JPH05299544A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH05299544A
JPH05299544A JP9930392A JP9930392A JPH05299544A JP H05299544 A JPH05299544 A JP H05299544A JP 9930392 A JP9930392 A JP 9930392A JP 9930392 A JP9930392 A JP 9930392A JP H05299544 A JPH05299544 A JP H05299544A
Authority
JP
Japan
Prior art keywords
diffusion plate
heat diffusion
screws
plate
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9930392A
Other languages
Japanese (ja)
Inventor
Hiroshi Kosaku
浩 小作
Toshihiro Tsuboi
敏宏 坪井
Masayuki Shirai
優之 白井
Takashi Miwa
孝志 三輪
Toshihiro Matsunaga
俊博 松永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi ULSI Engineering Corp
Hitachi Ltd
Original Assignee
Hitachi ULSI Engineering Corp
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi ULSI Engineering Corp, Hitachi Ltd filed Critical Hitachi ULSI Engineering Corp
Priority to JP9930392A priority Critical patent/JPH05299544A/en
Publication of JPH05299544A publication Critical patent/JPH05299544A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To facilitate an alignment of a heat diffusion plate with a wiring board and to make it possible to secure the constant thickness and stability of an adhesion layer by a method wherein screws are mounted in such a way that the end parts of the screws are made to project from the heat diffusion plate and at the same time, grooves to correspond to the projection parts of the screws are provided in the wiring board. CONSTITUTION:A semiconductor chip 7 is secured on a heat diffusion plate 2, the plate 2 is bonded to a wiring board 4 and a heat dissipation fin 11 is mounted on the plate 2 by screws. In this semiconductor device, the end parts of the screws 1 are made to project from the rear of the plate 2 and at the same time, grooves 10 to correspond to the projected parts of the screws 1 are provided in the board A. These grooves 10 are aligned with the projected parts of the screws 1 and the plate 2 is made to bond to the board 4 with a bonding agent 3. Thereby, when the plate 2 is bonded to the board 4, an assembly process is not only facilitated by combining the recessed parts of the board 4 with the projected parts of the screws but also the positional accuracy of the plate 2 to the board 4 is improved and the uniformity and stabilization of an adhesion layer are contrived.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体装置に関し、特
に、半導体チップを固着した熱拡散板の片面に放熱フイ
ンをネジ止めし、該放熱フインを着脱可能とし、当該半
導体チップからの発熱を当該熱拡散板を介して放熱フイ
ンにて放熱させる構造を有する半導体装置の改良技術に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a heat dissipating plate to which a semiconductor chip is fixed. The present invention relates to an improved technique of a semiconductor device having a structure in which heat is dissipated by a heat dissipation fin via the heat diffusion plate.

【０００２】[0002]

【従来の技術】半導体チップ（以下、単にチップとい
う）を熱拡散板に固着し、該熱拡散板の上面側に放熱フ
インをネジ（ボルト）止めし、該熱拡散板の下面側にセ
ラミック製配線基板を接合し、前記チップと当該配線基
板とを電気的に接続し、当該チップからの発熱を、当該
熱拡散板および放熱フインを順次介して放熱させる構造
を有する半導体装置がある。この場合、熱拡散板の材質
には、セラミック製配線基板の熱膨張係数との関係か
ら、銅（Ｃｕ）ータングステン合金が使用され、また、
放熱フインのネジ止めには、銀ろうを用いた銀ろう付け
がなされている。2. Description of the Related Art A semiconductor chip (hereinafter, simply referred to as a chip) is fixed to a heat diffusion plate, a heat radiation fin is fixed to a top surface of the heat diffusion plate with a screw (bolt), and a ceramic bottom surface of the heat diffusion plate. There is a semiconductor device having a structure in which a wiring board is joined, the chip and the wiring board are electrically connected, and heat generated from the chip is radiated through the heat diffusion plate and the heat dissipation fin in order. In this case, copper (Cu) -tungsten alloy is used as the material of the heat diffusion plate in consideration of the thermal expansion coefficient of the ceramic wiring board, and
Silver brazing using silver brazing is used for screwing the heat radiation fins.

