CN202150841U - Resin packaged SMD type quartz crystal resonator - Google Patents
Resin packaged SMD type quartz crystal resonator Download PDFInfo
- Publication number
- CN202150841U CN202150841U CN201120287271U CN201120287271U CN202150841U CN 202150841 U CN202150841 U CN 202150841U CN 201120287271 U CN201120287271 U CN 201120287271U CN 201120287271 U CN201120287271 U CN 201120287271U CN 202150841 U CN202150841 U CN 202150841U
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- Prior art keywords
- resin
- metal cover
- crystal resonator
- ceramic
- cover board
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- Expired - Lifetime
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Abstract
The utility model relates to a resin packaged SMD type quartz crystal resonator which includes a ceramic pedestal, a metal cover plate, and a wafer. The wafer is fixed on the ceramic pedestal. The periphery of the ceramic pedestal is provided with a packaging platform which is pasted to the metal cover plate via resin. The periphery of the lower part of the metal cover plate is adhesively fixed on the ceramic pedestal via the resin. The periphery of the lower part of the metal cover plate is provided with a bulge which extends downward to the surface of the packaging platform of the ceramic pedestal. Because the middle of an adhesive layer is provided with a moisture-proof barrier layer, the water molecules can be effectively prevented from entering into the crystal resonator, and the stability of the crystal is improved in a working environment of high temperature and high humidity.
Description
Technical field
The utility model relates to quartz-crystal resonator, specifically a kind of resin-encapsulated SMD type quartz-crystal resonator.
Background technology
The SMD quartz-crystal resonator of existing moulding mainly contains two kinds of packaged types, and a kind of is metallic packaging, and another kind is a glass packaging.Glass packaging is exactly around ceramic cover plate, to be printed on a circle low temperature glass; Adopt the weak point first low temperature glass of this packaged type under the temperature of 360-400 degree, the production capacity thawing to carry out bonding; The conducting resinl heatproof of like this fixed wafer being used requires high; Cost is also just high, and high like this temperature has been brought very big difficulty to high-precision wafer FREQUENCY CONTROL; Its two low temperature glass all contains lead, not environmental protection; Its three this packaged type curing temperature is high, and the time is long, and production cost is also just high.Metallic packaging is around base of ceramic, to be inlaid with to cut down ring; Adopt parallel soldering and sealing pattern with metal cover board with can cut down loops welded together, adopt the weak point first of this packaged type can cut down ring and when the base of ceramic sintering, inlay up, technical difficulty is very big; Controlling bad will causing can cut down annular strain or inlay the not firm slit that has; SMD leaks gas during moulding, influences electrical property, and small size pedestal production technology has only major company of Japanese a few family to grasp at present; Its two parallel sealing device also mainly relies on import, and equipment cost is high, and investment repayment is slow.In order to address this is that; Someone proposes to substitute the adhesives that can cut down ring conduct encapsulation with epoxy resin; Obtained better effects; In Chinese patent CN201699670U, propose a kind of substituting such as the applicant and can cut down the scheme that ring seal is adorned, can improve the quality of products, reduce product cost with epoxy resin.It is very stable that but the quartz-crystal resonator that adopts epoxy encapsulation is worked under normal temperature or low temperature environment, but under hot and humid environment, have the defective of poor stability, makes its applied environment be restricted.
Summary of the invention
The purpose of the utility model is to the weak point that exists in the prior art, and a kind of resin-encapsulated SMD type quartz-crystal resonator is provided, and has the advantage of good stability, applied range under hot and humid environment.
The inventor finds through studying for a long period of time finally; Adopt the resin-encapsulated quartz-crystal resonator under hot environment, to exist the reason of poor stability to be: there is micropore in inside after the resin bonded; Its internal capillary aperture enlarges under hot environment; Possibly cause the micropore in the adhesive-layer thereby formation capillarity to occur connecting from outside to inside; Make outside hydrone penetrate resin voids and evaporate in the die cavity, make frequency drift, the resistance of product become big behind the silver layer absorption steam of wafer surface, thereby destroy its stability.
Based on above-mentioned discovery; The utility model has adopted following technical scheme: it comprises base of ceramic, metal cover board and wafer; Wafer is fixed on the base of ceramic; Have and the package platforms of metal cover board around the base of ceramic, be fixed on the base of ceramic through resin bonding around the metal cover board lower end through resin bonding; The convexity that extends downward base of ceramic package platforms surface is arranged around the metal cover board lower end.During encapsulation, the resin of adhesive-layer is expressed to protruding both sides by convexity, and is protruding at the moistureproof barrier layer of the middle formation of resin.Because protruding iris action, when it is under the hot environment, the adhesive-layer micropore can not form capillarity from outside to inside, and it is inner to prevent that hydrone from getting into, thereby can improve the stability of work.Because protruding existence makes the contact area of resin and metal cover board increase, also improved bonding intensity simultaneously.
A preferred version of the utility model is that convex cross section is V-shaped, and because of stressed plastic deformation, the platform that formation and pedestal closely contact has guaranteed the contact area certain with pedestal to feasible protruding bottom wedge angle, can block resin effectively and absorb water when encapsulation.
