JP2002311303A - Package for optical communication - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for optical communication free from crack/ fissure, separation, etc., and provided with airtight reliability by relieving stress concentration to a translucent member. SOLUTION: In the package 10 for optical communication obtained by providing a translucent member 28 in a insertion hole 22 of a metallic fixed member 21 inserted to a through hole 20 bored at one side wall part of a substrate 15 with a semiconductor element mounted inside and communicated with a cavity part 14 and fixed by a high-temperature wax material 30, the end face of the outer peripheral part of the member 28 is a non-metalized part and has an annular metalize pattern 29 on a joining surface, the member 21 has a first level difference part 25 where the hole 22 becomes a medium diameter hole 24 from a large diameter hole 23 smaller than the hole diameter of the hole 20 and has a second level difference part 27 where the hole 22 becomes a small diameter hole 26 from the medium diameter hole 24 smaller than the hole diameter of the hole 20, and the part 27 and the pattern 29 of the member 28 are joined through a low temperature wax material 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication package for accommodating a semiconductor device for optical communication, and more particularly, to an optical communication package having a light-transmitting member opposed to the tip of an optical fiber. .

[0002]

2. Description of the Related Art An optical communication package for accommodating a semiconductor element for optical communication has a main body made of ceramic or metal, and a connection shape of an external connection terminal is a dual in line type or a butterfly. (But
terly) type and the like. For example, as shown in FIG. 5, a metallic butterfly-type optical communication package 50 is made of a Cu-W (copper tungsten) or Cu-Mo-Cu (copper-molybdenum-copper bonding plate) having a bottom with excellent heat dissipation.
KV whose thermal expansion coefficient is similar to that of the ceramic side
(Fe—Ni—Co alloy, trade name “Kover”) or a metal member such as 42 alloy (Fe—Ni alloy) and having a cavity 51 for mounting a semiconductor element therein. 52. The optical communication package 50 is formed by perforating one side wall of the base 52 and brazing to the through hole 53 communicating with the cavity 51 and the outer peripheral portion of the through hole 53. A metal fixing member 54 made of a metal material such as KV or 42 alloy having an insertion hole 61 for passing a signal is provided. Further, the optical communication package 50 closes the insertion hole 61 of the metal fixing member 54 by bonding, and maintains the airtightness in the cavity portion 51, and at the same time, the light transmitting member 55 for facing the tip of the optical fiber. Have. The optical communication package 50 is joined to window frames formed on opposing walls adjacent to one side wall of the base 52, and is bonded to a ceramic material such as alumina (Al ₂ O ₃ ). 52, a feed-through board 57 having a conductive wiring pattern 56 formed so as to conduct from the cavity portion 51 side of the base 52 to the outside of the base 52; And an external connection terminal 58 made of a metal member such as KV or 42 alloy for electrical connection from the outside.

This optical communication package 50 is composed of a base 52
The semiconductor element is mounted in the cavity part 51 of the semiconductor device, and the semiconductor element and the cavity part 5 of the base 52 of the feedthrough substrate 57
By connecting the conductor wiring pattern 56 on the first side with a bonding wire or the like, the external connection terminal 58 and the semiconductor element are brought into a conductive state. After welding the optical fiber member to the metal fixing member 54 using a laser such as YAG, a lid 59 made of metal, ceramic, or the like is formed on the upper surface of the base 52 by glass, brazing material, resin, or the like. An optical semiconductor device is formed by joining with a sealing material, and the semiconductor device is fixed to a board or the like with screws via a mounting hole 60.

The cavity 5 of the optical communication package 50
For example, as shown in FIG.
The metal fixing member 54 is joined to the outer peripheral portion of the through-hole 53 communicating with the cavity portion 51 by a high-temperature brazing material 63 such as Ag-Cu brazing. An annular metallized pattern 64 of a thin film is formed by sputtering or the like from the end surface 65 on the outer peripheral portion of the light transmitting member 55 having a shape such as a surface to the joining surface, and formed in the insertion hole 61 of the metal fixing member 54. The stepped portion 62, the metal fixing member 54, and the end surface 65 of the translucent member 55 are joined using a low-temperature brazing material 66 such as Au-Sn brazing or Au-Ge brazing.

