CN202160149U - Glass sealing surface mount type quartz resonator - Google Patents
Glass sealing surface mount type quartz resonator Download PDFInfo
- Publication number
- CN202160149U CN202160149U CN2011202348656U CN201120234865U CN202160149U CN 202160149 U CN202160149 U CN 202160149U CN 2011202348656 U CN2011202348656 U CN 2011202348656U CN 201120234865 U CN201120234865 U CN 201120234865U CN 202160149 U CN202160149 U CN 202160149U
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- ceramic
- glass
- quartz
- described base
- base
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Abstract
The utility model relates to a glass sealing surface mount type quartz resonator, which comprises a ceramic base and a ceramic upper cover, and a groove is arranged inside the ceramic base. A quartz chip is arranged in the groove of the ceramic base and adhered to an inner electrode of the ceramic base through conducting resin. Silver is plated on the electrode of the quartz chip. An inner electrode circuit of the ceramic base is connected with an outer electrode of the ceramic base. Glass for sealing is coated on the outer edge of the ceramic upper cover. The ceramic base and the ceramic upper cover are sealed together through the glass for sealing. The glass sealing surface mount type quartz resonator is downsized based on a traditional crystal base, and is low in cost, small in volume, high in frequency and miniaturized.
Description
Technical field
The utility model relates to microminiaturized quartz-crystal resonator, particularly relates to a kind of glass packaging surface-adhered type quartz-crystal resonator.
Background technology
Quick growth along with consumption electronic products (like mobile phone, digital camera etc.); Gently, thin, short, little demand becomes the market mainstream; In order to cater to the market demand, thereby microminiaturized quartz-crystal resonator demand increases rapidly, but in the microminiaturized process; Encapsulation technology is the difficult problem on it is produced, and therefore microminiaturized quartz-crystal resonator also is a big key element that in design, need overcome.
Summary of the invention
The utility model technical problem to be solved provides a kind of glass packaging surface-adhered type quartz-crystal resonator, realizes low cost, small size, high-frequency microminiaturized quartz-crystal resonator.
The utility model solves the technical scheme that its technical problem adopted: a kind of glass packaging surface-adhered type quartz-crystal resonator is provided, comprises base of ceramic and ceramic loam cake, have groove in the described base of ceramic; Insert a quartz chip in the groove of described base of ceramic, the electrode of described quartz chip adheres on the described base of ceramic internal electrode through conducting resinl; Described base of ceramic internal electrode circuit is connecting described base of ceramic outer electrode; Glass is used in the coating encapsulation on the described ceramic loam cake outer rim; Described encapsulation with glass with described ceramic loam cake and described base of ceramic involution.
The size at described base of ceramic involution place is wider than in described encapsulation with glass size.
Be coated with silver on the electrode of described quartz chip.
The volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.55mm.
Beneficial effect
Owing to adopted above-mentioned technical scheme; The utility model compared with prior art; Have following advantage and good effect: the utility model dwindles base of ceramic, capping and quartz chip size, significantly reduces material cost, realizes this microminiaturized quartz-crystal resonator after the improvement packaging technology.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only to be used to the utility model is described and be not used in the restriction the utility model scope.Should be understood that in addition those skilled in the art can do various changes or modification to the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
The execution mode of the utility model relates to a kind of glass packaging surface-adhered type quartz-crystal resonator, and is as shown in Figure 1, comprises base of ceramic 2 and ceramic loam cake 1, has groove in the described base of ceramic 2; Insert a quartz chip 3 in the groove of described base of ceramic 2, the electrode of described quartz chip 3 adheres on described base of ceramic 2 internal electrodes through conducting resinl 4; Be coated with silver on the electrode of described quartz chip 3; Described base of ceramic 2 internal electrode circuits are connecting described base of ceramic 2 outer electrodes; The coating encapsulation is with glass 5 on described ceramic loam cake 1 outer rim; Described encapsulation with glass 5 with described ceramic loam cake 1 and described base of ceramic 2 involutions.The size at described base of ceramic 2 involution places is wider than in encapsulation with glass 5 sizes.The volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.55mm.
Can not find; The utility model dwindles it on the conventional crystal pedestal; Make volume narrow down to 2.0 * 1.6 * 0.55mm by market mainstream specification 3.2 * 2.5 * 0.8mm and 2.5 * 2.0 * 0.75mm; Can be applied on the electronic product of present more and more miniaturization, and material cost is lower than metallic packaging mode, can realize cheap production cost.
Claims (4)
1. a glass packaging surface-adhered type quartz-crystal resonator comprises base of ceramic (2) and ceramic loam cake (1), it is characterized in that described base of ceramic has groove in (2); Insert a quartz chip (3) in the groove of described base of ceramic (2); The electrode of described quartz chip (3) adheres on described base of ceramic (2) internal electrode through conducting resinl; Described base of ceramic (2) internal electrode circuit is connecting described base of ceramic (2) outer electrode; The coating encapsulation is with glass (5) on described ceramic loam cake (1) outer rim; Described encapsulation with glass (5) with described ceramic loam cake (1) and described base of ceramic (2) involution.
2. glass packaging surface-adhered type quartz-crystal resonator according to claim 1 is characterized in that, the size at described base of ceramic (2) involution place is wider than in described encapsulation with glass (5) size.
3. glass packaging surface-adhered type quartz-crystal resonator according to claim 1 is characterized in that, is coated with silver on the electrode of described quartz chip (3).
4. glass packaging surface-adhered type quartz-crystal resonator according to claim 1 is characterized in that the volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.55mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202348656U CN202160149U (en) | 2011-07-05 | 2011-07-05 | Glass sealing surface mount type quartz resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202348656U CN202160149U (en) | 2011-07-05 | 2011-07-05 | Glass sealing surface mount type quartz resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202160149U true CN202160149U (en) | 2012-03-07 |
Family
ID=45767771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202348656U Expired - Lifetime CN202160149U (en) | 2011-07-05 | 2011-07-05 | Glass sealing surface mount type quartz resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202160149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104682909A (en) * | 2015-02-11 | 2015-06-03 | 福建省南平市三金电子有限公司 | Novel crystal oscillator low-temperature glass packaging structure and packaging technology thereof |
| CN114039574A (en) * | 2021-11-09 | 2022-02-11 | 台晶(重庆)电子有限公司 | Ceramic temperature sensing type resonator |
-
2011
- 2011-07-05 CN CN2011202348656U patent/CN202160149U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104682909A (en) * | 2015-02-11 | 2015-06-03 | 福建省南平市三金电子有限公司 | Novel crystal oscillator low-temperature glass packaging structure and packaging technology thereof |
| CN114039574A (en) * | 2021-11-09 | 2022-02-11 | 台晶(重庆)电子有限公司 | Ceramic temperature sensing type resonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120307 |
|
| CX01 | Expiry of patent term |