CN102324909A - Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof - Google Patents
Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof Download PDFInfo
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- CN102324909A CN102324909A CN201110187593A CN201110187593A CN102324909A CN 102324909 A CN102324909 A CN 102324909A CN 201110187593 A CN201110187593 A CN 201110187593A CN 201110187593 A CN201110187593 A CN 201110187593A CN 102324909 A CN102324909 A CN 102324909A
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Abstract
The invention relates to a glass packaging tuning fork type quartz crystal resonator and a manufacturing method thereof. The quartz crystal resonator comprises a ceramic base and a metal upper cover, wherein the metal upper cover is provided with a hole; a quartz chip is built in the ceramic base; an electrode of the quartz chip is adhered to an internal electrode of the ceramic base through a conductive adhesive; packaging glass is coated on the outer edge of the ceramic base; the ceramic base is sealed with the metal upper cover through the packaging glass; and the hole on the metal upper cover of the quartz crystal resonator is filled through a solder in a vacuum state. The manufacturing method comprises the following steps of: sealing the metal upper cover with the hole with the ceramic base by using the packaging glass under a nitrogen environment; vacuuming a sealed product by using vacuum equipment; and finally, filling the hole on the metal upper cover by using the solder under the vacuum environment. In the invention, vacuum packaging is realized, so that low-cost commercial-scale capacity is achieved.
Description
Technical field
The present invention relates to microminiaturized quartz-crystal resonator, particularly relate to a kind of glass packaging tuning-fork type quartz-crystal resonator and preparation method thereof.
Background technology
Quick growth along with consumption electronic products (like digital camera, mobile phone, e-book etc.); In order to cater to the market demand; Microminiaturized, low-cost product is the very important ring that dominates the market; But lower-cost glass packaging is difficult to overcome the technology of involution under the vacuum, how to be applied to tuning-fork type quartz-crystal resonator (be glass under molten condition involution) in a vacuum, is a big key element that on manufacturing technology, need overcome.
Summary of the invention
Technical problem to be solved by this invention provides a kind of glass packaging tuning-fork type quartz-crystal resonator and preparation method thereof, and realization can be carried out the microminiaturized glass packaging tuning-fork type quartz-crystal resonator of high vacuum encapsulation.
The technical solution adopted for the present invention to solve the technical problems is: a kind of glass packaging tuning-fork type quartz-crystal resonator is provided, comprises base of ceramic and metal top cover, described metal top cover is provided with hole; Insert a quartz chip in the described base of ceramic; The electrode of described quartz chip adheres on the described base of ceramic internal electrode through conducting resinl; Described base of ceramic internal electrode circuit is connecting described base of ceramic outer electrode; Glass is used in the coating encapsulation on the described base of ceramic outer rim; Described base of ceramic and described metal top cover are used the glass involution through described encapsulation; Described quartz-crystal resonator fills up the hole on the described metal top cover through scolder under vacuum state.
Described scolder carries out welding through the mode and the described metal top cover of laser.
Be coated with gold on the electrode of described quartz chip.
The volume of described quartz-crystal resonator is 3.2 * 1.5 * 0.75mm.
The technical solution adopted for the present invention to solve the technical problems is: a kind of manufacture method of glass packaging tuning-fork type quartz-crystal resonator also is provided, may further comprise the steps:
(1) quartz chip is inserted base of ceramic;
(2) through conducting resinl the electrode on the quartz chip is sticked together the base of ceramic internal electrode;
(3) under nitrogen environment, utilize encapsulation to carry out involution with metal top cover and the base of ceramic that glass will have hole;
(4) product that involution is good vacuumizes to utilize vacuum equipment;
(5) in vacuum environment, utilize scolder that the hole on the metal top cover is filled up.
Scolder described in the described step (5) carries out welding through the mode and the described metal top cover of laser, thereby makes scolder fill up the hole on the metal top cover.