[0005]

However, the conventional optical communication package as described above has the following problems. (1) The light-transmitting member and the metal fixing member are heated and joined via a brazing material, for example, a low-temperature brazing material such as Au-Sn brazing or Au-Ge brazing. When cooled, A joining the base and the metal fixing member
Due to the heat shrinkage of the high-temperature brazing material such as g-Cu brazing material and the low-temperature brazing material joining the translucent member and the metal fixing member, the vicinity of the end face of the translucent member made of glass is generated. Since a large tensile stress is generated, cracks occur in the translucent member, and cracks or peeling occur at the interface near the end face of the low-temperature brazing material and the translucent member, thereby maintaining the airtightness of the cavity. May disappear. (2) Various reliability tests assuming the global environment are imposed on optical communication packages. For example, -65 therein
In a temperature cycle test between 150 ° C. and 150 ° C., a high-temperature brazing filler metal such as Ag-C
The thermal expansion coefficient of u-wax is 17.6 × 10 ⁻⁶ / ° C., and the thermal expansion coefficient of the low-temperature brazing material at the joint between the metal fixing member and the translucent member, for example, Au-Sn braze is 16.0 ×. 10 ^-6 /
° C, which is larger than the thermal expansion coefficient of a glass translucent member of 5.1 × 10 ^-6 / ° C. In some cases, a tensile stress is generated to cause cracks in the translucent member, cracks or peeling to occur at the interface between the low-temperature brazing material and the translucent member, and the airtightness of the cavity cannot be maintained. (3) By setting the joining portion between the metal fixing member and the light transmitting member as far as possible from the joining portion between the base and the metal fixing member, high temperature to the joining portion between the metal fixing member and the light transmitting member can be obtained. Although it is conceivable to reduce the effects of thermal expansion and contraction of the brazing material, in this case, the cylindrical length of the metal fixing member becomes longer, and the package becomes larger. The present invention has been made in view of such circumstances, and alleviates stress concentration on a light-transmitting member, and does not cause cracks, cracks, peeling, or the like.
An object of the present invention is to provide an optical communication package having airtight reliability.

[0006]

According to the present invention, there is provided an optical communication package according to the present invention, wherein a hole is formed in one side wall of a base forming a cavity for mounting a semiconductor element for optical communication therein. Moreover, the optical communication package is provided with a light-transmitting member that is inserted into a through-hole communicating with the cavity portion and is provided in the through-hole of the metal fixing member fixed with the high-temperature brazing material so as to face the tip of the optical fiber. The end face of the outer peripheral portion of the translucent member is a non-metallized portion, has an annular metallized pattern on the joining surface, and the metal fixing member has a large through medium-diameter hole in which the insertion hole is smaller than the diameter of the through hole. And a second step from the medium hole to the small hole, and the annular metallized pattern of the second step and the light transmitting member is interposed through the low-temperature brazing material. Joined As a result, at the time of joining the low-temperature brazing material, the joining at the outer peripheral end face of the translucent member is not performed, and the low-temperature brazing material before melting can be dropped and set in the second step portion, and the molten material can be melted. Since the low-temperature brazing material can be stored in the second step portion, even if the high-temperature brazing material or the low-temperature brazing material undergoes thermal expansion and contraction, the tensile stress of the translucent member can be reduced, and the crack of the translucent member can be reduced. And the occurrence of cracks or peeling at the interface between the translucent member and the low-temperature brazing material can be prevented.

Here, the position of the joint portion of the light-transmitting member includes the through-hole portion of the base from the position twice as thick as the light-transmitting member inside the inner wall surface of the base in plan view. It is preferable that the space be provided between the outer wall surface and the outer side up to a position twice as thick as the translucent member. Accordingly, the joining portion of the translucent member to be joined to the metal fixing member can be located near the wall surface of the base in plan view, and it is not necessary to increase the size of the metal fixing member. Can be prevented from becoming larger.

