CN102044503A - Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole - Google Patents
Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole Download PDFInfo
- Publication number
- CN102044503A CN102044503A CN 201010558759 CN201010558759A CN102044503A CN 102044503 A CN102044503 A CN 102044503A CN 201010558759 CN201010558759 CN 201010558759 CN 201010558759 A CN201010558759 A CN 201010558759A CN 102044503 A CN102044503 A CN 102044503A
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- printed circuit
- heat dissipation
- radiating block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a packaging structure with a printed circuit board, a chip and an upright heat dissipation block with a locking hole. The packaging structure comprises a chip (3), a monolayer or multilayer printed circuit board (9) borne below the chip, metal wires (5) used for connecting the chip and the monolayer or multilayer printed circuit board via signals, conductive or non-conductive heat conduction bonding substances I (2) between the chip and the monolayer or multilayer printed circuit board (9) and a plastic package body (8). The structure is characterized in that a heat dissipation block (7) is arranged above the chip (3) and is provided with a locking hole (7.1), and conductive or non-conductive heat conduction bonding substances II (6) are inlaid between the heat dissipation block (7) and the chip (3). The packaging structure has the following beneficial effects: the heat dissipation block is additionally arranged above the chip to play a role in high heat dissipation, so the packaging structure has strong capability of providing heat dissipation function, thus rapidly conducting the heat of the chip to the outside of a package body; and the packaging structure avoids quick ageing and even burn or burnout of the chip.
Description
Technical field
The present invention relates to a kind of chip of printed circuit board radiating block package structure with locking hole for normal installation.Belong to the semiconductor packaging field.
Background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, providing a kind of can provide heat dissipation capability strong chip of printed circuit board radiating block package structure with locking hole for normal installation.
The object of the present invention is achieved like this: a kind of chip of printed circuit board radiating block package structure with locking hole for normal installation, include chip, the single or multiple lift printed substrate that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I and plastic-sealed body, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip.
The invention has the beneficial effects as follows:
The present invention serves as the function of the heat radiation of high heat by addition radiating block above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
Description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is chip of printed circuit board radiating block package structure with locking hole for normal installation embodiment 1 schematic diagram of the present invention.
Fig. 6 is chip of printed circuit board radiating block package structure with locking hole for normal installation embodiment 2 schematic diagrames of the present invention.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, printed substrate 9.
Embodiment
Embodiment 1:
Referring to Fig. 5, Fig. 5 is chip of printed circuit board radiating block package structure with locking hole for normal installation embodiment 1 schematic diagram of the present invention.As seen from Figure 5, chip of printed circuit board radiating block package structure with locking hole for normal installation of the present invention, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the wire 5 that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate 9 or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, in above described chip 3, being provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
Embodiment 2:
Claims (3)
1. chip of printed circuit board radiating block package structure with locking hole for normal installation, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3).
2. a kind of chip of printed circuit board radiating block package structure with locking hole for normal installation according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of chip of printed circuit board radiating block package structure with locking hole for normal installation according to claim 1 is characterized in that: described radiating block (7) is inverted T-shape structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010558759 CN102044503A (en) | 2010-01-27 | 2010-11-25 | Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010117063 | 2010-01-27 | ||
| CN201010117063.7 | 2010-01-27 | ||
| CN201010108688.7 | 2010-01-27 | ||
| CN 201010108688 CN101783328A (en) | 2010-01-27 | 2010-01-27 | Radiating block package structure with locking hole for normal installation of printed circuit board chip |
| CN 201010558759 CN102044503A (en) | 2010-01-27 | 2010-11-25 | Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102044503A true CN102044503A (en) | 2011-05-04 |
Family
ID=43910510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010558759 Pending CN102044503A (en) | 2010-01-27 | 2010-11-25 | Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102044503A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299544A (en) * | 1992-04-20 | 1993-11-12 | Hitachi Ltd | Semiconductor device |
| US5814536A (en) * | 1995-12-27 | 1998-09-29 | Lsi Logic Corporation | Method of manufacturing powdered metal heat sinks having increased surface area |
| CN1354512A (en) * | 2000-11-17 | 2002-06-19 | 矽品精密工业股份有限公司 | Semiconductor package with radiating structure |
| CN1355564A (en) * | 2000-11-24 | 2002-06-26 | 矽品精密工业股份有限公司 | Semiconductor package and its making method |
| CN1630073A (en) * | 2003-12-19 | 2005-06-22 | 威宇科技测试封装有限公司 | Chip ball grid array packaging structure |
-
2010
- 2010-11-25 CN CN 201010558759 patent/CN102044503A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299544A (en) * | 1992-04-20 | 1993-11-12 | Hitachi Ltd | Semiconductor device |
| US5814536A (en) * | 1995-12-27 | 1998-09-29 | Lsi Logic Corporation | Method of manufacturing powdered metal heat sinks having increased surface area |
| CN1354512A (en) * | 2000-11-17 | 2002-06-19 | 矽品精密工业股份有限公司 | Semiconductor package with radiating structure |
| CN1355564A (en) * | 2000-11-24 | 2002-06-26 | 矽品精密工业股份有限公司 | Semiconductor package and its making method |
| CN1630073A (en) * | 2003-12-19 | 2005-06-22 | 威宇科技测试封装有限公司 | Chip ball grid array packaging structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20110504 |