CN218499477U

CN218499477U - Diode packaging structure for photovoltaic junction box

Info

Publication number: CN218499477U
Application number: CN202222038027.2U
Authority: CN
Inventors: 余洪伟
Original assignee: Jiangsu Zerun New Material Co ltd
Current assignee: Jiangsu Zerun Xinneng Technology Co ltd
Priority date: 2022-08-03
Filing date: 2022-08-03
Publication date: 2023-02-17
Anticipated expiration: 2032-08-03

Abstract

The utility model relates to the technical field of diode packaging, in particular to a diode packaging structure for photovoltaic junction box, which comprises a PCB substrate, wherein the surface of the PCB substrate is provided with a PCB electrode layer, the surface of the PCB electrode layer arranged on the upper surface of the PCB substrate is provided with a photovoltaic wire bonding pad and a bus bar bonding pad, and the PCB substrate is provided with a bus bar leading-out hole at the bus bar bonding pad; the PCB comprises a PCB body and is characterized in that a high-temperature soldering tin layer is further arranged on the surface of the PCB electrode layer on the upper surface, a diode chip is arranged on the high-temperature soldering tin layer, electrode connecting pieces are connected between the diode chip and the PCB electrode layer, and the diode chip, the electrode connecting pieces and the high-temperature soldering tin layer are wrapped through plastic package main bodies in a plastic injection mode. The utility model discloses increase diode chip heat radiating area, the diode can obtain lower thermal resistance, has better thermal behavior.

Description

Diode packaging structure for photovoltaic junction box

Technical Field

The utility model relates to a diode packaging technology field, concretely relates to diode packaging structure for photovoltaic terminal box.

Background

Diode packaging refers to the use of wire bonding of circuit pins on a silicon die to external connections for connection to other devices. In electronics, it not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also is connected to the pins of the package housing by wires through the contacts on the chip, and these pins are connected with other devices by wires on the printed circuit board, thereby realizing the connection of the internal chip and the external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport.

With the development of photovoltaic modules towards large size and high current, the requirements on the current carrying capacity, the heat dissipation capacity and the connection reliability of the photovoltaic junction box and the bypass diode devices used in the photovoltaic junction box are also continuously improved. However, in the prior art, the thermal resistance of the diode is relatively high, and the thermal performance of the device is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming of the prior art, and provide a diode packaging structure for photovoltaic terminal box.

The utility model provides a following technical scheme:

a diode packaging structure for a photovoltaic junction box comprises a PCB substrate, wherein a PCB plate electrode layer is arranged on the surface of the PCB substrate, a photovoltaic wire bonding pad and a bus bar bonding pad are arranged on the surface of the PCB plate electrode layer arranged on the upper surface of the PCB substrate, and a bus bar leading-out hole is formed in the bus bar bonding pad of the PCB substrate;

the PCB comprises a PCB body and is characterized in that a high-temperature soldering tin layer is further arranged on the surface of the PCB electrode layer on the upper surface, a diode chip is arranged on the high-temperature soldering tin layer, electrode connecting pieces are connected between the diode chip and the PCB electrode layer, and the diode chip, the electrode connecting pieces and the high-temperature soldering tin layer are wrapped through plastic package main bodies in a plastic injection mode.

Preferably, the PCB electrode layer is provided with four first conductors, four second conductors, four third conductors and four fourth conductors, the first conductors and the second conductors are connected through metal through holes of the PCB substrate to form a first PCB electrode, and the third conductors and the fourth conductors are connected to form a second PCB electrode.

Preferably, the surface of the first conductor and the surface of the third conductor are both provided with high-temperature soldering tin layers, the high-temperature soldering tin layer on the surface of the first conductor is connected with the electrode connecting sheet, the high-temperature soldering tin layer on the surface of the third conductor is connected with the bottom of the diode chip, the high-temperature soldering tin layer is arranged on the top of the diode chip, and the high-temperature soldering tin layer is connected with the electrode connecting sheet.