[0008] The outer diameter of the annular metallized pattern provided on the translucent member is preferably equal to the outer diameter of the translucent member. As a result, it is possible to prevent surplus brazing material from entering the end surface of the translucent member without forming a joining portion of the low-temperature brazing material. Cracks and peeling at the interface between the conductive member and the low-temperature brazing material can be prevented.

Further, the outer diameter of the annular metallized pattern provided on the translucent member is smaller than the outer diameter of the translucent member, and it is preferable that the joining surface of the translucent member has a non-metallized lowered portion. . Thereby, it is possible to reduce the amount of the low-temperature brazing material protruding from the second stepped portion without forming a joining portion of the low-temperature brazing material on the end face of the translucent member, and to prevent the surplus brazing material from entering. This can prevent the occurrence of cracks in the translucent member and the occurrence of cracks and peeling at the interface between the translucent member and the low-temperature brazing material.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. 1A and 1B are a plan view and a cross-sectional view of an optical communication package according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view of a metal fixing member of the optical communication package. FIGS. 3 (A) and 3 (B) are explanatory views of the positions of the joining portions of the translucent members of the optical communication package, respectively, and FIGS. 4 (A) to 4 (C) are respectively the transparent diagrams of the optical communication package. It is explanatory drawing of the annular metallization pattern of an optical member.

As shown in FIGS. 1A and 1B, an optical communication package 10 according to an embodiment of the present invention includes a metal frame 11 and a fixing hole for mounting on a board or the like. 1
And a metal bottom plate 13 having a base 2 for forming a cavity 14 for mounting a semiconductor element for optical communication therein. Window frame-like holes 16 communicating with the cavities 14 are provided in the opposing walls located on both sides of the one side wall. A feed-through board 19 made of ceramic having a conductor pattern 18 is fitted into each window frame-shaped hole 16 and brazed, and the conductor pattern 18 is attached to the frame 11.
Outside and the outside connection terminal 17 is joined in a butterfly shape to the external connection terminal 17 and connected to the semiconductor element on the cavity portion 14 side by wire bonding or the like. Further, on one side wall of the frame body 11 to which the feedthrough board 19 is not joined,
A through hole 20 communicating with the cavity portion 14 is provided by being perforated.

As shown in FIG. 2, a metal fixing member 21 is provided.
Is a through hole 20 formed in the frame 11 with a diameter of the insertion hole 22.
From the large diameter hole 23 smaller than the hole diameter
And the small-diameter hole 26
Having a second step 27. The metal fixing member 21 is bonded and fixed to a through hole 20 formed in the frame 11 of the base 15 with a high-temperature brazing material 30 made of Ag-Cu brazing or the like. The depth of the second step 27 is 0.0
2 mm or more.

On the other hand, the translucent member 28 made of glass, sapphire, or the like has a non-metallized portion at the outer peripheral end surface, and has a sputtered surface on the bonding surface (the surface brazed to the metal fixing member 21). And the like. Then, the second step portion 27
And the annular metallized pattern 29 formed on the bonding surface of the translucent member 28 are bonded via a low-temperature brazing material 31 made of Au-Sn brazing or Au-Ge brazing. In this joining, the molten low-temperature brazing material 31 is
The gap 32 can be formed between the end face of the light transmitting member 28 and the inside of the large-diameter hole 23 of the metal fixing member 21. The gap 32 allows the frame 1
High-temperature brazing material 3 joining metal fixing member 21 and metal fixing member 21
0, and even if stress occurs due to thermal expansion and contraction in the low-temperature brazing material 31, cracks in the translucent member 28, cracks and peeling at the interface between the low-temperature brazing material 31 and the translucent member 28, etc. Can be prevented from occurring.

