CN211428140U - Device-level packaging module and circuit board - Google Patents
Device-level packaging module and circuit board Download PDFInfo
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- CN211428140U CN211428140U CN202020186451.XU CN202020186451U CN211428140U CN 211428140 U CN211428140 U CN 211428140U CN 202020186451 U CN202020186451 U CN 202020186451U CN 211428140 U CN211428140 U CN 211428140U
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Abstract
The utility model provides a device level encapsulation module and a circuit board that is provided with this device level encapsulation module. The utility model discloses in, device level encapsulation module includes base plate and apron, is set up the vacuole formation frame on the base plate by the apron, sets up the sealing layer outside the cavity frame, has formed the cavity that is used for holding bonding wire by the sealing layer, and the cavity is vacuum cavity. The utility model discloses owing to be provided with the cavity, packaging structure can not contact with bonding wire, no matter in the manufacturing process, still in the use, packaging structure can not produce the impact to bonding wire, and it has solved among the prior art to the packaging of power semiconductor module to exist probably cause the problem that bonding wire breaks. Furthermore, the cavity adopts a vacuum cavity structure, so that the conditions of moisture and harmful gas in the cavity can be avoided, and the protection of elements such as chips can be improved.
Description
Technical Field
The utility model relates to a chip package technical field, more specifically say, in particular to device level encapsulation module and a circuit board.
Background
At present, the inside of a low-power semiconductor module is mainly encapsulated by hard encapsulation by using epoxy resin, and the inside of a high-power semiconductor module is encapsulated by soft encapsulation by mostly adopting silica gel.
For the hard package, the epoxy resin used for the hard package has good dielectric properties, and is convenient, fast and cheap. However, unlike polyester resins, epoxy resins must be mixed in a ratio of resin to curing agent, otherwise, part of the epoxy resin or curing agent cannot form reactant, resulting in sticky product surface, failure to reach the desired target of the finished product, and short service life of the epoxy resin hard seal package. In addition, the epoxy resin encapsulating material risks breaking the bonding wire during the encapsulating process. The materials used for hard packaging need to be refrigerated for transportation and storage, and the transportation and storage conditions of the materials are harsh, so that the difficulty of the transportation and storage of the materials is increased, and the production cost is increased invisibly.
For the soft package, the soft package is packaged by using silica gel, the rigidity of the hardened silica gel is poor, and the protection level of the precise structure packaged in the silica gel is low. In addition, with silica gel encapsulation, the encapsulation material can release highly volatile silicone, which hinders the use of the igbt module in a silicon-free environment, such as an automatic spray line. Moreover, silica gel can absorb moisture from air, the moisture in the air may contain some sulfur substances (such as hydrosulfide), if the silica gel absorbs the moisture containing the sulfur substances, the silica gel is polluted, when the polluted mixture reaches the copper surface of the ceramic copper-clad plate, conductive copper sulfide is formed, the situation can spread along an electric field, the module is short-circuited, and the module is seriously damaged.
In both hard package and soft package, although the materials used for the package are different, the two package forms have certain heat transfer and mechanical properties, so that the bonding wire and the chip are adversely affected in normal operation, and the bonding wire is torn off and the chip is damaged in severe cases.
In summary, how to solve the problem that the package of the power semiconductor module in the prior art may cause the bond wire to be broken becomes a problem to be urgently solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
To solve the problems in the prior art, the application provides a device-level packaging module and a circuit board provided with the device-level packaging module. The utility model provides a device level encapsulation module has set up apron vacuole formation frame on the base plate, has set up the sealed layer vacuole formation on the cavity frame, holds bonding wire by the cavity. The utility model discloses in, bonding wire holds in the cavity, and it does not contact with packaging structure, and the condition that packaging structure broken bonding wire can be avoided like this to appear, has solved among the prior art to the packaging that power semiconductor module exists probably cause the problem that bonding wire breaks.
In a first aspect, the present invention provides a device-level package module, including: a substrate; the cover plate and the base plate are arranged at intervals, and the cover plate and the base plate form a cavity frame; and the sealing layer is arranged on the outer side of the cavity frame and used for forming a cavity for accommodating the bonding line, and the cavity is a vacuum cavity.
In one embodiment of the first aspect, the sealing layer is formed by high temperature tape winding.
In an embodiment of the first aspect, the present invention further comprises: the plastic package shell is assembled on the cavity frame, and the sealing layer is located in the inner space of the plastic package shell.