Preferably, the second electrode of the PCB is connected with the top of the diode chip through an electrode connecting sheet and a high-temperature soldering tin layer to form a diode anode, and the first electrode of the PCB is connected with the bottom of the diode chip through the high-temperature soldering tin layer to form a diode cathode.

Preferably, the number of the photovoltaic wire bonding pads and the number of the bus bar bonding pads are two, one of the photovoltaic wire bonding pads and one of the bus bar bonding pads are arranged on the first conductor, the other of the photovoltaic wire bonding pads and the other of the bus bar bonding pads are arranged on the third conductor, and the two photovoltaic wire bonding pads and the two of the bus bar bonding pads are symmetrical with respect to the center of the PCB substrate.

Preferably, the plastic package main body is made of high-temperature-resistant epoxy resin.

The beneficial effects of the utility model are that:

the high-temperature soldering tin layers are arranged at the top and the bottom of the diode chip, the electrode connecting sheet is connected with the electrode connecting sheet, the electrode connecting sheet is also connected with the high-temperature soldering tin layer on the surface of the first conductor, and the heat conduction of the electrode connecting sheet and the heat conduction of the high-temperature soldering tin layer are matched, so that the heat dissipation area of the diode chip is greatly increased;

through the bus bar pad and the bus bar leading-out hole, the direct welding with the photovoltaic module is convenient.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a second schematic view of the present invention;

labeled as: the circuit board comprises a PCB (1), a plastic package main body, a bus bar bonding pad, a photovoltaic wire bonding pad, a bus bar lead-out hole, a electrode connecting sheet, a diode chip, a first conductor, a second conductor, a third conductor, a fourth conductor and a high-temperature soldering tin layer, wherein the PCB comprises a PCB substrate, a plastic package main body, a bus bar bonding pad, a photovoltaic wire bonding pad, a bus bar lead-out hole, an electrode connecting sheet, a diode chip, a first conductor, a second conductor, a third conductor, a fourth conductor and a high-temperature soldering tin layer, wherein the PCB is 2, the bus bar bonding pad is 3, the photovoltaic wire bonding pad is 4, the bus bar lead-out hole is 5, the electrode connecting sheet is 6, the diode chip is 7, the first conductor, the second conductor, the third conductor, the fourth conductor and the high-temperature soldering tin layer are 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 and 2, a diode package structure for a photovoltaic junction box includes a PCB substrate 1, a PCB electrode layer disposed on a surface of the PCB substrate 1, a photovoltaic wire pad 4 and a bus bar pad 3 disposed on a surface of the PCB electrode layer disposed on an upper surface of the PCB substrate 1, and a bus bar lead-out hole 5 disposed at the bus bar pad 3 of the PCB substrate 1.

The surface of the PCB electrode layer of the upper surface is also provided with a high-temperature soldering tin layer 12, a diode chip 7 is arranged on the high-temperature soldering tin layer, an electrode connecting sheet 6 is connected between the diode chip 7 and the PCB electrode layer, and the diode chip 7, the electrode connecting sheet 6 and the high-temperature soldering tin layer 12 are wrapped by the plastic package main body 2 in an injection molding mode. The plastic package main body 2 adopts high-temperature-resistant epoxy resin.

The operating personnel moulds plastics the diode packaging part that the equipment is good for high temperature resistant epoxy wraps up diode chip 7, electrode connection piece 6 and high temperature soldering tin layer 12, wraps up PCB board electrode layer part simultaneously. Then draw the busbar from busbar lead-out hole 5 department and draw the busbar and weld busbar pad 3, make things convenient for the diode after the encapsulation to be connected with photovoltaic module. And, all be provided with high temperature soldering tin layer through the top and the bottom of diode chip, and top high temperature soldering tin layer 12 is connected with electrode connection piece 6, and electrode connection piece 6 still is connected with the high temperature soldering tin layer on first conductor 8 surface, and the heat conduction of cooperation electrode connection piece 6 and the heat conduction of high temperature soldering tin layer 12 have improved the heat radiating area of diode chip.