【０００３】[0003]

【発明が解決しようとする課題】上記従来技術では、熱
拡散板にネジを立てる際、そのネジ立てに際して、熱拡
散板とパッケージ（配線基板）との位置がなかなか決ら
ず、これらの間の位置合わせが困難であった。また、当
該熱拡散板と配線基板との間の接着層の厚みが安定化し
ないために、当該熱拡散板などが傾き、その接着にバラ
ツキが発生し、さらには、必要な絶縁性が図られないと
いう問題があった。さらに、パッケージ全体の組立プロ
セス工程においても、位置合せが容易ではないという問
題があった。本発明は、かかる従来技術の有する欠点を
解消することを目的としたものである。本発明の前記な
らびにそのほかの目的と新規な特徴は、本明細書の記述
および添付図面からあきらかになるであろう。In the above-mentioned prior art, when a screw is mounted on the heat diffusion plate, the positions of the heat diffusion plate and the package (wiring board) are not easily determined at the time of tapping, and the positions between them are not fixed. It was difficult to match. In addition, since the thickness of the adhesive layer between the heat diffusion plate and the wiring board is not stabilized, the heat diffusion plate or the like tilts, variations in the adhesion occur, and further, necessary insulation is achieved. There was a problem of not having. Further, there is a problem that alignment is not easy even in the process of assembling the entire package. The present invention is aimed at eliminating the drawbacks of the prior art. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

【０００４】[0004]

【課題を解決するための手段】本願において開示される
発明のうち代表的なものの概要を簡単に説明すれば、下
記のとおりである。本発明では、ネジの端部を前記熱拡
散板から突出させるようにするとともに、前記配線基板
に当該ネジの突出部に対応した溝を設けるようにする。The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows. In the present invention, the ends of the screws are projected from the heat diffusion plate, and the wiring board is provided with grooves corresponding to the projections of the screws.

【０００５】[0005]

【作用】上記のように、ネジの端部を前記熱拡散板から
突出させるようにするとともに、前記配線基板に当該ネ
ジの突出部に対応した溝を設けるようにすれば、突出し
たネジの端部を当該溝に位置合せすることにより、ネジ
立てに際して、熱拡散板とパッケージ（配線基板）との
位置合わせが容易となり、その際に、熱拡散板裏面側ネ
ジ突出部の高さを保てば、一定の間隙を確保することが
できるので、接着層の一定厚、安定化を保持することが
可能となる。このように接着層が一定厚にコントロール
できれば、その接着にバラツキが発生せず、熱拡散板な
どの傾きが抑えられ、熱拡散板とパッケージとの絶縁性
が保たれる。さらに、熱拡散板にネジを貫通させること
により、立てる側面の固着面積が増し、ネジの強度も向
上する。さらに、熱拡散板裏面側ネジ突起とパッケージ
側のザグリを組合せることにより、組立工程において容
易に、接着できる。As described above, if the end of the screw is projected from the heat diffusion plate and the groove corresponding to the projecting part of the screw is provided on the wiring board, the end of the projected screw is By aligning the part with the groove, it is easy to align the heat diffusion plate and the package (wiring board) when tapping, and at that time, keep the height of the screw protrusion on the back surface of the heat diffusion plate. In this case, since a constant gap can be secured, it is possible to maintain a constant thickness and stability of the adhesive layer. If the adhesive layer can be controlled to have a constant thickness in this manner, there will be no variation in the adhesion, the inclination of the heat diffusion plate or the like will be suppressed, and the insulation between the heat diffusion plate and the package will be maintained. Further, by penetrating the heat diffusion plate with a screw, the fixing area of the standing side surface is increased and the strength of the screw is also improved. Further, by combining the screw protrusions on the back surface of the heat diffusion plate and the counterbore on the package side, they can be easily bonded in the assembly process.

