CN214279970U - Packaging structure of shielding component - Google Patents

Packaging structure of shielding component Download PDF

Info

Publication number
CN214279970U
CN214279970U CN202022778359.5U CN202022778359U CN214279970U CN 214279970 U CN214279970 U CN 214279970U CN 202022778359 U CN202022778359 U CN 202022778359U CN 214279970 U CN214279970 U CN 214279970U
Authority
CN
China
Prior art keywords
shielding
chip
packaging
shell
packaging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202022778359.5U
Other languages
Chinese (zh)
Inventor
唐善辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Hongyiqi Electronics Co ltd
Original Assignee
Shenzhen Hongyiqi Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Hongyiqi Electronics Co ltd filed Critical Shenzhen Hongyiqi Electronics Co ltd
Priority to CN202022778359.5U priority Critical patent/CN214279970U/en
Application granted granted Critical
Publication of CN214279970U publication Critical patent/CN214279970U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model discloses a packaging structure of shielding subassembly, which comprises a substrate, base plate upper end fixed mounting has a plurality of to separate the strip, and two liang of distances between the strip equal, base plate upper end fixed mounting has a plurality of bottom encapsulation layer, open the base plate upper end has a plurality of group installation punch combination spare, and installs punch combination spare and be located the bottom encapsulation layer around, the quantity of installation punch combination spare is the same with bottom encapsulation layer quantity, bottom encapsulation layer upper end fixed mounting has the chip, chip front end and rear end all are provided with the pin, and the pin extends to the base plate in, be provided with outer encapsulation subassembly on the chip, and outer encapsulation subassembly lower part extends to in the installation punch combination spare, outer encapsulation subassembly upper portion is provided with the metallic shield shell. A packaging structure of shielding subassembly, through setting up bottom encapsulation subassembly, outer encapsulation subassembly and metallic shield shell and accomplish the parcel with the chip, provide good shielding effect, and convenient to detach.