Beneficial effect
Owing to adopted above-mentioned technical scheme; The present invention compared with prior art has following advantage and good effect: the present invention uses the metal top cover that has hole under nitrogen environment, to carry out involution, puts into the equipment of vacuum-pumping behind the involution again; Utilize this hole that quartz-crystal resonator inside is vacuumized; And under vacuum environment, the hole packing is accomplished sealing with scolder, and realize the vacuum involution technology of glass packaging quartz-crystal resonator, make the glass packaging quartz-crystal resonator that can't use the high vacuum sealing originally; Can realize Vacuum Package, thereby but reach the ability of volume production cheaply.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in the restriction scope of the present invention.Should be understood that in addition those skilled in the art can do various changes or modification to the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Execution mode of the present invention relates to a kind of glass packaging tuning-fork type quartz-crystal resonator, and is as shown in Figure 1, comprises base of ceramic 2 and metal top cover 1, and described metal top cover 1 is provided with hole; Insert a quartz chip 3 in the described base of ceramic 2; The electrode of described quartz chip 3 adheres on described base of ceramic 2 internal electrodes through conducting resinl 4, is coated with gold on the electrode of described quartz chip 3; Described base of ceramic 2 internal electrode circuits are connecting described base of ceramic 2 outer electrodes; The coating encapsulation is with glass 5 on described base of ceramic 2 outer rims; Described base of ceramic 2 with described metal top cover 1 through described encapsulation with glass 5 involutions; Described quartz-crystal resonator fills up the hole on the described metal top cover 1 through scolder 6 under vacuum state.Wherein, described scolder 6 carries out welding through the mode and the described metal top cover 1 of laser.The volume of described quartz-crystal resonator is 3.2 * 1.5 * 0.75mm.
Execution mode of the present invention also relates to a kind of manufacture method of glass packaging tuning-fork type quartz-crystal resonator, may further comprise the steps:
(1) quartz chip is inserted base of ceramic;
(2) through conducting resinl the electrode on the quartz chip is sticked together the base of ceramic internal electrode;
(3) under nitrogen environment, utilize encapsulation to carry out involution with metal top cover and the base of ceramic that glass will have hole;
(4) product that involution is good vacuumizes to utilize vacuum equipment;
(5) in vacuum environment, utilize scolder that the hole on the metal top cover is filled up, wherein, scolder can carry out welding through the mode and the described metal top cover of laser, thereby makes scolder fill up the hole on the metal top cover.
Be not difficult to find; The present invention uses the metal top cover that has hole under nitrogen environment, to carry out involution, puts into the equipment of vacuum-pumping behind the involution again, utilizes this hole that quartz-crystal resonator inside is vacuumized; And under vacuum environment, the hole packing is accomplished sealing with scolder; Realize the vacuum involution technology of glass packaging quartz-crystal resonator, make the glass packaging quartz-crystal resonator that can't use the high vacuum sealing originally, can realize Vacuum Package.
Claims (6)
1. a glass packaging tuning-fork type quartz-crystal resonator comprises base of ceramic (2) and metal top cover (1), it is characterized in that described metal top cover (1) is provided with hole; Insert a quartz chip (3) in the described base of ceramic (2); The electrode of described quartz chip (3) adheres on described base of ceramic (2) internal electrode through conducting resinl (4); Described base of ceramic (2) internal electrode circuit is connecting described base of ceramic (2) outer electrode; The coating encapsulation is with glass (5) on described base of ceramic (2) outer rim; Described base of ceramic (2) and described metal top cover (1) through described encapsulation with glass (5) involution; Described quartz-crystal resonator fills up the hole on the described metal top cover (1) through scolder (6) under vacuum state.
2. glass packaging tuning-fork type quartz-crystal resonator according to claim 1 is characterized in that, described scolder (6) carries out welding through the mode and the described metal top cover (1) of laser.
3. glass packaging tuning-fork type quartz-crystal resonator according to claim 1 is characterized in that, is coated with gold on the electrode of described quartz chip (3).
