JP2002228891A - Package for optical communication and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for optical communication which is inexpensive, and has high workability and airtight reliability, and to provide a method for manufacturing the same. SOLUTION: In a package 10 for optical communication which has a base body 15 made of ceramics or a metal in which a cavity 14 for mounting a semiconductor device for optical communication is formed in the inside, a through hole 20 which is formed at the side part of the base body 15 to communicate with the cavity 14, a metal fixing member 21 inserted into the through hole 20 and formed in a cylindrical shape, and a translucent member provided so as to be opposed to the tip part of a optical fiber in the cylinder of the metal fixing member 21, the translucent member is composed of a flat plate lens of substantially circular glass, and cemented to the metal fixing member 21 through a metal frame composed of a ring-shaped flat plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication package for accommodating a semiconductor element for optical communication and a method of manufacturing the same, and more particularly, to a light transmitting package comprising a flat lens opposed to the tip of an optical fiber. The present invention relates to an optical communication package including a member and a method for manufacturing the same.

[0002]

2. Description of the Related Art Optical communication packages for accommodating semiconductor elements for optical communication include those made of ceramic or metal, and the connection shape of external connection terminals is a dual-in-line type. And a butterfly (Butterfly) type package. For example, as shown in FIG. 5, a metal butterfly optical communication package is made of a metal member such as copper tungsten whose bottom has excellent heat dissipation and a kovar whose coefficient of thermal expansion is close to that of ceramic on the side. , A base 52 having a cavity 51 for mounting a semiconductor element therein is provided. The base body 52 has a through-hole 53 communicating with the cavity 51 on the side surface thereof, and a metal such as Kovar formed in a cylindrical shape having a cavity for passing an optical signal to the cavity 51 around the through-hole 53. A metal fixing member 54 made of a material is brazed and joined. This metal fixing member 5
A light transmissive member 55 is joined to 4 to close the cylinder and keep the inside of the cavity 51 airtight and at the same time, to oppose the tip of the optical fiber. A window frame is formed in the side surface of the base 52, and a feed-through substrate made of a ceramic material such as an aluminum oxide sintered body is provided on the window frame from the cavity 51 side of the base 52 to the outside of the base 52. A conductor wiring pattern 56 is formed on the cavity 51 side and connected to the semiconductor element via a bonding wire or the like. The conductor wiring pattern 56 on the outer portion of the base 52 is brazed and joined in a butterfly shape,
An external connection terminal 57 made of a metal member such as Kovar for external electrical connection is provided.

In this optical communication package, a semiconductor element is adhered to a cavity 51 of a base 52, and the semiconductor element is electrically connected to an external connection terminal 57 by connecting the semiconductor element and a conductor wiring pattern 56 with a bonding wire or the like. Thereafter, the optical fiber member is welded to the metal fixing member 54 using a laser such as YAG, and a lid 58 made of metal, ceramic, or the like is sealed on the upper surface of the base 52 with a sealing material made of glass, brazing material, resin, or the like. A semiconductor device is formed by joining with the above, and a screw is passed through the mounting hole 59 and screwed to a board or the like.

Usually, the cavity 5 of the optical communication package is used.
In order to keep the inside of the housing 1 airtight, the translucent member 55 is joined to the metal fixing member 54, as shown in FIG. 6, by applying a thin film to the translucent member 55 made of sapphire or an amorphous glass plate. It is disclosed in Japanese Patent Application Laid-Open No. Hei 10 (1998) -102 that a metallized layer 60 is formed, and the metallized layer 60 and the metal fixing member 54 are joined by brazing.
No. 41417.

[0005]

However, the conventional method for manufacturing an optical communication package as described above has the following problems. (1) When a thin metallized layer is formed on a sapphire or amorphous glass plate and is directly joined to a metal fixing member, the seal path width of the thin metallized layer is reduced, resulting in severe environmental conditions. In this case, there is a problem that cracks occur in sapphire and the amorphous glass plate to deteriorate airtightness. (2) When a sapphire glass plate is used for the translucent member, there is a problem that sapphire is expensive. (3) In the process of manufacturing the optical communication package, if the translucent member is handled alone, the surface is easily damaged by handling. The present invention has been made in view of such circumstances,
An object of the present invention is to provide an optical communication package which is inexpensive, has high workability, and has airtight reliability, and a method for manufacturing the same.

