JP2001028407A - Package for housing optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the fact where projected warpage caused in the direction that links an optical semiconductor device with an optical fiber is returned to the lower side of a substrate by fixing with screws so as not to put the positional alignment of the device with the fiber out of order due to fixing with screws. SOLUTION: This package is formed into a structure, where the package has an almost rectangular base body 1 having a mounting part 1, which is mounted with an optical semiconductor device 4 on its upper surface, and a frame 2 which is bonded to the base body 1 in such a way as to encircle the mounting part 1a, is provided with an optical fiber fixing member 8 for fixing an optical fiber 12, which is optically coupled with the device 4 on the side part of the frame 2 and is provided with lead terminals 11 for inputting a drive signal in the element 4 on the other side part of the frame 2, and screwing parts 15 are respectively provided in the center part of each long side of the base body 1, in such a way as to project to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device housing package for housing an optical semiconductor device such as a semiconductor laser or a photodiode, and the optical axis is shifted when fixed to another circuit board or the like. With respect to the above.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional package P for storing an optical semiconductor element (hereinafter referred to as an optical package). An optical package P for housing an optical semiconductor element such as a semiconductor laser or a photodiode is basically a flat plate-shaped base 22.
And a frame 21 which is bonded and fixed on a base 22 to form a box-shaped side wall. The base 22 is made of a copper (Cu) -tungsten (W) alloy or the like, and has a mounting portion 22a of the optical semiconductor element 20 on which the optical semiconductor element 20 is mounted in a central region on the upper surface. The frame 21 is made of iron (Fe) -nickel (N
i) -Cobalt (Co) alloy (Kovar) or the like,
A cylindrical optical fiber fixing member 25 for fixing an optical fiber to a side portion, which is adhered to the base 22 via a metal brazing material such as silver brazing so as to surround the mounting portion 22a; A lead terminal 24 connected to the terminal is brazed and an insulating terminal (feed-through terminal) member 23 made of alumina ceramic or the like having a metallized wiring layer is provided. A metal lid (not shown) for hermetically sealing the optical semiconductor element 20 is provided above the frame 21.

[0003] The optical semiconductor element 20 is adhered and fixed to the mounting portion 22a of the base 22, and the optical semiconductor element 20 is fixed.
Are connected to the metallized wiring layer to which the lead terminals 24 are connected via bonding wires, and then a lid is adhered to the upper part of the frame 21 to form a base 22
The optical semiconductor element 2 is placed inside a container comprising a frame, a frame 21 and a lid.
0 is stored. Finally, the optical fiber fixing member 2 of the frame 21
5 is welded to the end of the optical fiber 28 by irradiating a laser beam, and the optical fiber 28 is fixed to the frame 21 to form an optical semiconductor device. Reference numeral 26 denotes an optical package P provided at four corners of the base 22 on an external circuit board or the like.
A flange portion 27 formed with a through hole 26a for fixing the optical semiconductor device 20 with a screw or the like is a Peltier device installed under the optical semiconductor device 20 for cooling the optical semiconductor device 20 and performing stable driving. .

In such an optical semiconductor device, the optical semiconductor element 20 is driven by an electric signal supplied from an external drive circuit, for example, to oscillate a laser beam, and this light is transmitted to the optical fiber 2.
Transmission to the outside through 8 is used for high-speed optical communication and the like. In addition, as shown in FIG.
A flange portion (screw portion) 26 protruding from both short side ends of the rectangular base 22 in the direction along the long side is formed, and the screw portion is screwed to an external circuit board, an optical system member, or the like. It is fixed by stopping.

[0005]

However, in the conventional optical package P, the Cu-W
The coefficient of thermal expansion of the alloy is 7.0 × 10 ⁻⁶ / ° C. (room temperature to 800
° C), which is different from the coefficient of thermal expansion of the Fe-Ni-Co alloy constituting the frame 21 by 10 x ^10-6 / ° C (room temperature to 800 ° C). And the like, the maximum height difference is 10 to 2 due to the thermal stress caused by the difference in the thermal expansion coefficient between the two.
Warpage of about 0 μm had occurred. Therefore, if the optical semiconductor element 20 is housed in the optical package P to form an optical semiconductor device, and then the screwed portion of the base 22 is firmly screwed to an external member, the warpage of the base 22 is corrected. 22 and the height of the optical semiconductor device 20 mounted thereon changes, and the optical semiconductor device 2
There is a problem that the positional alignment between the optical fiber 28 and the optical fiber 28 is lost, and it becomes difficult to transmit the light oscillated from the optical semiconductor element 20 to the outside through the optical fiber 28.