As shown in FIG. 3A, the position of the joint between the annular metallized pattern 29 of the translucent member 28 and the second step portion 27 of the metal fixing member 21 by the low-temperature brazing material 31 is plane. The cavity 1 of the frame 11 of the base 15
Inward from the inner wall surface 33 which is the fourth side,
FIG. 3 (B) includes the portion of the through hole 20 of the frame 11 of the base 15 from a position at a distance B that is twice the thickness A of the translucent member 28 to be placed and joined to 1a, that is, from the double thickness position. As shown in FIG. 5, a position at a distance B which is twice the thickness A of the translucent member 28 placed and joined to the metal fixing member 21b from the outer wall surface 34 of the frame 11 of the base 15 in a plan view, That is, it is preferable to be between the double thickness position. Since the positional relationship between the frame 11 and the translucent member 28 is within this range, the low-temperature brazing material 31 is stored in the second step 27 without forming a metallized pattern on the end surface of the translucent member 28. A low-temperature brazing material 3 is formed between the end face of the translucent member 28 and the metal fixing members 21a and 21b by forming a gap 32.
The effect of not forming the joint 1 can be exhibited, and the high-temperature brazing material 3
Even when thermal expansion and contraction occur in the low-temperature brazing material 31 and the low-temperature brazing material 31, cracks in the light-transmitting member 28 occur and the light-transmitting member 28
Cracks and peeling at the interface between the low-temperature brazing material 31 and the low-temperature brazing material 31 can be prevented. In addition, the metal fixing members 21a, 2
The joining of the translucent member 28 to 1b can be done from the direction of the cavity 14 or from the outside.

As shown in FIG. 4A, the outer diameter substantially matches the outer diameter of the translucent member 28a.
An annular metallized pattern 29a may be formed from the outer diameter end face corner to the surface. Also, as in a light-transmitting member 28b shown in FIG. 4B, an outer diameter is smaller than the outer diameter of the light-transmitting member 28b, and a non-metallized pull-down portion 35 is provided from the outer diameter end face corner to the surface. An annular metallized pattern 29b can also be formed. Further, FIG.
As shown in FIG. 7, an annular metallized pattern 29c may be formed on the plane side of the translucent member 28c having a hemispherical shape.

Incidentally, the surface of the metallic base 15 which is the joining surface of the high-temperature brazing material 30 such as Ag-Cu is usually plated with Ni, and a low-temperature brazing material such as Au-Sn brazing or Au-Ge brazing. The surface of the metal fixing member 21 serving as the bonding surface of the base member 31 is usually plated with Ni and Au, respectively. Translucent member 28 bonded to metal fixing member 21
May be a flat lens, a hemispherical lens, or the like. The material may be any of borosilicate glass, sapphire glass and the like.

The substrate is made of a ceramic green sheet of alumina, glass ceramic, aluminum nitride, or the like, and is subjected to metallization printing, lamination, and sintering, which are manufactured by a method using an ordinary ceramic laminated package forming technique, to obtain a desired conductor. A laminate having a pattern can also be used. In this case, the external connection terminals are brazed to a butterfly type or a dual in-line type. The joining of the base and the metal fixing member 21 is performed by forming a metallized pattern on the base, applying Ni plating, and then performing Ag-Cu bonding.
This is performed by brazing using a high-temperature brazing material such as brazing.

In the above-mentioned optical communication package 10, a semiconductor element for optical communication is mounted in the cavity portion 14, and an optical fiber 36 is attached to the metal fixing member 21 by welding using a laser such as YAG. Thereafter, a cap (lid) formed of metal, ceramic, or the like such as Kovar or 42 alloy is further joined by using a brazing material, resin, glass, or the like, and the cavity portion 14 is sealed to thereby provide a cavity for optical communication. Used as a semiconductor device.

