CN201751996U - Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole - Google Patents

Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole Download PDF

Info

Publication number
CN201751996U
CN201751996U CN 201020120122 CN201020120122U CN201751996U CN 201751996 U CN201751996 U CN 201751996U CN 201020120122 CN201020120122 CN 201020120122 CN 201020120122 U CN201020120122 U CN 201020120122U CN 201751996 U CN201751996 U CN 201751996U
Authority
CN
China
Prior art keywords
chip
heat dissipation
dissipation block
radiator
radiating block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201020120122
Other languages
Chinese (zh)
Inventor
王新潮
梁志忠
林煜斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN 201020120122 priority Critical patent/CN201751996U/en
Application granted granted Critical
Publication of CN201751996U publication Critical patent/CN201751996U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a packaging structure of radiator connected to the external of normal-installed rectangular heat dissipation block with printed substrate, chip and locking hole, which comprises a chip (3), a single layer or multilayer printed substrate (9), a metal wire (5), heat conductive bonding substance I (2) which may be electric conductive or non-conductive, and a plastic packaging body (8), wherein a heat dissipation block (7) is arranged on the top of the chip (3), the heat dissipation block (7) has a locking hole (7.1) arranged thereon, a heat conductive bonding substance II (6) which may be electric conductive or non-conductive is inserted between the heat dissipation block (7) and the chip (3), and a radiator (11) is arranged above the heat dissipation block (7) and is fixedly connected to the heat dissipation block (7) via a screw (12) passing through the locking hole (7.1). The heat dissipation block (7) is in a rectangular structure. With the packaging structure disclosed in the utility model, strong heat dissipation capability is ensured.

Description

Chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure
(1) technical field
The utility model relates to a kind of chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
Referring to Fig. 1 and Fig. 2, Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.Fig. 2 is the vertical view of Fig. 1.By Fig. 1 and Fig. 2 as can be seen, baried type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type
Referring to Fig. 3 and Fig. 4, Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.Fig. 4 is the vertical view of Fig. 3.By Fig. 3 and Fig. 4 as can be seen, exposed type chip-packaging structure in Metal Substrate island was made up of pin 4 and wire 5 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal in the past.Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure.
The purpose of this utility model is achieved in that a kind of chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure, include chip, the single or multiple lift printed substrate that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I and plastic-sealed body, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, described radiator is fixedlyed connected with radiating block by described lock hole with screw, and described radiating block is square type structure.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure schematic diagram.
Reference numeral among the figure:
Pin 4, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, printed substrate 9, radiator 11, screw 12 in Metal Substrate island 1, conduction or nonconducting heat conduction bonding material I 2, chip 3, the metal.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure schematic diagram.As seen from Figure 5, the utility model chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the wire 5 that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate 9 or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, described radiator 11 usefulness screws 12 are fixedlyed connected with radiating block 7 by described lock hole 7.1, and described radiating block 7 is square type structure.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Annotate: " lockhole " is meant " lock hole 7.1 " described in the foregoing invention creation title.

Claims (3)

1. chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiator (11) in described radiating block (7) top, described radiator (11) is fixedlyed connected with radiating block (7) by described lock hole (7.1) with screw (12), and described radiating block (7) is square type structure.
2. a kind of chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium or pottery.
3. a kind of chip of printed circuit board formal dress square type lockhole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that radiator (11) is copper, aluminium or pottery.
CN 201020120122 2010-01-30 2010-01-30 Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole Expired - Fee Related CN201751996U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020120122 CN201751996U (en) 2010-01-30 2010-01-30 Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020120122 CN201751996U (en) 2010-01-30 2010-01-30 Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole

Publications (1)

Publication Number Publication Date
CN201751996U true CN201751996U (en) 2011-02-23

Family

ID=43602406

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020120122 Expired - Fee Related CN201751996U (en) 2010-01-30 2010-01-30 Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole

Country Status (1)

Country Link
CN (1) CN201751996U (en)

Similar Documents

Publication Publication Date Title
CN201629316U (en) Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss
CN201751996U (en) Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole
CN201623111U (en) Package structure of external radiator of rectangular heat dissipation part with locking hole of resin circuit board chip normal
CN201623101U (en) Packaging structure of printed circuit board with chip and radiating block with locking hole connected with external radiating board
CN201623104U (en) External connection heat radiator encapsulation structure of resin circuit board chip positive mounting reverse T-shaped lock hole heat radiation block
CN201623108U (en) Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block
CN201623055U (en) Printed circuit board chip positive mounting heat radiation block surface protruding encapsulation structure with locking hole
CN201623154U (en) Printed circuit board chip positive mounting encapsulation structure with rectangular heat radiation block
CN201681814U (en) Packaging structure for radiator externally connected with inverted T-shaped radiating block with lock hole uprightly mounted above chip on printed circuit board
CN201754402U (en) Normal printed circuit board chip packaging structure with rectangular heat sink having locking hole
CN201629327U (en) External heat radiator sealing structure for formal locking hole heat dissipation block of resin circuit board
CN201681815U (en) External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block
CN201623051U (en) Packaging structure of printed circuit board with chip and radiating block with locking hole
CN201629304U (en) Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and external heat dissipating cap
CN201623081U (en) External connection heat radiator encapsulation structure of printed circuit board chip reverse mounting reverse T-shaped heat radiation block
CN201623149U (en) Packaging structure of printed circuit board chip flip inverted T-shaped locking hole radiating block with external radiator
CN201629303U (en) Packaging structure with printed circuit board, positively arranged chip, rectangular heat dissipating block and external radiator
CN201751994U (en) Packaging structure with normal heat radiation block and external heat radiation plate for printed circuit board chip
CN201751986U (en) Resin circuit board chip normally-assembled heat slug external radiator packaging structure
CN201751983U (en) Resin circuit board chip inverted lock hole rectangular heat-radiating block external radiator encapsulation structure
CN201623110U (en) Packaging structure of printed circuit board with flip chip, rectangular radiating block with locking hole and external radiator
CN201623151U (en) Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block and protruding column
CN201623145U (en) Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator
CN201629311U (en) Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and radiator with external boss
CN201629326U (en) Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole and connected with external radiator

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110223

Termination date: 20140130