CN218182055U

CN218182055U - Paster type aluminum electrolytic capacitor installation component

Info

Publication number: CN218182055U
Application number: CN202222459480.0U
Authority: CN
Inventors: 尹志华; 李良; 尹超
Original assignee: Shenzhen Jianghao Electron Co ltd
Current assignee: Shenzhen Jianghao Electron Co ltd
Priority date: 2022-09-16
Filing date: 2022-09-16
Publication date: 2022-12-30
Anticipated expiration: 2032-09-16

Abstract

The utility model discloses a mounting component of a chip aluminum electrolytic capacitor, which comprises a chip capacitor component and a circuit board; the circuit board is provided with a chip capacitor assembly mounting hole, the chip capacitor assembly comprises a chip capacitor and a mounting base plate, the mounting base plate is placed in the chip capacitor mounting hole, and the chip capacitor is mounted on the mounting base plate; the bottom surface of the mounting base plate is flush with the side, provided with the electronic components, of the circuit board, and the chip capacitors protrude out of the other side of the circuit board, so that the chip capacitors and the electronic components are mounted on the two sides of the circuit board respectively. The patch capacitor and other devices are respectively arranged on two sides of the circuit board, so that the height can be reduced by the thickness of at least one mounting base plate, and the heat dissipation of the patch capacitor is facilitated; meanwhile, the mounting holes are formed in the circuit board, and the mounting base plate is placed at the mounting holes, so that the surface mount capacitor is more stably mounted, the shock resistance is high, and the surface mount capacitor is prevented from falling off.

Description

Paster type aluminum electrolytic capacitor installation component

Technical Field

The utility model belongs to the technical field of aluminum electrolytic capacitor, especially, relate to a paster type aluminum electrolytic capacitor installation component.

Background

In the production of electronic products, in order to realize high packaging density and reduce the volume and weight of the electronic products, a Surface Mount Technology (SMT) is often used, which requires that electronic components are patch components, and generally after the SMT is adopted, the electronic products have high reliability, strong vibration resistance, low welding spot defect rate and good high-frequency characteristics, reduce electromagnetic and radio frequency interference, are easy to realize automation, improve production efficiency, save materials, energy, equipment, manpower, time and the like.

Due to the advantages of the patch element, enterprises in the field of the aluminum electrolytic capacitor are exploring the development of the patch type aluminum electrolytic capacitor at present, the aluminum electrolytic capacitor is installed on the base by adding the base, and then the aluminum electrolytic capacitor is welded on the printed circuit board through the lead-out wire. However, the mounting of such chip type aluminum electrolytic containers is currently a front mounting, that is: the aluminum electrolytic capacitor is mounted on the front surface of the printed circuit board (the surface of the printed circuit board on which the electronic components are mounted). In some cases, the height of the circuit board on which the aluminum electrolytic capacitor is mounted is increased, and the aluminum electrolytic capacitor and other electronic components are mounted on the front surface of the printed circuit board, which is very disadvantageous to heat dissipation and is not ideal in shock absorption effect.

Therefore, in order to solve the above problems, a technical solution is proposed by actually conducting development and research to overcome the defects of the prior art, and a chip aluminum electrolytic capacitor mounting assembly is provided.

The above background disclosure is only provided to aid understanding of the inventive concepts and solutions of the present invention, and it does not necessarily pertain to the prior art of this patent application, and it should not be used to assess the novelty and inventive aspects of this application without explicit evidence that such contents are disclosed at the filing date of this patent application.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a paster type aluminium electrolytic capacitor installation component to solve at least one kind among the above-mentioned background art problem.

