CN206505948U - The sheet-shaped LED device and its display screen of a kind of high moisture - Google Patents
The sheet-shaped LED device and its display screen of a kind of high moisture Download PDFInfo
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- CN206505948U CN206505948U CN201720121718.5U CN201720121718U CN206505948U CN 206505948 U CN206505948 U CN 206505948U CN 201720121718 U CN201720121718 U CN 201720121718U CN 206505948 U CN206505948 U CN 206505948U
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Abstract
The utility model discloses a kind of sheet-shaped LED device of high moisture, including：Substrate, at least one LED chip and the packing colloid of the cladding LED chip being arranged on the substrate, the substrate includes at least one die bond pad and at least one pad with the die bond pad mutually insulated, the die bond pad includes chip mount portion, weld part and the connection chip mount portion and the connecting portion of the weld part, characterized in that, the either path connected between the connecting portion and the chip mount portion and the weld part is more than the shortest path connected between the chip mount portion and the weld part.A kind of display screen is also disclosed in the utility model.The sheet-shaped LED device and its display screen for a kind of high moisture that the utility model is provided, by setting bending part in connecting portion, extend the path that steam enters device inside along the gap between die bond pad and packing colloid, so as to improve the air-tightness of LED component.
Description
Technical field
The utility model is related to LED encapsulation technologies field, more particularly to the sheet-shaped LED device of a kind of high moisture and its aobvious
Display screen.
Background technology
Because the thermal coefficient of expansion of epoxy resin and metal has differences, and on packing colloid and pcb board insulation layer it is viscous
Relay degree is more than packing colloid and the bonding dynamics of metallic region on pcb board, easily causes the stripping of packing colloid and metallic region
From so as to cause moisture of external environment condition and other impurities to enter along the gap between metal pins and packing colloid in device
Portion, cause chip occur power down pole and metal ion transport etc. extremely cause chip failure so that cause display screen module concealed light,
Cross luma.
Traditional sheet-shaped LED device architecture, as shown in figure 1, the die bond pad 10 includes chip mount portion 101, welding
Portion 103 and the connection chip mount portion and the connecting portion 102 of the weld part（Dotted line is substantially separator bar in figure）；It is described
LED chip 2 is arranged in the chip mount portion, and extraneous steam is easily by the gap between packing colloid and die bond pad
Device inside is entered, the problem of causing component failure.
The content of the invention
The purpose of this utility model is sheet-shaped LED device and its display screen there is provided a kind of high moisture, and it can overcome
The deficiencies in the prior art, solve the airtight sex chromosome mosaicism that current device occurs in use for some time, and external environment condition steam enters
, there is chip power-down pole in device inside, and metal ion transport etc. is abnormal, the problem of causing display screen module concealed light, cross luma.
In order to solve the above technical problems, the technical solution of the utility model is：
A kind of sheet-shaped LED device of high moisture, including：Substrate, is arranged at least one LED chip on the substrate
And the packing colloid of the LED chip is coated, the substrate includes at least one die bond pad and at least one and the die bond
The pad of pad mutually insulated, the die bond pad includes chip mount portion, weld part and connects the chip mount portion and institute
State the connecting portion of weld part, it is characterised in that connected between the connecting portion and the chip mount portion and the weld part
Either path is more than the shortest path connected between the chip mount portion and the weld part.
Preferably, the connecting portion includes bending part.
Preferably, the connecting portion includes two bending parts, respectively the first bending part and the second bending part, described first
Bending part is close to the weld part, the angle of the bending part bending close to the chip mount portion, second bending part
90°。
Preferably, the connecting portion also includes buffer part and connects the bending part of the buffer part.
Preferably, the LED chip includes three LED chips, respectively red LED chip, green LED chip and blue light
LED chip.
Preferably, the chip mount portion includes two separate and mutually insulated the first chip mount portions and the
Two chip mount portions, the red LED chip is arranged in the first chip mount portion, blue-light LED chip and green light LED core
Piece is arranged in the second chip mount portion, and the connecting portion connects the first chip mount portion and the weld part.
Preferably, the LED chip is arranged in the chip mount portion into yi word pattern.
Preferably, the length and width of the substrate is equal, and size is between 0.9mm-1.2mm.
