CN202059379U - Frequency device - Google Patents
Frequency device Download PDFInfo
- Publication number
- CN202059379U CN202059379U CN201120152437.9U CN201120152437U CN202059379U CN 202059379 U CN202059379 U CN 202059379U CN 201120152437 U CN201120152437 U CN 201120152437U CN 202059379 U CN202059379 U CN 202059379U
- Authority
- CN
- China
- Prior art keywords
- pedestal
- cover plate
- frequency device
- crystal
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000013078 crystal Substances 0.000 claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 39
- 238000005520 cutting process Methods 0.000 claims description 32
- 239000011521 glass Substances 0.000 claims description 3
- 210000001624 hip Anatomy 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 239000000919 ceramic Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 4
- 208000037805 labour Diseases 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000012856 packing Methods 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The present utility model provides a frequency device which comprises a pedestal and a cover plate, silvering electrode crystal chips are arranged on the pedestal, the chips are glued on internal electrodes of the pedestal with conducting resin, and internal electrode lines are connected with external electrodes of the pedestal. The pedestal comprises crystal surfaces and sealing surfaces arranged on the periphery of the crystal surfaces. The cover plate comprises container surfaces and technology surfaces arranged on the periphery of the container surfaces. Each container surface is a box body type, each crystal surface is a flat type, the container surfaces are buckled with the crystal surfaces, glue-conducting surfaces are matched with the sealing surfaces, and the pedestal and the cover plate are sealed through the sealing surfaces and the glue-conducting surfaces. In the device, easily obtained mediums are adopted as materials for making the pedestal and an upper cover, ceramic pedestals or other mediums which can not be cut and have high cost are substituted, and the production cost is saved. The connecting plate way is convenient for automatic production, manual labors are reduced, and the productivity is greatly increased.
Description
Technical field
The utility model relates to communication and electronic technology field, relates in particular to a kind of method for packing of crystal oscillator and the crystal oscillator (being crystal oscillator) that is obtained by this method for packing.
Background technology
Number of patent application is: CN200820059640, CN200820059641.4, CN200820059312.X, CN200820153661.8, CN200920067387.7, CN200920068666.5 etc. introduce a kind of crystal oscillator respectively, its common characteristic is: what the base of crystal oscillator adopted is ceramic material, utilize pottery as submount material, a restriction to the crystal oscillator maximum is inconvenient suitability for industrialized production, because pottery is unfavorable for cutting, so in the process of producing, need single assembling, greatly reduce production efficiency.All the time, all be that as if people have formed a kind of gesture thinking of being used to so with the base of pottery as crystal oscillator, think that the base of crystal oscillator just should be with pottery, just can reach its effect with pottery.
Fig. 1 is a crystal oscillator exploded view in the prior art, and 101 is electrode pin among the figure, and 102 is base, and 103 is crystal cartridge, and 104 is crystal, and 105 is top cover, and the crystal oscillator of Fig. 1 is to adopt the mode of monolithic production to make, and its production process is as follows:
Solid crystalline substance → the bonding wire of a wafer plated electrode → glue → fine setting → cover plate press seal → airtight leak detection → test → packing, above production process is the production process of each Dan Pin, all produce like this for each Dan Pin, its manual composition increases greatly, is unfavorable for the reduction of industrial production cost.
Summary of the invention
In order to solve crystal oscillator manufacture order product operation in the prior art, production cost height, inefficient problem, the utility model provides method for packing and this frequency device of a kind of frequency device (being crystal oscillator).
A kind of frequency device, comprise the base and cover plate, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described cover plate comprises vessel faces and is positioned at the vessel faces glue face of leading all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.
Existing frequency device is to cooperate dull and stereotyped lid in the end of ceramic box body, frequency device of the present utility model is the cover plate that dull and stereotyped pedestal cooperates box body, the base and cover plate of She Zhiing lays the foundation for producing in flakes like this, because dull and stereotyped pedestal in flakes makes the industrialization of whole production technology, brush coating, fixed crystal, involution, test, cutting in flakes, do not need as traditional monolithic production, to carry out the manual operation in each step, saved time and manpower greatly.In addition, pedestal is flat structure, reduce greatly for the requirement of production environment because flat structure, can adopt wind or similarly mode remove dust on the pedestal, and the pedestal of box body formula can not be done like this.
