CN217280738U

CN217280738U - Surface-mounted ceramic low-temperature glass fusion sealing structure

Info

Publication number: CN217280738U
Application number: CN202221178078.9U
Authority: CN
Inventors: 赵桂林; 陈学善
Original assignee: Fujian Chuangxin Microelectronics Co Ltd
Current assignee: Fujian Chuangxin Microelectronics Co Ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-08-23
Anticipated expiration: 2032-05-17

Abstract

The utility model discloses a surface mounting formula pottery low temperature glass seals structure by fusion, it includes bottom plate and apron, first recess has been seted up on the bottom plate, the second recess has been seted up on the apron, and two relative borders of the open end of second recess downwardly extending respectively form the bellying that the longitudinal section is the V font, and the border undercut of the open end of first recess under the bellying forms the depressed part relative with the bellying, and the lead frame is located in the second recess, the laminating of leading wire of lead frame the bellying with curve between the depressed part stretches out and certainly the both sides of bottom plate are buckled downwards and are the J font pin, and the border sealing packing along first recess has first low temperature glass layer between lead wire and the bottom plate, and the border sealing packing along the second recess has second low temperature glass layer between lead wire and the apron. This structure makes the lead wire from the both sides of bottom plate difficult broken of time low temperature glass layer when buckling downwards, guarantees the gas tightness, has promoted packaging efficiency and yields.

Description

Surface-mounted ceramic low-temperature glass fusion sealing structure

Technical Field

The utility model relates to a microelectronics packaging application technical field especially relates to a surface mounting formula pottery low temperature glass melts a structure.

Background

The Small Out-Line Package (SOP) is a common component form, and with the development of technology, an SOJ Package structure is derived on the basis of the SOP, and is characterized in that leads are led Out from two sides of the Package and downwards in a J shape, so that bonding pads on a Printed Circuit Board (PCB) can be more concentrated, and the area of the whole Package on the PCB is smaller, so that the SOP is applied to a large number of plastic Package devices. However, in the process of SOJ packaging, the lead wire is bent to cause low-temperature glass around the lead wire to be broken, so that the air tightness of the chip is damaged, defective products are caused, and the yield of products is still to be improved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a surface mounting formula pottery low temperature glass melts and seals structure.

Realize the utility model discloses the technical scheme of purpose is: a surface-mounted ceramic low-temperature glass sealing structure comprises a bottom plate and a cover plate, wherein the bottom plate is made of ceramic, a first groove is formed in the bottom plate, a second groove is formed in the cover plate, the bottom plate and the cover plate are buckled oppositely, the first groove and the second groove relatively enclose an accommodating cavity of a lead frame, two opposite edges of an opening end of the second groove respectively extend downwards to form a protruding portion with a V-shaped longitudinal section, the edge of the opening end of the first groove under the protruding portion is sunken downwards to form a sunken portion opposite to the protruding portion, the lead frame is located in the second groove, a lead of the lead frame is attached to a curve between the protruding portion and the sunken portion, extends out of the bottom plate and is bent downwards from two sides of the bottom plate to form a J-shaped pin, and a first low-temperature glass layer is hermetically filled between the lead and the bottom plate along the edge of the first groove, and a second low-temperature glass layer is hermetically filled between the lead and the cover plate along the edge of the second groove.

Further, the width of each lead is 0.4mm, the distance between every two leads is 1.27mm, and the distance between every two adjacent leads is 1.27 mm.

Further, the dimensions of the surfaces of the cover plate and the base plate are 6.5mm 6mm 0.8 mm; the first grooves have a dimension of 3.5mm by 3.7mm by 0.25 mm; the second grooves have a dimension of 4.5mm 4.9mm 0.25 mm.

The utility model discloses the surface mounting formula pottery low temperature glass seals structure creatively first recess with the border of second recess sets up unsmooth complex depressed part and bellying, and depressed part and bellying are the V font, makes the lead wire on the one hand after sealed drying certainly low temperature glass layer is difficult broken when buckling downwards in the both sides of bottom plate, guarantees the gas tightness, and on the other hand for counterpoint more easily when apron and bottom plate equipment, promoted packaging efficiency and yields.