[0006]

According to the present invention, there is provided an optical communication package according to the present invention, comprising: a ceramic or metal base in which a cavity for mounting a semiconductor element for optical communication is formed; A through hole formed in the side surface of the base body and communicating with the cavity; a metal fixing member inserted into the through hole and formed in a cylindrical shape; and a metal fixing member provided in the cylinder of the metal fixing member so as to face the tip of the optical fiber. In the optical communication package having the light-transmitting member provided, the light-transmitting member is formed of a substantially circular glass flat lens, and further joined to a metal fixing member via a metal frame formed of a ring-shaped flat plate. Have been. A metal frame is interposed and joined between the translucent member and the metal fixing member to form a large seal path width at the junction between the translucent member and the metal frame, and between the metal frame and the metal fixing member. An optical communication package which is free from cracks in the light-transmitting member made of a glass plate, uses glass for the light-transmitting member, is inexpensive, and has high airtight reliability at each joint.

Here, the metal frame and the translucent member are joined so that a portion in contact with the translucent member is covered with a joining material over the entire circumference of the metal frame, and the outer diameter of the metal frame is smaller than the outer diameter of the metal frame. And the diameter of the light-transmitting member. Thereby, since the metal frame and the light-transmitting member can increase the meniscus due to the flow of the bonding material, the seal path width can be increased, and the seal path width at the joint between the metal frame and the metal fixing member can be increased. An optical communication package with high airtight reliability can be obtained.

It is preferable that the translucent member and the metal frame are joined with a low melting point glass, and the metal frame and the metal fixing member are joined with a low-temperature brazing material. With this, the meniscus can be formed up to the outer peripheral end surface of the translucent member by the low melting point glass, so that the seal path width can be increased, and the seal path width between the metal frame and the metal fixing member can be increased. A communication package is obtained.

According to the present invention, there is provided a method of manufacturing an optical communication package according to the present invention, comprising the steps of: forming a cavity on a side surface of a ceramic or metal base having a cavity for mounting a semiconductor element for optical communication therein; Forming a through hole communicating with, and joining a translucent member for facing the tip of the optical fiber into a tube of a metal fixing member formed in a cylindrical shape, and inserting the metal fixing member into the through hole. In the method for manufacturing an optical communication package bonded to a base, the light-transmitting member is formed of a substantially circular glass plate lens,
A first step of joining a metal frame made of a ring-shaped flat plate to the outer peripheral edge of one surface of the flat lens with a first joining material made of low-melting glass, and a second step of applying Ni plating and Au plating to the metal frame; And a third step of joining the translucent member to the metal fixing member with a second joining material made of a low-temperature brazing material via a metal frame. A meniscus is formed between the flat lens and the metal frame to the outer peripheral end surface of the flat lens by bonding with the first bonding material made of low-melting glass, so that the seal path width can be widened, and the metal frame and the metal fixing member can be formed. Also, the width of the ring of the metal frame becomes the width of the seal path between them, so that the metal frame can be formed wider. Therefore, no crack occurs in the light transmitting member made of glass. In addition, the second temperature may be lower than the bonding temperature of the first bonding material.
Since the joining temperature of the joining material can be lowered, the first joining material is not re-melted at the time of joining the metal frame and the metal fixing member. Furthermore, since the metal frame is bonded to a flat lens made of inexpensive glass, there is little generation of scratches due to handling in the manufacturing process, and a method for manufacturing an optical communication package that is inexpensive, has high bonding strength, and has high airtight reliability is provided. Can be provided.

