U CN 205429359U
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- 238000005538 encapsulation Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims description 37
- 238000000465 moulding Methods 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000006870 function Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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Abstract
The utility model discloses a type C interface and the integrative encapsulation memory disc structure of USB interface, it includes SIP package substrate, on SIP package substrate, be provided with USB type respectively C interface and USB interface, the one end that SIP package substrate is close to the USB interface is provided with one row of contact site, USB metal shrapnel is connected to the contact site, USB metal shrapnel fixes in a square frame, square frame's left and right sides frame strip is opened has near terminal of through -hole and left and right sides frame strip to open jaggedly, be provided with avris metal shrapnel in the frame strip through -hole of the left and right sides, this avris metal shrapnel end connection is on the contact site, the other end extends to the terminal breach department of left and right sides frame strip, it is provided with the through -hole to state square frame front end horizontal bar department, the through -hole is passed to middle part USB metal shrapnel one end, the connection is on the contact site, the crooked perk of the other end, arrange the groove that separates in the square frame. The utility model discloses the storage signal transmission will be more swift, and two interface function collection are integrative, saves the manufacturing cost of storage card.
Description
Technical field
The utility model relates to electronic applications, particularly relates to a kind of type-c interface and USB interface integral packaging storage dish structure.
Background technology
Development along with mobile phone Yu various portable products, mini memory card market Fast Growth, such as SD (SecureDigital), MicroSD, MMC (MultiMediaCard), USB2.0 Yu USB3.0 interface memory card (USB flash disk) etc..Storage card is a kind of high-capacity flash memory circuit module, this circuit module is connectable to an electronic information platform, such as personal computer, mobile phone, digital camera, multimedia browser etc., in order to store various digital multimedia data, such as digital photo, video data or voice data etc..
Employed in packaging technology, substrate is constituted by moulding ester material, and wherein include circuit connecting wire (usually copper foil circuit), realize the electrical connection between controller chip and flash memory chip, passive component and golden finger by the circuit connecting wire in substrate.Owing to the price of baseplate material itself is higher and processing technology is relative complex so that the cost of storage card chip improves relatively.It addition, gold thread in substrate because all chips all to need wiring to be connected to substrate relative travel longer, also can increase the cost of overall package technique.
Utility model content
For deficiency of the prior art, the technical problems to be solved in the utility model there are provided a kind of type-c interface and USB interface integral packaging storage dish structure.
For solving above-mentioned technical problem, the utility model is realized by below scheme: a kind of type-c interface and USB interface integral packaging storage dish structure, this storage dish structure includes SIP base plate for packaging；
At the surface front and rear of SIP base plate for packaging, it is respectively arranged with USB
Type-c interface and USB interface, described USB type-c interface connection end rear portion is suspended on outside SIP base plate for packaging, and described USB interface seat is on SIP base plate for packaging；
Described USB type-c interface is connected to SIP base plate for packaging by metal finger；
Described SIP base plate for packaging is provided with row's contact site near one end of USB interface, contact site connects USB metal clips, USB metal clips is fixed in a square box body, the left and right sides moulding of square framework has near through hole and left and right sides moulding end and has breach, it is provided with avris metal clips in the moulding through hole of the left and right sides, this avris metal clips end is connected on contact site, and the other end extends to the indentation, there of left and right sides moulding end；
Being provided with through hole at described square frame forward end horizontal stripe, USB metal clips one end, middle part passes through hole, is connected on contact site, and other end bending tilts, the groove being divided in being placed in square box body.
Further, described USB type-c interface is USB3.1
Type-c interface or Lightning interface.
Further, described USB interface is USB3.0 type
AUBA237 interface.
Further, the USB metal clips of the groove being divided in square box body is 2-1-2 arrangement.
Further, the upper surface of described square framework, being close to one end of contact site, be provided with U-frame, this U-frame corner is right angle.
Further, the upper surface of described SIP base plate for packaging, USB
Between type-c interface and USB interface, it is provided with convex platform.
Further, described USB type-c interface upper surface is provided with Access Division, the side rounding of USB type-c interface, and the side at rounding is provided with circular hole.
Further, in square box body, the front, warping part of middle part USB metal clips, it is provided with row's sheet metal.