In an embodiment of the first aspect, the plastic package housing includes four side wall plates, an upper end of each side wall plate is connected to the cover plate, and a lower end of each side wall plate is connected to the base plate.
In an embodiment of the first aspect, a first locking groove is formed in the upper portion of the side wall plate and located on the inner side surface of the side wall plate, and used for locking the outer edge of the cover plate, and a second locking groove is formed in the lower portion of the side wall plate and located on the inner side surface of the side wall plate, and used for locking the outer edge of the base plate.
In one embodiment of the first aspect, the cover plate is an insulating cover plate.
In one embodiment of the first aspect, the cover plate is a ceramic cover plate, an alumina cover plate, a copper oxide cover plate or a glass fiber cover plate.
In an embodiment of the first aspect, the substrate is a ceramic copper-clad plate or an aluminum substrate, pins are disposed on the substrate, and cover plate openings corresponding to the pins and used for inserting the pins are disposed on the cover plate.
In an embodiment of the first aspect, the substrate is a copper substrate, pins are formed on one side surface of the copper substrate through a bar cutting process, and cover plate openings corresponding to the pins and used for inserting the pins are formed in the cover plate.
In an embodiment of the first aspect, one end of the pin is connected to the substrate, and the other end of the pin is provided with a step structure for supporting the cover plate.
In an embodiment of the first aspect, the body of the pin is a cylinder, one end of the pin, which is used for being connected with the cover plate, is provided with a plug-in post, the plug-in post is a cylinder, the diameter of the cross section of the plug-in post is smaller than that of the cross section of the body of the pin, and the step structure is formed at the connecting position of the plug-in post and the body of the pin.
In an embodiment of the first aspect, the pins disposed on the outer edge of the substrate are semi-cylindrical, the side of the substrate on which the semi-cylindrical structure pins are disposed is a correction edge, the side wall plate connected to the correction edge is a correction side wall plate, and the correction side wall plate is disposed with a correction cylinder abutting against the plane of the semi-cylindrical structure pins.
In one embodiment of the first aspect, the other side surface of the copper substrate is provided with an insulating sheet.
In one embodiment of the first aspect, the plastic package housing is an epoxy housing or a metal housing.
In a second aspect, the present invention provides a circuit board, wherein the circuit board is provided with a device-level package module as described above.
The beneficial effects are as follows:
the utility model provides a device level encapsulation module, wherein, device level encapsulation module includes base plate and apron, is set up the vacuole formation frame on the base plate by the apron, has set up the sealing layer on the vacuole frame, has formed the cavity by the sealing layer, and the bonding wire holds in the cavity. The utility model discloses in, owing to be provided with the cavity, packaging structure can not contact with bonding wire, no matter be in the manufacturing process, still in the use, packaging structure can not produce the impact to bonding wire, and it has solved among the prior art to the packaging of power semiconductor module to exist probably cause the problem that bonding wire breaks.
Furthermore, the cavity adopts a vacuum cavity structure, so that the conditions of moisture and harmful gas in the cavity can be avoided, and the protection of elements such as chips can be improved.
Furthermore, the cavity is formed by a sealing layer and then is reinforced and protected by the plastic package shell, so that the sealing performance of the cavity can be improved, and the strength of the external structure of the whole device-level packaging module can be ensured.
Furthermore, the plastic package shell is composed of a plurality of side wall plates, and the cover plate, the base plate and the side wall plates are in a plug-in splicing structure, so that the assembly difficulty of the plastic package shell can be reduced.
Still further, the utility model discloses also proposed structural optimization to the pin, set up the grafting post in the main part of pin, formed the stair structure between the main part of grafting post and pin, adopt stair structure bearing apron, can fix a position the installation of apron, can also improve the stability of structure between apron and the base plate simultaneously.
The above-mentioned technical characteristics can be combined in various suitable ways or replaced by equivalent technical characteristics as long as the purpose of the invention can be achieved.
Drawings
The present invention will be described in more detail hereinafter based on embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 shows an appearance structure diagram of a device level package module according to an embodiment of the present invention;
fig. 2 shows an exploded view of a device-level package module in an embodiment of the invention;
fig. 3 shows an exploded view of a device-level package module after changing its angle according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a partial structure of a device-level package module according to an embodiment of the present invention;
fig. 5 is a schematic partial structure diagram of another device-level package module according to an embodiment of the present invention;
fig. 6 is a schematic partial structure diagram of another device-level package module according to an embodiment of the present invention;
fig. 7 shows a schematic structural diagram of a pin in an embodiment of the present invention.