As further improvement of the utility model, the described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads the glue hole.
Lead being provided with of glue hole and can make the saturated gluing of sealing surface, i.e. abundant gluing, unnecessary glue overflows by leading the glue hole, so not only abundant involution but also can not pollute frequency device inside.
As further improvement of the utility model, the material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
Than the base of ceramic of prior art, the material of base and cover plate of the present utility model has been saved production cost greatly.Because all be to use base of ceramic all the time, so those skilled in the art has just produced mindset, thinking just should be with pottery as pedestal.
The utility model has brought by single product and has produced the leap (because base of ceramic is not easy to cutting) of producing in batches owing to the variation of base material, this batch process, and promptly the connecting plate mode is convenient to automated production, and the minimizing hand labour greatly increases productivity.The miniaturization of ceramic base is what be difficult to realize, and the variation of the utility model material also is the miniaturization of the product condition of providing convenience.
As further improvement of the utility model, described pedestal is pedestal in flakes.Described pedestal can be arranged, is convenient to cutting like this, but is not limited to arranged.
As further improvement of the utility model, described cover plate is cover plate in flakes.
As further improvement of the utility model, on the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.
As further improvement of the utility model, described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
Leg-of-mutton projection is set, like this, in cutting, can cut along vertex of a triangle, leg-of-mutton inside generally is provided with glue or colloid, like this, after the cutting, prevent that glue or colloid are penetrated into protruding enclosure interior, influence the quality of finished product.
Above-mentioned triangular hill is preferred a kind of execution mode, but is not restricted to this, after the cutting, prevents that glue or colloid are penetrated into protruding enclosure interior, and the similar setting that influences the quality of finished product can.Overall design philosophy be exactly between protruding housing and pedestal, form airtight in, make glue or analog can not infiltrate the confined space that protruding housing and pedestal form, assurance product quality.
The place, summit of the triangular hill that further is provided with on the leg-of-mutton in the above basis is provided with depressed part, when cutting, cut along depressed part, so not only reached and prevented that glue or colloid are penetrated into protruding enclosure interior, influence the effect of the quality of finished product, and be more conducive to cutting.
As further improvement of the utility model, described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
Be selectable shape above, but be not to be confined to this several shapes, even can be irregular shape, so long as it is just passable to reach the purpose that is beneficial to cutting.
A kind of method for packing of frequency device may further comprise the steps:
The pedestal assembling procedure, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connected the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described crystal face is flat, and described pedestal is formula pedestal in flakes;
Cover plate press seal operation, described cover plate comprise vessel faces and are positioned at the vessel faces glue face of leading all around that described vessel faces is the box body formula, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface and lead the glue face with base and cover plate involution, described cover plate is formula cover plate in flakes;
Airtight leak detection operation;
Test step;
Cutting action cuts down each frequency device monomer.
As further improvement of the utility model, brush coating seals between described pedestal and the cover plate.
The beneficial effects of the utility model are: the utility model adopts the circuit board obtain easily as submount material, has replaced cutting and ceramic base that cost is higher, has saved production cost.Use the connecting plate mode; The connecting plate mode is convenient to automated production, reduces hand labour, greatly increases productivity.
[description of drawings]
Fig. 1 is crystal oscillator STRUCTURE DECOMPOSITION figure in the prior art;
Fig. 2 is the assembly drawing of Fig. 1;
Fig. 3 is pedestal in the method for packing of a kind of frequency device of the utility model, structure of cover plate schematic diagram;
Fig. 4 is the assembly drawing of Fig. 3;
Fig. 5 is the pedestal, cover plate press seal among Fig. 3, the structural representation of the Dan Pin after the cutting;
Fig. 6 is the structural representation of another angle of Fig. 5;
Fig. 7 is the STRUCTURE DECOMPOSITION figure of the utility model plug-in unit crystal oscillator (one type);
Fig. 8 is a kind of cutting groove structural representation of the present utility model;
Fig. 9 is an another kind of cutting groove structural representation of the present utility model;
Figure 10 is the schematic diagram of the another kind of structure of the utility model cover plate;
Figure 11 is the structural representation of the base and cover plate of Dan Pin.
[embodiment]
Below in conjunction with description of drawings and embodiment the utility model is further specified.
