JP2010135767A - Optical semiconductor element-storing package and optical semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor element-storing package capable of transferring an optical signal between an optical semiconductor element and an optical fiber with no problem, and to provide an optical semiconductor device. <P>SOLUTION: The optical semiconductor element-storing package 1 includes a bottom plate 11, a frame member 12, an optical fiber holding member 13, and a translucent member 14. The bottom plate 11 has an upper surface including a mounting area in which the optical semiconductor element 3 is mounted. The frame member 12 is formed on the bottom plate 11 so as to surround the mounting area and has a through-hole. The optical fiber holding member 13 is partially disposed in the through-hole, has a cylindrical structure and has parallel surfaces 12a relative to the frame member 12 in an inner surface of the cylindrical structure. The translucent member 14 is joined to the parallel surfaces 13a of the optical fiber holding member 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element, and an optical semiconductor device.

  2. Description of the Related Art Conventionally, a package for housing an optical semiconductor element used for optical communication or the like (hereinafter also simply referred to as “package”) includes a bottom plate and a frame member, and the frame member has a through hole for inputting and outputting optical signals. A hole is provided. A holding member for holding the optical fiber is provided around the through hole provided in the frame member. A translucent member for transmitting an optical signal between the optical semiconductor element and the optical fiber without waste and sealing the inside of the package in an airtight manner is further attached to the inner side surface of the holding member.

JP 2003-303909 A

  However, in the conventional package for housing an optical semiconductor element disclosed in Patent Document 1, the light-transmissive member has been miniaturized or the package has been lowered due to the recent miniaturization of the package. When the light-transmitting member is downsized, thermal stress easily acts on the lens greatly when, for example, an optical fiber is welded to the other end of the holding member. For this reason, the lens is easily damaged by cracks or the like. When damage such as a crack occurs in the lens, the light transmittance is lowered at the damaged portion, and the transmission of the optical signal is hindered.

  According to one aspect of the present invention, an optical semiconductor element housing package includes a bottom plate, a frame member, an optical fiber holding member, and a translucent member. The bottom plate has an upper surface including a mounting region for the optical semiconductor element. The frame member is provided on the bottom plate so as to surround the mounting region, and has a through hole. The optical fiber holding member is partially provided in the through hole, has a cylindrical structure, and has a parallel surface to the frame member on the inner surface of the cylindrical structure. The translucent member is bonded to the parallel surface of the optical fiber holding member.

  According to one aspect of the present invention, the optical semiconductor element housing package includes a translucent member bonded to a parallel surface of the optical fiber holding member. By including such a configuration, the optical semiconductor element storage package can reduce damage to the translucent member, and is improved in terms of optical signal transmission characteristics.

1 is a perspective view showing an optical semiconductor device according to a first embodiment of the present invention. It is a longitudinal cross-sectional view of the optical semiconductor device shown by FIG. It is a longitudinal cross-sectional view which shows the optical semiconductor device in the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the optical semiconductor device in the 3rd Embodiment of this invention. FIG. 5 is a plan view of the optical semiconductor device shown in FIG. 4.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
In the first embodiment of the present invention, an optical semiconductor device is provided in an optical semiconductor element housing package 1 (hereinafter referred to as a package 1) and in the package 1, as shown in FIGS. The submount substrate 2 and the optical semiconductor element 3 mounted on the submount substrate 2 are included. In FIG. 1, the optical semiconductor device is mounted on an xy plane in a virtual xyz space. In FIG. 1, the upward direction means the positive direction of the virtual z axis.

  The package 1 includes a bottom plate 11, a frame member 12 provided on the bottom plate 11, an optical fiber holding member 13 fixed to the frame member 12, and a light transmitting property provided in the optical fiber holding member 13. Member 14.

  The bottom plate 11 has an upper surface including the mounting region 11 a for the optical semiconductor element 3. As shown in FIGS. 1 and 2, the “mounting region” includes a region for directly mounting the optical semiconductor element 3 in addition to the region for mounting the optical semiconductor element 3 via the submount substrate 2. It is a waste.

