CN102054797A - Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator - Google Patents
Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator Download PDFInfo
- Publication number
- CN102054797A CN102054797A CN201010558763XA CN201010558763A CN102054797A CN 102054797 A CN102054797 A CN 102054797A CN 201010558763X A CN201010558763X A CN 201010558763XA CN 201010558763 A CN201010558763 A CN 201010558763A CN 102054797 A CN102054797 A CN 102054797A
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- Prior art keywords
- chip
- radiator
- circuit board
- printed circuit
- lockhole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a packaging structure of a printed circuit board, a chip, a flip lock hole radiating block and an external radiator. The structure comprises the chip (3), a single-layer or multi-layer printed circuit board (9), metal bumps (10) and a plastic package (8), wherein the radiating block (7) is arranged above the chip (3) and provided with a lock hole (7.1); a heat-conducting adhesive matter II (6) capable or incapable of conducting electricity is arranged between the heat dissipation block (7) and the chip (3); and the radiator (11) is arranged above the radiating block (7) and is fixedly connected with the radiating block (7) by a screw (12) through the lock hole (7.1). The packaging structure of the printed circuit board, the chip, the flip lock hole radiating block and the external radiator can provide high radiating capability, so that the heat of the chip can be quickly transferred to the outside of a package.
Description
Technical field
The present invention relates to a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure.Belong to the semiconductor packaging field.
Background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, providing a kind of can provide heat dissipation capability strong chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure.
The object of the present invention is achieved like this: a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure, include chip, the single or multiple lift printed substrate that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I and plastic-sealed body, above described chip, be provided with radiating block, this radiating block has lockhole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Be provided with radiator above described radiating block, described radiator is fixedlyed connected with radiating block by described lockhole with screw.
The invention has the beneficial effects as follows:
The present invention passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
Description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 1 schematic diagram of the present invention.
Fig. 6 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 2 schematic diagrames of the present invention.
Fig. 7 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 3 schematic diagrames of the present invention.
Fig. 8 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 4 schematic diagrames of the present invention.
Fig. 9 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 5 schematic diagrames of the present invention.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lockhole 7.1, plastic-sealed body 8, printed substrate 9, metal coupling 10, radiator 11, screw 12.
Embodiment
Embodiment 1:
Referring to Fig. 5, Fig. 5 is chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure embodiment 1 schematic diagram of the present invention.As seen from Figure 5, chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure of the present invention, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, above described chip 3, be provided with radiating block 7, this radiating block 7 has lockhole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Be provided with radiator 11 above described radiating block 7, described radiator 11 usefulness screws 12 are fixedlyed connected with radiating block 7 by described lockhole 7.1.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Embodiment 2:
Embodiment 3:
Embodiment 4:
Embodiment 5:
Claims (8)
1. chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate (10), conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lockhole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); Be provided with radiator (11) in described radiating block (7) top, described radiator (11) is fixedlyed connected with radiating block (7) by described lockhole (7.1) with screw (12).
2. a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
4. a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
5. according to claim 1,2,3 or 4 described a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiator (11) is a radiating cap.
6. according to claim 1,2,3 or 4 described a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiator (11) is a heating panel.
7. according to claim 1,2,3 or 4 described a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiating block (7) is inverted T-shape structure.
8. according to claim 1,2,3 or 4 described a kind of chip of printed circuit board upside-down mounting lockhole heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: the rectangular structure of described radiating block (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010558763XA CN102054797A (en) | 2010-01-30 | 2010-11-25 | Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator |
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010117847 | 2010-01-30 | ||
CN201010117847.X | 2010-01-30 | ||
CN201010117830.4 | 2010-01-30 | ||
CN201010117829 | 2010-01-30 | ||
CN201010117830 | 2010-01-30 | ||
CN201010117344.2 | 2010-01-30 | ||
CN201010117344 | 2010-01-30 | ||
CN201010117390 | 2010-01-30 | ||
CN201010117390.2 | 2010-01-30 | ||
CN201010117829.1 | 2010-01-30 | ||
CN201010558763XA CN102054797A (en) | 2010-01-30 | 2010-11-25 | Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator |
Publications (1)
Publication Number | Publication Date |
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CN102054797A true CN102054797A (en) | 2011-05-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201010558763XA Pending CN102054797A (en) | 2010-01-30 | 2010-11-25 | Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator |
Country Status (1)
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CN (1) | CN102054797A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05299544A (en) * | 1992-04-20 | 1993-11-12 | Hitachi Ltd | Semiconductor device |
US5814536A (en) * | 1995-12-27 | 1998-09-29 | Lsi Logic Corporation | Method of manufacturing powdered metal heat sinks having increased surface area |
CN1355564A (en) * | 2000-11-24 | 2002-06-26 | 矽品精密工业股份有限公司 | Semiconductor package and its making method |
CN1630073A (en) * | 2003-12-19 | 2005-06-22 | 威宇科技测试封装有限公司 | Chip ball grid array packaging structure |
CN101221944A (en) * | 2007-01-09 | 2008-07-16 | 矽品精密工业股份有限公司 | Cooling type semiconductor packaging member |
-
2010
- 2010-11-25 CN CN201010558763XA patent/CN102054797A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05299544A (en) * | 1992-04-20 | 1993-11-12 | Hitachi Ltd | Semiconductor device |
US5814536A (en) * | 1995-12-27 | 1998-09-29 | Lsi Logic Corporation | Method of manufacturing powdered metal heat sinks having increased surface area |
CN1355564A (en) * | 2000-11-24 | 2002-06-26 | 矽品精密工业股份有限公司 | Semiconductor package and its making method |
CN1630073A (en) * | 2003-12-19 | 2005-06-22 | 威宇科技测试封装有限公司 | Chip ball grid array packaging structure |
CN101221944A (en) * | 2007-01-09 | 2008-07-16 | 矽品精密工业股份有限公司 | Cooling type semiconductor packaging member |
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PB01 | Publication | ||
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110511 |