【０００６】[0006]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。実施例１ ．本発明の一実施例を図１および図３により説
明する。本実施例はプラスチックピングリッドアレイ型
のパッケージに適用した場合を示す。図１にて、１はネ
ジ、２は熱拡散板、３はシリコーンゴム系接着剤、４は
パッケージ（配線基板）、５はキャップ、６はコネクタ
ワイヤ、７はチップ、８はダイボンデイング剤、９はリ
ードピンである。図１に示すように、ネジ１の端部を熱
拡散板２の裏面から突出させるようにする。すなわち、
熱拡散板２にネジ１を立設できるような穴をあけ、ネジ
１を熱拡散板２中を貫通させ、熱拡散板２の裏面から一
部適宜高さで突出させる。一方、配線基板４に、当該ネ
ジ１の突出部に対応した溝１０を設ける。当該溝１０
は、配線基板４の上面の当該ネジ１の突出部に対応した
位置に設ける。熱拡散板２の裏面から突出したネジ１の
突出部と配線基板４に設けた溝１０との凹凸を組み合
せ、シリコーンゴム系接着剤３で、熱拡散板２の裏面と
配線基板４上面とを接着する。図示のように、逆凸状の
熱拡散板４の下部凸面には、ダイボンデイング剤８によ
りチップ７を固着する。チップ７からの発熱は、熱拡散
板４を介して後で述べる放熱フインから放熱されるよう
になっている。配線基板４の段部には、その図示が省略
されているが、外部配線が布設され、チップ７の電極
（図示せず）と当該段部の外部配線とが、コネクタワイ
ヤ６により電気的に接続されている。該外部配線は、配
線基板４から下方向に垂設された外部リードピン９と電
気的に接続し、チップ７への信号の入出力を行ないチッ
プ７を機能させる。Embodiments of the present invention will be described below with reference to the drawings. Example 1 . An embodiment of the present invention will be described with reference to FIGS. This embodiment shows a case where the present invention is applied to a plastic pin grid array type package. In FIG. 1, 1 is a screw, 2 is a heat diffusion plate, 3 is a silicone rubber adhesive, 4 is a package (wiring board), 5 is a cap, 6 is a connector wire, 7 is a chip, 8 is a die bonding agent, Reference numeral 9 is a lead pin. As shown in FIG. 1, the end of the screw 1 is projected from the back surface of the heat diffusion plate 2. That is,
A hole is formed in the heat diffusion plate 2 so that the screw 1 can be erected, the screw 1 is penetrated through the heat diffusion plate 2, and a part is projected from the back surface of the heat diffusion plate 2 at an appropriate height. On the other hand, the wiring board 4 is provided with the groove 10 corresponding to the protruding portion of the screw 1. The groove 10
Is provided on the upper surface of the wiring board 4 at a position corresponding to the protruding portion of the screw 1. The protrusions of the screws 1 protruding from the back surface of the heat diffusion plate 2 and the recesses and protrusions of the groove 10 provided on the wiring board 4 are combined, and the back surface of the heat diffusion plate 2 and the top surface of the wiring board 4 are bonded with the silicone rubber adhesive 3. To glue. As shown in the figure, the chip 7 is fixed to the lower convex surface of the inversely convex heat diffusion plate 4 by the die bonding agent 8. The heat generated from the chip 7 is radiated from a heat radiation fin, which will be described later, via the heat diffusion plate 4. Although not shown, external wiring is laid on the step portion of the wiring board 4 so that the electrode (not shown) of the chip 7 and the external wiring of the step portion are electrically connected by the connector wire 6. It is connected. The external wiring is electrically connected to the external lead pin 9 vertically extending from the wiring board 4, and inputs / outputs a signal to / from the chip 7 to make the chip 7 function.

【０００７】図３に示すように、シリコーンゴム系の接
着剤３により、放熱フイン１１の下面と熱拡散板４の上
面とを接合し、熱拡散板２および放熱フイン１１にそれ
ぞれ開けられた穴にネジ１を通し、ネジ１の突出部を溝
１０内に収納し、ナット１２で締付け固定する。図示が
省略されているが、放熱フイン１１の下面と熱拡散板２
の上面とが接触する部分全体にも、シリコーンゴム系の
接着剤を塗布する。As shown in FIG. 3, the lower surface of the heat dissipating fin 11 and the upper surface of the heat dissipating plate 4 are joined with a silicone rubber adhesive 3 to form holes in the heat dissipating plate 2 and the heat dissipating fin 11, respectively. The screw 1 is passed through, the projecting portion of the screw 1 is housed in the groove 10, and the nut 12 is tightened and fixed. Although not shown, the lower surface of the heat dissipation fin 11 and the heat diffusion plate 2
A silicone rubber-based adhesive is also applied to the entire portion in contact with the upper surface of the.