The embodiment of the utility model provides a technical scheme is realized like this:

a chip type aluminum electrolytic capacitor mounting assembly comprises a chip capacitor assembly and a circuit board for mounting the chip capacitor assembly; the circuit board is provided with a chip capacitor assembly mounting hole, the chip capacitor assembly comprises a chip capacitor and a mounting base plate, the mounting base plate is placed in the chip capacitor mounting hole, and the chip capacitor is mounted on the mounting base plate; the bottom surface of the mounting base plate is flush with one surface of the circuit board, on which the electronic components are mounted, and the chip capacitor protrudes out of the other surface of the circuit board, so that the chip capacitor and the electronic components are mounted on two surfaces of the circuit board respectively.

In some embodiments, the mounting base plate includes a base body having a shape substantially identical to a shape of the patch capacitor mounting hole.

In some embodiments, the patch capacitor mounting hole is a square hole.

In some embodiments, the base body is provided with a pin through hole, and the bottom surface of the base body is connected with the pin through hole and is provided with a lead slot in an extending manner.

In some embodiments, the thickness of the base body is equal to the thickness of the circuit board.

In some embodiments, the mounting seat plate further includes a plurality of arc-shaped support blocks disposed on the base body, and an opening is disposed between two adjacent support blocks.

In some embodiments, the plurality of arc-shaped supporting blocks are respectively arranged at four corners of the base body, inner side surfaces of the four arc-shaped supporting blocks are arc-shaped surfaces, the arc-shaped surfaces of the four arc-shaped supporting blocks form an inner circular cavity matched with an outer circle of the chip capacitor, and when the chip capacitor is installed on the installation base plate, the chip capacitor is supported and fixed through the inner circular cavity.

In some embodiments, the pin through hole is disposed at a middle position of the base body.

In some embodiments, the positive pin and the negative pin of the patch capacitor respectively pass through the pin through hole and then are bent and embedded in the lead groove.

In some embodiments, a lead frame portion is disposed on the front surface of the circuit board corresponding to the lead groove, and the positive lead and the negative lead of the chip capacitor are respectively soldered to the lead frame portion.

In the embodiment of the utility model, the patch capacitor and other devices are respectively arranged on two sides of the circuit board by mounting the patch capacitor in an inverted manner, so that the height can be reduced by the thickness of at least one mounting plate, and the heat dissipation of the patch capacitor is facilitated; meanwhile, the mounting base plate is placed at the square hole through the square hole formed in the circuit board, so that the mounting of the chip capacitor is more stable, the shock resistance is high, and the chip capacitor is prevented from falling off.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

For a better understanding and an implementation, the present invention is described in detail below with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a perspective view of the chip type aluminum electrolytic capacitor mounting component of the present invention.

Fig. 2 is another perspective view of the chip type aluminum electrolytic capacitor mounting assembly of the present invention.

Fig. 3 is a partially exploded view of the chip type aluminum electrolytic capacitor mounting component of the present invention.

Fig. 4 is a further partially exploded view of the chip type aluminum electrolytic capacitor mounting assembly of the present invention.

Fig. 5 is a partially exploded view of the mounting assembly for a chip type aluminum electrolytic capacitor according to another aspect of the present invention.

Fig. 6 is a partially cut-away view of the chip type aluminum electrolytic capacitor mounting component of the present invention.

Fig. 7 is a partially exploded view of the chip capacitor module of the chip type aluminum electrolytic capacitor mounting module according to the present invention.

Fig. 8 is a partially exploded view of the chip capacitor module of the chip type aluminum electrolytic capacitor mounting module according to another aspect of the present invention.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present invention more clearly understood, the technical solutions in the embodiments of the present invention can be better understood by those skilled in the art, and the drawings in the embodiments of the present invention will be combined below to clearly and completely describe the technical solutions in the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixing or for circuit connection.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the embodiments of the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, unless explicitly stated or limited otherwise, "plurality" means two or more, and the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as meaning a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-8, the mounting assembly of the chip type aluminum electrolytic capacitor of the present invention comprises a chip capacitor assembly 1 and a circuit board 2 for mounting the chip capacitor assembly 1; a chip capacitor assembly mounting hole 20 is formed in the circuit board 2, the chip capacitor assembly 1 comprises a chip capacitor 10 and a mounting base plate 11, the mounting base plate 11 is placed in the chip capacitor mounting hole 20, and the chip capacitor 10 is mounted on the mounting base plate 11; the bottom surface of the mounting base plate 11 is flush with a surface (circuit board front surface) 21 of the circuit board on which the electronic components are mounted, and the chip capacitor 10 protrudes out of another surface (circuit board back surface) 22 of the circuit board, so that the chip capacitor 10 and the electronic components (not shown) are respectively mounted on two surfaces of the circuit board 2, that is, the inverted mounting of the chip capacitor is realized.