Description

Packaging structure of shielding component
Technical Field
The utility model relates to an packaging structure technical field, in particular to packaging structure of shielding subassembly.
Background
Packaging means that circuit pins on a silicon chip are connected to external terminals by wires to facilitate connection of other devices. The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport. The quality of the packaging technology is also of great importance since it directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) to which it is connected. The packaging structure of the existing shielding component has the following disadvantages: 1. the packaging structure of the existing shielding assembly has poor shielding effect, and the stability and reliability of a chip are influenced by the direction or angle of radiation interference of the chip; 2. the packaging structure of a present shielding component adopts the metallic shield shell to further strengthen packaging structure's anti radiation interference ability mostly, but the connection between present metallic shield shell and the outer encapsulation is comparatively complicated, and the metallic shield shell dismantles the difficulty, is difficult for carrying on the adjustment in later stage, and is impractical.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a packaging structure of a shield assembly, which can effectively solve the problems of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a packaging structure of shielding subassembly, includes the base plate, base plate upper end fixed mounting has a plurality of to separate the strip, and two liang of distances between the strip of separating equal, base plate upper end fixed mounting has a plurality of bottom encapsulation layer, open the base plate upper end has a plurality of group's installation punch combination spare, and installs punch combination spare and be located the bottom encapsulation layer around, the quantity of installation punch combination spare is the same with bottom encapsulation quantity of piles, bottom encapsulation layer upper end fixed mounting has the chip, chip front end and rear end all are provided with the pin, and the pin extends to in the base plate, be provided with outer encapsulation subassembly on the chip, and outer encapsulation subassembly lower part extends to in the installation punch combination spare, outer encapsulation subassembly upper portion is provided with metal shielding shell.
Preferably, outer encapsulation subassembly includes outer shielding case, outer shielding case is cavity structures, a plurality of opening has all been opened to outer shielding case front end and rear end, the equal fixed mounting in outer shielding case lower extreme left part and lower extreme right part has the first location foot of a plurality of, outer shielding case lower extreme ancestor and the equal fixed mounting in lower extreme rear portion have a plurality of second location foot, the equal fixed mounting of outer shielding case left end and right-hand member and connection cardboard.
Preferably, the number of the openings is the same as that of the pins, the height and width of the openings are matched with those of the pins, and the lower ends of the first positioning pin and the second positioning pin are fixedly provided with the protruding blocks.
Preferably, a resin encapsulation layer is filled between the inside of the outer shielding shell and the outer surface of the chip.
Preferably, the metal shielding shell comprises a U-shaped shell, a plurality of bayonets are formed in the left end and the right end of the U-shaped shell, and the bayonets are matched with the connecting bayonets.
Preferably, the mounting hole assembly comprises a first positioning groove and a second positioning groove, the first positioning groove is matched with the first positioning foot, and the second positioning groove is matched with the second positioning foot.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model relates to a packaging structure of shielding subassembly encapsulates through the bottom of bottom encapsulated layer and chip at first, and the rethread outer shielding shell cup joints in the outside of chip, and packs the resin encapsulated layer between the two, carries out the joint through metal shielding shell and outer shielding shell at last and accomplishes final encapsulation, and whole packaging structure wraps up the chip completely, does not have any angle or direction that receives the radiation interference, plays the effect of shielding, guarantees the stability and the reliability of chip during operation;
2. the utility model relates to a connect through the mode of joint between metal shield shell among the packaging structure of shielding subassembly and the outer shielding shell, carry out the joint through the bayonet socket on connection cardboard on the outer shielding shell and the metal shield shell, whole joint process easy operation easily dismantles, is convenient for carry out the adjustment in later stage.
Drawings
Fig. 1 is a schematic overall structure diagram of a packaging structure of a shielding assembly according to the present invention;
fig. 2 is a schematic diagram of an overall structure of an outer package assembly of the packaging structure of the shielding assembly according to the present invention;
fig. 3 is a schematic view of an overall structure of a metal shielding case of an encapsulation structure of a shielding assembly according to the present invention;
fig. 4 is a schematic diagram of an overall structure of a mounting hole assembly of the packaging structure of the shielding assembly according to the present invention.
In the figure: 1. a substrate; 2. a dividing strip; 3. a bottom encapsulation layer; 4. a chip; 5. a pin; 6. an outer packaging component; 7. a metal shielding can; 8. mounting a hole assembly; 61. an outer shield shell; 62. an opening; 63. a first positioning pin; 64. a second positioning leg; 65. connecting a clamping plate; 66. a raised block; 67. a resin encapsulation layer; 71. a U-shaped housing; 72. a bayonet; 81. a first positioning groove; 82. a second positioning groove.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a packaging structure of a shielding component, including a substrate 1, a plurality of separation strips 2 are fixedly installed at the upper end of the substrate 1, and the distance between every two separation strips 2 is equal, a plurality of bottom packaging layers 3 are fixedly installed at the upper end of the substrate 1, a plurality of groups of mounting hole components 8 are opened at the upper end of the substrate 1, and the mounting hole components 8 are located around the bottom packaging layers 3, the number of the mounting hole components 8 is the same as that of the bottom packaging layers 3, a chip 4 is fixedly installed at the upper end of the bottom packaging layers 3, pins 5 are respectively arranged at the front end and the rear end of the chip 4, and the pins 5 extend into the substrate 1, an outer packaging component 6 is arranged on the chip 4, and the lower portion of the outer packaging component 6 extends into the mounting hole components 8, and a metal shielding shell 7 is arranged at the upper portion of the outer packaging component 6.
