CN201623102U - Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column - Google Patents

Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column Download PDF

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Publication number
CN201623102U
CN201623102U CN 201020120115 CN201020120115U CN201623102U CN 201623102 U CN201623102 U CN 201623102U CN 201020120115 CN201020120115 CN 201020120115 CN 201020120115 U CN201020120115 U CN 201020120115U CN 201623102 U CN201623102 U CN 201623102U
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CN
China
Prior art keywords
heat dissipation
chip
radiating
cap
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201020120115
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Chinese (zh)
Inventor
王新潮
梁志忠
刘志刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN 201020120115 priority Critical patent/CN201623102U/en
Application granted granted Critical
Publication of CN201623102U publication Critical patent/CN201623102U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a printed substrate chip inverted heat dissipation cap packaging structure externally connected with a locking hole and a heat dissipation block and a protruding column, comprising a chip (3), a single-layer or multilayer printed wiring board (9), a metal protruding block (10) and a plastic packaging body (8), a radiating block (7) is arranged above the chip (3), the heat dissipation block (7) is provided with a locking hole (7.1), a heat dissipation cap (11) is arranged above the heat dissipation block (7), a protruding column (11.1) is protruded at the middle of the lower end face of the heat dissipation cap (11), the heat dissipation cap (11) is connected with the heat dissipation block (7) with the locking hole by the protruding column (11.1) in a splicing way, conductive or non-conductive heat conductive bonding substances III (13) are embedded between the heat dissipation cap (11) and the heat dissipation block (7) and in the locking hole (7.1). and the heat dissipation cap (11) is sleeved on the plastic packaging body (8). The packaging structure has strong heat dissipation capability, and the heat of the chip can be conducted to the outside of the packaging body quickly.

Description

The external radiating cap encapsulating structure of chip of printed circuit board upside-down mounting lockhole radiating block projection
(1) technical field
The utility model relates to the external radiating cap encapsulating structure of a kind of chip of printed circuit board upside-down mounting lockhole radiating block projection.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability the strong external radiating cap encapsulating structure of chip of printed circuit board upside-down mounting lockhole radiating block projection.
The purpose of this utility model is achieved in that the external radiating cap encapsulating structure of a kind of chip of printed circuit board upside-down mounting lockhole radiating block projection, include chip, the single or multiple lift printed substrate that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate, the conduction between chip and the described single or multiple lift printed substrate or the plastic-sealed body of nonconducting heat conduction bonding material I and insulation, above described chip, be provided with radiating block, this radiating block has lockhole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiating cap above described radiating block, protrusion is provided with a projection in the middle of the described radiating cap lower surface, and described radiating cap patches with the radiating block that has lockhole by this projection and is connected; And between this radiating cap and described radiating block and in described lockhole, being equipped with conduction or nonconducting heat conduction bonding material III, described radiating cap is sleeved on the plastic-sealed body.
The beneficial effects of the utility model are:
The utility model passes through addition radiating block above chip, and sets up radiating cap outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the external radiating cap encapsulating structure of a utility model chip of printed circuit board upside-down mounting lockhole radiating block projection schematic diagram.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lockhole 7.1, plastic-sealed body 8, printed substrate 9, metal coupling 10, radiating cap 11, projection 11.1, conduction or nonconducting heat conduction bonding material III13.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the external radiating cap encapsulating structure of a utility model chip of printed circuit board upside-down mounting lockhole radiating block projection schematic diagram.As seen from Figure 5, the external radiating cap encapsulating structure of the utility model chip of printed circuit board upside-down mounting lockhole radiating block projection, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of single or multiple lift printed substrate, the plastic-sealed body 8 of the conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I 2 and insulation, it is characterized in that above described chip 3, being provided with radiating block 7, this radiating block 7 has lockhole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiating cap 11 above described radiating block 7, protrusion is provided with a projection 11.1 in the middle of described radiating cap 11 lower surfaces, and described radiating cap 11 patches with the radiating block 7 that has lockhole by this projection 11.1 and is connected; And being equipped with conduction or nonconducting heat conduction bonding material III13 between this radiating cap 11 and the described radiating block 7 and in described lockhole 7.1, described radiating cap 11 is sleeved on the plastic-sealed body 8.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiating cap 11 can be copper, aluminium, pottery or alloy etc.
Annotate: " lockhole " is meant " lock hole 7.1 " described in the foregoing invention creation title.

Claims (4)

1. external radiating cap encapsulating structure of chip of printed circuit board upside-down mounting lockhole radiating block projection, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate (10), the plastic-sealed body (8) of the conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I (2) and insulation, it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lockhole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiating cap (11) in described radiating block (7) top, protrusion is provided with a projection (11.1) in the middle of described radiating cap (11) lower surface, and described radiating cap (11) patches with the radiating block that has lockhole (7) by this projection (11.1) and is connected; And between this radiating cap (11) and described radiating block (7) and in described lockhole (7.1), being equipped with conduction or nonconducting heat conduction bonding material III (13), described radiating cap (11) is sleeved on the plastic-sealed body (8).
2. the external radiating cap encapsulating structure of a kind of chip of printed circuit board upside-down mounting lockhole radiating block projection according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. the external radiating cap encapsulating structure of a kind of chip of printed circuit board upside-down mounting lockhole radiating block projection according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
4. the external radiating cap encapsulating structure of a kind of chip of printed circuit board upside-down mounting lockhole radiating block projection according to claim 1, the material that it is characterized in that described radiating cap (11) is copper, aluminium, pottery or alloy.
CN 201020120115 2010-01-30 2010-01-30 Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column Expired - Fee Related CN201623102U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020120115 CN201623102U (en) 2010-01-30 2010-01-30 Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020120115 CN201623102U (en) 2010-01-30 2010-01-30 Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column

Publications (1)

Publication Number Publication Date
CN201623102U true CN201623102U (en) 2010-11-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020120115 Expired - Fee Related CN201623102U (en) 2010-01-30 2010-01-30 Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column

Country Status (1)

Country Link
CN (1) CN201623102U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101103

Termination date: 20140130