Preferably, the substrate includes a die bond pad and three pads, and three pads include the first pad, the
Two pads and the 3rd pad, the red LED chip bottom are electrically connected with chip mount portion, and the other end is electrically connected to by lead
3rd pad, one end of the green LED chip is electrically connected to first pad by lead, and the other end passes through lead
The 3rd pad is electrically connected to, one end of the blue-light LED chip is electrically connected to second pad, the other end by lead
3rd pad is electrically connected to by lead.
A kind of display screen, is formed by some LED components are evenly distributed, and LED component is the piece of high moisture described above
Formula LED component.
Compared with prior art, the utility model has the following advantages that：
1st, the sheet-shaped LED device and its display screen for a kind of high moisture that the utility model is provided, the die bond pad bag
Include chip mount portion, weld part and the connection chip mount portion and the connecting portion of the weld part；By in the connecting portion
The either path being connected between the chip mount portion and the weld part is more than the chip mount portion and the weld part
Between the shortest path that connects, extend the road that steam enters device inside along the gap between die bond pad and packing colloid
Footpath, so as to improve the air-tightness of LED component.
2nd, the sheet-shaped LED device and its display screen for a kind of high moisture that the utility model is provided, the die bond pad
Chip mount portion includes two separate and mutually insulated the first chip mount portions and the second chip mount portion, feux rouges
LED chip is provided separately within the first chip mount portion, and blue and green light LED chip is arranged in the second chip mount portion, described
Connecting portion connects the first chip mount portion and the weld part, and external environment condition steam is along between die bond pad and packing colloid
Gap enter device after, due to the path for being delivered to blue and green light LED chip be disconnect, can preferably protect to moisture
More sensitive blue and green light LED chip.
Brief description of the drawings
Fig. 1 is the top view of sheet-shaped LED device architecture of the prior art；
Fig. 2 is a kind of top view of the sheet-shaped LED device architecture of the high moisture of the utility model embodiment one；
Fig. 3 is a kind of front view of the sheet-shaped LED device architecture of the high moisture of the utility model embodiment one；
Fig. 4 is a kind of top view of the sheet-shaped LED device architecture of the high moisture of the utility model embodiment two.
Embodiment
To describe technology contents of the present utility model, construction feature, the objects and the effects in detail, below in conjunction with implementation
Mode simultaneously coordinates accompanying drawing to be explained in detail.
Device embodiments one
The utility model provides a kind of sheet-shaped LED device of high moisture, as shown in Figures 2 and 3, including substrate 1, sets
In the packing colloid 3 of at least one LED chip 2 on the substrate 1 and the cladding LED chip, the substrate 1 is included at least
One die bond pad 10 and at least one pad with the mutually insulated of die bond pad 10, the die bond pad 10 include chip
Placement portion 101, weld part 103 and the connection chip mount portion and the connecting portion 102 of the weld part（Dotted line is big in Fig. 2
Cause cut-off rule）；The LED chip is placed in the chip mount portion of the die bond pad, wherein, the connecting portion and the chip
The either path connected between placement portion and the weld part is more than what is connected between the chip mount portion and the weld part
Shortest path.In the present embodiment, as shown in Fig. 2 the substrate 1 is PCB, preferably black BT plates, the LED chip
Including three LED chips, the substrate 1 includes a die bond pad 10 and three pads, and three pads include the first weldering
Disk 11, the second pad 12 and the 3rd pad 13, the length and width of the substrate 1 are equal, and size is in more than 0.8mm, this implementation
The length and width of the preferred substrate of example is between 0.9mm-1.2mm, and three pads are distributed in the three of upper surface of base plate
Individual angle, the chip mount portion 101 of the die bond pad is located at the centre of upper surface of base plate and in yi word pattern distribution, the weld part
103 are located at another angle for being not provided with pad of upper surface of base plate.
The connecting portion 102 includes in bending part, the present embodiment, and the connecting portion includes two bending parts, is respectively
First bending part 1021 and the second bending part 1022, first bending part is close to the chip mount portion, second bending
Portion is close to the weld part, and the angle of the bending part bending is preferably 90 °；In other preferred embodiments, the connecting portion
Also include buffer part and connect the bending part of the buffer part, specific is the institute before first bending part 1021 is formed
Stating connecting portion also includes at least one buffer part 1020, and the buffer part 1020 makes the connecting portion away from the weld part, kept away
Exempt from the generation of short circuit, also extend the road that steam enters device inside along the gap between die bond pad and packing colloid
Footpath.