【０００８】上記において、熱拡散板２は、例えばアル
ミニウムなどの金属板により構成される。配線基板４
は、例えば樹脂配線基板あるいはセラミック配線基板に
より構成される。チップ７は、例えばシリコン単結晶基
板から成り、周知の技術によってその内部には多数の回
路素子が形成され、１つの回路機能が与えられている。
回路素子の具体例は、例えばＭＯＳトランジスタから成
り、これらの回路素子によって、例えば論理回路および
メモリの回路機能が形成されている。キャップ５は、例
えばアルミニウムなどの金属板により構成される。コネ
クタワイヤ６は、例えば、Ａｕ細線により構成されてい
る。リ−ドピン９は、例えばＮｉ−Ｆｅ合金により構成
されている。当該シリコーンゴム系の接着剤３には、Ｓ
ｉ−Ｏの分子骨格を有するゴム状の性状を示すシリコー
ンゴムを主成分としたものが使用でき、加熱によって加
硫する熱加硫形、あるいは硬化剤の混合が空気中の湿気
で加硫させる室温加硫形（ＲＴＶシリコーン）を使用す
ることができる。当該シリコーンゴム系の接着剤には、
高熱伝導性のものを使用するとよい。放熱フイン１１
は、例えばアルミニウムなどの金属により構成される。
本実施例によれば、放熱フイン１１の着脱構造として、
熱拡散板２側にネジ１を立てる際に、その裏側までネジ
１を貫通させ固定させる事により、ネジ立て性が安定化
し、締め付けトルク強度も向上する。パッケージ４側に
もザグリにより溝１０を設け、シリコーンゴム系の接着
剤３で接着する。その結果、組立プロセス工程において
も、熱拡散板２の裏面から突出したネジ１の突出部と配
線基板４に設けた溝１０との凹凸部分を合わせるだけ
で、接着出き、工程での作業が容易となる。熱拡散板２
とパッケージ４及びチップ７のパッドとパッケージ４の
リード部の位置精度が向上する。ネジ１の突出部の長さ
を調節する事により、熱拡散板２とパッケージ４の間に
一定の間隔ができ、接着層３の一定化、安定化が保たれ
る。同時に、絶縁性のシリコーンゴム系の接着剤３を用
いることにより、熱拡散板２とパッケージ４側での絶縁
性が得られる。In the above, the heat diffusion plate 2 is made of a metal plate such as aluminum. Wiring board 4
Is composed of, for example, a resin wiring board or a ceramic wiring board. The chip 7 is made of, for example, a silicon single crystal substrate, a large number of circuit elements are formed in the chip 7 by a well-known technique, and one circuit function is given.
A specific example of the circuit element includes, for example, a MOS transistor, and these circuit elements form a circuit function of a logic circuit and a memory, for example. The cap 5 is made of a metal plate such as aluminum. The connector wire 6 is made of, for example, an Au thin wire. The lead pin 9 is made of, for example, a Ni—Fe alloy. The silicone rubber adhesive 3 contains S
It is possible to use a material mainly composed of silicone rubber having a rubber-like property having an i-O molecular skeleton. A heat vulcanization type that vulcanizes by heating or a mixture of curing agents vulcanizes with moisture in the air. Room temperature vulcanizates (RTV silicone) can be used. The silicone rubber-based adhesive includes
It is preferable to use one with high thermal conductivity. Heat dissipation fin 11
Is made of metal such as aluminum.
According to this embodiment, as the structure for attaching and detaching the heat dissipation fin 11,
When the screw 1 is erected on the heat diffusion plate 2 side, the screw 1 is penetrated and fixed to the back side of the heat diffusion plate 2 to stabilize the tapping property and improve the tightening torque strength. Grooves 10 are also provided on the package 4 side with counterbores, and they are adhered with a silicone rubber adhesive 3. As a result, even in the assembly process step, the protrusion of the screw 1 protruding from the back surface of the heat diffusion plate 2 and the concave-convex portion of the groove 10 provided in the wiring board 4 are simply combined to allow adhesion and work in the step. It will be easy. Heat diffusion plate 2
The positional accuracy of the pads of the package 4 and the chip 7 and the lead portions of the package 4 is improved. By adjusting the length of the protruding portion of the screw 1, a constant space is formed between the heat diffusion plate 2 and the package 4, and the adhesive layer 3 is kept constant and stable. At the same time, by using the insulative silicone rubber adhesive 3, it is possible to obtain insulation between the heat diffusion plate 2 and the package 4.