Specifically, the mounting seat plate 11 includes a base body 110 and an arc-shaped supporting block 111 disposed on the base body 110; wherein, the base body 110 is provided with a pin through hole 112; in some embodiments, the pin through hole 112 is disposed at a middle position of the base body 110; in some embodiments, there are two pin through holes 112 corresponding to the positive and

negative pins

101 and 102 of the patch capacitor 10; the number of the arc-shaped supporting blocks 111 is four, and an opening is formed between every two adjacent supporting blocks; four arc-shaped supporting blocks set up respectively in four angles of base body 110, and the medial surface of four arc-shaped supporting blocks is the arcwall face, and the arcwall face of four arc-shaped supporting blocks forms the interior chamber with paster electric capacity 10's excircle looks adaptation, when paster electric capacity installs on installation bedplate 11, through interior chamber is in order to support fixedly paster electric capacity. The shape of the base body 110 is substantially the same as that of the chip capacitor mounting hole 20 on the circuit board 2; in the embodiment of the present invention, the mounting hole 20 of the chip capacitor is a square hole; referring to fig. 6, in some embodiments, the thickness of the base body 110 is equal to the thickness of the circuit board 2, so that when the base body 110 is mounted in the square hole of the circuit board 2, two surfaces of the base body 110 are respectively flush with two surfaces of the circuit board 2. It should be noted that in some embodiments, the capacitor mounting hole 20 is a circular hole, and correspondingly, the base body is designed to be circular to fit the circular hole.

In some embodiments, a lead groove 113 is formed on the bottom surface of the base body 110 and connected to the pin through hole 112 in an extending manner, and the positive and

negative pins

101 and 102 of the patch capacitor respectively pass through the pin through hole 112 and then are bent and embedded in the lead groove 113; referring to fig. 4 and 8, corresponding to the lead groove 113, a lead soldering portion 210 is disposed on the front surface 21 of the circuit board 2, and positive and negative leads of the chip capacitor are respectively soldered to the lead soldering portion 210.

In some embodiments, the mounting plate 11 has two arc-shaped support blocks with outer sides on the same vertical plane as the side walls of the base body 110, and two other arc-shaped support blocks with outer sides perpendicular to the bottom surface of the base body 110, so that two positioning surfaces in the shape of a right triangle are formed on the bottom surface.

Referring to fig. 7 and 8, the chip capacitor 10 includes

pins

101 and 102, a core package having a polar lead-out wire, a polar lead-out wire guide pin (not shown) led out from the core package, and a package metal housing 103 wrapping the core package, wherein the bottom of the package metal housing 103 adopts an interlayer design, and an explosion-proof gasket is arranged between the bottom of the package metal housing and the bottom of the core package.

In some embodiments, the

leads

101 and 102 are connected to the polar lead wire guide pins of the chip capacitor, the chip capacitor is mounted on the mounting base plate 11, the

leads

101 and 102 of the chip capacitor are inserted into the lead through holes 112 on the base body 110 to extend out of the bottom surface of the base body, and the leads are bent and then embedded in the lead grooves 113. Specifically, the pin comprises a connecting part and a bending part; the polarity lead-out wire guide pin of core package is connected to connecting portion, the portion of bending is acceptd in this lead wire groove 113 of base after connecting portion buckle, the thickness of the portion of bending equals lead wire groove 113's the degree of depth to make the portion of bending bury underground behind lead wire groove 113, its surface is in same horizontal plane with the bottom surface of base body 110.

