CN201629316U - Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss - Google Patents
Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss Download PDFInfo
- Publication number
- CN201629316U CN201629316U CN 201020120084 CN201020120084U CN201629316U CN 201629316 U CN201629316 U CN 201629316U CN 201020120084 CN201020120084 CN 201020120084 CN 201020120084 U CN201020120084 U CN 201020120084U CN 201629316 U CN201629316 U CN 201629316U
- Authority
- CN
- China
- Prior art keywords
- chip
- heat dissipating
- radiating block
- heating panel
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a packaging structure with a printed circuit board, a positively arranged chip, a heat dissipating block with a locking hole and a heat dissipating plate with an external boss, which comprises the chip (3), the single-layer or multilayer printed circuit board (9), metal wires (5) and a plastic packaging body (8). The upper part of the chip (3) is provided with the heat dissipating block (7). The heat dissipating block (7) is provided with the locking hole (7.1). A conductive or non-conductive heat conducting bonding material II (6) is embedded between the heat dissipating block (7) and the chip (3). The upper part of the heat dissipating block (7) is provided with a heat dissipating plate (11). The middle of the lower end surface of the heat dissipating plate (11) is convexly provided with the boss (11.1). The heat dissipating plate (11) is inserted with the heat dissipating block (7) with the locking hole by the boss (11.1). Conductive or non-conductive heat conducting bonding materials III (13) are respectively embedded between the heat dissipating plate (11) and the heat dissipating block (7) and inside the locking hole (7.1). The packaging structure of the utility model can provide strong capability of dissipating heat and enables the heat of the chip to be rapidly conducted to the outside of the packaging body.
Description
(1) technical field
The utility model relates to the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress lockhole radiating block projection.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability the strong external heating panel encapsulating structure of chip of printed circuit board formal dress lockhole radiating block projection.
The purpose of this utility model is achieved in that the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress lockhole radiating block projection, include chip, the single or multiple lift printed substrate that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I and plastic-sealed body, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with heating panel above described radiating block, protrusion is provided with a projection in the middle of the described heating panel lower surface, and described heating panel patches with the radiating block that has lock hole by this projection and is connected; And between this heating panel and described radiating block and in described lock hole, be equipped with the conduction or nonconducting heat conduction bonding material III.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up heating panel outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the external heating panel encapsulating structure of a utility model chip of printed circuit board formal dress lockhole radiating block projection schematic diagram.
Fig. 6 is another embodiment schematic diagram of the external heating panel encapsulating structure of the utility model chip of printed circuit board formal dress lockhole radiating block projection.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, printed substrate 9, heating panel 11, projection 11.1, conduction or nonconducting heat conduction bonding material III13.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the external heating panel encapsulating structure of a utility model chip of printed circuit board formal dress lockhole radiating block projection schematic diagram.As seen from Figure 5, the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress of the utility model lockhole radiating block projection, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the wire 5 that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate 9 or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with heating panel 11 above described radiating block 7, protrusion is provided with a projection 11.1 in the middle of described heating panel 11 lower surfaces, and described heating panel 11 patches with the radiating block 7 that has lock hole by this projection 11.1 and is connected; And be equipped with conduction or nonconducting heat conduction bonding material III13 between this heating panel 11 and the described radiating block 7 and in described lock hole 7.1; So that the two interfixes or bonds with heating panel 11 and radiating block 7.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described heating panel 11 can be copper, aluminium, pottery or alloy etc.
Described heating panel 11 can adopt one or more layers, as shown in Figure 6.
Annotate: " lockhole " is meant " lock hole 7.1 " described in the foregoing invention creation title.
Claims (4)
1. external heating panel encapsulating structure of chip of printed circuit board formal dress lockhole radiating block projection, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with heating panel (11) in described radiating block (7) top, protrusion is provided with a projection (11.1) in the middle of described heating panel (11) lower surface, and described heating panel (11) patches with the radiating block that has lock hole (7) by this projection (11.1) and is connected; And between this heating panel (11) and described radiating block (7) and in described lock hole (7.1), be equipped with the conduction or nonconducting heat conduction bonding material III (13).
2. the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress lockhole radiating block projection according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress lockhole radiating block projection according to claim 1, the material that it is characterized in that heating panel (11) is copper, aluminium, pottery or alloy.
4. the external heating panel encapsulating structure of a kind of chip of printed circuit board formal dress lockhole radiating block projection according to claim 1 is characterized in that described heating panel (11) has one or more layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020120084 CN201629316U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020120084 CN201629316U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201629316U true CN201629316U (en) | 2010-11-10 |
Family
ID=43060714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020120084 Expired - Fee Related CN201629316U (en) | 2010-01-30 | 2010-01-30 | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201629316U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000906A1 (en) * | 2016-06-29 | 2018-01-04 | 深圳市九洲电器有限公司 | Chip heat-dissipation structure and set-top box |
| WO2023098751A1 (en) * | 2021-12-03 | 2023-06-08 | Oppo广东移动通信有限公司 | Chip heat dissipation structure and electronic device |
-
2010
- 2010-01-30 CN CN 201020120084 patent/CN201629316U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000906A1 (en) * | 2016-06-29 | 2018-01-04 | 深圳市九洲电器有限公司 | Chip heat-dissipation structure and set-top box |
| WO2023098751A1 (en) * | 2021-12-03 | 2023-06-08 | Oppo广东移动通信有限公司 | Chip heat dissipation structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101110 Termination date: 20140130 |