JP2002270944A - Package for housing optical semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor package which can prevent the occurrence of cracking in a lens member, house airtightly an optical semiconductor element to be housed therein, operate it normally and stably for a long time, and transmit an optical signal efficiently. SOLUTION: This package is provided with a substrate 1 having a placing part 1a to place an optical semiconductor element 8 on an upper main surface, a frame 2 provided with a penetrated opening 2a that is bonded to surround the placing part 1a in the outer periphery of the upper main surface and used to input/output an optical signal to/from a side part, a nearly disc-like metallic supporting member 5 in which a through hole 5a is formed in a center, and a lens 4 joined with the periphery of the through hole 5a. The metallic supporting member 5 is formed in a manner that a curved part 5b having an almost U-shape surrounds the through hole 5a on the outer peripheral side of the joint part of the through hole 5a and the lens 4, and it be projected toward the inside of the frame 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element operating at a high frequency used in the field of optical communication and the like.

[0002]

2. Description of the Related Art An optical semiconductor device housing package (hereinafter referred to as an optical semiconductor device) for hermetically sealing and housing an optical semiconductor device such as a semiconductor laser (LD) and a photodiode (PD) operating at a high frequency for conventional optical communication and the like. FIG. 7 is a sectional view showing an example of a semiconductor package). In the figure, 21 is a base, 2
2 is a frame, 24 is a lens member, 25 is a metal holding member,
26 is an optical fiber and 28 is an optical semiconductor element.

The base 21 is made of iron (Fe) -nickel (Ni).
Metal materials such as cobalt (Co) alloy and copper (Cu) -tungsten (W) alloy, alumina (Al ₂ O ₃ ), aluminum nitride (AlN), mullite (3Al ₂ O ₃ .2S)
A mounting portion 21a on which an optical semiconductor element 28 such as an LD or PD is mounted is formed substantially at the center of the upper main surface of the ceramic such as iO ₂ ). The optical semiconductor element 28 is mounted and fixed on the mounting portion 21a via a mounting base 29 such as a circuit board or a subcarrier.

An outer peripheral portion of the upper main surface of the base 21 is joined so as to surround the mounting portion 21a, and has a penetrating opening 22a on one side serving as an optical signal input / output portion.
Metal materials such as Ni—Co alloys, alumina (Al ₂ O ₃ ),
Aluminum nitride (AlN), mullite (3Al ₂ O _3.
A frame 22 made of ceramics such as 2SiO ₂ ) is provided upright.

Further, a through hole 25a is formed in the center of the metal member, such as an Fe--Ni--Co alloy, and is joined to the opening 22a around the outside of the frame 2 for holding the lens member 24. Substantially disk-shaped metal holding member 25
Is joined to one side of the frame 22. Metal holding member 2
5, a lens member 24 is joined around the through hole 25a so as to cover the through hole 25a.

The lens member 24 is a disk-shaped, spherical, or hemispherical member made of glass, sapphire, or the like, and is hermetically bonded to the metal holding member 25 by glass bonding, soldering, or the like. The metal holding member 25 may be a cap-shaped member as shown in a sectional view in FIG.

A lid 23 made of a metal such as an Fe-Ni-Co alloy is joined to the upper surface of the frame 22 by a welding method such as a brazing method or a seam welding method. An optical semiconductor element 28 is housed in a container mainly composed of a lens 23, a lens member 24 and a metal holding member 25, and hermetically sealed.

Finally, a cylindrical metal fixing member 27 for fixing the optical fiber 26 is welded to the outer peripheral portion of the metal holding member 25, and the optical fiber 26 is inserted and fixed from the outside to the metal fixing member 27 to form a frame. By being fixed to one side of the body 2, an optical semiconductor device as a product is obtained.

In this optical semiconductor device, the optical semiconductor element 2 is driven by an electric signal supplied from an external electric circuit (not shown).
By exciting the light to 8, transmitting the light in the order of the lens member 24 and the optical fiber 26, and transmitting the light to the outside via the optical fiber 26, it functions as an optical semiconductor device used for high-speed optical communication or the like. Alternatively, an optical signal transmitted from the outside via the optical fiber 26 is transmitted to the lens member 24.
The optical semiconductor device 28 functions as an optical semiconductor device used for high-speed optical communication and the like by converting the optical signal into an electric signal by transmitting the light to the optical semiconductor element 28 and receiving the light.