4. glass packaging tuning-fork type quartz-crystal resonator according to claim 1 is characterized in that the volume of described quartz-crystal resonator is 3.2 * 1.5 * 0.75mm.
5. the manufacture method of a glass packaging tuning-fork type quartz-crystal resonator is characterized in that, may further comprise the steps:
(1) quartz chip is inserted base of ceramic;
(2) through conducting resinl the electrode on the quartz chip is sticked together the base of ceramic internal electrode;
(3) under nitrogen environment, utilize encapsulation to carry out involution with metal top cover and the base of ceramic that glass will have hole;
(4) product that involution is good vacuumizes to utilize vacuum equipment;
(5) in vacuum environment, utilize scolder that the hole on the metal top cover is filled up.
6. the manufacture method of glass packaging tuning-fork type quartz-crystal resonator according to claim 1; It is characterized in that; Scolder described in the described step (5) carries out welding through the mode and the described metal top cover of laser, thereby makes scolder fill up the hole on the metal top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110187593A CN102324909A (en) | 2011-07-05 | 2011-07-05 | Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110187593A CN102324909A (en) | 2011-07-05 | 2011-07-05 | Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102324909A true CN102324909A (en) | 2012-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201110187593A Pending CN102324909A (en) | 2011-07-05 | 2011-07-05 | Glass packaging tuning fork type quartz crystal resonator and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106064280A (en) * | 2016-06-30 | 2016-11-02 | 随州泰华电子科技有限公司 | A kind of tuning fork crystal sealing welding technique for extra |
| CN111917395A (en) * | 2020-08-02 | 2020-11-10 | 泰晶科技股份有限公司 | High-vacuum surface-mounted micro tuning fork quartz crystal resonator and manufacturing method thereof |
| CN114171479A (en) * | 2022-02-14 | 2022-03-11 | 潮州三环（集团）股份有限公司 | Ceramic packaging base and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6541897B2 (en) * | 2001-02-19 | 2003-04-01 | Seiko Epson Corporation | Piezoelectric device and package thereof |
| CN1965405A (en) * | 2004-03-31 | 2007-05-16 | 西铁城时计株式会社 | Manufacturing method of electronic component seal and electronic component seal |
| CN201639551U (en) * | 2010-02-03 | 2010-11-17 | 台晶(宁波)电子有限公司 | Glass seal type ceramic quartz crystal resonator |
| CN201878102U (en) * | 2010-12-07 | 2011-06-22 | 台晶(宁波)电子有限公司 | Glass-sealed surface-mounted crystal oscillator |
-
2011
- 2011-07-05 CN CN201110187593A patent/CN102324909A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6541897B2 (en) * | 2001-02-19 | 2003-04-01 | Seiko Epson Corporation | Piezoelectric device and package thereof |
| CN1965405A (en) * | 2004-03-31 | 2007-05-16 | 西铁城时计株式会社 | Manufacturing method of electronic component seal and electronic component seal |
| CN201639551U (en) * | 2010-02-03 | 2010-11-17 | 台晶(宁波)电子有限公司 | Glass seal type ceramic quartz crystal resonator |
| CN201878102U (en) * | 2010-12-07 | 2011-06-22 | 台晶(宁波)电子有限公司 | Glass-sealed surface-mounted crystal oscillator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106064280A (en) * | 2016-06-30 | 2016-11-02 | 随州泰华电子科技有限公司 | A kind of tuning fork crystal sealing welding technique for extra |
| CN111917395A (en) * | 2020-08-02 | 2020-11-10 | 泰晶科技股份有限公司 | High-vacuum surface-mounted micro tuning fork quartz crystal resonator and manufacturing method thereof |
| CN114171479A (en) * | 2022-02-14 | 2022-03-11 | 潮州三环（集团）股份有限公司 | Ceramic packaging base and preparation method and application thereof |
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Application publication date: 20120118 |