CN218730961U

CN218730961U - SMD SOD diode

Info

Publication number: CN218730961U
Application number: CN202222920098.5U
Authority: CN
Inventors: 苏奕翰; 李玫媛; 肖思敏
Original assignee: Shenzhen Goodwork Electronic Co ltd
Current assignee: Shenzhen Goodwork Electronic Co ltd
Priority date: 2022-11-02
Filing date: 2022-11-02
Publication date: 2023-03-24
Anticipated expiration: 2032-11-02

Abstract

The utility model discloses a SMD SOD diode, relate to the electronic device field, including shell, anodal pin, negative pole pin and chip, the shaping has the cavity in the shell, anodal pin and negative pole pin are installed respectively at the left and right both ends in the cavity, the interior end of anodal pin and negative pole pin separates the setting from top to bottom each other, the chip sets up the clearance department between anodal pin and negative pole pin, the upside shaping of shell has two screw holes, the screw hole lets in the cavity setting, screw hole internal screw fit installs locking screw, left locking screw pushes down the interior end of anodal pin, the locking screw on right side pushes down the interior end of negative pole pin, the downside shaping of shell has the encapsulation hole, the encapsulation hole lets in the cavity setting; the beneficial effects are that: positive pin, negative pole pin and chip have been settled in the cavity, use locking screw pin and negative pole pin, have guaranteed chip electric connection's stability, then carry out the operation of encapsulation again, have guaranteed the life of paster diode.

Description

SMD SOD diode

Technical Field

The utility model belongs to the technical field of the electron device and specifically relates to a SMD SOD diode is related to.

Background

SOD is the encapsulation of paster diode, use the encapsulation to glue the positive pole pin of fixing paster diode, negative pole pin and chip, the heat of chip during operation can be transmitted to the encapsulation and glue, in the in-process of encapsulation operation, positive pole pin, negative pole pin and chip are folded each other and are put together, as in the chinese utility model patent (publication number CN211957630U published Japanese 20201117) disclose an SOD encapsulation semiconductor device, its electric connection through the soldering paste completion chip, it avoids the soldering paste to spill over from the side position to set up a plurality of through-hole, however, paster diode's volume is very little, the coating of soldering paste is very difficult, and positive pole pin, do not have fixed knot to construct between negative pole pin and the chip, easy the aversion takes place during encapsulation operation, lead to the yields lower.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an it is not enough to overcome above-mentioned condition, provides a technical scheme that can solve above-mentioned problem.

The utility model provides a SMD SOD diode, which comprises an outer shell, anodal pin, negative pole pin and chip, the shaping has the cavity in the shell, both ends about anodal pin and negative pole pin are installed respectively in the cavity, the inner end of anodal pin and negative pole pin separates the setting from top to bottom each other, the chip sets up the clearance department between anodal pin and negative pole pin, the upside shaping of shell has two screw holes, the screw hole lets in the cavity setting, locking screw is installed to screw hole internal screw cooperation, the inner end of anodal pin is pushed down to left locking screw, the inner end of negative pole pin is pushed down to the locking screw on right side, the downside shaping of shell has the encapsulation hole, the encapsulation hole lets in the cavity setting.

As a further aspect of the present invention: the equal fixed mounting in both ends has electrically conductive section of thick bamboo about in the cavity, and the outer end of anodal pin and negative pole pin all is moulded has first through-hole, and the welding of electrically conductive section of thick bamboo one-to-one is installed in the first through-hole of anodal pin and negative pole pin.

As a further aspect of the present invention: the welding piece is all inlayed at both ends about the shell and installed, and the inner end of welding piece lets in the cavity setting, and the outer end one-to-one of positive pole pin and negative pole pin is pressed on the welding piece, and the outer end of welding piece leads to out the shell setting, and the inner end shaping of welding piece has the second through-hole, and electrically conductive section of thick bamboo welded mounting is in the second through-hole.

As a further aspect of the present invention: u-shaped grooves are formed in the left end and the right end of the upper side of the shell, and the conductive cylinders are arranged below the U-shaped grooves in a one-to-one correspondence mode.

