CN201751994U - Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip - Google Patents
Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip Download PDFInfo
- Publication number
- CN201751994U CN201751994U CN 201020120082 CN201020120082U CN201751994U CN 201751994 U CN201751994 U CN 201751994U CN 201020120082 CN201020120082 CN 201020120082 CN 201020120082 U CN201020120082 U CN 201020120082U CN 201751994 U CN201751994 U CN 201751994U
- Authority
- CN
- China
- Prior art keywords
- chip
- heat radiation
- radiating block
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a packaging structure with a normal heat radiation block and an external heat radiation plate for a printed circuit board chip, which comprises a chip (3), a single-layer or multi-layer printed circuit board (9), metal wires (5), a conductive or non-conductive heat conduction bonding matter I (2) and a plastic sealed body (8), wherein the heat radiation block (7) is arranged above the chip (3), and a conductive or non-conductive heat conduction bonding matter II (6) is embedded between the heat radiation block (7) and the chip (3), a heat radiation plate (11) is arranged above the heat radiation block (7), and a conductive or non-conductive heat conduction bonding matter III (13) is embedded between the heat radiation plate (11) and the heat radiation block (7). The packaging structure can provide strong heat radiation capability.
Description
(1) technical field
The utility model relates to the external heating panel encapsulating structure of a kind of radiating block for chip of printed circuit board.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
Referring to Fig. 1 and Fig. 2, Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.Fig. 2 is the vertical view of Fig. 1.By Fig. 1 and Fig. 2 as can be seen, baried type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type
Referring to Fig. 3 and Fig. 4, Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.Fig. 4 is the vertical view of Fig. 3.By Fig. 3 and Fig. 4 as can be seen, exposed type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide the strong radiating block for chip of printed circuit board of heat dissipation capability external heating panel encapsulating structure.
The purpose of this utility model is achieved in that the external heating panel encapsulating structure of a kind of radiating block for chip of printed circuit board, include the single or multiple lift printed substrate that is carried of chip, chip below, conduction or nonconducting heat conduction bonding material I and the plastic-sealed body between wire, chip and the described single or multiple lift printed substrate that chip is used to the signal interconnection of single or multiple lift printed substrate, it is characterized in that above described chip, being provided with radiating block, be equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Above described radiating block, be provided with heating panel, be equipped with conduction or nonconducting heat conduction bonding material III between this heating panel and the described radiating block.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up heating panel outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the external heating panel encapsulating structure of a utility model radiating block for chip of printed circuit board schematic diagram.
Fig. 6 is another embodiment schematic diagram of the external heating panel encapsulating structure of the utility model radiating block for chip of printed circuit board.
Reference numeral among the figure:
(5) embodiment
Referring to Fig. 5, Fig. 5 is the external heating panel encapsulating structure of a utility model radiating block for chip of printed circuit board schematic diagram.As seen from Figure 5, the external heating panel encapsulating structure of the utility model radiating block for chip of printed circuit board, include the single or multiple lift printed substrate 9 that is carried of chip 3, chip below, conduction or nonconducting heat conduction bonding material I2 and the plastic-sealed body 8 between wire 5, chip and the described single or multiple lift printed substrate 9 that chip is used to the signal interconnection of single or multiple lift printed substrate, in above described chip 3, being provided with radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Above described radiating block 7, be provided with heating panel 11, be equipped with conduction or nonconducting heat conduction bonding material III13 between this heating panel 11 and the described radiating block 7.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described heating panel 11 can be copper, aluminium, pottery or alloy etc.
Described heating panel 11 can be provided with one or more layers, as Fig. 6.
Claims (4)
1. external heating panel encapsulating structure of radiating block for chip of printed circuit board, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3) in described chip (3) top; Be provided with heating panel (11) in described radiating block (7) top, be equipped with conduction or nonconducting heat conduction bonding material III (13) between this heating panel (11) and the described radiating block (7).
2. the external heating panel encapsulating structure of a kind of radiating block for chip of printed circuit board according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium or pottery.
3. the external heating panel encapsulating structure of a kind of radiating block for chip of printed circuit board according to claim 1, the material that it is characterized in that heating panel (11) is copper, aluminium or pottery.
4. the external heating panel encapsulating structure of a kind of radiating block for chip of printed circuit board according to claim 1 is characterized in that described heating panel (11) has one or more layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020120082 CN201751994U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020120082 CN201751994U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201751994U true CN201751994U (en) | 2011-02-23 |
Family
ID=43602404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201020120082 Expired - Fee Related CN201751994U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201751994U (en) |
-
2010
- 2010-01-30 CN CN 201020120082 patent/CN201751994U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201623107U (en) | Packaging structure of printed circuit board with flip chip and radiating block connected with external radiating board | |
CN201629316U (en) | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss | |
CN201623068U (en) | Packaging structure of printed circuit board with chip and inverted radiating block connected with external radiator | |
CN201623022U (en) | Packaging structure of printed circuit board with flip chip connected with external radiating board | |
CN201751994U (en) | Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip | |
CN201751988U (en) | Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip | |
CN201623069U (en) | Package structure of external heat-dissipating plate of heat dissipation part of resin circuit board chip normal | |
CN201629312U (en) | External heat radiator sealing structure for formal rectangle heat dissipation block of resin circuit board | |
CN201751986U (en) | Resin circuit board chip normally-assembled heat slug external radiator packaging structure | |
CN201629309U (en) | Packaging structure with printed circuit board, positively arranged chip and heat dissipating block | |
CN201751992U (en) | Encapsulation structure with inversely-mounted printed circuit board and chip, as well as rectangular heat dissipation block and external connected radiator | |
CN201623154U (en) | Printed circuit board chip positive mounting encapsulation structure with rectangular heat radiation block | |
CN201629303U (en) | Packaging structure with printed circuit board, positively arranged chip, rectangular heat dissipating block and external radiator | |
CN201751989U (en) | Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block | |
CN201681812U (en) | Full-coating packaging structure of printed circuit board chip packaging heat dissipating block | |
CN201623101U (en) | Packaging structure of printed circuit board with chip and radiating block with locking hole connected with external radiating board | |
CN201681818U (en) | Packaging structure of external heat radiator of upright heat-radiation block of chip of printed circuit board | |
CN201623081U (en) | External connection heat radiator encapsulation structure of printed circuit board chip reverse mounting reverse T-shaped heat radiation block | |
CN201751995U (en) | Packaging structure of flipped chip heat radiation block externally connected with radiator for printed circuit board | |
CN201623024U (en) | Packaging structure of printed circuit board with chip and radiating block connected with external radiating cap | |
CN201629327U (en) | External heat radiator sealing structure for formal locking hole heat dissipation block of resin circuit board | |
CN201629308U (en) | Packaging structure with printed circuit board, positively arranged chip and heat dissipating block with protruded surface | |
CN201623108U (en) | Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block | |
CN201623096U (en) | Package structure of external radiator of inversed T-shaped heat dissipation part of resin circuit board chip normal | |
CN201754402U (en) | Normal printed circuit board chip packaging structure with rectangular heat sink having locking hole |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110223 Termination date: 20140130 |