List of reference numerals:
1-a substrate; 2-cover plate; 3-sealing layer; 4-side wall panels; 5-a first card slot; 6-a second card slot; 7-a pin;
8-a plug column; 9-corrective cylinder.
In the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Referring to fig. 1 to fig. 3, fig. 1 is a schematic diagram illustrating an appearance structure of a device-level package module according to an embodiment of the present invention; fig. 2 shows an exploded view of a device-level package module in an embodiment of the invention; fig. 3 shows an exploded view of a device-level package module after changing angles according to an embodiment of the present invention.
The utility model provides a device level encapsulation module, through the functional partitioning, device level encapsulation module can divide into functional part and protection part. The functional part is a component for realizing the specific function of the device-level packaging module and comprises a substrate 1, a chip arranged on the substrate 1, pins 7 arranged on the substrate 1 and bonding lines for connecting the chip and the pins 7; the protection part is used for insulating and protecting the functional part, and the protection part is packaged on the outer side of the functional part.
The utility model discloses a core improvement point lies in: and a cavity for accommodating the bonding wire is arranged on the device-level packaging module. Specifically, the cavity is arranged on the protection part of the device-level package module, and the bonding line is located in the cavity, so that the package part arranged on the substrate 1 (including the chip and the bonding line) cannot impact the bonding line, and the design solves the problem that the bonding line is broken possibly in the package of the power semiconductor module in the prior art.
For the cavity structure, there are three forms: 1. a vacuum cavity; 2. a normal pressure cavity; 3. a pressurized cavity. For a vacuum cavity, it is not an absolute vacuum, but a pressure below one atmosphere, relative to normal pressure, can be considered a vacuum; for a pressurized cavity, which is also relative to atmospheric pressure, a pressure greater than one atmosphere is the pressurized cavity. The vacuum cavity is mainly used for pumping out the gas in the cavity, so that the condition that the substrate 1, the chip or other elements are damaged by the moisture and the harmful gas contained in the gas can be avoided. The pressurizing cavity is mainly used for filling inert gas and the like into the cavity, and the aim of the pressurizing cavity is to remove moisture and harmful gas in the cavity.
Specifically, the device-level package module may be divided into two main parts: one is the substrate 1, as described above, the substrate 1 is provided with the chip, the pins 7 and the bonding wires; one is a plastic package body, the plastic package body is used for packaging the substrate 1, and the plastic package body comprises a cover plate 2, a plastic package shell and a sealing layer 3.
Under the perspective of the main view, the substrate 1 is horizontally placed, the chip, the pins 7 and the bonding wires are arranged on the upper side of the substrate 1, and other functional "layer" structures, such as an insulating sheet, can be arranged on the lower side of the substrate 1. A cover plate 2 is provided on the upper side of the base plate 1, and a cover plate opening is provided in the cover plate 2, through which the tip portions of the leads 7 can pass and protrude upward with respect to the cover plate 2. The gap between the pin 7 and the cover plate opening is sealed, for example, the gap is sealed by welding, so that the stability of the structure between the cover plate 2 and the substrate 1 can be improved while the sealing is achieved. The apron 2 sets up with the interval of base plate 1, and this interval distance is decided according to the height of chip and bonding line, and the minimum distance between apron 2 and the base plate 1 should be greater than the chip or the distance between the highest point of bonding line and the base plate 1, and chip and bonding line are located this clearance like this, just can not receive the oppression of apron 2.
The cover plate 2 is disposed on the substrate 1, for convenience of structural description, a structure formed by connecting the cover plate 2 and the substrate 1 is a cavity frame, and the sealing layer 3 is disposed outside the cavity frame to form a cavity.
The sealing layer 3 is preferably made of a flexible material, such as an adhesive tape, or is a capsule structure made of a high temperature resistant flexible material, such as a high temperature resistant silicone.
Specifically, when the sealing layer 3 is made of an adhesive tape, the cover plate 2 is first fixed to the base plate 1, and then wound on the cavity frame using a heat-resistant adhesive tape to form a cavity.
When the cavity is a vacuum cavity, the heat-resistant adhesive tape is wound on the cavity frame under a vacuum environment.