The PCB electrode layer is provided with four first conductors 8, second conductors 9, third conductors 10 and fourth conductors 11, the first conductors 8 and the second conductors 9 are connected through metal through holes of the PCB substrate 1 to form first PCB electrodes, and the third conductors 10 and the fourth conductors 11 are connected to form second PCB electrodes.

The surface of the first conductor 8 and the surface of the third conductor 10 are both provided with high-temperature soldering tin layers 12, the high-temperature soldering tin layers 12 on the surface of the first conductor 8 are connected with the electrode connecting sheet 6, and the high-temperature soldering tin layers 12 on the surface of the third conductor 10 are connected with the bottom of the diode chip 7.

The second electrode of the PCB is connected with the top of the diode chip 7 through the electrode connecting sheet 6 and the high-temperature soldering tin layer 12 to form a diode anode, and the first electrode of the PCB is connected with the bottom of the diode chip 7 through the high-temperature soldering tin layer 12 to form a diode cathode.

Two photovoltaic wire pads 4 and two bus bar pads 3 are provided, one photovoltaic wire pad 4 and one bus bar pad 3 are provided on the first conductor 8, and the other photovoltaic wire pad 4 and the other bus bar pad 3 are provided on the third conductor 10, both the two photovoltaic wire pads 4 and the two bus bar pads 3 being centrosymmetric with respect to the PCB substrate 1.

The first conductor 8 and the second conductor 9 are respectively connected through metal through holes of the PCB substrate, and the third conductor 10 and the fourth conductor 11 are connected, so that external electrodes of a diode chip are formed, and a motor of the diode is respectively connected with the two photovoltaic wire bonding pads 4. When a problem occurs in the photovoltaic wire pad 4, only the photovoltaic wire pad 4 needs to be rearranged, thereby saving cost and time.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A diode packaging structure for a photovoltaic junction box is characterized by comprising a PCB substrate, wherein a PCB electrode layer is arranged on the surface of the PCB substrate, a photovoltaic wire bonding pad and a bus bar bonding pad are arranged on the surface of the PCB electrode layer arranged on the upper surface of the PCB substrate, and a bus bar lead-out hole is formed in the bus bar bonding pad of the PCB substrate;

the PCB electrode layer of upper surface's the surface still is provided with high temperature soldering tin layer, be provided with diode chip on the high temperature soldering tin layer, diode chip with be connected with the electrode connection piece between the PCB electrode layer, diode chip, electrode connection piece and high temperature soldering tin layer are moulded through plastic envelope main part and are annotated the parcel.

2. The diode package structure for the photovoltaic junction box as claimed in claim 1, wherein the PCB electrode layer is provided with four first, second, third and fourth conductors, the first and second conductors are connected through a metal via of the PCB substrate to form a first PCB electrode, and the third and fourth conductors are connected to form a second PCB electrode.

3. The diode package structure for the photovoltaic junction box as claimed in claim 2, wherein the surface of the first conductor and the surface of the third conductor are both provided with high temperature solder layers, the high temperature solder layer on the surface of the first conductor is connected with the electrode connection pad, the high temperature solder layer on the surface of the third conductor is connected with the bottom of the diode chip, the high temperature solder layer is arranged on the top of the diode chip, and the high temperature solder layer is connected with the electrode connection pad.

4. The diode package structure of claim 2, wherein the second electrode of the PCB is connected to the top of the diode chip through the electrode connecting pad and the high temperature solder layer to form a diode anode, and the first electrode of the PCB is connected to the bottom of the diode chip through the high temperature solder layer to form a diode cathode.

5. The diode package structure of claim 1, wherein there are two photovoltaic wire pads and two bus bar pads, one on the first conductor and the other on the third conductor, both symmetrical about the center of the PCB substrate.

6. The diode package structure of claim 1, wherein the plastic package body is made of a high temperature epoxy resin.