Next, the manufacturing process of the optical communication package 10 according to one embodiment of the present invention will be described. A frame body formed by cutting a metal lump such as Kovar or 42 alloy having a thermal expansion coefficient similar to that of ceramic, or by cutting a pipe-shaped Kovar or 42 alloy and cutting it into a circle, and then forming a rectangular shape in plan view. In addition, a window frame-like hole 16 having a substantially rectangular shape communicating with the cavity portion 14 is formed on a wall portion facing a position adjacent to one side wall portion of the frame body 11.
Then, a substantially circular through hole 20 communicating with the cavity portion 14 is also formed on one side wall portion of the frame body 11 where the window frame-shaped hole 16 is not formed. On the other hand, a bottom plate 13 formed of a metal plate such as copper tungsten which is excellent in radiating heat generated from the semiconductor element and having a fixing hole 12 for mounting to a mounting member such as a board with screws is formed.

After the Ni plating is applied to the frame 11 and the bottom plate 13, a high-temperature brazing material such as Ag-Cu brazing is sandwiched between the joints, and the joint is heated and brazed. A base 15 having a cavity portion 14 for mounting a semiconductor element such as a laser diode, a light emitting diode, or the like is formed. The window frame-shaped hole 16 has a conductor pattern 18 of a feedthrough substrate 19 made of ceramic.
After performing the i-plating, a high-temperature brazing material such as Ag-Cu brazing is sandwiched between the joints and heated to perform brazing.

Here, the feed-through board 19 made of ceramic such as alumina bonded to the window frame-shaped hole 16 is
For example, magnesia, silica, a powder obtained by adding an appropriate amount of a sintering aid such as calcia, a plasticizer such as dioxyl phthalate, and a binder such as an acrylic resin,
Solvents such as toluene, xylene and alcohols are added, kneaded well, and defoamed to a viscosity of 2000 to 40000 cps.
Is prepared, and a roll-shaped sheet having a thickness of, for example, 0.25 mm is formed by a doctor blade method or the like.
It is made from a rectangular sheet cut to an appropriate size. A conductor pattern 18 is formed on this ceramic green sheet with a refractory metal such as tungsten or molybdenum,
Approximately 15 layers of laminated ceramic green sheets
A ceramic and a high melting point metal are simultaneously fired in a reducing atmosphere at 50 ° C. to form a film. This feed-through board 19 includes
In order to fit the feed-through board 19 into the above-described window frame-shaped hole 16 and braze and join it with a high-temperature brazing material such as Ag-Cu braze, a metallized outer peripheral portion of the feed-through board 19 that comes into contact with the window frame-shaped hole 16. A pattern is formed, and a conductive pattern 18 for conduction between the inside and the outside of the frame 11 is formed.

An external connection terminal 17 is abutted on the conductor pattern 18 outside the frame body 11 in a butterfly shape.
The brazing is performed using a high-temperature brazing material such as Cu brazing. The conductor pattern 18 on the side of the cavity 14 is used to connect to the semiconductor element by a bonding wire or the like. In addition, the brazing joining using a high-temperature brazing material such as the above-described Ag-Cu brazing includes a case where each joining portion is heated and joined together at a time, and a case where the joining portion is heated and joined in a plurality of times. is there.

On the other hand, the metal fixing member 21 to be joined to the through hole 20 in one side wall of the frame body 11 to which the feed-through board 19 is not joined is first formed from a metal lump such as Kovar or 42 alloy. The portion is inserted into the through hole 20 formed in one side wall of the frame body 11 and formed by cutting or the like so as to be able to contact the one side wall of the frame body 11 around the through hole 20. At the same time, the first hole 23 is changed from the large hole 23 to the medium hole 24.
Is formed, and the insertion hole 22 having the second step portion 27 which becomes the small diameter hole 26 from the medium diameter hole 24 is formed. In addition,
The positions of the first stepped portion 25 and the second stepped portion 27 which are the joining portions of the translucent member 28 include the through hole 20 of the frame 11 in plan view and It is preferable to form by cutting or the like so that it can be joined from the double-thickness position of the light-transmitting member 28 on the inside to the double-thickness position of the light-transmitting member 28 from the outer wall surface of the frame 11 to the outside. . Then
The metal fixing member 21 is brazed to the frame 11 using a high-temperature brazing material 30 such as Ag-Cu brazing. Thereafter, the metal portion of the base 15 to which the feed-through substrate 19, the external connection terminal 17, and the metal fixing member 21 are bonded is Ni
Plating and Au plating are performed.

