CN217280737U - Large-size ceramic low-temperature glass sealing structure - Google Patents
Large-size ceramic low-temperature glass sealing structure Download PDFInfo
- Publication number
- CN217280737U CN217280737U CN202221178069.XU CN202221178069U CN217280737U CN 217280737 U CN217280737 U CN 217280737U CN 202221178069 U CN202221178069 U CN 202221178069U CN 217280737 U CN217280737 U CN 217280737U
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- Prior art keywords
- substrate
- lead
- bottom plate
- temperature glass
- low
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a large-size ceramic low-temperature glass sealing structure, which comprises a bottom plate and a cover plate which are oppositely arranged, wherein the bottom plate is provided with a first groove; a substrate is clamped between the bottom plate and the cover plate, the middle of the substrate is hollowed to form a hollowed-out part, the hollowed-out part is communicated with the first groove and is enclosed to form an accommodating cavity, the lead frame is located in the first groove and comprises a chip and a lead, the lead in the accommodating cavity is electrically connected with the chip through a bonding wire, a first low-temperature glass layer is hermetically filled between the lead and the bottom plate along the edge of the first groove, and a second low-temperature glass layer is hermetically filled between the lead and the substrate along the edge of the substrate; and a third low-temperature glass layer is hermetically filled between the substrate and the cover plate along the edge of the substrate. The utility model discloses only open first recess between on the bottom plate to change traditional apron structure of taking the recess into the integrated configuration of flat apron and annular base plate, make the processing of apron more simple, reduce equipment cost.
Description
Technical Field
The utility model relates to a microelectronics encapsulation application technique field especially relates to a jumbo size pottery low temperature glass melts and seals structure.
Background
The ceramic low-temperature glass sealing is a packaging form sealed by ceramic, a lead frame and low-temperature glass, the packaging structure enables a chip inside the packaging structure to be electrically connected with an external circuit board, and meanwhile, the purpose of reliable sealing is achieved.
Common ceramic low temperature glass seals the structure like chinese patent number 201520766295.3's utility model patent shows, and it discloses a 44 line element surface package structure, including bottom plate and the apron of ceramic system, the relative surperficial middle part of bottom plate and apron all is provided with the recess that is used for placing the component, the clearance intussuseption between bottom plate and the apron except that the recess is filled with low temperature and seals glass, and the lead wire of component is worn out from low temperature and is extended to outside bottom plate and the apron. Although the structure has good heat dissipation and air tightness, when a large-size chip such as a 144-wire chip is produced, a large-size ceramic cover plate is easy to deform due to stamping shrinkage in the production process, a larger press is needed for ensuring the product quality, the investment of equipment is increased, and on the other hand, if soldering tin at a lead is not cleaned up, the lead of the chip is likely to be pulled out during the dismounting process of the chip, so that a bonding wire falls off.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a jumbo size pottery low temperature glass seals structure by fusing.
Realize the utility model discloses the technical scheme of purpose is: a large-size ceramic low-temperature glass sealing structure comprises a ceramic bottom plate and a ceramic cover plate which are arranged oppositely, wherein a first groove is formed in the bottom plate; a ceramic substrate is clamped between the bottom plate and the cover plate, the substrate and the cover plate are the same in size, a hollow part is formed in the middle of the substrate in a hollow mode, the hollow part is communicated with the first groove and encloses a containing cavity used for containing a lead frame, the lead frame is located in the first groove and comprises a chip and a lead, the lead in the containing cavity is electrically connected with the chip through a bonding wire, a pin part of the lead extends out from the position between the bottom plate and the substrate, a first low-temperature glass layer is filled between the lead and the bottom plate along the edge of the first groove in a sealing mode, and a second low-temperature glass layer is filled between the lead and the substrate along the edge of the substrate in a sealing mode; and a third low-temperature glass layer is hermetically filled between the substrate and the cover plate along the edge of the substrate.
Furthermore, the end side of the lead wire in the accommodating cavity is attached to the groove wall of the first groove and is bent downwards. When the chip is detached from the circuit board, the end side of the lead wire positioned in the accommodating cavity is attached to the groove wall of the first groove and is bent downwards, so that the lead wire is not easy to fall off, and the stability of the bonding wire mounting structure is further ensured.