When the cavity is a pressurized cavity, the heat-resistant adhesive tape is wound on the cavity frame under a high-pressure environment filled with inert gas.
When the cavity is a normal-pressure cavity, the operating environment of the heat-resistant adhesive tape and the cavity frame is a dust-free constant-pressure constant-temperature operating environment.
When the sealing layer 3 is designed to be of a capsule structure, the capsule structure is made of heat-resistant silica gel, the cavity frame is filled into the capsule structure, and an opening of the capsule structure is sealed, so that the cavity frame is arranged in the closed environment of the capsule structure, and a gap between the base plate 1 and the cover plate 2 can form the cavity structure.
In order to provide reliable shock protection to base plate 1, the utility model discloses set up the plastic envelope shell outside base plate 1, the plastic envelope shell is made by hard material, and the plastic envelope shell assembles on the cavity frame, and sealing layer 3 is arranged in the inner space of plastic envelope shell.
The plastic package shell is arranged on the substrate 1 by increasing the air tightness of the plastic package shell, and a cavity structure can be formed by the plastic package shell. In this structure, the sealing layer 3 may be omitted, but the plastic package housing is required to have high airtightness, so as to avoid the occurrence of air leakage.
In order to reduce the difficulty in producing and manufacturing the plastic package shell, the plastic package shell preferably adopts a split type structure.
Specifically, the plastic package housing includes a side wall plate 4, the side wall plate 4 is of a rectangular plate structure, the length of the side wall plate 4 is designed according to the size (length) of the base plate 1, the side wall plate 4 is vertically arranged relative to the base plate 1, the side wall plate 4 is arranged on the side face of the cavity frame, the upper end of the side wall plate 4 is connected with the cover plate 2, and the lower end of the side wall plate 4 is connected with the base plate 1.
Referring to fig. 4 to 6, fig. 4 is a schematic diagram illustrating a partial structure of a device-level package module according to an embodiment of the present invention; fig. 5 is a schematic partial structure diagram of another device-level package module according to an embodiment of the present invention; fig. 6 shows a schematic partial structure diagram of another device-level package module according to an embodiment of the present invention.
The side wall plate 4 is arranged on the cavity frame, and the side wall plate 4 and the base plate 1 or the cover plate 2 can be fixed through glue adhesion.
The side wall plate 4 and the base plate 1 and the cover plate 2 may be fixedly connected by other methods, for example: a first clamping groove 5 is formed in the upper portion of the side wall plate 4 and located on the inner side face of the side wall plate for clamping the outer edge of the cover plate 2, and a second clamping groove 6 is formed in the lower portion of the side wall plate 4 and located on the inner side face of the side wall plate for clamping the outer edge of the base plate 1.
The outer edge of the base plate 1 is clamped into the second clamping groove 6 of the side wall plate 4, and if the bottom surface of the base plate 1 is provided with an insulating sheet, the bottom surface of the insulating sheet is flush with the lower end surface of the side wall plate 4.
If the bottom surface of the substrate 1 is not provided with any component, the bottom surface of the substrate 1 may have a planar structure, and the bottom surface of the substrate 1 may also have a convex structure. The corresponding substrate 1 adopts a plane structure, and the structure of the second clamping groove 6 is as follows: the inner side surface of the side wall plate 4 extends from the lower end surface to the middle part thereof to form an L-shaped groove, so that the bottom surface of the whole module is a plane when the base plate 1 is clamped into the second clamping groove 6 of the side wall plate 4. The bottom surface of the corresponding base plate 1 is provided with a boss structure, the second clamping groove 6 is arranged on the inner side surface of the side wall plate 4, the distance between the second clamping groove 6 and the lower end surface of the side wall plate 4 is the same as the height of the boss structure, and when the base plate 1 is clamped into the second clamping groove 6, the bottom surface of the whole module is also a plane.
Under the general condition, base plate 1 is the rectangular plate structure usually, in order to further reduce the operation degree of difficulty of whole module assembly, the utility model discloses carried out optimal design to side wall plate 4: four side wall plates 4 are provided, four side wall plates 4 are respectively installed on four sides of the base plate 1, among the four side wall plates 4, three side wall plates 4 are connected to form a U-shaped frame structure, and the U-shaped frame structure formed by connecting the three side wall plates 4 has an opening for loading the base plate 1. Wherein the fourth side wall panel 4 is arranged at the opening of the U-shaped structure for closing the opening. The above optimization is mainly directed to the second locking groove 6 being arranged on the side surface of the side wall plate 4.