The bottom plate 11 of the package according to the present embodiment includes, for example, iron (Fe) -nickel (Ni) -cobalt (Co) alloy, stainless steel (SUS), copper (Cu) -tungsten (W), Cu-molybdenum (Mo ) Or ceramics such as alumina (Al ₂ O ₃ ) ceramics, aluminum nitride (AlN) ceramics, mullite (3Al ₂ O ₃ · 2SiO ₂ ) ceramics. Here, when the bottom plate 11 is made of a metal, the ingot is manufactured into a predetermined shape by applying a conventionally known metal processing method such as rolling, punching, or cutting.

When the bottom plate 11 is made of, for example, Al ₂ O ₃ ceramics, it is manufactured as follows. Add a suitable organic binder, plasticizer, dispersant, solvent, etc. to raw powder such as Al ₂ O ₃ , silicon oxide (SiO ₂ ), calcium oxide (CaO), magnesium oxide (MgO), etc. .
A plurality of ceramic green sheets are obtained by making this into a sheet by a conventionally known doctor blade method.
Thereafter, these ceramic green sheets are appropriately punched and laminated, and are fired at a temperature of about 1600 ° C. in a reducing atmosphere.

  The frame member 12 is provided on the bottom plate 11 so as to surround the mounting area 11a, and has a through hole 12a serving as an optical signal input / output unit. The through hole 12 a is provided in the virtual x-axis direction in the frame member 12. A frame-shaped or cylindrical optical fiber holding member 13 for fixing the optical fiber 4 is joined to the periphery of the through hole 12a on the outer surface of the frame member 12. When a part of the optical fiber holding member 13 is fitted into the through hole 12a, the optical fiber holding member 13 comes into contact with the periphery of the through hole 12a on the outer surface of the frame member 12. Therefore, the optical axis of the optical semiconductor element 3 and the optical axis of the optical fiber 4 held by the optical fiber holding member 13 can be easily adjusted.

  The frame member 12 forms a space for accommodating the optical semiconductor element 3 in the inner side (internal space) together with the bottom plate 11. The frame member 12 has a rectangular shape or a circular shape in plan view, and supports the optical fiber holding member 13.

The frame member 12 is made of a metal such as Fe—Ni—Co alloy, SUS, Cu—W, or Cu—Mo, or ceramics such as Al ₂ O ₃ , AlN, 3Al ₂ O ₃ .2SiO ₂ , similarly to the bottom plate 11. Become. The frame member 12 is formed integrally with the bottom plate 11. Alternatively, the frame member 12 is joined to the outer peripheral portion of the upper surface of the bottom plate 11 by brazing the bottom plate 11 with a brazing material such as Ag—Cu brazing or by a welding method such as a seam welding method.

  As shown in FIGS. 1 and 2, the package 1 according to this embodiment has a form in which a bottom plate 11 is projected outward from the frame member 12. By fixing the protruding portion to an external electric circuit board (not shown) with screws, the bottom plate 11 can be easily fixed in close contact with the external electric circuit board. Further, the heat generated from the optical semiconductor element 3 can be dissipated favorably from the bottom plate 1. Therefore, the heat generated during the operation of the optical semiconductor element 3 can be efficiently dissipated to the outside of the package 1, and an optical semiconductor element storage package suitable for high-speed optical communication can be provided. In particular, the package shown in FIGS. 1 and 2 can be suitably used as a long-distance transmission optical communication package.

  The optical fiber holding member 13 is partially provided in the through hole 12a. The optical fiber holding member 13 has a cylindrical structure, and has a parallel surface 13a with respect to the frame member 12 on the inner surface of the cylindrical structure. The parallel surface 13 a is provided in parallel to the side surface of the frame member 12.

  One end side of the optical fiber holding member 13 for holding the translucent member 14 in the through hole 2 a is joined around the through hole 2 a on the outer surface of the frame member 12. The optical fiber holding member 13 is made of, for example, an Fe—Ni—Co alloy or the like, and is formed into a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to a metal ingot. One end side of the optical fiber holding member 13 is joined to the periphery of the through hole 2a on the outer surface of the frame member 12 by brazing with Ag brazing or the like, or soldering with Au-Sn solder or the like. Airtightly closed. The optical fiber 4 is held on the other end side of the optical fiber holding member 13. In the optical fiber holding member 13, a notch is formed between the surface where the optical fiber holding member 13 and the frame member 12 are joined and the outer peripheral surface of the optical fiber holding member 13.