[0010]

However, in the above-mentioned conventional optical semiconductor package, the metal holding member 25 is required.
Metal fixing member 27 for fixing optical fiber 26
In joining, the heat generated by welding is locally applied to the vicinity of the outer peripheral portion of the metal holding member 25, and the metal holding member 25 may be deformed by thermal expansion. As a result, cracks occur in the lens member 24 joined to the metal holding member 25, and the airtightness in the optical semiconductor package cannot be maintained.
There is a problem that the optical semiconductor element 28 housed inside does not operate normally.

When the lens member 24 is cracked, an optical signal emitted from the optical semiconductor element 28 causes irregular reflection in the lens member 24, and the optical signal from the optical semiconductor element 28 is efficiently transmitted to the optical fiber 26. There was a problem that it became impossible. Alternatively, an optical signal transmitted from the outside through the optical fiber 26 is irregularly reflected in the lens member 24, so that the optical semiconductor element 28 cannot receive the optical signal efficiently.

Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to prevent the occurrence of cracks in a lens member, and as a result, to optically house an optical semiconductor element housed therein. It is another object of the present invention to provide an optical semiconductor package capable of operating an optical semiconductor element normally and stably for a long period of time and transmitting an optical signal efficiently.

[0013]

An optical semiconductor package according to the present invention has a base having a mounting portion for mounting an optical semiconductor element on an upper main surface, and a mounting portion on an outer peripheral portion of the upper main surface. And a frame body provided with a penetrating opening for inputting / outputting an optical signal at a side portion, and an outer peripheral portion is joined around the outside of the frame body of the opening, and penetrated at the center. In an optical semiconductor element storage package including a substantially disk-shaped metal holding member having a hole formed therein and a lens member joined around the through hole, the metal holding member is provided with a through hole. A curved portion having a substantially U-shaped cross section is formed on the outer peripheral side of the joint portion with the lens member so as to surround the through hole and protrude inward of the frame.

According to the present invention, the metal holding member is formed such that a curved portion having a substantially U-shaped cross section surrounds the through hole and protrudes inward of the frame body, on the outer peripheral side of the joint portion of the through hole with the lens member. Accordingly, even when the metal holding member is deformed due to thermal expansion due to heat applied thereto, the deformation can be absorbed by the curved portion. As a result, when welding the metal fixing member for fixing the optical fiber to the outer peripheral portion of the metal holding member,
Even when heat due to welding is locally applied to the vicinity of the outer periphery of the metal holding member and the metal holding member is deformed by thermal expansion, it is possible to prevent the lens member from being cracked. As a result, the airtightness inside the optical semiconductor package can be effectively maintained, the optical signal from the optical semiconductor element can be efficiently transmitted to the optical fiber, and the optical signal transmitted from the external optical fiber can be transmitted to the optical semiconductor element. It will be possible to receive efficiently.

Further, since the curved portion of the metal holding member is formed so as to protrude inward of the frame, there is no protruding portion on the optical fiber side where heat is easily dissipated. Problems are less likely to occur. In addition, since the curved portion of the metal holding member is formed so as to protrude inward of the frame, the metal holding member can be appropriately deformed inward with respect to the atmospheric pressure from the outside, so that the metal holding member is deformed. The pressure due to the atmospheric pressure can be reduced to prevent deformation and breakage.

Further, the optical semiconductor package of the present invention has a base having a mounting portion for mounting an optical semiconductor element on the upper main surface, and an outer peripheral portion of the upper main surface surrounding the mounting portion. A frame body provided with a penetrating opening for inputting / outputting an optical signal on the side part, and an outer peripheral part joined to the periphery of the opening outside the frame body, and a through hole is formed in the center. An optical disc device housing package comprising a substantially disc-shaped metal holding member and a lens member joined around the through hole, wherein the metal holding member has a frame around the through hole. An intermediate portion between the periphery of the through-hole and the outer peripheral portion is located on the inside of the body and has a slope extending to the outside of the frame.

