CN201751989U - Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block - Google Patents

Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block Download PDF

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Publication number
CN201751989U
CN201751989U CN 201020118866 CN201020118866U CN201751989U CN 201751989 U CN201751989 U CN 201751989U CN 201020118866 CN201020118866 CN 201020118866 CN 201020118866 U CN201020118866 U CN 201020118866U CN 201751989 U CN201751989 U CN 201751989U
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China
Prior art keywords
chip
heat dissipation
circuit board
resin circuit
dissipation block
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Expired - Fee Related
Application number
CN 201020118866
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Chinese (zh)
Inventor
王新潮
梁志忠
承杰
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Priority to CN 201020118866 priority Critical patent/CN201751989U/en
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Publication of CN201751989U publication Critical patent/CN201751989U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

The utility model relates to an encapsulation structure of external radiator with a resin circuit board, an invertedly-mounted chip, and a reverse T-shaped heat dissipation block, which comprises a chip (3), a single-layer or multi-layer resin circuit board (9), a metal convex block (10) and a plastic package body (8), and is characterized in that a heat dissipation block (7) is arranged above the chip (3); a conductive or non-conductive heat conduction bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); a radiator (11) is positioned above the heat dissipation block (7); a conductive or non-conductive heat conduction bonding substance III (13) is embedded between the radiator (11) and the heat dissipation block (7); and the heat dissipation block (7) takes on a reversed T shape. The utility model is strong in heat dissipation capability and leads the heat of the chip to be rapidly transferred to the outside of the encapsulation body.

Description

Resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure
(1) technical field
The utility model relates to a kind of resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
Referring to Fig. 1 and Fig. 2, Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.Fig. 2 is the vertical view of Fig. 1.By Fig. 1 and Fig. 2 as can be seen, baried type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type
Referring to Fig. 3 and Fig. 4, Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.Fig. 4 is the vertical view of Fig. 3.By Fig. 3 and Fig. 4 as can be seen, exposed type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure.
The purpose of this utility model is achieved in that a kind of resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure, include the single or multiple lift resin circuit board that is carried of chip, chip below, conduction or nonconducting heat conduction bonding material I and the plastic-sealed body between metal coupling, chip and the described single or multiple lift resin circuit board that chip is used to the signal interconnection of single or multiple lift resin circuit board, above described chip, be provided with radiating block, be equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, be equipped with conduction or nonconducting heat conduction bonding material III between this radiator and the described radiating block, described radiating block is inverted T-shape structure.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure schematic diagram.
Reference numeral among the figure:
Pin 4, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, plastic-sealed body 8, resin circuit board 9, metal coupling 10, radiator 11, conduction or nonconducting heat conduction bonding material III13 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure schematic diagram.As seen from Figure 5, the utility model resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure, include the single or multiple lift resin circuit board 9 that is carried of chip 3, chip below, conduction or nonconducting heat conduction bonding material I 2 and the plastic-sealed body 8 between metal coupling 10, chip and the described single or multiple lift resin circuit board that chip is used to the signal interconnection of single or multiple lift resin circuit board, above described chip 3, be provided with radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material III13 between this radiator 11 and the described radiating block 7, described radiating block 7 is inverted T-shape structure.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.

Claims (4)

1. resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure, include chip (3), the single or multiple lift resin circuit board (9) that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift resin circuit board (10), conduction between chip and the described single or multiple lift resin circuit board or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3) in described chip (3) top; Be provided with radiator (11) in described radiating block (7) top, be equipped with conduction or nonconducting heat conduction bonding material III (13) between this radiator (11) and the described radiating block (7), described radiating block (7) is inverted T-shape structure.
2. a kind of resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium or pottery.
3. a kind of resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin or gold.
4. a kind of resin circuit board chip-flip reverse T type heat dissipation block external radiator packaging structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium or pottery.
CN 201020118866 2010-01-30 2010-01-30 Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block Expired - Fee Related CN201751989U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020118866 CN201751989U (en) 2010-01-30 2010-01-30 Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020118866 CN201751989U (en) 2010-01-30 2010-01-30 Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block

Publications (1)

Publication Number Publication Date
CN201751989U true CN201751989U (en) 2011-02-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020118866 Expired - Fee Related CN201751989U (en) 2010-01-30 2010-01-30 Encapsulation structure of external radiator with resin circuit board, invertedly-mounted chip, and reverse T-shaped heat dissipation block

Country Status (1)

Country Link
CN (1) CN201751989U (en)

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C17 Cessation of patent right
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Granted publication date: 20110223

Termination date: 20140130