Relative to prior art, the beneficial effects of the utility model are: type-c interface is combined by the utility model with USB interface, storage dish structure function is made to increase, the most in the line, gold thread is not had to connect, storage signal transmission will be more quick, and two interface functions are integrated, save the production cost of storage card.USB type-c interface can be divided into Micro-USB interface, Lightning interface, two kinds of interfaces to support traditional Android mobile phone socket and i Phone socket respectively, and storage dish is easy to carry.
Accompanying drawing explanation
Fig. 1 is the utility model storage dish Micro-USB interface and USB interface integral packaging structural representation.
Fig. 2 is the utility model storage dish Lightning interface and USB interface integral packaging structural representation.
Accompanying drawing marks: USB type-c interface 1, Access Division 2, convex platform 3, contact site 4, U-frame 5, USB metal clips 6, sheet metal 7, avris metal clips 8, SIP base plate for packaging 9, metal finger 10, circular hole 11.
Detailed description of the invention
Below in conjunction with the accompanying drawings preferred embodiment of the present utility model is described in detail, so that advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus protection domain of the present utility model is made apparent clear and definite defining.
Refer to accompanying drawing 1 ~ 2, a kind of type-c interface of the present utility model and USB interface integral packaging storage dish structure, this storage dish structure includes SIP base plate for packaging 9；At the surface front and rear of SIP base plate for packaging 9, being respectively arranged with USB type-c interface 1 and USB interface, described USB type-c interface 1 connects end rear portion and is suspended on outside SIP base plate for packaging 9, and described USB interface seat is on SIP base plate for packaging 9；Described USB type-c interface 1 is connected to SIP base plate for packaging 9 by metal finger 10；Described SIP base plate for packaging 9 is provided with row's contact site 4 near one end of USB interface, contact site connects USB metal clips, USB metal clips is fixed in a square box body, the left and right sides moulding of square framework has near through hole and left and right sides moulding end and has breach, it is provided with avris metal clips 8 in the moulding through hole of the left and right sides, this avris metal clips 8 end is connected on contact site 4, and the other end extends to the indentation, there of left and right sides moulding end；Being provided with through hole at described square frame forward end horizontal stripe, USB metal clips 6 one end, middle part passes through hole, is connected on contact site 4, and other end bending tilts, the groove being divided in being placed in square box body.Described USB type-c interface 1 is USB3.1
Type-c interface or Lightning interface, USB3.1 type-c interface is also Micro-USB interface, and Lightning interface is the charging inlet of i Phone.Described USB interface is USB3.0 type AUBA237 interface, and the USB metal clips of the groove being divided in square box body is 2-1-2 arrangement.The upper surface of described square framework, being close to one end of contact site 4, be provided with U-frame 5, this U-frame 5 corner is right angle, the upper surface of described SIP base plate for packaging 9, between USB type-c interface 1 and USB interface, is provided with convex platform 3.Described USB type-c interface 1 upper surface is provided with Access Division 2, the side rounding of USB type-c interface 1, and the side at rounding is provided with circular hole 11, in square box body, the front, warping part of middle part USB metal clips 6, is provided with row's sheet metal 7.Type-c interface is combined by the utility model with USB interface, makes storage dish structure function increase, the most in the line, does not has gold thread to connect, and storage signal transmission will be more quick, and two interface functions are integrated, save the production cost of storage card.USB type-c interface can be divided into Micro-USB interface, Lightning interface, two kinds of interfaces to support traditional Android mobile phone socket and i Phone socket respectively, and storage dish is easy to carry.
The foregoing is only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure utilizing the utility model specification and accompanying drawing content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, the most in like manner it is included in scope of patent protection of the present utility model.