Here, the diameter of the outer peripheral side of the metal frame is formed to be larger than the diameter of the translucent member, and the first joining material of the joining portion between the translucent member and the metal frame is a glass pellet made of low melting glass. It is preferable to use a heat sink and heat after mounting. Accordingly, since the glass pellet made of the low melting point glass is used, the first bonding material can be easily placed and heated, and the portion of the metal frame having a diameter larger than that of the light transmitting member or the light transmitting member can be used. Since the seal path width can be made large by the meniscus of the low-melting glass that has melted and flowed out to the outer peripheral end surface of the optical communication package, a method of manufacturing an optical communication package having high bonding strength and high airtight reliability can be provided.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. 1A and 1B are a plan view and a sectional view of an optical communication package according to an embodiment of the present invention, respectively, and FIG. 2 is a joining portion of a metal fixing member of the optical communication package. 3 is an explanatory view of a joint between the light transmitting member and the metal frame of the optical communication package, and FIGS. 4A and 4B are perspective views of modified examples of the optical communication package. FIG.

As shown in FIGS. 1A and 1B, an optical communication package 10 according to an embodiment of the present invention includes, for example, a metal metal wall 11 serving as a frame, a And a metal base 13 having a fixing hole 12 for attachment to a metal base 13 by brazing, and a cavity 14 for mounting a semiconductor element for optical communication therein.
Is provided. A cavity 14 is provided on the side surface of the base 15 facing the metal wall 11.
Is provided on the inner peripheral wall surface of the window frame-shaped hole 16.
9 are brazed. Feedthrough board 19
The conductor pattern 18 on the cavity 14 side is connected to the semiconductor element via wire bonding or the like. A lead frame 17 serving as an external connection terminal is brazed to the conductor pattern 18 outside the metal wall 11 in a butterfly shape. A through-hole 20 communicating with the cavity 14 is provided in a side surface of the metal wall 11 to which the feed-through board 19 is not joined. A cylindrical metal fixing member 21 is inserted into the through-hole 20. It is joined to the metal wall 11 of the base 15 with a joining material 22 such as brazing material, resin, or the like.

As shown in FIG. 2, the metal fixing member 21 is provided with a light transmitting member 23 made of a substantially circular glass flat lens for facing the tip of an optical fiber 24 in a cylinder. A metal frame 2 made of a ring-shaped flat plate between the translucent member 23 and the metal fixing member 21.
5 is interposed. The translucent member 23 and the metal frame 25 are joined using a first joining material 26, and the metal frame 25 and the metal fixing member 21 are joined using a second joining material 27.

As shown in FIG. 3, an optical communication package 1 is provided.
0, the metal frame 25 and the translucent member 23 are brought into contact with the first bonding material 26 so that there is no gap between the end surface of the metal frame 25 and the end surface of the translucent member 23; Are joined so that the contacting parts are covered with the first joining material 26 over the entire circumference of the metal frame 25, and the diameter of the outer peripheral side of the metal frame 25 is
It is preferable that the diameter be larger than the diameter of the light transmitting member 22.

The optical communication package 10 uses a low-melting-point glass for the first bonding material 26 between the light transmitting member 23 and the metal frame 25, and forms the first bonding material 26 between the metal frame 25 and the metal fixing member 21. It is preferable to use a low-temperature brazing material for the second bonding material 27.

Next, a method of manufacturing the optical communication package 10 according to one embodiment of the present invention will be described with reference to FIGS. The metal wall 11 is formed by cutting a metal lump such as Kovar or 42 alloy having a thermal expansion coefficient similar to that of ceramic to form a concave portion, or by cutting and bending a pipe-shaped member and then bending it. Further, a metal base 13 having a fixing hole 12 for mounting to a mounting member such as a board with screws is formed of a metal plate such as copper tungsten which is excellent in radiating heat generated from a semiconductor element. The metal wall 11 and the metal base 13 are, for example, A
A high-temperature brazing material such as a g-Cu brazing material is heated by being sandwiched between joints and brazed to form a cavity 14 for mounting a semiconductor element such as a laser diode for light communication and a light emitting diode therein. The base 15 is formed.
A substantially rectangular window frame-like hole 16 communicating with the cavity 14 is formed in the side surface of the base 15 facing the metal wall 11, and the window frame-like hole 16 is made of ceramic. Ag-C feed-through substrate 19
A high-temperature brazing material such as a u-brazing material is sandwiched between the joints and heated to be brazed.