The utility model discloses a jumbo size pottery low temperature glass melts and seals the structure only first recess between opening on the bottom plate, then change traditional apron structure of taking the recess into the integrated configuration of flat apron and annular base plate for the processing of apron is more simple, to the great ceramic apron of size, need not the high pressure press, reduces equipment cost.
Drawings
FIG. 1 is a schematic longitudinal sectional view of a large-sized ceramic low-temperature glass sealing structure according to an embodiment of the present invention;
fig. 2 is a schematic top view of the substrate according to the embodiment of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1, a large-size ceramic low-temperature glass sealing structure comprises a ceramic bottom plate 1 and a cover plate 2 which are oppositely arranged, wherein a first groove 11 is formed on the bottom plate 1; a ceramic substrate 3 is clamped between the bottom plate 1 and the cover plate 2, the substrate 3 and the cover plate 2 have the same size, a hollow part 31 is formed in the middle of the substrate 3 in a hollow manner, the hollow part 31 is communicated with the first groove 11 and encloses an accommodating cavity 4 for accommodating a lead frame 10, the lead frame 10 is located in the first groove 11, the lead frame 10 comprises a chip 101 and a lead 102, the lead 102 in the accommodating cavity 4 is electrically connected with the chip 101 through a bonding wire 103, a lead part 1021 of the lead 102 extends out from between the bottom plate 1 and the cover plate 2, and an end side 1022 of the lead 102 located in the accommodating cavity 4 is attached to a groove wall 111 of the first groove 11 and bends downwards; a first low-temperature glass layer 5 is hermetically filled between the lead 102 and the bottom plate 1 along the edge of the first groove 11, and a second low-temperature glass layer 6 is hermetically filled between the lead 102 and the substrate 3 along the edge of the substrate 3; and a third low-temperature glass layer 7 is hermetically filled between the substrate 3 and the cover plate 2 along the edge of the substrate 3.
The above only be the embodiment of the utility model discloses a not consequently restriction the patent scope of the utility model, all utilize the equivalent flow transform that the content of the specification was made, or direct or indirect application is in other relevant technical field, all including on the same reason the utility model discloses a patent protection within range.
Claims (2)
1. The utility model provides a jumbo size pottery low temperature glass seals structure by fusion, its includes relative bottom plate and the apron of ceramic system that sets up, first recess has been seted up on the bottom plate, its characterized in that: a ceramic substrate is clamped between the bottom plate and the cover plate, the substrate and the cover plate are the same in size, a hollow part is formed in the middle of the substrate in a hollow mode, the hollow part is communicated with the first groove and encloses a containing cavity used for containing a lead frame, the lead frame is located in the first groove and comprises a chip and a lead, the lead in the containing cavity is electrically connected with the chip through a bonding wire, a pin part of the lead extends out from the position between the bottom plate and the substrate, a first low-temperature glass layer is filled between the lead and the bottom plate along the edge of the first groove in a sealing mode, and a second low-temperature glass layer is filled between the lead and the substrate along the edge of the substrate in a sealing mode; and a third low-temperature glass layer is hermetically filled between the substrate and the cover plate along the edge of the substrate.
2. The large-size ceramic low-temperature glass frit sealing structure according to claim 1, wherein: the end side of the lead wire positioned in the accommodating cavity is attached to the groove wall of the first groove and bends downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221178069.XU CN217280737U (en) | 2022-05-17 | 2022-05-17 | Large-size ceramic low-temperature glass sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221178069.XU CN217280737U (en) | 2022-05-17 | 2022-05-17 | Large-size ceramic low-temperature glass sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217280737U true CN217280737U (en) | 2022-08-23 |
Family
ID=82887266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221178069.XU Active CN217280737U (en) | 2022-05-17 | 2022-05-17 | Large-size ceramic low-temperature glass sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217280737U (en) |
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2022
- 2022-05-17 CN CN202221178069.XU patent/CN217280737U/en active Active
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