Embodiment 1:
A kind of frequency device, comprise pedestal 202 and cover plate 205, pedestal is provided with silver-plated electrode crystal chip 204, with conducting resinl chip is sticked together on base interior electrode 201, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face 302 and is positioned at crystal face sealing surface 305 all around, described cover plate comprises vessel faces 301 and is positioned at the vessel faces glue face 303 of leading all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.The described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads glue hole 304.The material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
Embodiment 2:
On the basis of embodiment 1, described pedestal is pedestal in flakes.
Embodiment 3:
As shown in Figure 8, on the basis of embodiment 1 or 2, described cover plate is cover plate in flakes.On the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.Described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
Embodiment 4: as shown in Figure 9, on the basis of embodiment 1 or 2, described cover plate is cover plate in flakes.On the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.Described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
A kind of method for packing of frequency device may further comprise the steps:
The pedestal assembling procedure, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connected the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described crystal face is flat, and described pedestal is formula pedestal in flakes;
Cover plate press seal operation, described cover plate comprise vessel faces and are positioned at the vessel faces glue face of leading all around that described vessel faces is the box body formula, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface and lead the glue face with base and cover plate involution, described cover plate is formula cover plate in flakes;
Airtight leak detection operation;
Test step;
Cutting action cuts down each frequency device monomer.
Brush coating seals between described pedestal and the cover plate.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (8)
1. frequency device, comprise the base and cover plate, it is characterized in that: pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face (302) and is positioned at crystal face sealing surface (305) all around, described cover plate comprises vessel faces (301) and is positioned at the vessel faces glue face of leading (303) all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.
2. a kind of frequency device according to claim 1 is characterized in that: the described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads glue hole (304).
3. a kind of frequency device according to claim 1 is characterized in that: the material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
4. according to any described a kind of frequency device of claim 1 to 3, it is characterized in that: described pedestal is pedestal in flakes.
5. according to any described a kind of frequency device of claim 1 to 3, it is characterized in that: described cover plate is cover plate in flakes.
6. a kind of frequency device according to claim 5 is characterized in that: on the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.
7. a kind of frequency device according to claim 6 is characterized in that: described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
8. a kind of frequency device according to claim 6 is characterized in that: described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120152437.9U CN202059379U (en) | 2011-05-13 | 2011-05-13 | Frequency device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120152437.9U CN202059379U (en) | 2011-05-13 | 2011-05-13 | Frequency device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202059379U true CN202059379U (en) | 2011-11-30 |
Family
ID=45019341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120152437.9U Expired - Lifetime CN202059379U (en) | 2011-05-13 | 2011-05-13 | Frequency device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202059379U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281042A (en) * | 2011-05-13 | 2011-12-14 | 李东 | Frequency device and packaging method thereof |
| CN102497171A (en) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技（无锡）有限公司 | Clamp in filling procedure |
-
2011
- 2011-05-13 CN CN201120152437.9U patent/CN202059379U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281042A (en) * | 2011-05-13 | 2011-12-14 | 李东 | Frequency device and packaging method thereof |
| CN102497171A (en) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技（无锡）有限公司 | Clamp in filling procedure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN E-WELLY ELECTRONICS Co.,Ltd. Assignor: Li Dong Contract record no.: 2014440020230 Denomination of utility model: Testing device and testing method of aging rate of frequency devices Granted publication date: 20111130 License type: Exclusive License Record date: 20140620 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN YIWEILI ELECTRONICS CO., LTD. Free format text: FORMER OWNER: LI DONG Effective date: 20150605 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 518103 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150605 Address after: Baoan District Fuyong Street Huaide road Shenzhen city Guangdong province 518103 Hing Wai Industrial Zone second the first floor of building two Patentee after: SHENZHEN E-WELLY ELECTRONICS Co.,Ltd. Address before: No. 2 Jinlange A-201 layered yuan Luohu District Yinhu 518000 Shenzhen Road, Guangdong Province Patentee before: Li Dong |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Baoan District Fuyong Street Huaide road Shenzhen city Guangdong province 518000 Hing Wai Industrial Zone second the first floor of building two Patentee after: Shenzhen jointsound intelligent Polytron Technologies Inc Address before: Baoan District Fuyong Street Huaide road Shenzhen city Guangdong province 518103 Hing Wai Industrial Zone second the first floor of building two Patentee before: SHENZHEN E-WELLY ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |
|
| CX01 | Expiry of patent term |