As a further aspect of the present invention: the upper end of the conductive cylinder is communicated with the U-shaped groove, and the lower end of the conductive cylinder is communicated with the outer shell.

As a further aspect of the present invention: the bottom side fixed mounting in the cavity has the gasket, and the inner end of anodal pin passes through left locking screw and presses on the gasket.

As a further aspect of the present invention: the front side of cavity goes out the shell setting, and the front side of shell is provided with the apron, and the apron covers the cavity setting.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the positive pin, the negative pin and the chip are arranged in the cavity, the positive pin and the negative pin are locked by the locking screw, the chip is locked between the positive pin and the negative pin, the stability of the electrical connection of the chip is ensured,

2. and encapsulating glue is poured into the encapsulating hole and can be filled in the cavity, so that the further positioning among the anode pin, the cathode pin and the chip is completed, and the service life of the surface mount diode is ensured.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic structural view of the utility model after the cover plate is hidden;

fig. 3 is a schematic structural diagram of the positive electrode pin, the negative electrode pin, the welding sheet and the conductive barrel.

Shown in the figure: 1. a housing; 2. a positive electrode pin; 3. a negative electrode pin; 4. a chip; 5. a cavity; 6. a threaded hole; 7. locking screws; 8. packaging the holes; 9. a conductive barrel; 10. a first through hole; 11. welding the sheet; 12. a second through hole; 13. a U-shaped groove; 14. a gasket; 15. and (7) a cover plate.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.

The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-3, the utility model discloses a SMD SOD diode, including shell 1, anodal pin 2, negative pole pin 3 and chip 4, the shaping has cavity 5 in the shell 1, anodal pin 2 and negative pole pin 3 install the left and right both ends in cavity 5 respectively, the inner end of anodal pin 2 and negative pole pin 3 separates the setting from top to bottom each other, chip 4 sets up the clearance department between anodal pin 2 and negative pole pin 3, the upside shaping of shell 1 has two screw holes 6, screw hole 6 lets in cavity 5 and sets up, screw hole 6 internal screw fit installs locking screw 7, the left locking screw 7 pushes down the inner end of anodal pin 2, the right side locking screw 7 pushes down the inner end of negative pole pin 3, the downside shaping of shell 1 has encapsulation hole 8, encapsulation hole 8 lets in cavity 5 and sets up;

the principle is as follows: settle anodal pin 2 in cavity 5, negative pole pin 3 and chip 4, use locking screw 7 to pin anodal pin 2 and negative pole pin 3, let chip 4 lock between anodal pin 2 and negative pole pin 3, guaranteed chip 4 electric connection's stability, then pour into the packaging glue toward packaging hole 8 department, the packaging glue can be filled in cavity 5, accomplish anodal pin 2, the location between negative pole pin 3 and the chip 4, the life of paster diode has been guaranteed.

As a further aspect of the present invention: the left end and the right end in the cavity 5 are fixedly provided with conductive cylinders 9, the outer ends of the anode pin 2 and the cathode pin 3 are respectively provided with a first through hole 10, and the conductive cylinders are welded in the first through holes 10 of the anode pin 2 and the cathode pin 3 in a one-to-one correspondence manner; the conductive cylinder 9 can be connected with the electric wire on the circuit board through the shell 1, and the electric wire connection mode can be welding or screw installation, so that the practical operation is convenient.

As a further aspect of the present invention: welding pieces 11 are embedded and mounted at the left end and the right end of the shell 1, the inner ends of the welding pieces 11 are arranged in the cavity 5, the outer ends of the anode pins 2 and the cathode pins 3 are pressed on the welding pieces 11 in a one-to-one correspondence mode, the outer ends of the welding pieces 11 are arranged through the shell 1, second through holes 12 are formed in the inner ends of the welding pieces 11, and the conductive cylinders 9 are installed in the second through holes 12 in a welding mode; the soldering tab 11 can be adapted to be soldered to a circuit board, enabling a stable mounting of the chip diode on the circuit board.

