CN202153725U - Glass packaged quartz crystal resonator - Google Patents
Glass packaged quartz crystal resonator Download PDFInfo
- Publication number
- CN202153725U CN202153725U CN2011202348726U CN201120234872U CN202153725U CN 202153725 U CN202153725 U CN 202153725U CN 2011202348726 U CN2011202348726 U CN 2011202348726U CN 201120234872 U CN201120234872 U CN 201120234872U CN 202153725 U CN202153725 U CN 202153725U
- Authority
- CN
- China
- Prior art keywords
- quartz
- crystal resonator
- ceramic
- glass
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model relates to a glass packaged quartz crystal resonator, which comprises a ceramic pedestal and a metal upper cover, wherein the metal upper cover is provided with a hole, the ceramic pedestal is provided with a groove, a quartz chip is arranged in the groove of the ceramic pedestal, the electrode of the quartz chip is adhered to the internal electrode of the ceramic pedestal via conductive glue, the electrode of the quartz chip is plated with silver, the internal electrode of the ceramic pedestal is in circuit connection with the external electrode of the ceramic pedestal, glass used for packaging is coated on the outer rim of the ceramic pedestal, the ceramic pedestal and the metal upper cover are sealed via the glass used for packaging, and the quartz crystal resonator fills the hole in the metal upper cover with solder at a vacuum state. The utility model enables the glass packaged quartz crystal resonator incapable of high vacuum solder sealing to realize vacuum packaging.
Description
Technical field
The utility model relates to microminiaturized quartz-crystal resonator, particularly relates to a kind of microminiaturized glass packaging pottery quartz-crystal resonator that carries out the high vacuum encapsulation.
Background technology
Quick growth along with consumption electronic products (like digital camera, mobile phone, IC smart card etc.); In order to cater to the market demand; Microminiaturized, low-cost product is the very important ring that dominates the market; But lower-cost glass packaging quartz-crystal resonator is difficult to overcome the technology (be glass under molten condition involution) in a vacuum of involution under the vacuum, and encapsulation technology is the difficult problem on it is produced, so encapsulation technology is a big key element that on manufacturing technology, need overcome.
Summary of the invention
The utility model technical problem to be solved provides a kind of glass packaging quartz-crystal resonator, and realization can be carried out the microminiaturized glass packaging pottery quartz-crystal resonator of high vacuum encapsulation.
The utility model solves the technical scheme that its technical problem adopted: a kind of glass packaging quartz-crystal resonator is provided, comprises base of ceramic and metal top cover, described metal top cover is provided with hole; Have groove in the described base of ceramic; Insert a quartz chip in the groove of described base of ceramic, the electrode of described quartz chip adheres on the described base of ceramic internal electrode through conducting resinl; Be coated with silver on the electrode of described quartz chip; Described base of ceramic internal electrode circuit is connecting described base of ceramic outer electrode; Glass is used in the coating encapsulation on the described base of ceramic outer rim; Described base of ceramic and described metal top cover are used the glass involution through described encapsulation; Described quartz-crystal resonator fills up the hole on the described metal top cover through scolder under vacuum state.
Described scolder carries out welding through the mode and the described metal top cover of laser.
Be coated with silver on the electrode of described quartz chip.
The volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.45mm.
Beneficial effect
Owing to adopted above-mentioned technical scheme; The utility model compared with prior art has following advantage and good effect: the utility model uses the metal top cover that has hole under nitrogen environment, to carry out involution, puts into the equipment of vacuum-pumping behind the involution again; Utilize this hole that quartz-crystal resonator inside is vacuumized; And under vacuum environment, the hole packing is accomplished sealing with scolder, and realize the vacuum involution technology of glass packaging quartz-crystal resonator, make the glass packaging quartz-crystal resonator that can't use the high vacuum sealing originally; Can realize Vacuum Package, thereby but reach the ability of volume production cheaply.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only to be used to the utility model is described and be not used in the restriction the utility model scope.Should be understood that in addition those skilled in the art can do various changes or modification to the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
The execution mode of the utility model relates to a kind of glass packaging quartz-crystal resonator, and is as shown in Figure 1, comprises base of ceramic 2 and metal top cover 1, and described metal top cover 1 is provided with hole; Have groove in the described base of ceramic 2; Insert a quartz chip 3 in the groove of described base of ceramic 2, described quartz chip 3 adheres on described base of ceramic 2 internal electrodes through conducting resinl 4; Be coated with silver on the electrode of described quartz chip 3; Described base of ceramic 2 internal electrode circuits are connecting described base of ceramic 2 outer electrodes; The coating encapsulation is with glass 5 on described base of ceramic 2 outer rims; Described encapsulation with glass 5 with described base of ceramic 2 and described metal top cover 1 involution; Described quartz-crystal resonator fills up the hole on the described metal top cover 1 through scolder 6 under vacuum state.Wherein, scolder 6 carries out welding through the mode and the described metal top cover 1 of laser.The volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.45mm.
