CN102054799A - Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post - Google Patents

Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post Download PDF

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Publication number
CN102054799A
CN102054799A CN2010105588030A CN201010558803A CN102054799A CN 102054799 A CN102054799 A CN 102054799A CN 2010105588030 A CN2010105588030 A CN 2010105588030A CN 201010558803 A CN201010558803 A CN 201010558803A CN 102054799 A CN102054799 A CN 102054799A
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CN
China
Prior art keywords
radiating block
radiator
lock hole
chip
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105588030A
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Chinese (zh)
Inventor
王新潮
梁志忠
林煜斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN2010105588030A priority Critical patent/CN102054799A/en
Publication of CN102054799A publication Critical patent/CN102054799A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to an encapsulating structure with an exposed inner pin, an inverted chip and a radiating block provided with a lock hole and externally connected with a radiator through a projecting post. The encapsulating structure comprises a chip (3), an inner metal pin (4), a metal projecting block (10) and a plastic package body (8), wherein the inner metal pin (4) is exposed out of the plastic package body (8); a radiating block (7) is arranged above the chip (3) and is provided with a lock hole (7.1); a radiator (11) is arranged above the radiating block (7); a projecting post (11.1) is arranged in the middle of the lower end face of the radiator (11) in a protruding way; the radiator (11) is spliced with the radiating block (7) with the lock hole through the projecting post (11.1); and a conductive or non-conductive heat conducting adhesive substance III (13) is embedded between the radiator (11) and the radiating block (7) and in the lock hole (7.1). The encapsulating structure has high radiating capability and can quickly conduct heat of the chip to the outside of an encapsulated body.

Description

Interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure
Technical field
The present invention relates to a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure and method for packing thereof.Belong to the semiconductor packaging field.
Background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, providing a kind of can provide heat dissipation capability strong interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure and method for packing thereof.
The object of the present invention is achieved like this: pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure in a kind of, include conduction or nonconducting heat conduction bonding material I and plastic-sealed body between pin in the metal that is carried of chip, chip below, the chip interior pin of metal coupling, chip and metal that the signal interconnection of pin is used in the metal, pin exposes plastic-sealed body in the described metal, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, protrusion is provided with a projection in the middle of the described radiator lower surface, and described radiator patches with the radiating block that has lock hole by this projection and is connected; And between this radiator and described radiating block and in described lock hole, be equipped with the conduction or nonconducting heat conduction bonding material III.
The invention has the beneficial effects as follows:
The present invention passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
Description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure embodiment 1 schematic diagram in the present invention.
Fig. 6 is pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure embodiment 2 schematic diagrames in the present invention.
Fig. 7 is pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure embodiment 3 schematic diagrames in the present invention.
Reference numeral among the figure:
Pin 4, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, metal coupling 10, radiator 11, projection 11.1, conduction or nonconducting heat conduction bonding material III 13 in conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal.
Embodiment
Embodiment 1:
Referring to Fig. 5, Fig. 5 is pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure embodiment 1 schematic diagram in the present invention.As seen from Figure 5, pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure in the present invention, include chip 3, pin 4 in the metal that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8 in chip and the metal between the pin, pin 4 exposes plastic-sealed body 8 in the described metal, it is characterized in that above described chip 3, being provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, protrusion is provided with a projection 11.1 in the middle of described radiator 11 lower surfaces, and described radiator 11 patches with the radiating block 7 that has lock hole by this projection 11.1 and is connected; And be equipped with conduction or nonconducting heat conduction bonding material III 13 between this radiator 11 and the described radiating block 7 and in described lock hole 7.1.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Embodiment 2:
Embodiment 2 only is with the difference of embodiment 1: described radiator 11 is for radiating cap, as Fig. 6.
Embodiment 3:
Embodiment 3 only is with the difference of embodiment 1: described radiator 11 is for heating panel, as Fig. 7.

Claims (6)

1. pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure in a kind, include chip (3), pin (4) in the metal that is carried of chip below, the metal coupling (10) that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8) in chip and the metal between the pin, pin (4) exposes plastic-sealed body (8) in the described metal, it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), this radiating block (7 and described chip (3) between be equipped with the conduction or nonconducting heat conduction bonding material II (6); Be provided with radiator (11) in described radiating block (7) top, protrusion is provided with a projection (11.1) in the middle of described radiator (11) lower surface, and described radiator (11) patches with the radiating block that has lock hole (7) by this projection (11.1) and is connected; And between this radiator (11) and described radiating block (7) and in described lock hole (7.1), be equipped with the conduction or nonconducting heat conduction bonding material III (13).
2. a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
4. a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
5. according to claim 1,2,3 or 4 described a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structures, it is characterized in that: described radiator (11) is a radiating cap.
6. according to claim 1,2,3 or 4 described a kind of interior pin exposed chip upside-down mounting lock hole radiating block projection external radiator packaging structures, it is characterized in that: described radiator (11) is a heating panel.
CN2010105588030A 2010-01-30 2010-11-25 Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post Pending CN102054799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105588030A CN102054799A (en) 2010-01-30 2010-11-25 Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
CN201010117802 2010-01-30
CN201010117802.2 2010-01-30
CN201010117807.5 2010-01-30
CN201010117827 2010-01-30
CN201010117827.2 2010-01-30
CN201010117807 2010-01-30
CN2010105588030A CN102054799A (en) 2010-01-30 2010-11-25 Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post

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CN102054799A true CN102054799A (en) 2011-05-11

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681512A (en) * 2014-12-30 2015-06-03 华天科技（西安）有限公司 Flip chip-packaging heat dissipation structure and preparation method thereof
WO2022057822A1 (en) * 2020-09-21 2022-03-24 青岛歌尔微电子研究院有限公司 Heat dissipating packaging structure and preparation method therefor, and electronic device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299544A (en) * 1992-04-20 1993-11-12 Hitachi Ltd Semiconductor device
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
CN1630073A (en) * 2003-12-19 2005-06-22 威宇科技测试封装有限公司 Chip ball grid array packaging structure
CN1725460A (en) * 2005-05-27 2006-01-25 江苏长电科技股份有限公司 Plane button type packing technology of integrated circuit or discrete component and its packing structure
CN101221944A (en) * 2007-01-09 2008-07-16 矽品精密工业股份有限公司 Cooling type semiconductor packaging member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299544A (en) * 1992-04-20 1993-11-12 Hitachi Ltd Semiconductor device
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
CN1630073A (en) * 2003-12-19 2005-06-22 威宇科技测试封装有限公司 Chip ball grid array packaging structure
CN1725460A (en) * 2005-05-27 2006-01-25 江苏长电科技股份有限公司 Plane button type packing technology of integrated circuit or discrete component and its packing structure
CN101221944A (en) * 2007-01-09 2008-07-16 矽品精密工业股份有限公司 Cooling type semiconductor packaging member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681512A (en) * 2014-12-30 2015-06-03 华天科技（西安）有限公司 Flip chip-packaging heat dissipation structure and preparation method thereof
WO2022057822A1 (en) * 2020-09-21 2022-03-24 青岛歌尔微电子研究院有限公司 Heat dissipating packaging structure and preparation method therefor, and electronic device

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Application publication date: 20110511