CN201623150U - Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole - Google Patents
Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole Download PDFInfo
- Publication number
- CN201623150U CN201623150U CN2010201246256U CN201020124625U CN201623150U CN 201623150 U CN201623150 U CN 201623150U CN 2010201246256 U CN2010201246256 U CN 2010201246256U CN 201020124625 U CN201020124625 U CN 201020124625U CN 201623150 U CN201623150 U CN 201623150U
- Authority
- CN
- China
- Prior art keywords
- chip
- radiating block
- radiator
- metal
- externally connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a package structure for a rectangular radiating block externally connected with a radiator, inversed on a chip with an exposed inner lead and provided with a locking hole, which a chip (3), a metal inner lead (4), a metal bump (10), conducting or non-conducting heat-conducting binding material I (2) between the chip (3) and the metal inner lead (4), and a plastic body (8), wherein the metal inner lead (4) is exposed out of the plastic body (8). The utility model is characterized in that a radiating block (7) is arranged above the chip (3); the radiating block (7) is provided with a locking hole (7.1); conducting or non-conducting heat-conducting binding material II(6) is nested between the radiating block (7) and the chip (3); a radiator (11) is arranged above the radiating block (7), and is fixedly connected with the radiating block (7) by a screw (12) passing through the locking hole (7.1); and the radiating block (7) is in a rectangular structure. The utility model can provide strong radiating ability to enable the heat of the chip to rapidly conduct to the outside of a package body.
Description
(1) technical field
The utility model relates to a kind of interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure and method for packing thereof.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure and method for packing thereof.
The purpose of this utility model is achieved in that a kind of interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure, include chip, pin in the metal that is carried of chip below, the metal coupling that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I and plastic-sealed body in chip and the metal between the pin, pin exposes plastic-sealed body in the described metal, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, described radiator is fixedlyed connected with radiating block by described lock hole with screw, and described radiating block is square type structure.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is a pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure schematic diagram in the utility model.
Reference numeral among the figure:
(5) embodiment
Referring to Fig. 5, Fig. 5 is a pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure schematic diagram in the utility model.As seen from Figure 5, pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure in the utility model, include chip 3, pin 4 in the metal that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8 in chip and the metal between the pin, pin 4 exposes plastic-sealed body 8 in the described metal, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, described radiator 11 usefulness screws 12 are fixedlyed connected with radiating block 7 by described lock hole 7.1, and described radiating block 7 is square type structure.。
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Claims (4)
1. pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure in a kind, include chip (3), pin (4) in the metal that is carried of chip below, the metal coupling (10) that chip is used to the signal interconnection of the interior pin of metal, conduction or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8) in chip and the metal between the pin, pin (4) exposes plastic-sealed body (8) in the described metal, it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiator (11) in described radiating block (7) top, described radiator (11) is fixedlyed connected with radiating block (7) by described lock hole (7.1) with screw (12), and described radiating block (7) is square type structure.
2. a kind of interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
4. a kind of interior pin exposed chip upside-down mounting square type lock hole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201246256U CN201623150U (en) | 2010-01-30 | 2010-01-30 | Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201246256U CN201623150U (en) | 2010-01-30 | 2010-01-30 | Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623150U true CN201623150U (en) | 2010-11-03 |
Family
ID=43026607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201246256U Expired - Fee Related CN201623150U (en) | 2010-01-30 | 2010-01-30 | Package structure for rectangular radiating block externally connected with radiator, inversed on chip with exposed inner lead and provided with locking hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623150U (en) |
-
2010
- 2010-01-30 CN CN2010201246256U patent/CN201623150U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20140130 |