Wherein, in the present embodiment, the LED chip 2 is red LED chip 21, green LED chip 22, blue-light LED chip
23, the LED chip is arranged in the chip mount portion into yi word pattern.Wherein, the red LED chip 21 uses vertical junction
Structure chip, bottom is directly electrically connected with chip mount portion 101, and the other end is electrically connected to the 3rd pad 13, institute by lead 4
The one end for stating green LED chip 22 is electrically connected to first pad 11 by lead 4, and the other end is electrically connected to by lead 4
3rd pad 13, one end of the blue-light LED chip 23 is electrically connected to second pad 12, the other end by lead 4
3rd pad 13 is electrically connected to by lead 4.
As shown in figure 3, in the present embodiment, there is one layer of packing colloid 3 on the surface of shown substrate by mould pressing, is used for
Encapsulate the LED chip.Wherein, the packing colloid is black or transparent epoxy resin.In other embodiments, the envelope
It is black or transparent silicones to fill colloid, and the silicones can also have matte surface, and the silicones can also adulterate
There is epoxy resin to increase the combination dynamics between the hardness of silicones and silicones and substrate.
In other embodiments, when the LED component is monochromatic or two-color device, the LED component includes one or two
Individual LED chip, the packing colloid is transparent enclosure colloid；Or, when the LED component is white light parts, the LED chip
During for blue-light LED chip, the packing colloid is the packing colloid for being mixed with yellow fluorescent powder.
Because the thermal coefficient of expansion of packing colloid and metal has differences, and packing colloid with substrate insulation layer it is bonding
Dynamics is more than packing colloid and the bonding dynamics of metallic region on substrate, easily causes the stripping of packing colloid and metallic region,
So as to cause the gap between die bond pad and packing colloid of the moisture of external environment condition along metal material to be connect into device inside
Chip is touched, causes chip failure.Pass through appointing for being connected between the connecting portion and the chip mount portion and the weld part
One path is more than the shortest path that is connected between the chip mount portion and the weld part, extend steam along die bond pad with
Gap between packing colloid enters the path of device inside, so as to improve the air-tightness of LED component.
However, the shape of the connecting portion between the chip mount portion of die bond pad and the weld part of die bond pad is not limited
In above-described embodiment, as long as the path that steam enters device inside along the gap between die bond pad and packing colloid can be extended,
So as to improve the air-tightness and moisture resistance of device.
Device embodiments two
Fig. 4 is the structural representation of the sheet-shaped LED device of high moisture of the present utility model.The LED component of the present embodiment
The LED device structure identical element of structure and embodiment one has identical label, and the present embodiment and embodiment one are identical
Part do not repeating.The LED device structure of the present embodiment is with the difference of embodiment one, the core of the die bond pad 10
Piece placement portion 101 includes two separate and mutually insulated the first chip mount portion 101a and the second chip mount portion
101b, wherein, red LED chip 21 is provided separately within the first chip mount portion 101a, blue light and green LED chip 23,22
It is arranged on the second chip mount portion 101b, the connecting portion 102 connects the first chip mount portion 101a and the welding
Portion 103.
In the present embodiment, external environment condition steam enters after device along the gap between die bond pad and packing colloid, due to
The path for being delivered to blue and green light LED chip is to disconnect, and can preferably protect the blue and green light LED more sensitive to moisture
Chip.
Display screen embodiment
The present embodiment also provides a kind of display screen, and it is formed by some LED components are evenly distributed.In the present embodiment, often
One LED component is above-mentioned device embodiments one or any described LED component of device embodiments two.
In the utility model, the LED display module and its display screen of high moisture have the advantages that：
1st, the sheet-shaped LED device and its display screen for a kind of high moisture that the utility model is provided, the die bond pad bag
Include chip mount portion, weld part and the connection chip mount portion and the connecting portion of the weld part；By in the connecting portion
The either path being connected between the chip mount portion and the weld part is more than the chip mount portion and the weld part
Between the shortest path that connects, extend the road that steam enters device inside along the gap between die bond pad and packing colloid
Footpath, so as to improve the air-tightness of LED component.
2nd, the sheet-shaped LED device and its display screen for a kind of high moisture that the utility model is provided, the die bond pad
Chip mount portion includes two separate and mutually insulated the first chip mount portions and the second chip mount portion, feux rouges
LED chip is provided separately within the first chip mount portion, and blue and green light LED chip is arranged in the second chip mount portion, described
Connecting portion connects the first chip mount portion and the weld part, and external environment condition steam is along between die bond pad and packing colloid
Gap enter device after, due to the path for being delivered to blue and green light LED chip be disconnect, can preferably protect to moisture
More sensitive blue and green light LED chip.
