CN201681815U - External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block - Google Patents
External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block Download PDFInfo
- Publication number
- CN201681815U CN201681815U CN 201020118774 CN201020118774U CN201681815U CN 201681815 U CN201681815 U CN 201681815U CN 201020118774 CN201020118774 CN 201020118774 CN 201020118774 U CN201020118774 U CN 201020118774U CN 201681815 U CN201681815 U CN 201681815U
- Authority
- CN
- China
- Prior art keywords
- chip
- radiating block
- printed circuit
- circuit board
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to an external radiator packaging structure of a printed circuit board chip positive-mounting locking hole radiating block which comprises a chip (3), single layer or multi-layers of printed circuit boards (9), metal wires (5), a conducting or non-conducting heat-conductive sticky substance I (2) and an insulated plastic body (8); a radiating block (7) is arranged above the chip (3) and is provided with a locking hole (7.1); a conducting or non-conducting heat-conductive sticky substance II (6) is embedded between the radiating block (7) and the chip (3); a radiator (11) is arranged above the radiating block (7) and is fixedly connected with the radiating block (7) by screws (12) through the locking hole (7.1). The external radiator packaging structure of the printed circuit board chip positive-mounting locking hole radiating block has strong radiating capacity.
Description
(1) technical field
The utility model relates to a kind of chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure.
The purpose of this utility model is achieved in that a kind of chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure, include chip, the single or multiple lift printed substrate that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate, the conduction between chip and the described single or multiple lift printed substrate or the plastic-sealed body of nonconducting heat conduction bonding material I and insulation, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, described radiator is fixedlyed connected with radiating block by described lock hole with screw.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure schematic diagram.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I2, chip 3, wire 5, conduction or nonconducting heat conduction bonding material II6, radiating block 7, lock hole 7.1, plastic-sealed body 8, printed substrate 9, radiator 11, screw 12.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure schematic diagram.As seen from Figure 5, the utility model chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the wire 5 that chip is used to the signal interconnection of single or multiple lift printed substrate, the conduction between chip and the described single or multiple lift printed substrate 9 or the plastic-sealed body 8 of nonconducting heat conduction bonding material I2 and insulation, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, described radiator 11 usefulness screws 12 are fixedlyed connected with radiating block 7 by described lock hole 7.1.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Claims (3)
1. chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), the plastic-sealed body (8) of the conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and insulation, it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiator (11) in described radiating block (7) top, described radiator (11) is fixedlyed connected with radiating block (7) by described lock hole (7.1) with screw (12).
2. chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. chip of printed circuit board formal dress lock hole heat dissipation block externally connected with radiator encapsulating structure, the material that it is characterized in that radiator (11) is copper, aluminium, pottery or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020118774 CN201681815U (en) | 2010-01-30 | 2010-01-30 | External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020118774 CN201681815U (en) | 2010-01-30 | 2010-01-30 | External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681815U true CN201681815U (en) | 2010-12-22 |
Family
ID=43346851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020118774 Expired - Fee Related CN201681815U (en) | 2010-01-30 | 2010-01-30 | External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681815U (en) |
-
2010
- 2010-01-30 CN CN 201020118774 patent/CN201681815U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201629316U (en) | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss | |
| CN201681815U (en) | External radiator packaging structure of printed circuit board chip positive-mounting locking hole radiating block | |
| CN201623101U (en) | Packaging structure of printed circuit board with chip and radiating block with locking hole connected with external radiating board | |
| CN201629304U (en) | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and external heat dissipating cap | |
| CN201623104U (en) | External connection heat radiator encapsulation structure of resin circuit board chip positive mounting reverse T-shaped lock hole heat radiation block | |
| CN201629327U (en) | External heat radiator sealing structure for formal locking hole heat dissipation block of resin circuit board | |
| CN201623108U (en) | Resin wiring board chip mounted heat sink packaging structure externally connected with locking hole and heat dissipation block | |
| CN201623128U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiator | |
| CN201751986U (en) | Resin circuit board chip normally-assembled heat slug external radiator packaging structure | |
| CN201681814U (en) | Packaging structure for radiator externally connected with inverted T-shaped radiating block with lock hole uprightly mounted above chip on printed circuit board | |
| CN201623072U (en) | Package structure of external heat-dissipating cap of heat dissipation part with locking hole of resin circuit board chip normal | |
| CN201623145U (en) | Normal chip packaging structure with embedded substrate and rectangular heat sink having locking hole and connected with external radiator | |
| CN201751996U (en) | Packaging structure of radiator connected to the external of normally installed rectangular heat dissipation block with printed substrate, chip and locking hole | |
| CN201623141U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate | |
| CN201629321U (en) | Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external radiating cap | |
| CN201629303U (en) | Packaging structure with printed circuit board, positively arranged chip, rectangular heat dissipating block and external radiator | |
| CN201629326U (en) | Normal chip packaging structure with exposed substrate and rectangular heat sink having locking hole and connected with external radiator | |
| CN201623111U (en) | Package structure of external radiator of rectangular heat dissipation part with locking hole of resin circuit board chip normal | |
| CN201623130U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external heat-dissipating plate | |
| CN201623051U (en) | Packaging structure of printed circuit board with chip and radiating block with locking hole | |
| CN201623154U (en) | Printed circuit board chip positive mounting encapsulation structure with rectangular heat radiation block | |
| CN201623129U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external radiator | |
| CN201623115U (en) | Normal chip packaging structure with exposed substrate and heat sink having locking hole and connected with external heat-dissipating cap | |
| CN201681818U (en) | Packaging structure of external heat radiator of upright heat-radiation block of chip of printed circuit board | |
| CN201754402U (en) | Normal printed circuit board chip packaging structure with rectangular heat sink having locking hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20140130 |