In the middle of making metal cover board adhesive-layer all around, moistureproof barrier layer is set all, said convexity is linked to be the ring-type of sealing around metal cover board.
In order not increase cover sheet thickness, the height of said convexity is not more than 0.1mm.
Can know that by technique scheme the utility model is provided with moistureproof barrier layer in the middle of the resin of adhesive-layer, can effectively intercept hydrone and get into crystal resonator inside, thereby can improve the stability of work.Simultaneously can also improve the adhesive strength between metal cover board and the pedestal.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the upward view of metal cover board.
Embodiment
Like Fig. 1, shown in Figure 2; The utility model comprises base of ceramic 6, metal cover board 1 and wafer 2; Wafer 2 is fixed on by elargol in the die cavity 7 of base of ceramic 6, have around the base of ceramic 5 with metal cover board 1 through the bonding package platforms 5 of resin 4, the V-shaped convexity 3 in cross section that extends downward base of ceramic 6 package platforms 5 surfaces is arranged around metal cover board 1 lower end; Protruding 3 are linked to be the ring-type of sealing as shown in Figure 2 around metal cover board 1, protruding 3 height is not more than 0.1mm.
During encapsulation, protruding 3 resins 4 with adhesive-layer intercept in protruding both sides, thereby in adhesive-layer, form moistureproof barrier layer.Protruding 3 bottom wedge angle forms the platform that closely contacts with pedestal because of stressed plastic deformation simultaneously, has guaranteed the contact area certain with pedestal, can block the resin suction effectively.
When package platforms 5 width were enough, above-mentioned annular projection 3 can also be provided with twice or multiple tracks.
The platform that pedestal 6 package platforms 5 raise up for pedestal 6 edges in this example.Also be fit to the downward package platforms of susceptor edges, as disclosed among the CN201699670U at the downward step of susceptor edges.
Claims (4)
1. resin-encapsulated SMD type quartz-crystal resonator; Comprise base of ceramic (6), metal cover board (1) and wafer (2); Wafer (2) is fixed on the base of ceramic (6); Base of ceramic (6) has all around and metal cover board (1) passes through the bonding package platforms (5) of resin (4), is fixed on the base of ceramic (6) through resin bonding around metal cover board (1) lower end; It is characterized in that: the convexity (3) that extends downward base of ceramic (6) package platforms (5) surface is arranged around metal cover board (1) lower end.
2. resin-encapsulated SMD type quartz-crystal resonator according to claim 1 is characterized in that: said convexity (3) cross section is V-shaped.
3. resin-encapsulated SMD type quartz-crystal resonator according to claim 1 and 2 is characterized in that: said convexity (3) is linked to be the ring-type of sealing all around at metal cover board (1).
4. resin-encapsulated SMD type quartz-crystal resonator according to claim 3 is characterized in that: the height of said convexity (3) is not more than 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120287271U CN202150841U (en) | 2011-08-09 | 2011-08-09 | Resin packaged SMD type quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120287271U CN202150841U (en) | 2011-08-09 | 2011-08-09 | Resin packaged SMD type quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202150841U true CN202150841U (en) | 2012-02-22 |
Family
ID=45591891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120287271U Expired - Lifetime CN202150841U (en) | 2011-08-09 | 2011-08-09 | Resin packaged SMD type quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202150841U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106788260A (en) * | 2016-12-21 | 2017-05-31 | 广东大普通信技术有限公司 | A kind of surface-mount type crystal oscillator and its manufacture method |
| CN107666296A (en) * | 2017-09-27 | 2018-02-06 | 合肥晶威特电子有限责任公司 | A kind of processing method of quartz-crystal resonator |
| CN113380643A (en) * | 2021-05-31 | 2021-09-10 | 济南市白象科技发展有限公司 | Packaging structure of graphene chip and manufacturing process thereof |
-
2011
- 2011-08-09 CN CN201120287271U patent/CN202150841U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106788260A (en) * | 2016-12-21 | 2017-05-31 | 广东大普通信技术有限公司 | A kind of surface-mount type crystal oscillator and its manufacture method |
| WO2018112915A1 (en) * | 2016-12-21 | 2018-06-28 | 广东大普通信技术有限公司 | Surface-mounted crystal oscillator and manufacturing method therefor |
| CN107666296A (en) * | 2017-09-27 | 2018-02-06 | 合肥晶威特电子有限责任公司 | A kind of processing method of quartz-crystal resonator |
| CN113380643A (en) * | 2021-05-31 | 2021-09-10 | 济南市白象科技发展有限公司 | Packaging structure of graphene chip and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160425 Address after: 230061 Anhui city of Hefei Province Economic and Technological Development Zone Yungu Road No. 2569 Patentee after: HEFEI JINGWEITE ELECTRONICS CO., LTD. Address before: The two economic and Technological Development Zone in Anhui province Tongling City Road 244061 No. 1258 Patentee before: Tongling Jingweite Electronics Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120222 |
|
| CX01 | Expiry of patent term |