If the second engaging groove 6 is an L-shaped groove structure formed on the lower end surface of the side wall plate 4, the four side wall plates 4 may be connected to form a frame shaped like a Chinese character 'kou', and then the base plate 1 is directly engaged with the second engaging groove 6 of the side wall plate 4. In this structural design, the plastic envelope shell that four side wall plates 4 formed integrated into one piece, its equipment operation degree of difficulty is lower, and moreover, the structural strength and the leakproofness of plastic envelope shell have also obtained promoting.
According to the technological requirement of the module, the utility model discloses well apron 2 is the insulating cover plate 2 that adopts insulating material preparation to form. Specifically, the cover plate 2 is a ceramic cover plate, an alumina cover plate, a copper oxide cover plate or a glass fiber cover plate.
The plastic package is packaged outside the substrate 1, and should have a certain strength, and therefore, the plastic package is an epoxy resin package or a metal package.
As described above, the cover plate 2 is attached to the leads 7, and is fixed to the substrate 1 by being connected to the leads 7. Then, in order to improve the stability of apron 2 installation on pin 7, the utility model discloses structural optimization has been proposed to pin 7: pin 7 adopts the cylinder structure, the one end and the base plate 1 of pin 7 are connected, specifically be with the chip that sets up on the base plate 1 pass through welded fastening and be connected, pin 7 sets up for the chip is perpendicular, the other end setting of pin 7 is used for bearing apron 2's stair structure, pin 7 is provided with after 2 holes of apron are passed to the one end that stair structure, apron 2 can block on stair structure, through the installation location of stair structure realization apron 2 to and improve the purpose of joint strength between apron 2 and the pin 7.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a pin according to an embodiment of the present invention.
Specifically, the main body of the pin 7 is a long and thin cylinder, the insertion column 8 is disposed at one end (i.e., the end provided with the step structure) of the pin 7, which is used for being connected with the cover plate 2, the insertion column 8 is a cylinder, and the insertion column 8 is integrally formed on the pin 7. The diameter of the cross section of the plug column 8 is smaller than that of the main body of the pin 7, and a step structure is formed at the connecting part of the plug column 8 and the main body of the pin 7.
As a deformation of above-mentioned structure, the peg graft post 8 can also adopt other non-circular (cross section) cylinders, for example triangle-shaped, oval, square etc. adopt non-cylinder structural design, can carry on spacingly through the installation of shape to apron 2, and it can improve the utility model discloses in the equipment precision between each part.
Furthermore, the pins 7 arranged on the outer edge of the substrate 1 are of a semi-cylindrical structure, the side edge of the substrate 1 on which the pins of the semi-cylindrical structure are arranged is a correction edge, the side wall plate 4 connected with the correction edge is a correction side wall plate, and the correction side wall plate is provided with correction cylinders 9 which are abutted to the plane of the pins 7 of the semi-cylindrical structure. After the correction cylinder 9 is butted with the semi-cylindrical pins 7, a complete cylinder structure can be formed, the cover plate 2 is also provided with the circular cover plate 2 hole corresponding to the correction cylinder 9, so that the correction cylinder 9 and the semi-cylindrical pins 7 are inserted into the circular cover plate 2 hole, the installation of the correction side wall plate 4 is positioned, and the installation precision of the correction side wall plate 4 is improved.
The utility model discloses a concrete embodiment as follows: the method comprises the following steps of mounting a chip on a substrate 1, then routing and bonding, then welding pins 7, arranging a cover plate 2 on the substrate 1, then winding the cover plate 2 and the substrate 1 of a module by using high-temperature-resistant adhesive tape in a vacuum environment to form a sealing layer 3, and forming a basic vacuum cavity by the sealing layer 3; then, the module is encapsulated by epoxy resin or metal to reinforce the module and improve the mechanical strength.
The utility model discloses replace the encapsulating material (entity structure) of parcel around bonding wire originally with vacuum structure, it has reduced the influence of encapsulating material to chip and bonding wire, has prolonged the life of module, has practiced thrift manufacturing cost.
