CN213152020U - PCB filter packaging structure - Google Patents
PCB filter packaging structure Download PDFInfo
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- CN213152020U CN213152020U CN202022523954.4U CN202022523954U CN213152020U CN 213152020 U CN213152020 U CN 213152020U CN 202022523954 U CN202022523954 U CN 202022523954U CN 213152020 U CN213152020 U CN 213152020U
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- cover plate
- opening
- shell
- annular
- epoxy resin
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Abstract
The utility model provides a PCB wave filter packaging structure, include: the shell is provided with an accommodating cavity suitable for accommodating an electronic element and a plurality of pins and an opening arranged at the top of the accommodating cavity, and epoxy resin is filled in the accommodating cavity; the cover plate is arranged at the opening and is suitable for shielding epoxy resin, and through holes for the pins to extend out are formed in the cover plate. The cover plate is arranged at the opening of the cover plate, and the cover plate can shield epoxy resin in the accommodating cavity, so that the surface quality of the epoxy resin is not required to be considered, the appearance consistency is good, the epoxy resin filling requirement is greatly reduced, and the production efficiency is improved.
Description
Technical Field
The utility model relates to a wave filter technical field, concretely relates to PCB wave filter packaging structure.
Background
The filter is a filter circuit consisting of a capacitor, an inductor and a resistor, and can effectively filter the frequency point of specific frequency in the power line or frequencies except the frequency point.
The existing PCB filter comprises a shell, an electronic element arranged in a containing cavity of the shell, and a plurality of pins extending out of an opening at the top of the shell, wherein in order to fix the positions of the electronic element and the pins, after the electronic element and the pins are assembled, epoxy resin needs to be filled in the containing cavity. Since the epoxy resin on the side of the opening is liable to have surface quality deviation such as bubbles or surface irregularities, the uniformity of appearance is poor.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming the PCB wave filter among the prior art and having the relatively poor defect of outward appearance uniformity to a PCB wave filter packaging structure that outward appearance uniformity is good is provided.
Therefore, the utility model provides a PCB filter packaging structure, including casing and apron, the casing has the holding chamber that is suitable for placing electronic component and a plurality of pins to and locate the opening at the holding chamber top, the filling has epoxy in the holding chamber; the cover plate is arranged at the opening and is suitable for shielding the epoxy resin, and a through hole for the pin to extend out is formed in the cover plate.
The cover plate is connected with the inner wall of the opening of the shell in an interference fit mode.
The opening of the shell is provided with an annular groove which is connected with the cover plate in an adaptive manner.
The cover plate is connected with the housing through a sealing structure, the sealing structure including: the cross section of the annular mounting block is in an inverted L shape, and a mounting groove suitable for mounting an annular sealing ring is formed between the inverted L-shaped annular mounting block and the bottom surface of the cover plate; and the annular step is arranged at the opening of the shell and can be abutted against the annular mounting block.
The outer diameter of the annular sealing ring is larger than the maximum outer diameter of the annular mounting block, wherein the inner wall of the shell, which is positioned between the annular step and the cover plate, is arranged in an inclined plane so as to compress the annular sealing ring. The utility model discloses technical scheme has following advantage:
1. the utility model provides a PCB wave filter packaging structure, including casing and apron, the opening part of casing is located to the apron, and its shaping has the perforation that can supply the pin to stretch out, and the inventor is ingenious to set up the apron at the opening part, because the apron can shelter from the epoxy that is located the holding intracavity to need not to consider epoxy's surface quality, can not only guarantee like this that the outward appearance uniformity is good, also greatly reduced the epoxy filling requirement, improved production efficiency.
2. The utility model provides a PCB wave filter packaging structure, the casing opening part be equipped with apron adaptation connection's annular groove to it is more firm to make apron and casing assembly.
3. The utility model provides a PCB wave filter packaging structure, ring type seal's external diameter is greater than the biggest external diameter of annular installation piece, and wherein, the shells inner wall that is located between annular step and the apron is the inclined plane setting, and this inclined plane can compress tightly ring type seal, and sealed effect is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of the PCB filter package structure of the present invention;
fig. 2 is an enlarged schematic view of a portion a in fig. 1.
Description of reference numerals: 1. a housing; 10. an annular groove; 11. an annular step; 12. a bevel; 2. a pin; 3. an accommodating cavity; 4. a cover plate; 41. an annular mounting block; 5. an annular seal ring.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Examples
The present embodiment provides a PCB filter package structure, as shown in fig. 1, including a housing 1 and a cover plate 4.