As a further aspect of the present invention: u-shaped grooves 13 are formed in the left end and the right end of the upper side of the shell 1, and the conductive cylinders 9 are correspondingly arranged below the U-shaped grooves 13 one by one; the chip diode is mounted to the circuit board using screws, the heads of which can be recessed into the U-shaped slots 13.

As a further aspect of the present invention: the upper end of the conductive cylinder 9 is communicated with the U-shaped groove 13, and the lower end of the conductive cylinder 9 is communicated with the outer shell 1; the operation of electrical connection can be completed by using screws to pass through the conductive cylinder 9 and lock on the circuit board, which is convenient for mounting the chip diode.

As a further aspect of the present invention: a gasket 14 is fixedly arranged at the bottom side in the cavity 5, and the inner end of the positive pin 2 is pressed on the gasket 14 through a locking screw 7 at the left side; the left locking screw 7 cannot bend the inner end of the positive pin 2, and the stability of the electrical connection of the chip 4 between the positive pin 2 and the negative pin 3 is ensured.

As a further aspect of the present invention: the front side of the cavity 5 is arranged through the shell 1, the front side of the shell 1 is provided with a cover plate 15, and the cover plate 15 is arranged to cover the cavity 5; can open apron 15 before the encapsulation and adjust the position at anodal pin 2, negative pole pin 3 and chip 4 place, avoid taking place the aversion, during the encapsulation cover 15 toward encapsulation hole 8 again pour into encapsulation glue alright, and then guaranteed the qualification rate of paster diode.

The present embodiment is not intended to limit the shape, material, structure, etc. of the present invention in any form, and all of the technical matters of the present invention belong to the protection scope of the present invention to any simple modification, equivalent change and modification made by the above embodiments.

Claims

1. The utility model provides a SMD SOD diode, includes shell, anodal pin, negative pole pin and chip, its characterized in that: the shaping has the cavity in the shell, both ends about the cavity are installed respectively to anodal pin and negative pole pin, the inner end of anodal pin and negative pole pin separates the setting from top to bottom each other, the chip sets up the clearance department between anodal pin and negative pole pin, the upside shaping of shell has two screw holes, the screw hole lets in the cavity setting, screw hole internal screw fit installs locking screw, the inner end of anodal pin is pushed down to left locking screw, the inner end of negative pole pin is pushed down to the locking screw on right side, the downside shaping of shell has the encapsulation hole, the encapsulation hole lets in the cavity setting.

2. The SMD SOD diode of claim 1, wherein: the equal fixed mounting in both ends has electrically conductive section of thick bamboo about in the cavity, and the outer end of anodal pin and negative pole pin all is moulded has first through-hole, and the welding of electrically conductive section of thick bamboo one-to-one is installed in the first through-hole of anodal pin and negative pole pin.

3. The SMD SOD diode of claim 2, wherein: the welding piece is all inlayed at both ends about the shell and installed, and the inner end of welding piece lets in the cavity setting, and the outer end one-to-one of positive pole pin and negative pole pin is pressed on the welding piece, and the outer end of welding piece leads to out the shell setting, and the inner end shaping of welding piece has the second through-hole, and electrically conductive section of thick bamboo welded mounting is in the second through-hole.

4. The SMD SOD diode of claim 2, wherein: u-shaped grooves are formed in the left end and the right end of the upper side of the shell, and the conductive cylinders are arranged below the U-shaped grooves in a one-to-one correspondence mode.

5. The SMD SOD diode of claim 4, wherein: the upper end of the conductive cylinder is communicated with the U-shaped groove, and the lower end of the conductive cylinder is communicated with the outer shell.

6. The SMD SOD diode of claim 1, wherein: the bottom side fixed mounting in the cavity has the gasket, and the inner end of anodal pin passes through left locking screw and presses on the gasket.

7. The SMD SOD diode of claim 1, wherein: the front side of cavity is led out the shell setting, and the front side of shell is provided with the apron, and the apron covers the cavity setting.