According to the present invention, the metal holding member has a slope in which the periphery of the through hole is located inside the frame, and an intermediate portion between the periphery of the through hole and the outer peripheral portion extends to the outside of the frame. Therefore, even when the metal holding member is deformed due to heat expansion due to heat, the deformation can be absorbed by the frustum-shaped slope. As a result, when the metal fixing member for fixing the optical fiber is welded to the outer periphery of the metal holding member, heat due to welding is locally applied to the vicinity of the outer periphery of the metal holding member, and the metal holding member thermally expands. This prevents the lens member from being cracked even when deformed. As a result, while maintaining the airtightness inside the optical semiconductor package effectively,
An optical signal emitted from the optical semiconductor element can be efficiently transmitted to the optical fiber, and an optical signal transmitted from the outside via the optical fiber can be efficiently received by the optical semiconductor element.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical semiconductor package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an optical semiconductor package of the present invention, wherein 1 is a base, 2 is a frame, 4 is a lens member, 5 is a metal holding member, 6 is an optical fiber, and 8 is It is an optical semiconductor device.

The substrate 1 of the present invention is made of an Fe—Ni—Co alloy
Metal materials such as Al and Cu-W alloys and Al _TwoO_Three, AlN, 3A
l_TwoO_Three・ 2SiO_TwoMade of ceramics, etc., metal materials
Rolled or punched into the ingot
By applying a conventionally known metal processing method such as processing
It is manufactured in the shape of

When the substrate 1 is made of, for example, Al ₂ O ₃ ceramics, it is manufactured as follows. First, A
l ₂ O ₃ , silicon oxide (SiO ₂ ), calcium oxide (Ca
An organic binder, a plasticizer, a dispersant, a solvent, and the like are added to a raw material powder such as O) and magnesium oxide (MgO) and mixed to form a slurry. This is formed into a sheet by a conventionally known doctor blade method to obtain a plurality of ceramic green sheets. Thereafter, these ceramic green sheets are appropriately punched and fired at a temperature of about 1600 ° C. in a reducing atmosphere.

A mounting section 1a on which an optical semiconductor element 8 such as an LD or PD is mounted is formed on the upper main surface of the base 1, and the optical semiconductor element 8 is mounted on the mounting section 1a. It is mounted and fixed via a mounting base 9 such as a subcarrier or a subcarrier.

Further, an outer peripheral portion of the upper main surface of the base 1 is joined so as to surround the mounting portion 1a, and a cylindrical metal fixing member 7 for fixing the optical fiber 6 is provided on one side. A frame 2 having a penetrating opening 2a serving as an optical signal input / output unit is joined and erected, and the frame 2 together with the base 1 has a space for accommodating the optical semiconductor element 8 inside (internal space) thereof. To form

The frame 2 is a frame having a substantially rectangular shape in a plan view, and functions to support the optical fiber 6. Further, similarly to the base 1, an Fe—Ni—Co alloy or Cu
-W alloys and the like, Al ₂ O ₃ , AlN, 3Al ₂ O ₃
The base 1 is made of ceramics such as 2SiO ₂ and is formed integrally with the base 1, brazed to the base 1 with a brazing material such as Ag braze, or joined by a welding method such as a seam welding method. Is erected on the outer peripheral portion of the upper main surface of the main body.

Further, for holding the lens member 4 which is made of a metal such as an Fe-Ni-Co alloy, the outer peripheral portion is joined to the periphery of the opening 2a outside the frame 2, and the through hole 5a is formed in the center. , A substantially disk-shaped metal holding member 5 is provided. The lens member 4 is hermetically bonded to the metal holding member 5 around the through hole 5a by glass bonding or soldering so as to cover the through hole 5a.

The lens member 4 is a disk-shaped, spherical or hemispherical member made of glass, sapphire, or the like. In this case, the outer peripheral portion of the flat portion is joined to the metal holding member 5 by glass joining or soldering.