Outer encapsulation subassembly 6 includes outer shielding shell 61, outer shielding shell 61 is cavity structures, a plurality of opening 62 has all been opened to outer shielding shell 61 front end and rear end, the equal fixed mounting in outer shielding shell 61 lower extreme left part and lower extreme right part has the first location foot 63 of a plurality of, outer shielding shell 61 lower extreme ancestor and the equal fixed mounting in lower extreme rear portion have a plurality of second location foot 64, the equal fixed mounting of outer shielding shell 61 left end and right-hand member and connection cardboard 65, it is the U-shaped structure to connect cardboard 65, the lower part and the outer shielding shell 61 fixed connection of connecting cardboard 65, the upper portion of connecting cardboard 65 does not contact with outer shielding shell 61, it can carry out horizontal rotation to connect cardboard 65 promptly.
The quantity of opening 62 is the same with the quantity of pin 5, and opening 62 height and width and pin 5's height and width phase-match, the equal fixed mounting of first location foot 63 and second location foot 64 lower extreme has protruding piece 66, and protruding piece 66 mainly plays and tentatively strengthens being connected between location foot and the constant head tank, avoids the location foot to break away from the constant head tank.
The resin packaging layer 67 is filled between the inner part of the outer shielding shell 61 and the outer surface of the chip 4, the resin packaging layer 67 further strengthens the connection between the chip 4 and the outer shielding shell 61, and simultaneously plays a role in closing the opening 62 and strengthens the shielding function.
The metal shielding shell 7 comprises a U-shaped shell 71, a plurality of bayonets 72 are formed in the left end and the right end of the U-shaped shell 71, the bayonets 72 are matched with the connecting clamping plates 65, and the metal shielding shell 7 plays a role in shielding in the prior art.
The mounting hole assembly 8 includes a first positioning groove 81 and a second positioning groove 82, the first positioning groove 81 is matched with the first positioning leg 63, the second positioning groove 82 is matched with the second positioning leg 64, and the insides of the first positioning groove 81 and the second positioning groove 82 are matched with the protruding block 66.
It should be noted that the present invention is a packaging structure of shielding assembly, first packaging the bottom of the chip 4 and the bottom packaging layer 3, and simultaneously primarily fixing the chip 4 on the substrate 1, and then covering the chip 4 by the outer shielding shell 61, and filling the resin packaging layer 67 between the two, the connection between the chip 4 and the outer shielding shell 61 is strengthened by the resin packaging layer 67, and simultaneously playing a role of closing the opening 62, strengthening the shielding function, and finally completing the final packaging by the metal shielding shell 7 and the outer shielding shell 61, the whole packaging structure completely covers the chip 4, there is no any angle or direction affected by radiation interference, playing a good shielding effect, ensuring the stability and reliability of the chip 4 during operation, connecting the metal shielding shell 7 and the outer shielding shell 61 by way of clamping, carry out the joint through the bayonet socket 72 on the connection cardboard 65 on the outer shielding shell 61 and the U-shaped shell 71, whole joint process easy operation easily dismantles, is convenient for carry out the adjustment in later stage, the utility model discloses shield effectually, convenient to detach, the adjustment in easy later stage is favorable to shielding assembly's packaging structure's using widely.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A package structure of a shielding assembly, comprising a substrate (1), characterized in that: a plurality of separation strips (2) are fixedly arranged at the upper end of the base plate (1), the distances between every two separation strips (2) are equal, a plurality of bottom packaging layers (3) are fixedly arranged at the upper end of the base plate (1), a plurality of groups of mounting hole assemblies (8) are arranged at the upper end of the base plate (1), and the mounting hole assemblies (8) are positioned around the bottom packaging layer (3), the number of the mounting hole assemblies (8) is the same as that of the bottom packaging layer (3), a chip (4) is fixedly arranged at the upper end of the bottom packaging layer (3), pins (5) are arranged at the front end and the rear end of the chip (4), and the pins (5) extend into the substrate (1), an outer packaging component (6) is arranged on the chip (4), and the lower part of the outer packaging component (6) extends into the mounting hole component (8), and a metal shielding shell (7) is arranged on the upper part of the outer packaging component (6).
2. The packaging structure of the shielding component according to claim 1, wherein: outer packaging component (6) is including outer shielded cell shell (61), outer shielded cell shell (61) is cavity structures, a plurality of opening (62) have all been opened to outer shielded cell shell (61) front end and rear end, the equal fixed mounting in outer shielded cell shell (61) lower extreme left part and lower extreme right part has a plurality of first location foot (63), outer shielded cell shell (61) lower extreme elder generation and the equal fixed mounting in lower extreme rear portion have a plurality of second location foot (64), outer shielded cell shell (61) left end and the equal fixed mounting of right-hand member and connection cardboard (65).
3. The packaging structure of the shielding assembly of claim 2, wherein: the number of the openings (62) is the same as that of the pins (5), the height and width of the openings (62) are matched with those of the pins (5), and the lower ends of the first positioning pins (63) and the second positioning pins (64) are fixedly provided with protruding blocks (66).
4. The packaging structure of the shielding assembly of claim 2, wherein: and a resin packaging layer (67) is filled between the inside of the outer layer shielding shell (61) and the outer surface of the chip (4).
5. The packaging structure of the shielding component according to claim 1, wherein: the metal shielding shell (7) comprises a U-shaped shell (71), a plurality of bayonets (72) are formed in the left end and the right end of the U-shaped shell (71), and the bayonets (72) are matched with the connecting clamping plates (65).
6. The packaging structure of the shielding component according to claim 1, wherein: the mounting hole assembly (8) comprises a first positioning groove (81) and a second positioning groove (82), the first positioning groove (81) is matched with the first positioning foot (63), and the second positioning groove (82) is matched with the second positioning foot (64).
CN202022778359.5U 2020-11-26 2020-11-26 Packaging structure of shielding component Expired - Fee Related CN214279970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022778359.5U CN214279970U (en) 2020-11-26 2020-11-26 Packaging structure of shielding component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022778359.5U CN214279970U (en) 2020-11-26 2020-11-26 Packaging structure of shielding component