Drawings

FIG. 1 is a schematic longitudinal sectional view of a surface-mount ceramic low-temperature glass sealing structure according to an embodiment of the present invention;

fig. 2 is a schematic front view of the bottom plate of the present invention;

fig. 3 is a schematic view of the structure of the cover plate of the present invention.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be made with reference to the accompanying drawings.

As shown in fig. 1 to fig. 3, a surface-mounted ceramic low-temperature glass sealing structure comprises a bottom plate 1 and a cover plate 2 made of ceramic, wherein a first groove 11 is formed on the bottom plate 1, a second groove 21 is formed on the cover plate 2, the bottom plate 1 and the cover plate 2 are buckled with each other, the first groove 11 and the second groove 21 relatively enclose an accommodating cavity 3 of a lead frame 10, two opposite edges of an open end 211 of the second groove 21 respectively extend downwards to form a protruding portion 2111 with a V-shaped longitudinal section, an edge of an open end 111 of the first groove 11 under the protruding portion 2111 is recessed downwards to form a recessed portion 1111 opposite to the protruding portion 2111, the lead frame 10 is located in the second groove 21, a lead 101 of the lead frame 10 is attached to a contour curve between the protruding portion 2111 and the recessed portion 1111 to extend out and bend downwards from two sides of the bottom plate 1 to form a J-shaped pin, the first low-temperature glass layer 4 is sealed and filled between the lead 101 and the bottom plate 1 along the edge of the open end 111 of the first groove 11, and the second low-temperature glass layer 5 is sealed and filled between the lead 101 and the cover plate 2 along the edge of the open end 211 of the second groove 21.

The lead frame of the embodiment has eight leads, the width of each lead is 0.4mm, and the distance between every two leads is 1.27 mm; the distance between the adjacent leads is 1.27mm, and the sizes of the surfaces of the cover plate and the bottom plate are 6.5mm by 6mm by 0.8 mm; the first groove has a dimension of 3.5mm 3.7mm 0.25 mm. The second grooves have a dimension of 4.5mm 4.9mm 0.25 mm.

The surface-mounted ceramic low-temperature glass melt-sealing structure realized by the embodiment has higher reliability than an 8-wire IC plastic packaging shell, and meanwhile, the occupied area of a bonding pad on a PCB can be reduced by the J-shaped lead design, so that the plastic packaging shell with the same size as a welding chassis can be replaced.

The above only be the embodiment of the utility model discloses a not consequently restriction the patent scope of the utility model, all utilize the equivalent flow transform that the content of the specification was made, or direct or indirect application is in other relevant technical field, all including on the same reason the utility model discloses a patent protection within range.

Claims

1. The utility model provides a table pastes formula pottery low temperature glass and melts a structure, its includes bottom plate and the apron of pottery system, first recess has been seted up on the bottom plate, the second recess has been seted up on the apron, the bottom plate with the relative lock of apron, just first recess with the second recess encloses the holding chamber of synthetic lead frame relatively, its characterized in that: two relative borders of the open end of second recess downwardly extending respectively form the bellying that the longitudinal section is the V font, under the bellying the border undercut of the open end of first recess form with the bellying relative depressed part, the lead frame is located in the second recess, the lead wire laminating of lead frame the bellying with curve between the depressed part stretches out the bottom plate and certainly the both sides of bottom plate are buckled downwards and are J font pin, the lead wire with follow between the bottom plate the sealed packing in border of first recess has first low temperature glass layer, the lead wire with follow between the apron the sealed packing in border of second recess has second low temperature glass layer.

2. The surface-mount ceramic low-temperature glass frit sealing structure according to claim 1, wherein: the width of each lead is 0.4mm, the distance between every two leads is 1.27mm, and the distance between every two adjacent leads is 1.27 mm.

3. The surface-mount ceramic low-temperature glass frit sealing structure according to claim 1, wherein: the dimensions of the surfaces of the cover plate and the base plate are 6.5mm by 6mm by 0.8 mm; the first grooves have a dimension of 3.5mm by 3.7mm by 0.25 mm; the second grooves have a dimension of 4.5mm 4.9mm 0.25 mm.