The metal holding member 5 is manufactured into a predetermined shape by subjecting an ingot of a metal material to a conventionally known metal working method such as rolling or punching, and FIG. As shown in the figure, a curved portion 5b having a substantially U-shaped cross section is formed on the outer peripheral side of the joint portion of the through hole 5a with the lens member 4 so as to surround the through hole 5a and protrude inside the frame 2. ing.

The metal holding member 5 is joined by brazing with Ag brazing or the like, or by soldering with Au-Sn solder, Pb-Sn solder or the like so that the outer peripheral portion closes the opening 2a.
The opening 2a is hermetically closed together with the lens member 4.

The optical fiber 6 is made of Fe—Ni—Co
It is fixed to a substantially cylindrical metal fixing member 7 made of a metal such as an alloy, and one end surface of the metal fixing member 7 is joined to the vicinity of the outer peripheral portion of the metal holding member 5 by welding such as a laser welding method, The optical fiber 6 is joined to one side of the frame 2 via the metal fixing member 7 to form an optical semiconductor device as a product. Thereby, it becomes possible to exchange optical signals between the optical semiconductor element 8 housed therein and the outside via the optical fiber 6.

The metal holding member 5 is formed with a curved portion 5b having a substantially U-shaped cross section so as to surround the through hole 5a on the outer peripheral side of the joint with the lens member 4 so as to surround the metal. A metal fixing member 7 is provided near the outer peripheral portion of the holding member 5.
Are joined by a welding method, and even when heat generated by welding is applied locally and the metal holding member 5 is deformed by thermal expansion, the deformation is absorbed by the curved portion 5b. As a result, deformation is suppressed at the joint portion between the metal holding member 5 and the lens member 4, thereby preventing the lens member 4 from being cracked. As a result, the airtightness in the optical semiconductor package can be effectively maintained, and the optical signal from the optical semiconductor element 8 can be efficiently transmitted to the optical fiber 6 without being irregularly reflected in the lens member 4. Alternatively, the optical signal can be efficiently received by the optical semiconductor element 28 without irregularly reflecting the optical signal transmitted from the outside through the optical fiber 26 in the lens member 24.

Further, since the curved portion 5b of the metal holding member 5 is formed so as to project toward the inside of the frame 2, there is no convex portion of the curved portion 5b which easily radiates heat on the optical fiber 6 side. Problems such as displacement of the optical axis of the optical fiber 6 due to heat are less likely to occur. Further, since the metal holding member 5 can be appropriately deformed inward with respect to the atmospheric pressure from the outside, the pressure due to the atmospheric pressure applied to the lens member 4 can be reduced, and the deformation and damage can be prevented.

In the present invention, it is preferable that the lens member 4 be joined to the periphery of the opening 5a of the metal holding member 5 outside the frame 2. In this case, as shown in FIG. 9, the semiconductor package is pressurized from the outside to the inside in order to make the inside airtight, and when the both ends of the base 1 deformed so as to be generally convex downward, the base 1 is fixed. A correcting force for flattening is applied, and the correcting force is applied to the lens member 4.
Is applied as tensile stress. When a tensile stress is applied to the lens member 4, the lens member 4 is easily peeled from the metal holding member 5. However, the lens member 4 is connected to the frame 2 having the opening 5a.
By bonding the lens member 4 to the outer periphery, the lens member 4 is pressed against the metal holding member 5 by the air pressure, and is hardly peeled off. On the other hand, when the lens member 4 is joined around the inside of the frame 2 at the opening 5a, the force for peeling the lens member 4 by the tensile stress and the pressure due to the atmospheric pressure cause the lens member 4 to move away from the metal holding member 5. It will be easily removed.

As shown in FIG. 2 (b), the metal holding member 5 has a substantially U-shaped curved portion 5b alternately and continuously formed to form a waveform, and one of the curved portions 5b becomes convex outside the frame 2. The other may be curved so as to be convex inside the frame 2. When there is only one substantially U-shaped curved portion 5b or the curved portion 5
When the metal holding member 5 is deformed and the protrusion direction is the same, the metal holding member 5
Is likely to warp in the protruding direction. As a result, there is a possibility that the metal holding member 5 is warped at the joint with the lens member 4, and the lens member 4 may be cracked. Therefore, it is preferable that the U-shaped curved portion 5b is projected to the outside and the inside of the frame 2, respectively. With this configuration, warping deformation due to a force acting in the vertical direction is buffered, and the lens member 4 is bent.
Warp deformation can be effectively suppressed at the junction with the substrate.