The utility model is described in detail above, using specific case to principle of the present utility model and reality in text
The mode of applying is set forth, and the explanation of above example is only intended to help and understands that method of the present utility model and its core are thought
Think.It should be pointed out that for those skilled in the art, on the premise of the utility model principle is not departed from,
Some improvement and modification can also be carried out to the utility model, these are improved and modification also falls into the utility model claim
In protection domain.
Claims (10)
1. a kind of sheet-shaped LED device of high moisture, including：Substrate, at least one LED chip being arranged on the substrate and
The packing colloid of the LED chip is coated, the substrate includes at least one die bond pad and at least one is welded with the die bond
The pad of disk mutually insulated, the die bond pad include chip mount portion, weld part and connect the chip mount portion with it is described
The connecting portion of weld part, it is characterised in that what is connected between the connecting portion and the chip mount portion and the weld part appoints
One path is more than the shortest path connected between the chip mount portion and the weld part.
2. the sheet-shaped LED device of a kind of high moisture according to claim 1, it is characterised in that the connecting portion includes
There is bending part.
3. the sheet-shaped LED device of a kind of high moisture according to claim 2, it is characterised in that the connecting portion includes
Two bending parts, respectively the first bending part and the second bending part, first bending part are described close to the chip mount portion
Second bending part is close to the weld part, and the angle of the bending part bending is 90 °.
4. the sheet-shaped LED device of a kind of high moisture according to claim 2, it is characterised in that the connecting portion is also wrapped
Include buffer part and connect the bending part of the buffer part.
5. the sheet-shaped LED device of a kind of high moisture according to claim 1, it is characterised in that the LED chip includes
Three LED chips, respectively red LED chip, green LED chip and blue-light LED chip.
6. a kind of sheet-shaped LED device of high moisture according to claim 5, it is characterised in that the chip mount portion
Including two separate and mutually insulated the first chip mount portions and the second chip mount portion, the red LED chip
It is arranged in the first chip mount portion, blue-light LED chip and green LED chip are arranged in the second chip mount portion, institute
State connecting portion and connect the first chip mount portion and the weld part.
7. a kind of sheet-shaped LED device of high moisture according to claim 5 or 6, it is characterised in that the LED chip
Arranged in the chip mount portion into yi word pattern.
8. a kind of sheet-shaped LED device of high moisture according to claim 1, it is characterised in that the length of the substrate
Equal with width, size is between 0.9mm-1.2mm.
9. a kind of sheet-shaped LED device of high moisture according to claim 5, the substrate include a die bond pad and
Three pads, three pads include the first pad, the second pad and the 3rd pad, the red LED chip bottom and core
Piece placement portion is electrically connected, and the other end is electrically connected to the 3rd pad by lead, and one end of the green LED chip is by drawing
Line is electrically connected to first pad, and the other end is electrically connected to the 3rd pad, the one of the blue-light LED chip by lead
End is electrically connected to second pad by lead, and the other end is electrically connected to the 3rd pad by lead.
10. a kind of display screen, is formed by some LED components are evenly distributed, it is characterised in that the LED component is claim
The sheet-shaped LED device of any described high moistures of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720121718.5U CN206505948U (en) | 2017-02-10 | 2017-02-10 | The sheet-shaped LED device and its display screen of a kind of high moisture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720121718.5U CN206505948U (en) | 2017-02-10 | 2017-02-10 | The sheet-shaped LED device and its display screen of a kind of high moisture |
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| CN206505948U true CN206505948U (en) | 2017-09-19 |
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| CN201720121718.5U Active CN206505948U (en) | 2017-02-10 | 2017-02-10 | The sheet-shaped LED device and its display screen of a kind of high moisture |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335310A (en) * | 2021-11-30 | 2022-04-12 | 佛山市国星光电股份有限公司 | LED device |
| WO2022203099A1 (en) * | 2021-03-25 | 2022-09-29 | 엘지전자 주식회사 | Light emitting device package and display device |
-
2017
- 2017-02-10 CN CN201720121718.5U patent/CN206505948U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022203099A1 (en) * | 2021-03-25 | 2022-09-29 | 엘지전자 주식회사 | Light emitting device package and display device |
| CN114335310A (en) * | 2021-11-30 | 2022-04-12 | 佛山市国星光电股份有限公司 | LED device |
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