The feed-through substrate 19 is a laminated body in which a conductor pattern is formed on each ceramic green sheet formed of a ceramic such as alumina as an insulator with a high melting point metal such as tungsten or molybdenum, and each ceramic green sheet is laminated. Is formed by firing. As one of the conductive patterns, the conductor pattern is formed on an outer peripheral portion of the feed-through board 19 which is in contact with the window frame-shaped hole 16. Is brazed with an Ag-Cu brazing material or the like. The other is to form a conductive pattern 18 for conduction between the inside and the outside of the metal wall 11. After the conductor pattern 18 of the feed-through board 19 is plated with Ni, the feed-through board 19 is brought into contact with the window frame-shaped hole 16 and the lead serving as an external connection terminal is formed on the conductor pattern 18 outside the metal wall 11. The frame 17 is brought into contact with the butterfly mold, and each contact portion is made of Ag-C
Brazing with a high-temperature brazing material such as a u-brazing material. Further, the base 15 to which the feedthrough substrate 19 and the lead frame 17 are joined is subjected to Ni plating and Au plating.
The conductor pattern 18 in the cavity 14 is used for connecting to a semiconductor element by a bonding wire or the like.

On the other hand, a substantially circular through-hole 20 communicating with the cavity 14 is formed in the side surface of the metal wall 11 to which the feed-through substrate 19 is not joined. A metal fixing member 21 made of Kovar, 42 alloy or the like in which a light-transmitting member 23 for joining the tip of the optical fiber 24 is joined is inserted into the tube and is joined using a joining material 22.

In the cylinder of the metal fixing member 21, a step portion having a different cylinder inner diameter for mounting the translucent member 23 is formed by cutting or the like, so that the translucent portion is formed through the metal frame 25. The sex member 23 can be stably mounted, and can be easily joined to the metal fixing member 21.

Next, the metal fixing member 2 of the translucent member 23
1 will be described. First, as a first step, the translucent member 23 prepares a substantially circular flat lens made of glass such as borosilicate glass, and the outer peripheral edge of one surface of this flat lens has Kovar, 42 A metal frame 25 formed of an alloy or the like and processed into a ring-shaped flat plate is joined by heating and melting with a first joining material 26 made of low-melting glass interposed therebetween.

Next, as a second step, the light transmitting member 23
After the metal frame 25 is joined with the low melting glass,
5 is subjected to Ni plating and Au plating.
Ni plating and Au plating can be formed by any of electrolytic plating and electroless plating. Further, alloy plating such as NiCo plating can be applied to Ni plating. The surface of the metal frame 25 may be plated with Ni before being joined to the translucent member 23 with low-melting glass. By this Ni plating, a stable metal oxide film is formed on the surface of the metal frame 25, so that the bonding strength with the low-melting glass can be stably obtained.

Next, as a third step, a translucent member 23 composed of a flat lens in which a metal frame 25 is joined with low-melting glass is attached to the metal fixing member 21 between the metal frame 25 and the metal fixing member 21. Then, a second bonding material 27 using a low-temperature brazing material such as an Au-Sn brazing material or an Au-Ge brazing material is sandwiched and heated and fused. In addition, Au-Sn brazing material and Au-Ge brazing material used as low-temperature brazing materials are about 300-4.
Can be joined at a low temperature of 00 ° C.

Here, the outer diameter of the ring-shaped metal frame 25 is formed to be larger than the diameter of the translucent member 23 formed of a flat lens. Further, the translucent member 23 and the metal frame 2
The first joining material 26 at the joint of No. 5 is formed by press-molding a powder of low-melting glass having a joining temperature higher than the joining temperature of the second joining material 27 at the joint of the metal frame 25 and the metal fixing member 21. Then, the glass pellet made of the low melting point glass is preferably placed between the translucent member 23 and the metal frame 25, and is heated and joined. Note that it is preferable to use glass having a melting point of 650 ° C. or less as the low-melting glass as the first bonding material 26. If the melting point exceeds 650 ° C., a normal meniscus shape cannot be obtained, and the flat lens made of glass of the translucent member 23 is softened and deformed. The lower limit side is naturally limited by the joining temperature of the brazing material used as the low-temperature brazing material as the second joining material 27.
It is only necessary to select a low-melting glass having a melting point at which the first bonding material 26 is re-melted at the bonding temperature and no problem occurs in confidentiality.