  A frame-like or cylindrical fixing member 16 for fixing the optical fiber 4 is provided on the other end side outside the frame member 12 of the optical fiber holding member 13. The translucent member 14 is joined so that the central axis of the translucent member 14 and the central axis of the inner surface of the optical fiber holding member 13 coincide with each other, and the translucent member 14 is an optical semiconductor. It is joined at a position facing the element 3.

  The optical fiber holding member 13 has an inner side surface formed in the axial direction of the central portion, and the translucent member 14 is made of a brazing material such as Ag-Cu solder, Au-Sn solder or the like so as to close the inner side surface. It is airtightly bonded by a bonding material such as solder or glass.

  The translucent member 14 is bonded to the parallel surface 13 a of the optical fiber holding member 13. The translucent member 14 is made of glass, sapphire, or the like, and has a plate shape such as a disk shape or a square plate shape, a spherical shape, a hemispherical shape, or a lens shape. It may be a plate-like one that simply transmits light, or may have a function of condensing the light that is transmitted in a spherical shape, a hemispherical shape, or a lens shape.

  When the translucent part 14 is joined to the optical fiber holding member 13 via a brazing material or solder, the outer peripheral part of the translucent member 14 is W, Mo, manganese (Mn), Ag—Cu over the entire circumference. -A metal layer made of titanium (Ti) alloy, Ni, Au or the like is preferably applied. Adhesion with the brazing material and solder is improved in the metal layer of the translucent member 14, and the translucent member 14 is firmly joined to the inner surface of the optical fiber holding member 13 via the brazing material and solder. It is.

  It is preferable that an antireflection film is provided on the main surface of the translucent member 14 on the side where the optical signal is incident. In this way, it is possible to suppress the occurrence of loss due to the reflection of the optical signal on the surface of the translucent member 14.

  When the translucent member 14 provided with the antireflection film is bonded to the optical fiber holding member 13, in order to prevent the antireflection film from being altered or evaporated by heat, bonding at a low temperature with a melting point of 400 ° C. or lower. It is preferable to join through a material.

  As a bonding material having a melting point of 400 ° C. or lower, for example, Au—Sn solder (melting point is 280 ° C.) composed of 80% by mass of Au and 20% by mass of tin (Sn), 88% by mass of Au and germanium (Ge) Au-Ge solder, Sn-Ag series solder, Sn-antimony (Sb) series solder, Sn-bismuth (Bi) series solder, Sn-lead (Pb) series solder such as .

  The translucent member 14 is bonded to the optical fiber holding member 13 in advance, and an antireflection film is applied to the surface of the translucent member 14 in a state where the translucent member 14 is bonded to the optical fiber holding member 13. May be. In this case, bonding can be performed via a bonding material having a high melting point exceeding 400 ° C.

  When the translucent member 14 is made of glass, the vicinity of the surface of the translucent member 14 to be bonded to the optical fiber holding member 13 is melted to hold the translucent member 14 and the optical fiber without using a bonding material. The member 13 may be joined. With this configuration, since the translucent member 14 is directly joined to the optical fiber holding member 13, the adhesion of the translucent member 14 to the optical fiber holding member 13 can be improved.

The optical fiber 4 is fixed to a frame-like or cylindrical fixing member 16 made of a metal such as Fe-Ni-Co alloy or SUS. One end or one main surface of the fixing member 16 is joined to the other end side of the optical fiber holding member 13 by welding such as laser welding or soldering, and the optical fiber 4 is attached to the frame member 12 via the fixing member 16. Bonded to one side.
As a result, optical signals can be exchanged between the optical semiconductor element 3 housed inside the package and the outside via the optical fiber 4.