In the embodiment of the present invention, the core package is a circular design, and includes a positive aluminum foil, electrolytic paper disposed on both sides of the positive aluminum foil, a negative aluminum foil, an electrolyte, and an electronic tape (not shown). The negative aluminum foil is arranged on the outermost layer of the core bag and is close to or in contact with the metal shell wrapping the core bag.

The surface mount type aluminum electrolytic capacitor mounting component of the utility model mounts the surface mount capacitor in an inverted manner, and respectively mounts the surface mount capacitor and other devices on two sides of the circuit board, thereby reducing the height by the thickness of at least one mounting base plate and facilitating the heat dissipation of the surface mount capacitor; meanwhile, the mounting base plate is placed at the square hole through the square hole formed in the circuit board, so that the mounting of the chip capacitor is more stable, the shock resistance is high, and the chip capacitor is prevented from falling off.

It is to be understood that the foregoing is a more detailed description of the invention, and specific/preferred embodiments thereof are described, and it is not intended that the invention be limited to the specific embodiments disclosed. For those skilled in the art to which the invention pertains, several alternatives or modifications can be made to the described embodiments without departing from the inventive concept, and such alternatives or modifications should be considered as falling within the scope of the present patent. In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "preferred embodiments," "example," "specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention.

In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the scope of the invention as defined by the appended claims.

Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate, the above-described disclosures, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.

Claims

1. The utility model provides a paster type aluminium electrolytic capacitor installation component, includes paster electric capacity subassembly and installation paster electric capacity subassembly's circuit board, its characterized in that: the circuit board is provided with a chip capacitor assembly mounting hole, the chip capacitor assembly comprises a chip capacitor and a mounting base plate, the mounting base plate is placed in the chip capacitor mounting hole, and the chip capacitor is mounted on the mounting base plate; the bottom surface of the mounting base plate is flush with one surface of the circuit board, on which the electronic components are mounted, and the chip capacitor protrudes out of the other surface of the circuit board, so that the chip capacitor and the electronic components are mounted on two surfaces of the circuit board respectively.

2. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 1, wherein: the mounting base plate comprises a base body, and the shape of the base body is approximately the same as that of the mounting hole of the chip capacitor.

3. The chip type aluminum electrolytic capacitor mounting assembly as recited in claim 2, wherein: the mounting hole of the chip capacitor is a square hole.

4. The chip type aluminum electrolytic capacitor mounting assembly as recited in claim 2, wherein: the base body is provided with a pin through hole, and the bottom surface of the base body is connected with the pin through hole and is provided with a lead groove in an extending mode.

5. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 2, wherein: the thickness of the base body is equal to that of the circuit board.

6. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 2, wherein: the installation base plate further comprises a plurality of arc-shaped supporting blocks arranged on the base body, and an opening is formed between every two adjacent supporting blocks.

7. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 6, wherein: a plurality of arc supporting shoes set up respectively in four angles of base body, and the medial surface of four arc supporting shoes is the arcwall face, and the arcwall face of four arc supporting shoes forms the interior chamber with paster electric capacity's excircle looks adaptation, when paster electric capacity installs on the installation bedplate, through interior chamber is in order to support fixedly paster electric capacity.

8. The chip type aluminum electrolytic capacitor mounting assembly as recited in claim 4, wherein: the pin through hole is arranged in the middle of the base body.

9. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 8, wherein: and a positive pin and a negative pin of the chip capacitor respectively penetrate through the pin through holes and then are bent and embedded in the lead groove.

10. A chip type aluminum electrolytic capacitor mounting assembly as set forth in claim 9, wherein: the front surface of the circuit board is provided with a pin welding part corresponding to the lead groove, and a positive pin and a negative pin of the chip capacitor are respectively welded on the pin welding part.