The utility model provides an encapsulation mode can save packaging structure's inner space, and it can practice thrift about 50% plastic envelope material, has reduced manufacturing cost, has improved the profit of module. And the vacuum environment makes the module use under the very bumpy environment, the bonding wire can not be pulled apart by packaging material, the condition that the bonding wire is broken is more difficult to appear when normally working, and the service life of the module is greatly prolonged.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (15)
1. A device-level package module, comprising:
a substrate;
the cover plate and the base plate are arranged at intervals, and the cover plate and the base plate form a cavity frame;
and the sealing layer is arranged on the outer side of the cavity frame and used for forming a cavity for accommodating the bonding line, and the cavity is a vacuum cavity.
2. The device-scale package module of claim 1, wherein the sealing layer is formed by high temperature tape wrapping.
3. The device-scale package module of claim 1, further comprising:
the plastic package shell is assembled on the cavity frame, and the sealing layer is located in the inner space of the plastic package shell.
4. The device-level package module of claim 3, wherein the plastic encasement comprises four sidewall plates, an upper end of the sidewall plates being connected to the cover plate, and a lower end of the sidewall plates being connected to the base plate.
5. The device-level package module according to claim 4, wherein a first locking groove is formed in the upper portion of the side wall plate and located on the inner side surface of the side wall plate, and used for locking the outer edge of the cover plate, and a second locking groove is formed in the lower portion of the side wall plate and located on the inner side surface of the side wall plate, and used for locking the outer edge of the substrate plate.
6. The device-scale package module of any of claims 1 to 5, wherein the cover plate is an insulating cover plate.
7. The device-scale package module of claim 6, wherein the cover plate is a ceramic cover plate, an aluminum oxide cover plate, a copper oxide cover plate, or a glass fiber cover plate.
8. The device-level package module according to claim 1, wherein the substrate is a ceramic copper-clad plate or an aluminum substrate, pins are disposed on the substrate, and cover plate openings corresponding to the pins and used for inserting the pins are disposed on the cover plate.
9. The device-scale package module according to claim 1, wherein the substrate is a copper substrate, one side of the copper substrate is formed with pins by a rib cutting process, and the cover plate is provided with cover plate openings corresponding to the pins and used for inserting the pins.
10. The device-scale package module according to claim 8 or 9, wherein one end of the pin is connected to the substrate, and the other end of the pin is provided with a step structure for supporting the cover plate.
11. The device-scale package module of claim 10, wherein the body of the pin is a cylinder, and a plug-in post is disposed at an end of the pin for connecting with the cover plate, the plug-in post being a cylinder, a cross-sectional diameter of the plug-in post being smaller than a cross-sectional diameter of the body of the pin, and the step structure is formed at a connecting portion of the plug-in post and the body of the pin.
12. The device-scale package module according to claim 8 or 9, wherein the pins disposed on the outer edge of the substrate are semi-cylindrical, the side of the substrate on which the semi-cylindrical pins are disposed is a correction edge, the side wall plate connected to the correction edge is a correction side wall plate, and the correction side wall plate is disposed with a correction cylinder abutting against the plane of the semi-cylindrical pins.
13. The device-scale package module of claim 9, wherein the other side of the copper substrate is provided with an insulation sheet.
14. The device-level package module of claim 3, wherein the plastic package housing is an epoxy housing or a metal housing.
15. A circuit board on which a device-scale package module according to any one of claims 1 to 14 is disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020186451.XU CN211428140U (en) | 2020-02-19 | 2020-02-19 | Device-level packaging module and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020186451.XU CN211428140U (en) | 2020-02-19 | 2020-02-19 | Device-level packaging module and circuit board |
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| CN211428140U true CN211428140U (en) | 2020-09-04 |
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| CN202020186451.XU Active CN211428140U (en) | 2020-02-19 | 2020-02-19 | Device-level packaging module and circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864140A (en) * | 2020-12-31 | 2021-05-28 | 西安交通大学 | Novel high temperature resistant SiC MOSFET half-bridge multilayer packaging structure |
| CN114514105A (en) * | 2020-09-16 | 2022-05-17 | 华为技术有限公司 | Injection mold and injection molding method |
-
2020
- 2020-02-19 CN CN202020186451.XU patent/CN211428140U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114514105A (en) * | 2020-09-16 | 2022-05-17 | 华为技术有限公司 | Injection mold and injection molding method |
| CN114514105B (en) * | 2020-09-16 | 2023-08-22 | 华为技术有限公司 | Injection mold and injection molding method |
| CN112864140A (en) * | 2020-12-31 | 2021-05-28 | 西安交通大学 | Novel high temperature resistant SiC MOSFET half-bridge multilayer packaging structure |
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