  As described above, according to the package according to the present embodiment, the optical fiber holding member located outside the through hole 2a of the optical fiber holding member 13 or the portion of the optical fiber holding member 13 fitted in the through hole 2a. Since the translucent member 14 is bonded only to the surface parallel to the frame member 12 among the inner surfaces of the working member 13, the optical fiber 4 is connected to the other end side. For example, the thermal stress applied to the translucent member 14 can be reduced when the is held by welding. Here, if the optical fiber holding member 13 is fitted into the through-hole 2a, the translucent member 14 is provided on the inner surface of the optical fiber holding member 13 on a surface perpendicular to the frame member 12. Consider the mode of joining. In this aspect, when the optical fiber 4 is held on the other end side by, for example, welding, the thermal stress applied to the optical fiber holding member 13 directly acts on the translucent member 14. That is, thermal stress is applied to the translucent member 14 from the up and down direction of the translucent member 14. For this reason, the translucent member 14 becomes easy to be damaged by a crack or the like. On the other hand, according to the electronic component storage package according to the present embodiment, the portion of the optical fiber holding member 13 fitted in the through hole 2a or the outer side of the through hole 2a of the optical fiber holding member 13 is provided. Since the translucent member 14 is joined only to the surface parallel to the frame member 12 among the inner side surfaces of the optical fiber holding member 13, when the optical fiber 4 is held by the other end side, for example, by welding. The thermal stress applied to the optical fiber holding member 13 does not directly act on the translucent member 14. That is, thermal stress is not applied to the translucent member 14 from above and below the translucent member 14. For this reason, the translucent member 14 becomes difficult to be damaged by a crack or the like. Thereby, an optical signal can be transmitted between the optical semiconductor element 3 and the optical fiber 4 without hindrance.

  That is, as shown in FIG. 2, only the surface parallel to the frame member 12 among the inner surfaces of the optical fiber holding member 13 at the location of the optical fiber holding member 13 fitted in the through hole 2a is transparent. When the optical member 14 is joined, the outer peripheral surface of the optical fiber holding member 13 where the translucent member 14 is joined is restrained and held by the frame member 12, and the optical fiber 4 is welded. When the optical fiber holding member 13 is held, thermal stress applied to the optical fiber holding member 13 is hardly applied to the translucent member 14.

  Further, as shown in FIG. 2, when the seal ring is bonded to the upper surface of the frame member 12, the package becomes low in height, and the height of the package becomes almost the same as the height of the optical fiber holding member 13. In addition, since the notch is formed, it is possible to prevent the end face of the optical fiber holding member 13 from coming into contact with the seal ring. For this reason, it can prevent that the attachment state of the member 13 for optical fiber holding changes according to the state of a seal ring. Therefore, the optical fiber holding member 13 can be attached at a predetermined position and in a predetermined direction even if the seal ring has dimensional variation or deviation and the side surface of the seal ring protrudes from the side surface of the frame member 12. As a result, it is possible to prevent the optical axis of the optical semiconductor element 3 from deviating from the optical axis of the optical fiber 4 held by the optical fiber holding member 13.

  Preferably, as shown in FIG. 2, the thickness of the optical fiber holding member 13 at the location (fitting portion) of the optical fiber holding member 13 fitted in the through hole 2a is formed as a notch. It is preferable that the optical fiber holding member 13 is thinner than the thickness of the optical fiber holding member 13 at the portion (thin wall portion) of the optical fiber holding member 13. According to this aspect, when holding the optical fiber 4 on the other end side, for example, by welding, even if a thermal stress acts on the optical fiber holding member 13, the optical fiber holding member to which the translucent member 14 is bonded is joined. It is difficult for thermal stress to be transmitted to the part of the member 13. Therefore, the translucent member 14 is not easily damaged by cracks or the like. Thereby, an optical signal can be transmitted between the optical semiconductor element 3 and the optical fiber 4 without hindrance.

(Second Embodiment)
When configured as an optical semiconductor device, as shown in FIG. 3, a rubber cover 17 is attached so as to cover the optical fiber holding member 13 and protect the periphery of the joint portion of the optical fiber 4 with the fixing member 16. There is a case. In this case, by providing the rubber cover 17 with a protrusion that can fit into the notch, the protrusion can be fitted into the notch. By doing so, it is possible to make it difficult for the rubber cover 17 to be detached from the optical fiber holding member 13. The cover is not limited to rubber.