Also, as shown in FIG. 2B, it is preferable that the curved portion 5b projecting inward of the frame 2 is located on the side close to the lens member 4. The holding member 5 is easily deformed appropriately.

Further, in a configuration similar to that of FIG.
As shown in FIG. 2C, it is preferable to increase the curvature of the curved portion 5b on the outer peripheral side of the metal holding member 5 and reduce the curvature of the curved portion 5b on the side of the through hole 5a. Thereby, the warpage can be more effectively suppressed, and the thermal expansion is particularly large near the outer peripheral portion where the metal fixing member 7 is welded, and the metal fixing member 7 is easily deformed. Thereby, the deformation can be absorbed more effectively in the curved portion 5b on the outer peripheral side. Further, by reducing the curvature on the side of the through hole 5a, the rigidity of the curved portion 5b on the side of the through hole 5a is increased, so that the curved portion 5b is not easily deformed. Therefore, the deformation on the side of the through hole 5a due to the vertical force is further suppressed, and the lens member 4
Can be prevented from cracking.

Also in this case, it is preferable that the curved portion 5b protruding inside the frame 2 is located on the side close to the lens member 4.
In this case, the metal holding member 5 is easily deformed appropriately with respect to the atmospheric pressure from the outside.

The substantially U-shaped curved portion 5b is provided as shown in FIG.
As shown in (a), the cross section may be a concave shape having a sharp corner. In this configuration, when the metal fixing member 5 is deformed, there is almost no directivity of the warping deformation in and out of the frame 2, and thus the substantially U-shaped curved portion 5 b as shown in FIG.
Can be suppressed without forming two of them continuously. In a configuration similar to that of FIG.
As shown in FIG. 3B, it is preferable that the corner on the outer peripheral portion side be substantially a right angle and the corner portion on the through hole 5a side be an obtuse angle. With this configuration, the thermal expansion is particularly large in the vicinity of the outer peripheral portion where the metal fixing member 7 is welded, and the metal fixing member 7 is easily deformed. The deformation can be more effectively absorbed at the corners on the outer peripheral side. In addition, by making the corner on the side of the through-hole 5a obtuse, deformation near the through-hole 5a can be suppressed, and cracks in the lens member 4 can be prevented.

The substantially U-shaped curved portion 5b may have a triangular cross section as shown in FIG. Also in this configuration, as in the case of FIG. 3A, there is almost no direction of the warping deformation in and out of the frame 2, so that a substantially U-shaped curved portion as shown in FIG. The warpage can be suppressed without forming two 5b in a row.

The optical semiconductor package of the present invention
The electrodes of the optical semiconductor element 8 are electrically connected to an external electric circuit (not shown), and then the Fe-Ni-
An optical semiconductor device as a product is obtained by joining the lid 3 made of a metal such as a Co alloy by a soldering method or a seam welding method.

In this optical semiconductor device, light is excited in the optical semiconductor element 8 by an electric signal supplied from an external electric circuit, and this light is transmitted through the lens member 4 and the optical fiber 6 in this order. By transmitting to the outside, it functions as an optical semiconductor device used for high-speed optical communication or the like. Alternatively, an optical signal transmitted from the outside through the optical fiber 6 is transmitted through the lens member 4 and received by the optical semiconductor element 8 to convert the optical signal into an electric signal.
It functions as an optical semiconductor device used for high-speed optical communication and the like.

FIG. 5 is a cross-sectional view showing another embodiment of the optical semiconductor package of the present invention, wherein 1 is a base, 2 is a frame, 4 is a lens member, 5 is a metal holding member,
6 is an optical fiber and 8 is an optical semiconductor element. As shown in the figure, the metal holding member 5 is provided with a through hole 2 provided in the frame 2.
Brazing with Ag braze etc. to cover a and Au-Sn
By soldering such as solder, Pb-Sn solder or the like, the outer peripheral portion is joined so as to close the opening 2a, and the opening 2a together with the lens member 4 is airtightly closed.