The metal wall 11 of the base 15 on which the Ni plating and the Au plating are applied, and the metal fixing member 21
Means that the joining material 22 made of a low-temperature brazing material such as an Au-Sn brazing material or an Au-Ge brazing material is used to join the second joining material 27 between the metal frame 25 and the metal fixing member 21. Can be joined at the same time. In addition, bonding can be performed using a resin or the like.

As shown in FIGS. 4A and 4B, an optical communication package 10a which is a modification of the optical communication package 10 according to one embodiment of the present invention has a base 31 made of ceramic. It is manufactured by laminating and firing ceramic green sheets. Inside the base 31, there is a cavity 32 for mounting a semiconductor element for optical communication, and inside the cavity 32 is a bonding wire. And a conductor pattern 33 for connection. Further, on the opposing side surfaces of the base 31, there are provided conductor patterns 34 electrically connected to the conductor patterns 33 in the cavity 32. Furthermore, on the upper surface of the base 31, there is provided a conductor pattern 38 for connecting a seal ring 37 for covering the lid after the semiconductor element is mounted and for hermetically sealing the lid.
Then, the ceramic green sheet forming the base 31 and the refractory metal forming the conductor patterns 33, 34, 38 and the like are simultaneously fired, and the conductor pattern 34 is provided with a lead frame 35 for external connection terminals in a dual in-line type. Further, a seal ring 37 for covering and sealing hermetically by covering the semiconductor element with a lid after mounting is brazed to the conductor pattern 38 with a high-temperature brazing material.

Further, a through hole 36 communicating with the cavity 32 is provided on a side surface of the base 31 to which the lead frame 35 is not joined, and the through hole 20 is formed in the through hole 20 similarly to the case of the metal base 15 described above. A cylindrical metal fixing member 21 is inserted and joined with a brazing material, resin, or the like. When the metal fixing member 21 is joined to the base 31 by using a brazing material, the metal fixing member 21 is connected to the base 31 around the through hole 36 in the same manner as the formation of the conductor pattern 34.
The metallized pattern is formed in substantially the same shape as the ring-shaped surface that abuts the side surface of. In addition, the translucent member 23
The form in which the metal frame 25 is joined to the cylinder of the metal fixing member 21 is the same as that in the case of the metal base 15 described above.

In the optical communication packages 10, 10a, semiconductor elements for optical communication are mounted in the cavities 14, 32, and after the optical fiber 24 is attached to the metal fixing member 21, the Kovar, 42 alloy, etc. A cap (lid) made of metal, ceramic, etc.
It is used as a semiconductor device for optical communication by bonding and sealing with glass or the like.

Next, a method of manufacturing an optical communication package 10a which is a modification of the optical communication package 10 according to one embodiment of the present invention will be described with reference to FIG. The optical communication package 10a is manufactured by laminating and firing ceramic green sheets such as alumina (Al ₂ O ₃ ), for example, in which the base 31 is made of ceramic. The ceramic green sheet is obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, and calcia to alumina powder, a plasticizer such as dioxyl phthalate, a binder such as an acrylic resin, and toluene, xylene, and alcohols. , And kneaded well, and then defoamed to give a viscosity of 2000 to 40.
A slurry of 000 cps is prepared, and a roll-shaped sheet having a thickness of, for example, 0.25 mm is formed by a doctor blade method or the like, and cut into an appropriate size to prepare a rectangular sheet.