Next, the translucent member 28 to be joined to the metal fixing member 21 is made of a glass plate such as borosilicate glass or sapphire, a hemispherical lens, or the like. For example, a metallized pattern composed of a laminate of three layers of titanium-nickel-gold is formed by a method such as a sputtering method, a vapor deposition method, or an ion plating method. In this formation, the metallized pattern is not formed on the outer peripheral end face of the translucent member 28, and the annular metallized pattern 29 is formed on the joining surface of the translucent member 28.
To form The outer diameter of the annular metallized pattern 29 is smaller than the outer diameter of the translucent member 28,
Is preferably provided with a non-metallized pull-down portion 35 on the bonding surface.

Next, a ring-shaped low-temperature brazing material 31 made of Au-Sn brazing or Au-Ge brazing is placed on the second step 27 of the metal fixing member 21, The low-temperature brazing material 31 is melted by being brought into contact with the annular metallized pattern 29 and heated while applying an appropriate pressure, and the translucent member 28 is joined to the second step 27 via the low-temperature brazing material 31. In this bonding, the first step 25
Also, the translucent member 28 can be stably placed by the second step portion 27, and even if the low-temperature brazing material 31 flows out by heating and melting, it is possible to form an appropriate solder pool in the second step portion 27. As a result, the gap 32 can be formed without the low-temperature brazing material 31 flowing out between the end face of the translucent member 28 and the metal fixing member 21.

When the substrate is formed of ceramic, a metallized pattern such as a wire bond pad is screen-printed on a ceramic green sheet manufactured by the above-described method for manufacturing a ceramic green sheet using a refractory metal such as tungsten or molybdenum. The ceramic green sheets are formed by laminating desired portions so as to obtain a cavity portion and a through hole, and the outer portion is cut into a laminated body, and further, a through hole communicating with the cavity portion is formed. A metallized pattern is formed by screen printing on the side wall and the portion where the external connection terminals are to be joined, and is formed by simultaneously firing ceramic and a high melting point metal in a reducing atmosphere at about 1550 ° C. Then, after Ni plating is applied to the metallized pattern of the base, the external connection terminals are joined in a dual in-line type or a butterfly type using a high-temperature brazing material such as Ag-Cu brazing. At the same time, the metal fixing member 21 is joined to the through hole with a high-temperature brazing material such as Ag-Cu brazing.

[0027]

According to the optical communication package of the present invention, the end face of the outer peripheral portion of the light-transmitting member has a non-metallized portion, has an annular metallized pattern on the joining surface, and has a metal fixing member. Has a first step portion in which the insertion hole is smaller in diameter from a large hole to a medium hole, and further has a second step portion in which the insertion hole is smaller in diameter from the medium hole, and has a second step portion. Since the low-temperature brazing material and the annular metallized pattern of the translucent member are joined via the low-temperature brazing material, there is no joining at the outer peripheral end face of the low-temperature brazing material, and the low-temperature brazing material before melting is dropped into the second step portion. The molten low-temperature brazing material can be stored in the second step, and even if thermal expansion or contraction occurs in the high-temperature brazing material or low-temperature brazing material, the tensile stress of the translucent member is reduced. Cracks in the light-transmitting member It is possible to prevent the occurrence of cracks or peeling at the interface between the low-temperature brazing material, comprising an airtight reliability.

[0028] In particular, in the optical communication package according to the second aspect, the position of the joining portion of the translucent member may be from the inner wall surface of the substrate in a plan view and inward from the position twice as thick as the translucent member. The through-hole portion is located between the outer wall surface of the base and the outside to the position twice as thick as the translucent member, so that the joint portion of the translucent member to be joined to the metal fixing member is viewed in plan. As a result, it is not necessary to increase the size of the metal fixing member, and it is possible to prevent the optical communication package from increasing in size.