The casing 1 has the holding chamber 3 that is suitable for placing electronic component and a plurality of pin 2, and locates the opening at 3 tops in holding chamber, the filling has epoxy in the holding chamber 3.
The cover plate 4 is arranged at the opening and is suitable for shielding the epoxy resin, and through holes for the pins 2 to extend out are formed in the cover plate 4. An opening of the shell 1 is provided with an annular groove 10 which is connected with the cover plate 4 in an adaptive mode. The cover plate 4 is connected to the housing 1 by a sealing structure, as shown in fig. 2, which includes: the annular mounting block 41 is arranged on one side, facing the shell 1, of the cover plate 4, the cross section of the annular mounting block 41 is in an inverted L shape, and a mounting groove suitable for mounting the annular sealing ring 5 is formed between the inverted L-shaped annular mounting block 41 and the bottom surface of the cover plate 4 in an opposite mode; and the annular step 11 is arranged at the opening of the shell 1 and can be abutted against the annular mounting block 41. The outer diameter of the annular sealing ring 5 is larger than the maximum outer diameter of the annular mounting block 41, wherein the inner wall of the shell 1 between the annular step 11 and the cover plate 4 is arranged in an inclined plane 12 to press the annular sealing ring 5.
As an alternative embodiment, the cover plate 4 is connected with the inner wall of the opening of the housing 1 in an interference fit manner
The utility model provides a PCB wave filter packaging structure, including casing 1 and apron 4, the opening part of casing 1 is located to apron 4, and its shaping has the perforation that can supply pin 2 to stretch out, and the ingenious passing through of inventor sets up apron 4 at the opening part, because apron 4 can shelter from the epoxy that is located holding chamber 3 to need not to consider epoxy's surface quality, can not only guarantee like this that the outward appearance uniformity is good, also greatly reduced the filling requirement to epoxy, improved production efficiency.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (5)
1. A PCB filter package structure, comprising:
the electronic component packaging device comprises a shell (1) and a packaging box, wherein the shell is provided with an accommodating cavity (3) suitable for accommodating an electronic component and a plurality of pins (2), and an opening arranged at the top of the accommodating cavity (3), and epoxy resin is filled in the accommodating cavity (3);
the cover plate (4) is arranged at the opening and is suitable for shielding the epoxy resin, and through holes for the pins (2) to extend out are formed in the cover plate (4).
2. The PCB filter packaging structure of claim 1, wherein the cover plate (4) is connected with the inner wall of the opening of the shell (1) in an interference fit manner.
3. The PCB filter packaging structure of claim 2, wherein the opening of the shell (1) is provided with an annular groove (10) which is in fit connection with the cover plate (4).
4. The PCB filter package structure of claim 2 or 3, wherein the cover plate (4) is connected with the housing (1) by a sealing structure comprising:
the annular mounting block (41) is arranged on one side, facing the shell (1), of the cover plate (4), the cross section of the annular mounting block (41) is in an inverted L shape, and a mounting groove suitable for mounting an annular sealing ring (5) is formed between the inverted L-shaped annular mounting block (41) and the bottom surface of the cover plate (4) in a relative mode;
and the annular step (11) is arranged at the opening of the shell (1) and can be abutted against the annular mounting block (41).
5. The PCB filter package structure of claim 4, wherein the outer diameter of the ring-shaped sealing ring (5) is larger than the largest outer diameter of the ring-shaped mounting block (41), wherein the inner wall of the housing (1) between the annular step (11) and the cover plate (4) is provided with a bevel (12) to compress the ring-shaped sealing ring (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022523954.4U CN213152020U (en) | 2020-11-04 | 2020-11-04 | PCB filter packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022523954.4U CN213152020U (en) | 2020-11-04 | 2020-11-04 | PCB filter packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213152020U true CN213152020U (en) | 2021-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022523954.4U Active CN213152020U (en) | 2020-11-04 | 2020-11-04 | PCB filter packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213152020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI806567B (en) * | 2022-04-22 | 2023-06-21 | 台達電子工業股份有限公司 | Electrical device |
-
2020
- 2020-11-04 CN CN202022523954.4U patent/CN213152020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI806567B (en) * | 2022-04-22 | 2023-06-21 | 台達電子工業股份有限公司 | Electrical device |
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