CN201751988U - Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip - Google Patents
Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip Download PDFInfo
- Publication number
- CN201751988U CN201751988U CN2010201188566U CN201020118856U CN201751988U CN 201751988 U CN201751988 U CN 201751988U CN 2010201188566 U CN2010201188566 U CN 2010201188566U CN 201020118856 U CN201020118856 U CN 201020118856U CN 201751988 U CN201751988 U CN 201751988U
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- resin circuit
- heating panel
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to an encapsulation structure of an external radiator with a resin circuit board and an invertedly-mounted chip, which comprises a chip (3), a single-layer or multi-layer resin circuit board (9) born under the chip, a metal convex block (10) used for signal interconnection between the chip and the and the single-layer or multi-layer resin circuit board, and a conductive or non-conductive heat conduction bonding substance I (2) arranged between the chip and the and the single-layer or multi-layer resin circuit board; the encapsulation structure is characterized in that a heat dissipation plate (11) is arranged above the chip (3); and a conductive or non-conductive heat conduction bonding substance II (6) is embedded between the heat dissipation plate (11) and the chip (3). The utility model is strong in heat dissipation capability and leads the heat of the chip to be rapidly transferred to the outside of the encapsulation body.
Description
(1) technical field
The utility model relates to the external heating panel encapsulating structure of a kind of resin circuit board chip-flip.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide the strong resin circuit board chip-flip of heat dissipation capability external heating panel encapsulating structure.
The purpose of this utility model is achieved in that the external heating panel encapsulating structure of a kind of resin circuit board chip-flip, include chip, the single or multiple lift resin circuit board that is carried of chip below, metal coupling and the conduction between chip and the described single or multiple lift resin circuit board or the nonconducting heat conduction bonding material I that chip is used to the signal interconnection of single or multiple lift resin circuit board, it is characterized in that above described chip, being provided with heating panel, be equipped with conduction or nonconducting heat conduction bonding material II between this heating panel and the described chip.
The beneficial effects of the utility model are:
The utility model is served as the function of the heat radiation of high heat by addition radiator above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the external heating panel encapsulating structure of a utility model resin circuit board chip-flip schematic diagram.
Fig. 6 is another embodiment schematic diagram of the external heating panel encapsulating structure of the utility model resin circuit board chip-flip.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, resin circuit board 9, metal coupling 10, heating panel 11.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the external heating panel encapsulating structure of a utility model resin circuit board chip-flip schematic diagram.As seen from Figure 5, the external heating panel encapsulating structure of the utility model resin circuit board chip-flip, include chip 3, the single or multiple lift resin circuit board 9 that is carried of chip below, metal coupling 10 and the conduction between chip 3 and the described single or multiple lift resin circuit board or the nonconducting heat conduction bonding material I 2 that chip is used to the signal interconnection of single or multiple lift resin circuit board, above described chip 3, be provided with heating panel 11, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this heating panel 11 and the described chip 3.
Described heating panel 11 can have one or more layers, as Fig. 6.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described heating panel 11 can be copper, aluminium, pottery or alloy etc.
Claims (4)
1. external heating panel encapsulating structure of resin circuit board chip-flip, include the single or multiple lift resin circuit board (9) that is carried of chip (3), chip below, metal coupling (10) that chip is used to the signal interconnection of single or multiple lift resin circuit board and conduction or the nonconducting heat conduction bonding material I (2) between chip and the described single or multiple lift resin circuit board, it is characterized in that being provided with heating panel (11), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this heating panel (11) and the described chip (3) in described chip (3) top.
2. the external heating panel encapsulating structure of a kind of resin circuit board chip-flip according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
3. the external heating panel encapsulating structure of a kind of resin circuit board chip-flip according to claim 1, the material that it is characterized in that described heating panel (11) is copper, aluminium, pottery or alloy.
4. the external heating panel encapsulating structure of a kind of resin circuit board chip-flip according to claim 1 is characterized in that described heating panel (11) has one or more layers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201188566U CN201751988U (en) | 2010-01-30 | 2010-01-30 | Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201188566U CN201751988U (en) | 2010-01-30 | 2010-01-30 | Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201751988U true CN201751988U (en) | 2011-02-23 |
Family
ID=43602398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201188566U Expired - Fee Related CN201751988U (en) | 2010-01-30 | 2010-01-30 | Encapsulation structure of external radiator with resin circuit board and invertedly-mounted chip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201751988U (en) |
-
2010
- 2010-01-30 CN CN2010201188566U patent/CN201751988U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110223 Termination date: 20140130 |