In the optical communication package according to the third aspect, the outer diameter of the annular metallized pattern provided on the translucent member matches the outer diameter of the translucent member. Without forming a joint of low-temperature brazing material on the end face of the member, surplus brazing material can be prevented from wrapping around,
It is possible to prevent the occurrence of cracks in the light-transmitting member and the occurrence of cracks or peeling at the interface between the light-transmitting member and the low-temperature brazing material.

Further, in the optical communication package according to the fourth aspect, the outer diameter of the annular metallized pattern provided on the translucent member is smaller than the outer diameter of the translucent member, and the bonding surface of the translucent member is formed. Since the low-temperature brazing material protruding from the second step portion can be reduced and accumulated without forming a joining portion of the low-temperature brazing material on the end surface of the light-transmitting member, By preventing the brazing material from wrapping around, it is possible to prevent cracks in the translucent member and cracks and peeling at the interface between the translucent member and the low-temperature brazing material.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a cross-sectional view, respectively, of an optical communication package according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a metal fixing member of the optical communication package.

FIGS. 3A and 3B are explanatory diagrams each showing a position of a bonding portion of a translucent member of the optical communication package. FIGS.

FIGS. 4A to 4C are explanatory views of an annular metallized pattern of a translucent member of the optical communication package.

FIG. 5 is a perspective view of a conventional optical communication package.

FIG. 6 is a cross-sectional view of a light transmitting member of a conventional optical communication package.

[Explanation of symbols]

10: package for optical communication, 11: frame, 12: fixing hole, 13: bottom plate, 14: cavity, 15: base, 1
6: window frame-shaped hole, 17: external connection terminal, 18: conductor pattern, 19: feed-through board, 20: through hole, 21,
21a, 21b: metal fixing member, 22: insertion hole, 2
3: large diameter hole, 24: medium diameter hole, 25: first step portion, 2
6: small-diameter hole, 27: second step portion, 28, 28a, 28
b, 28c: translucent member, 29, 29a, 29b, 29
c: annular metallized pattern, 30: high-temperature brazing material, 3
1: low temperature brazing material, 32: void, 33: inner wall surface, 3
4: Outer wall surface, 35 lowered portion, 36: Optical fiber

 ────────────────────────────────────────────────── ─── Continued on the front page F-term (reference) 2H037 BA02 BA11 DA03 DA04 DA06 DA36 DA39 5F073 AB28 FA07

Claims (4)

[Claims] 1. A hole formed in a side wall of a base forming a cavity for mounting a semiconductor element for optical communication therein, and inserted into a through hole communicating with the cavity.
In the insertion hole of the metal fixing member fixed with high-temperature brazing material,
In an optical communication package provided with a translucent member for facing the tip of the optical fiber, an end surface of an outer peripheral portion of the translucent member is a non-metallized portion, and has an annular metallized pattern on a bonding surface, Moreover, the metal fixing member has a first step portion in which the insertion hole is changed from a large diameter hole to a medium diameter hole smaller than the hole diameter of the through hole, and further, a second step portion is formed from the medium diameter hole to a small diameter hole. And the second
An optical communication package characterized in that the stepped portion of (1) and the annular metallized pattern of the translucent member are joined via a low-temperature brazing material. 2. The optical communication package according to claim 1, wherein a position of the joining portion of the light-transmitting member is twice as thick as that of the light-transmitting member inward from an inner wall surface of the base in plan view. And an optical communication package including a portion of the through hole of the base and extending from an outer wall surface of the base to a position twice as thick as the translucent member. 3. The optical communication package according to claim 1, wherein an outer diameter of the annular metallized pattern provided on the translucent member matches an outer diameter of the translucent member. An optical communication package, characterized in that: 4. The optical communication package according to claim 1, wherein an outer diameter of the annular metallized pattern provided on the translucent member is smaller than an outer diameter of the translucent member. An optical communication package having a non-metallized pull-down portion on a bonding surface of an optical member.