The optical fiber 6 is fixed to a substantially cylindrical metal fixing member 7 made of a metal such as an Fe—Ni—Co alloy, and one end face of the metal fixing member 7 is connected to the metal holding member 5. The optical semiconductor device as a product is obtained by joining the optical fiber 6 to one side of the frame 2 via a metal fixing member 7 near the outer periphery of the frame 2 by welding such as a laser welding method. Thereby, it becomes possible to exchange optical signals between the optical semiconductor element 8 housed therein and the outside via the optical fiber 6.

As shown in FIG. 6, the metal holding member 5 shown in FIG. 5 has the periphery of the through hole 5a located inside the frame body 2 and the intermediate portion between the periphery of the through hole 5a and the outer peripheral portion as a frame. The slope 5d extends outside the body 2. From this, when one end surface of the metal fixing member 7 is joined to the vicinity of the outer peripheral portion of the metal holding member 5 by a welding method, heat by welding is locally applied, and the metal holding member 5 is deformed by thermal expansion. In this case, the deformation is absorbed by the slope 5d, and the deformation is suppressed at the joint of the metal holding member 5 and the lens member 4. As a result, it is possible to prevent cracks from entering the lens member 4, effectively maintain airtightness in the optical semiconductor package, and prevent the optical signal from the optical semiconductor element 8 from being irregularly reflected in the lens member 4, and 6 can be transmitted efficiently, or an optical signal transmitted from the outside through the optical fiber 6 can be efficiently received by the optical semiconductor element 8.

Further, since the inclined surface 5d is formed as described above, the corner with the flat surface 5c becomes obtuse, and stress corrosion cracking of the metal holding member 5 at the corner is reduced, and the inside of the optical semiconductor package is reduced. Can be effectively maintained.

The optical semiconductor package of the present invention
The electrodes of the optical semiconductor element 8 are electrically connected to an external electric circuit (not shown), and then the Fe-Ni-
An optical semiconductor device as a product is obtained by joining the lid 3 made of a metal such as a Co alloy by soldering or seam welding.

In this optical semiconductor device, light is excited in the optical semiconductor element 8 by an electric signal supplied from an external electric circuit, and this light is transmitted through the lens member 4 and the optical fiber 6 in this order. By transmitting to the outside, it functions as an optical semiconductor device used for high-speed optical communication or the like. Alternatively, an optical signal transmitted from the outside through the optical fiber 6 is transmitted through the lens member 4 and received by the optical semiconductor element 8 to convert the optical signal into an electric signal.
It functions as an optical semiconductor device used for high-speed optical communication and the like.

The present invention is not limited to the above embodiment, and various changes can be made without departing from the scope of the present invention.

[0047]

According to the present invention, a metal holding member for holding a lens member functioning as an optical signal input / output unit of an optical semiconductor package has a cross section substantially on the outer peripheral side of a joint portion of the through hole with the lens member. Since the U-shaped curved portion surrounds the through hole and is formed so as to protrude inside the frame, the metal fixing member for fixing the optical fiber to the vicinity of the outer peripheral portion of the metal holding member is formed by a laser. When deformation due to thermal expansion occurs due to welding by a welding method or the like, the deformation can be absorbed by the substantially U-shaped curved portion. As a result, it is possible to prevent deformation due to thermal expansion at the joint portion of the lens member, and prevent the lens member from being cracked. As a result, the airtightness in the optical semiconductor package is effectively maintained, the optical semiconductor element is operated normally and stably for a long time, and the optical signal from the optical semiconductor element is efficiently transmitted to the optical fiber without irregular reflection in the lens member. It is possible to transmit. Alternatively, it is possible to transmit an optical signal transmitted from an optical fiber from the outside to the optical semiconductor element side without causing irregular reflection in the lens member, and convert the optical signal into an electric signal without waste.