(Third embodiment)
An optical semiconductor device according to the third embodiment of the present invention will be described with reference to FIGS. The optical semiconductor device in the present embodiment includes a package 1, a submount substrate 2 provided in the package 1, and an optical semiconductor element 3 mounted on the submount substrate 2. In FIG. 4, the upward direction means the positive direction of the virtual z axis.

  The package 1 includes a bottom plate 11, a frame member 12, an optical fiber holding member 13, a translucent member 14, and a lid 15.

  The bottom plate 11 is substantially made of a metal material and has a mounting region 11 a for the optical semiconductor element 3. In FIG. 5, the submount substrate 2 and the optical semiconductor element 3 are shown by broken lines in a transmitted state.

  The frame member 12 is provided on the bottom plate 11 so as to surround the mounting region 111, and has a through hole 12a provided in the virtual x-axis direction. The frame member 12 is substantially made of a metal material.

  The optical fiber holding member 13 is partially provided in the through hole 12a and has a cylindrical structure. The optical fiber holding member 13 has a parallel surface 13a with respect to the frame member 12 on the inner surface of the cylindrical structure. The parallel surface 13 a is provided in parallel to the side surface of the frame member 12. The parallel surface 13 a is provided outside the frame member 12. In the present embodiment, the surface 13a parallel to the frame member 12 of the optical fiber holding member 13 is preferably directed toward the outside of the package.

  The translucent member 14 is bonded to the parallel surface 13 a of the optical fiber holding member 13. “Translucent” in the member 14 means that at least part of the wavelength of light emitted from the optical semiconductor element 3 can be transmitted, or that at least part of the wavelength of light emitted from the optical fiber 4 can be transmitted. Say. The translucent member 14 is substantially made of glass or sapphire. The translucent member 14 is provided outside the frame member 12. The translucent member 14 is separated from the vertical surface 13 b with respect to the frame member 12 on the inner surface of the optical fiber holding member 13.

  The optical semiconductor device according to the present embodiment has a surface 13 a parallel to the frame member 12 among the inner surfaces of the optical fiber holding member 13 outside the through hole 2 a of the optical fiber holding member 13. Since the translucent member 14 is bonded only to the surface 13a parallel to the surface, even if the portion of the optical fiber holding member 13 on the fixing member 16 bonding surface side is deformed, the deformation is transmitted in a direction perpendicular thereto. When the optical fiber 4 is held by welding, thermal stress applied to the optical fiber holding member 13 is hardly applied to the translucent member 14.

  In the optical semiconductor device according to the present embodiment, the translucent member 14 is provided outside the frame member 12, so that deterioration of the translucent member 14 due to heat generated by the optical semiconductor element 3 is reduced. Yes.

DESCRIPTION OF SYMBOLS 1 Package 11 Bottom plate 12 Frame member 13 Optical fiber holding member 14 Translucent member 15 Lid 2 Submount substrate 3 Optical semiconductor element 4 Optical fiber

Claims (6)

A bottom plate having an upper surface including a mounting region of the optical semiconductor element;
A frame member provided on the bottom plate so as to surround the mounting region, and having a through hole;
An optical fiber holding member that is partially provided in the through hole, has a cylindrical structure, and has a parallel surface to the frame member on an inner surface of the cylindrical structure;
An optical semiconductor element housing package comprising: a translucent member bonded to the parallel surface of the optical fiber holding member.   2. The optical semiconductor element housing package according to claim 1, wherein the translucent member is provided in a portion corresponding to the frame member in an inner space of the optical fiber holding member.   2. The optical semiconductor element housing package according to claim 1, wherein the translucent member is provided in a portion outside the frame member in an inner space of the optical fiber holding member.   The optical semiconductor element storage package according to claim 1, wherein the holding member has a notch formed between a surface where the holding member and the side wall are joined and an outer peripheral surface of the holding member. .   The thickness of the said holding member in the location of the said holding member fitted to the said through-hole is thinner than the thickness of the said holding member in the location of the said holding member in which the said notch part was formed. Optical semiconductor element storage package. An optical semiconductor element storage package according to any one of claims 1 to 5,
The optical semiconductor device provided with the optical semiconductor element mounted in the said mounting part so that it might optically couple | bond with the said optical fiber, and the cover body joined to the upper surface of the said side wall.

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