Can not find; The utility model uses the metal top cover that has hole under nitrogen environment, to carry out involution, puts into the equipment of vacuum-pumping behind the involution again, utilizes this hole that quartz-crystal resonator inside is vacuumized; And under vacuum environment, the hole packing is accomplished sealing with scolder; Realize the vacuum involution technology of glass packaging quartz-crystal resonator, make the glass packaging quartz-crystal resonator that can't use the high vacuum sealing originally, can realize Vacuum Package.
Claims (4)
1. a glass packaging quartz-crystal resonator comprises base of ceramic (2) and metal top cover (1), it is characterized in that described metal top cover (1) is provided with hole; Described base of ceramic has groove in (2); Insert a quartz chip (3) in the groove of described base of ceramic (2); The electrode of described quartz chip (3) adheres on described base of ceramic (2) internal electrode through conducting resinl (4); Described base of ceramic (2) internal electrode circuit is connecting described base of ceramic (2) outer electrode; The coating encapsulation is with glass (5) on described base of ceramic (2) outer rim; Described base of ceramic (2) and described metal top cover (1) through described encapsulation with glass (5) involution; Described quartz-crystal resonator fills up the hole on the described metal top cover (1) through scolder (6) under vacuum state.
2. glass packaging quartz-crystal resonator according to claim 1 is characterized in that, described scolder (6) carries out welding through the mode and the described metal top cover (1) of laser.
3. glass packaging quartz-crystal resonator according to claim 1 is characterized in that, is coated with silver on the electrode of described quartz chip (3).
4. glass packaging quartz-crystal resonator according to claim 1 is characterized in that, the volume of described quartz-crystal resonator is 2.0 * 1.6 * 0.45mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202348726U CN202153725U (en) | 2011-07-05 | 2011-07-05 | Glass packaged quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202348726U CN202153725U (en) | 2011-07-05 | 2011-07-05 | Glass packaged quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202153725U true CN202153725U (en) | 2012-02-29 |
Family
ID=45694218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202348726U Expired - Lifetime CN202153725U (en) | 2011-07-05 | 2011-07-05 | Glass packaged quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202153725U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970002A (en) * | 2012-11-06 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Small paster type quartz crystal resonator and processing method thereof |
| CN106405446A (en) * | 2016-11-28 | 2017-02-15 | 中国船舶重工集团公司第七〇九研究所 | Magnetic sensor array integrated structure and making method thereof |
-
2011
- 2011-07-05 CN CN2011202348726U patent/CN202153725U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970002A (en) * | 2012-11-06 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Small paster type quartz crystal resonator and processing method thereof |
| CN106405446A (en) * | 2016-11-28 | 2017-02-15 | 中国船舶重工集团公司第七〇九研究所 | Magnetic sensor array integrated structure and making method thereof |
| CN106405446B (en) * | 2016-11-28 | 2023-08-18 | 中国船舶重工集团公司第七一九研究所 | Magnetic sensor array integrated structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202153725U (en) | Glass packaged quartz crystal resonator | |
| CN101820264B (en) | Through-hole type wafer-level package structure for vibrator device | |
| CN102324909A (en) | Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof | |
| TW201210098A (en) | Resonating device wafer level package structure with enhanced air-tightness | |
| CN201639552U (en) | Resin package quartz-crystal resonator | |
| CN202395731U (en) | Thin metal package ceramic quartz-crystal resonator | |
| CN204408288U (en) | A kind of novel crystal oscillator low temperature glass encapsulating structure | |
| CN201365231Y (en) | Metallic packaging crystal oscillator | |
| CN202153726U (en) | Glass packaged tuning-fork quartz crystal resonator | |
| CN202160149U (en) | Glass sealing surface mount type quartz resonator | |
| CN201878102U (en) | Glass-sealed surface-mounted crystal oscillator | |
| CN201699669U (en) | Quartz crystal resonator packaged by resin | |
| CN201298830Y (en) | A novel chipped quartz-crystal resonator | |
| CN201846318U (en) | Surface mount type quartz crystal resonator | |
| CN201298832Y (en) | A small surface mount quartz crystal resonator | |
| CN204518073U (en) | Stereo array micro-electro-mechanical microphone packaging structure | |
| CN202488409U (en) | Subminiature surface mounted device (SMD) quartz-crystal resonator | |
| CN102006030B (en) | Reinforced-airtightness oscillator device wafer-grade packaging structure | |
| CN201639549U (en) | Novel ceramic resin encapsulation quartz crystal resonator | |
| CN201294497Y (en) | Miniature glass encapsulation crystal vibration | |
| CN203014756U (en) | Percussion welding ceramic sealed housing and crystal oscillator employing same | |
| CN201639551U (en) | Glass seal type ceramic quartz crystal resonator | |
| CN204906331U (en) | Formula metallic packaging surface mounting formula quartz crystal syntonizer is welded to miniature resistance | |
| CN207200675U (en) | Quartz crystal oscillator pasted on surface matrix is large stretch of | |
| CN201774504U (en) | Through-hole type wafer-level encapsulating structure of vibrator device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120229 |
|
| CX01 | Expiry of patent term |