Further, since the curved portion of the metal holding member is formed so as to protrude inward of the frame, there is no protruding portion on the optical fiber side where heat is easily dissipated. And other problems are unlikely to occur. In addition, since the curved portion of the metal holding member is formed so as to protrude inward of the frame, the metal holding member can be appropriately deformed inward with respect to the atmospheric pressure from the outside, so that the metal holding member is deformed. The pressure due to the atmospheric pressure can be reduced to prevent deformation and breakage.

Further, according to the present invention, there is provided a metal holding member having a through hole for holding a lens member serving as an optical signal input / output portion of an optical semiconductor package. The metal fixing member for fixing the optical fiber to the vicinity of the outer peripheral portion of the metal holding member is formed by a laser welding method since an intermediate portion between the periphery of the hole and the outer peripheral portion is formed as a slope extending outside the frame. When deformation due to thermal expansion occurs due to welding or the like, the slope can absorb the deformation. As a result, it is possible to prevent deformation due to thermal expansion at the joint portion of the lens member, and prevent the lens member from being cracked. By preventing cracks in the lens member, the airtightness in the optical semiconductor package is effectively maintained, the optical semiconductor element operates normally and stably for a long time, and the optical signal emitted from the optical semiconductor element is transmitted through the lens member. The optical fiber can be efficiently transmitted without irregular reflection. Alternatively, it is possible to transmit an optical signal transmitted from an optical fiber from the outside to the optical semiconductor element side without causing irregular reflection in the lens member, and convert the optical signal into an electric signal without waste.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of an optical semiconductor package of the present invention.

FIGS. 2A to 2C are cross-sectional views of main parts showing respective examples of an embodiment of the optical semiconductor package of the present invention.

FIGS. 3 (a) and 3 (b) are cross-sectional views of main parts showing respective examples of an embodiment of the optical semiconductor package of the present invention.

FIG. 4 is a sectional view of a main part showing another example of the embodiment of the optical semiconductor package of the present invention.

FIG. 5 is a sectional view showing another example of the embodiment of the optical semiconductor package of the present invention.

FIG. 6 is a cross-sectional view of a principal part showing another example of the embodiment of the optical semiconductor package of the present invention.

FIG. 7 is a cross-sectional view of an example of a conventional optical semiconductor package.

FIG. 8 is a sectional view of a main part of a conventional optical semiconductor package.

FIG. 9 is a cross-sectional view of a main part for describing an operation of a metal holding member in the optical semiconductor package of the present invention.

[Explanation of symbols]

 1: base 1a: mounting portion 2: frame 2a: opening 4: lens member 5: metal holding member 5a: through hole 5b: curved portion 5c: flat surface 5d: inclined surface 8: optical semiconductor element

Claims (2)

[Claims] 1. A base body having a mounting portion for mounting an optical semiconductor element on an upper main surface, and joined to an outer peripheral portion of the upper main surface so as to surround the mounting portion and to a side portion. A substantially disc-shaped metal member having a frame provided with a penetrating opening for inputting and outputting an optical signal, and an outer peripheral portion joined to a periphery of the opening outside the frame, and a through hole formed in the center. In an optical semiconductor element housing package including a holding member and a lens member joined around the through hole, the metal holding member is closer to the outer periphery than a joint of the through hole with the lens member. A package for storing an optical semiconductor element, wherein a curved portion having a substantially U-shaped cross section surrounds the through hole and is formed to protrude inside the frame. 2. A base having a mounting portion on which an optical semiconductor element is mounted on an upper main surface, and joined to an outer peripheral portion of the upper main surface so as to surround the mounting portion. A substantially disc-shaped metal member having a frame provided with a penetrating opening for inputting and outputting an optical signal, and an outer peripheral portion joined to a periphery of the opening outside the frame, and a through hole formed in the center. In the optical semiconductor element housing package including a holding member and a lens member joined around the through hole, the metal holding member is configured such that a periphery of the through hole is located inside the frame body and the through hole is provided. An optical semiconductor element housing package, wherein an intermediate portion between the periphery of the hole and the outer peripheral portion is formed as a slope extending outside the frame body.