【０００９】実施例２．図２に示す実施例は、図１に示
す実施例のように熱拡散板２の裏面からネジ１を突出せ
ずに、同様の突出部に相当する突起部１３を、熱拡散板
２それ自体に、プレス成形やロウ付などで作成した以外
は実施例１と同様にしてプラスチックピングリッドアレ
イ型のパッケージを構成した例を示す。この場合、熱拡
散板２側に、熱硬化性のシリコーンゴムを用いて、ゴム
を塗布しベークをして、突起部１３を作成するようにし
てもよい。以上本発明者によってなされた発明を実施例
にもとずき具体的に説明したが、本発明は上記実施例に
限定されるものではなく、その要旨を逸脱しない範囲で
種々変更可能であることはいうまでもない。以上の説明
では主として本発明者によってなされた発明をその背景
となった利用分野であるピングリットアレイ型パッケー
ジに適用した場合について説明したが、それに限定され
るものではなく、他の半導体装置にも適用できる。 Embodiment 2 . The embodiment shown in FIG. 2 does not project the screw 1 from the back surface of the heat diffusion plate 2 as in the embodiment shown in FIG. 1, but the protrusion 13 corresponding to a similar protrusion is provided on the heat diffusion plate 2 itself. An example in which a plastic pin grid array type package is configured in the same manner as in Example 1 except that the package is formed by press molding, brazing, or the like. In this case, the protrusions 13 may be formed on the heat diffusion plate 2 side by using a thermosetting silicone rubber to apply the rubber and bake. Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. In the above description, the case where the invention made by the present inventor is mainly applied to a pingrit array type package which is a field of application which is the background of the invention has been described, but the invention is not limited thereto and other semiconductor devices can be used. Applicable.

【００１０】[0010]

【発明の効果】本願において開示される発明のうち代表
的なものによって得られる効果を簡単に説明すれば、下
記のとおりである。本発明によれば、熱拡散板側に突起
部を作成し、パッケージ側にザグリを入れ、熱拡散板を
パッケージに接着する時、凹凸部を組み合せることによ
り、組立プロセス工程が容易になるばかりでなく熱拡散
板とパッケージとの位置精度が向上し、接着層の一定
化、安定化が図れる。また、ネジ立て部の安定化も図れ
る。The effects obtained by the representative ones of the inventions disclosed in this application will be briefly described as follows. According to the present invention, a protrusion is formed on the heat diffusion plate side, a counterbore is put on the package side, and when the heat diffusion plate is adhered to the package, the asperities are combined to facilitate the assembly process steps. Not only that, the positional accuracy between the heat diffusion plate and the package is improved, and the adhesive layer can be made uniform and stable. In addition, the tapping portion can be stabilized.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す半導体装置の要部断面
図、FIG. 1 is a sectional view of an essential part of a semiconductor device showing an embodiment of the present invention,

【図２】本発明の他の一実施例を示す半導体装置の要部
断面図、FIG. 2 is a cross-sectional view of a main portion of a semiconductor device showing another embodiment of the present invention,

【図３】図１に示す装置に放熱フインを取付け後の半導
体装置の断面図、FIG. 3 is a cross-sectional view of the semiconductor device after attaching a heat dissipation fin to the device shown in FIG.