Claims (8)
1. a type-c interface and USB interface integral packaging storage dish structure, it is characterised in that: this storage dish structure includes SIP base plate for packaging (9)；
Surface front and rear at SIP base plate for packaging (9), it is respectively arranged with USB type-c interface (1) and USB interface, described USB type-c interface (1) connects end rear portion and is suspended on SIP base plate for packaging (9) outside, and described USB interface seat is on SIP base plate for packaging (9)；
Described USB type-c interface (1) is connected to SIP base plate for packaging (9) by metal finger (10)；
Described SIP base plate for packaging (9) is provided with row's contact site (4) near one end of USB interface, contact site connects USB metal clips, USB metal clips is fixed in a square box body, the left and right sides moulding of square framework has near through hole and left and right sides moulding end and has breach, avris metal clips (8) it is provided with in the moulding through hole of the left and right sides, this avris metal clips (8) end is connected on contact site (4), and the other end extends to the indentation, there of left and right sides moulding end；
Being provided with through hole at described square frame forward end horizontal stripe, USB metal clips (6) one end, middle part passes through hole, is connected on contact site (4), and other end bending tilts, the groove being divided in being placed in square box body.
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: described USB type-c interface (1) is USB3.1 type-c interface or Lightning interface.
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: described USB interface is USB3.0 type AUBA237 interface.
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: the USB metal clips of the groove being divided in square box body is 2-1-2 arrangement.
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: the upper surface of described square framework, being close to one end of contact site (4), be provided with U-frame (5), this U-frame (5) corner is right angle.
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: the upper surface of described SIP base plate for packaging (9), between USB type-c interface (1) and USB interface, it is provided with convex platform (3).
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterized in that: described USB type-c interface (1) upper surface is provided with Access Division (2), the side rounding of USB type-c interface (1), the side at rounding is provided with circular hole (11).
A kind of type-c interface the most according to claim 1 and USB interface integral packaging storage dish structure, it is characterised in that: in square box body, the front, warping part at middle part USB metal clips (6), it is provided with row's sheet metal (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620182577.3U CN205429359U (en) | 2016-03-10 | 2016-03-10 | Type -c interface and integrative encapsulation memory disc structure of USB interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620182577.3U CN205429359U (en) | 2016-03-10 | 2016-03-10 | Type -c interface and integrative encapsulation memory disc structure of USB interface |
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| CN205429359U true CN205429359U (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620182577.3U Active CN205429359U (en) | 2016-03-10 | 2016-03-10 | Type -c interface and integrative encapsulation memory disc structure of USB interface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252344A (en) * | 2016-09-12 | 2016-12-21 | 深圳市时创意电子有限公司 | The multiple-layer stacked storage dish of a kind of same substrate compatibility multiple interfaces and packaging technology thereof |
-
2016
- 2016-03-10 CN CN201620182577.3U patent/CN205429359U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252344A (en) * | 2016-09-12 | 2016-12-21 | 深圳市时创意电子有限公司 | The multiple-layer stacked storage dish of a kind of same substrate compatibility multiple interfaces and packaging technology thereof |
| CN106252344B (en) * | 2016-09-12 | 2019-01-04 | 深圳市时创意电子有限公司 | A kind of the multiple-layer stacked storage dish and its packaging technology of the compatible multiple interfaces of same substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 the first floor to the third floor of No.7 Xinfa East Road, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province. The business premises are set up in No.2 workshop, zone a, xinfengze Industrial Zone, Shangnan East Road Patentee after: Ni Huangzhong Address before: 518000, Guangdong, Baoan, Shenzhen manhole street, Whampoa East Ring Road, Feng Industrial Park, 2 buildings, four floor northwest side Patentee before: Ni Huangzhong |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211221 Address after: 518000 floor 1, floor 2, floor 3, floor 5, floor 1, floor 2, floor 3, No. 7, Xinfa East Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee after: SHENZHEN SHICHUANGYI ELECTRONIC CO.,LTD. Address before: 518000 business premises are set up on the first to third floors, No. 7, Xinfa East Road, Xinqiao street, Bao'an District, Shenzhen, Guangdong Province, and at plant 2, zone a, xinfengze Industrial Zone, Shangnan East Road Patentee before: Ni Huangzhong |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 floor 1, floor 2, floor 3, floor 5, floor 1, floor 2, floor 3, No. 7, Xinfa East Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Shi Creative Electronics Co.,Ltd. Country or region after: China Address before: 518000 floor 1, floor 2, floor 3, floor 5, floor 1, floor 2, floor 3, No. 7, Xinfa East Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN SHICHUANGYI ELECTRONIC CO.,LTD. Country or region before: China |