Next, through holes for establishing conduction between the upper and lower conductor patterns of the plurality of ceramic green sheets are formed using a press die or a punching machine, and each is formed using a high melting point metal such as tungsten or molybdenum. Is filled in through holes of the ceramic green sheet, and conductor patterns 33 and 38 are screen-printed on the surface of the ceramic green sheet. And the base 31
In order to form a cavity 32 for mounting a semiconductor element for optical communication therein, holes are punched out of a plurality of ceramic green sheets with a mold or the like, and a through hole for joining a metal fixing member 21 is formed. To form the hole 36,
A cavity 32 is formed on a plurality of ceramic green sheets.
Notches are provided with different widths for each ceramic green sheet from the side that will be the same, and if they are overlapped, they are substantially circular, or notches are provided with the same width on multiple ceramic green sheets, and if they are overlapped, they are substantially provided Each ceramic green sheet is stacked so as to form a rectangular cavity, and is stacked by applying temperature and pressure. The part of the hole punched in the ceramic green sheet by this
A cavity 32 is formed, and a through-hole 36 is formed in a laminate formed by cutting the outer periphery so as to form the base 31.

Then, conductor patterns 34 for brazing the lead frame 35 are formed on the opposing outer side surfaces of the laminate formed by cutting the outer periphery. In addition, a metallized pattern is formed of a high melting point metal on the periphery of the through hole 36 formed on one of the side surfaces of the laminate where the lead frame 35 is not attached. Then, the laminated body is simultaneously fired with the ceramic and the high melting point metal in a reducing atmosphere at about 1550 ° C. to form the base 31.

Next, the surface of the high melting point metal of the base 31 is plated with Ni for the first time, and a lead frame 35 and a seal ring 37 are attached to the conductor patterns 34 and 38, respectively.
It is formed by brazing with a high-temperature brazing material such as a g-Cu brazing material. Then, the metal surface of the base 31 is further subjected to a second Ni plating and Au plating.

Next, the metal fixing member 21 is attached to the metallized pattern on the periphery of the through hole 36 on the side surface of the base 31 by Ni plating and Au plating.
The members are brought into contact with each other via a joining material 22 made of a low-temperature brazing material such as a Ge brazing material, and are joined by heating. In addition, about the manufacturing method of the metal fixing member 21 to which the translucent member 23 which consists of a flat lens is joined via the metal frame 25, the manufacturing similar to the case of the metal fixing member 21 of the metal base | substrate 15 is carried out. The method is applicable.

[0033]

According to the optical communication package of the present invention, the light transmitting member comprises a substantially circular glass plate lens, and the metal fixing member comprises a ring-shaped flat metal frame. Since the joints are formed through the seal member, the width of the seal path at the joint between the translucent member and the metal frame and the joint between the metal frame and the metal fixing member can be formed to be large. , An optical communication package having a high value can be obtained.

In particular, in the optical communication package according to the second aspect, the ring-shaped metal frame and the light-transmitting member are covered with a bonding material at a portion in contact with the light-transmitting member over the entire circumference of the metal frame. And the diameter of the outer peripheral side of the metal frame is larger than the diameter of the translucent member, so that the metal frame and the translucent member can have a large meniscus due to the outflow of the joining material and can have a large seal path width. In addition, the metal frame and the metal fixing member can increase the ring width of the metal frame and the seal path width, thereby obtaining an optical communication package with high airtight reliability.

According to a third aspect of the present invention, in the optical communication package, the light transmitting member and the metal frame are joined with low melting point glass.
Since the metal frame and the metal fixing member are joined by a low-temperature brazing material, a meniscus can be formed up to the outer peripheral end surface of the translucent member with low-melting glass, the seal path width can be increased, and the ring width of the metal frame is increased. The width of the seal path between the frame and the metal fixing member can be increased, and a highly airtight and reliable optical communication package can be obtained.

According to a fourth aspect of the present invention, there is provided a method for manufacturing an optical communication package, wherein the light-transmitting member is formed of a substantially circular glass flat lens, and one surface of the flat lens has an outer peripheral edge formed from a ring-shaped flat plate. A first step of joining a metal frame with a first joining material made of low-melting glass, a second step of applying Ni plating and Au plating to the metal frame, and a step of attaching a translucent member to the metal fixing member by attaching the metal frame to the metal fixing member. And a third step of bonding with a second bonding material made of a low-temperature brazing material via a low-melting-point glass. The ring width of the frame is equal to the seal path width and can be formed wider, and there is no crack in the glass plate. In addition, the joining temperature of the second joining material can be lower than that of the first joining material, and the first joining material is not re-melted when joining the metal frame and the metal fixing member. Further, it is possible to provide a method for manufacturing an optical communication package which is inexpensive, has high bonding strength, and has high airtight reliability, with a metal frame being bonded to a flat lens made of inexpensive glass and scarcely caused by handling in the manufacturing process.