Publications (1)

Publication Number Publication Date
CN214279970U true CN214279970U (en) 2021-09-24

Family

ID=77778102

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022778359.5U Expired - Fee Related CN214279970U (en) 2020-11-26 2020-11-26 Packaging structure of shielding component

Country Status (1)

Country Link
CN (1) CN214279970U (en)

Similar Documents

Publication Publication Date Title
CN1163988C (en) Cassette battery
US6777819B2 (en) Semiconductor package with flash-proof device
EP1499172B1 (en) Electromagnetically shielded circuit device and shielding method therefor
JP5123234B2 (en) battery pack
US9905835B2 (en) Secondary battery pack
EP3783645B1 (en) Pin, pin combination structure, packaging body and manufacturing method therefor
CN103718342A (en) Secondary battery pack
EP2164312B1 (en) Electric apparatus unit
CN1918726A (en) Battery pack of improved structure
CN103165833B (en) Battery pack
KR101023895B1 (en) Battery Pack
CN214279970U (en) Packaging structure of shielding component
CN211428140U (en) Device-level packaging module and circuit board
US20070158830A1 (en) Circuit module
US20070014092A1 (en) Resin-packaged protection circuit module for rechargeable batteries and method of making the same
CN217740354U (en) Metal packaging laminated solid-state aluminum electrolytic capacitor
CN219892171U (en) Packaging structure
CN218585962U (en) Module sealing shell and high-voltage IGBT module
CN207993854U (en) Integrated circuit SIP encapsulating structures
CN217544602U (en) Surface-mounted chip packaging structure
CN218730961U (en) SMD SOD diode
CN218977180U (en) Metal shielding packaging structure with circuit board
CN217444225U (en) High-temperature-resistant high-humidity dry capacitor
CN220400674U (en) Battery protection board and battery
CN218499477U (en) Diode packaging structure for photovoltaic junction box

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210924

Termination date: 20211126

CF01 Termination of patent right due to non-payment of annual fee