【符号の説明】[Explanation of symbols]

１・・・ネジ ２・・・熱拡散板 ３・・・シリコーンゴム系の接着剤 ４・・・パッケージ（配線基板） ５・・・キャップ ６・・・コネクトワイヤ ７・・・チップ ８・・・ダイボンデイング剤 ９・・・リードピン １０・・・溝 １１・・・放熱フイン １２・・・ナット １３・・・突起部 1 ... Screw 2 ... Thermal diffusion plate 3 ... Silicone rubber adhesive 4 ... Package (wiring board) 5 ... Cap 6 ... Connect wire 7 ... Chip 8.・ Die bonding agent 9 ... Lead pin 10 ... Groove 11 ... Heat dissipation fin 12 ... Nut 13 ... Projection

───────────────────────────────────────────────────── フロントページの続き (72)発明者 坪井 敏宏 東京都小平市上水本町５丁目20番１号 日 立超エル・エス・アイ・エンジニアリング 株式会社内 (72)発明者 白井 優之 東京都青梅市今井2326番地 株式会社日立 製作所デバイス開発センタ内 (72)発明者 三輪 孝志 東京都青梅市今井2326番地 株式会社日立 製作所デバイス開発センタ内 (72)発明者 松永 俊博 東京都青梅市今井2326番地 株式会社日立 製作所デバイス開発センタ内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshihiro Tsuboi 5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Inside Hitsuritsu Cho-LS Engineering Co., Ltd. (72) Inventor Yuu Shirai Tokyo 2326 Imai, Ome City Hitachi, Ltd. Device Development Center (72) Inventor Takashi Miwa 2326 Imai, Ome City Tokyo Metropolitan Area (72) Inventor, Toshihiro Matsunaga Toshihiro Matsunaga 2326 Imai, Ome City Tokyo Hitachi Device Development Center

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】熱拡散板に半導体チップを固着し、該熱拡
散板と配線基板とを接合し、該熱拡散板に放熱フインを
ネジにより取付けしてなる半導体装置において、ネジの
端部を前記熱拡散板裏面から突出させるとともに、前記
配線基板に当該ネジの突出部に対応した溝を設け、該溝
と当該ネジの突出部とを位置合せして、接着剤にて熱拡
散板と配線基板とを接合して成ることを特徴とする半導
体装置。1. A semiconductor device in which a semiconductor chip is fixed to a heat diffusion plate, the heat diffusion plate and a wiring board are joined, and a heat radiation fin is attached to the heat diffusion plate with a screw While protruding from the back surface of the heat diffusion plate, a groove corresponding to the protruding portion of the screw is provided on the wiring board, the groove and the protruding portion of the screw are aligned, and the heat diffusion plate and the wiring are bonded with an adhesive. A semiconductor device, which is formed by joining a substrate. 【請求項２】熱拡散板に半導体チップを固着し、該熱拡
散板と配線基板とを接合し、該熱拡散板に放熱フインを
ネジにより取付けしてなる半導体装置において、該熱拡
散板に突起部を設けるとともに前記配線基板に溝を設
け、当該溝と前記突起部とを位置合せして、接着剤にて
熱拡散板と配線基板とを接合して成ることを特徴とする
半導体装置。2. A semiconductor device in which a semiconductor chip is fixed to a heat diffusion plate, the heat diffusion plate and a wiring board are joined, and heat radiation fins are attached to the heat diffusion plate by screws. A semiconductor device comprising: providing a protrusion and providing a groove in the wiring board; aligning the groove with the protrusion; and joining the heat diffusion plate and the wiring board with an adhesive.
JP9930392A 1992-04-20 1992-04-20 Semiconductor device Withdrawn JPH05299544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9930392A JPH05299544A (en) 1992-04-20 1992-04-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9930392A JPH05299544A (en) 1992-04-20 1992-04-20 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH05299544A true JPH05299544A (en) 1993-11-12

Family

ID=14243865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9930392A Withdrawn JPH05299544A (en) 1992-04-20 1992-04-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH05299544A (en)

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Effective date: 19990706