In particular, in the method for manufacturing an optical communication package according to the fifth aspect, the outer diameter of the metal frame is formed to be larger than the diameter of the translucent member, and the joint between the translucent member and the metal frame is formed. Since a glass pellet made of low-melting glass is used as the first bonding material and is bonded by heating, the first of the glass pellets is used.
The bonding material can be easily placed and heated, and the seal path width can be formed large by a metal frame portion having a diameter larger than that of the translucent member or a meniscus formed on the outer peripheral end surface of the translucent member. It is possible to provide a method for manufacturing an optical communication package having high bonding strength and high airtight reliability.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a cross-sectional view, respectively, of an optical communication package according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a joint portion of a metal fixing member of the optical communication package.

FIG. 3 is an explanatory diagram of a joint between a light transmitting member and a metal frame of the optical communication package.

FIGS. 4A and 4B are a perspective view and an explanatory view, respectively, of a modification of the optical communication package.

FIG. 5 is a perspective view of an optical communication package according to a conventional example.

FIG. 6 is a cross-sectional view of a joint between a metal fixing member and a translucent member of an optical communication package according to a conventional example.

[Explanation of symbols]

10, 10a: optical communication package, 11: metal wall, 12: fixing hole, 13: metal base, 14: cavity, 15: base, 16: window frame-like hole, 17: lead frame, 18: conductor pattern, 19: feed-through board, 20: through hole, 21: metal fixing member, 22: bonding material, 23: translucent member, 24: optical fiber, 25:
Metal frame, 26: first bonding material, 27: second bonding material, 3
1: base, 32: cavity, 33, 34: conductor pattern, 35: lead frame, 36: through hole, 37: seal ring, 38: conductor pattern

Claims (5)

[Claims] A ceramic or metal base in which a cavity for mounting a semiconductor element for optical communication is formed; a through-hole formed in a side surface of the base and communicating with the cavity; An optical communication package having a metal fixing member inserted into the through hole and formed in a cylindrical shape, and a light transmitting member provided in the cylinder of the metal fixing member to face the tip of the optical fiber. Wherein the translucent member comprises a substantially circular glass plate lens,
In addition, the optical communication package is bonded to the metal fixing member via a metal frame formed of a ring-shaped flat plate. 2. The optical communication package according to claim 1, wherein the metal frame and the translucent member are covered with a bonding material at a portion in contact with the translucent member over the entire circumference of the metal frame. Wherein the outer diameter of the metal frame is larger than the diameter of the translucent member. 3. The optical communication package according to claim 1, wherein the translucent member and the metal frame are joined with a low melting point glass, and the metal frame and the metal fixing member are a low-temperature brazing material. An optical communication package characterized by being joined by: 4. A through hole communicating with the cavity is formed in a side surface of a ceramic or metal base having a cavity for mounting a semiconductor element for optical communication therein. The through hole is formed in a cylindrical shape. A method for manufacturing an optical communication package in which a light-transmitting member for facing the tip of an optical fiber is joined to a metal fixing member tube, and the metal fixing member is inserted into the through hole and joined to the base. Wherein the translucent member is formed of a substantially circular glass plate lens, and a metal frame formed of a ring-shaped flat plate is formed on one outer peripheral edge of the flat lens with a first bonding material made of low-melting glass. A first step of joining, a second step of applying Ni plating and Au plating to the metal frame, and a second joining of the light transmitting member to the metal fixing member via a low temperature brazing material via the metal frame. With wood And a third step of bonding. 5. The method for manufacturing an optical communication package according to claim 4, wherein an outer diameter of the metal frame is formed larger than a diameter of the light transmitting member, and the light transmitting member and the metal frame are formed. A method for manufacturing an optical communication package, comprising using a glass pellet made of the low melting point glass as a first bonding material at a bonding portion of (1), mounting the glass pellet after mounting, and bonding.