Accordingly, the applicant of the present invention has the following formula: 0.3 ≦ T ≦ 1.0, where X is the thickness of the central region of the substrate and T is the thickness of both ends.
(Mm), and an optical package satisfying X ≧ 2T has been proposed (conventional example 1: see JP-A-6-314747). However, it is difficult to further reduce the thickness of the optical semiconductor device in the optical package of Conventional Example 1. A similar invention has been proposed in Japanese Patent No. 2,781,303, but has a similar problem.

In order to solve the above-mentioned problems, the applicant of the present application has joined to both end regions of a substrate made of a Cu-W alloy so as to protrude from a frame, and has a Young's modulus of 20,000 kgf /.
mm ² or less at the yield stress is proposed a light package having a screw member made of 50 kgf / mm ² or less of the metal material (Conventional Example 2: see Japanese Laid-Hei 11-74619). In this optical package, the fixing height of the optical semiconductor element does not change due to the stress of screwing, the positional alignment between the optical semiconductor element and the optical fiber is maintained, and the light from the optical semiconductor element is transmitted well to the outside. And a thin optical semiconductor device.

However, according to the optical package of Conventional Example 2, since the screwing members are provided at both ends of the base so as to protrude from the short side of the rectangular frame, the occupied area of the base is increased, and the optical semiconductor is increased. There is a problem that the miniaturization of the device is hindered. In addition, a step of bonding the base and the screwed portion with silver brazing or the like is required, and there is a problem that the assembling step is complicated, and a problem that the yield is further reduced as the number of assembling steps increases. In addition, the positional accuracy of the screwed portion is also easily deteriorated, and since the base and the screwed portion are separate,
There is a disadvantage that the structure is complicated and the optical package becomes expensive. A similar invention is proposed in JP-A-6-82659, but has the same problem.

Also, a first metal member fixed to a frame body may be used.
And a second bottom plate fixed to the surface of the first bottom plate opposite to the frame and having a higher Young's modulus than the first bottom plate. 11-74
934), and a first bottom plate made of metal fixed to the frame, and a metal fixed to the surface of the first bottom plate opposite to the frame and having a Young's modulus smaller than that of the first bottom plate. Although an optical semiconductor hermetically sealed container provided with a second bottom plate (conventional example 4: see Japanese Patent Application Laid-Open No. H11-74935) is known, in these conventional examples 3 and 4, in addition to the above problems,
Since the area of silver brazing is large, voids are generated at the silver brazing joint between the first bottom plate and the second bottom plate, which is a factor that greatly reduces reliability.

In each of the above-mentioned conventional examples 1 to 4, the screwing members are arranged on a line parallel to the line connecting the optical semiconductor element and the optical fiber, and are provided at both ends on the short side of the base. Further, in the conventional optical package, a convex warpage tends to be generated on the lower side, in which case the mounting portion and the screwing portion at the center of the base are located at the farthest position in the base, and the mounting portion is at the lowest position in the base. These two locations have the highest heights because the threaded stop is at the highest position. Therefore, with respect to the alignment position between the optical semiconductor element and the optical fiber, the warp of the base returns when the screw is fixed and the height and angle of the optical semiconductor element and the optical fiber are changed, and the laser light oscillated by the optical semiconductor element is transmitted to the outside. The problem that it becomes difficult occurs.

Accordingly, the present invention has been completed in view of the above circumstances, and an object of the present invention is to change the height and angle of the optical semiconductor element fixed to the base by returning the warpage of the substrate due to the stress of screwing. The optical coupling between the optical semiconductor element and the optical fiber is maintained, and the optical coupling between the optical semiconductor element and the optical fiber is maintained satisfactorily.
In addition, the optical semiconductor device is downsized by reducing the occupied area of the base, and the structure of the optical package is simplified, thereby reducing the number of assembly steps and preventing a decrease in yield, and further improving the reliability of the optical package. The purpose is to improve.

[0012]

According to the present invention, there is provided a package for storing an optical semiconductor element, comprising a substantially rectangular base having a mounting part on which an optical semiconductor element is mounted, and the base surrounding the mounting part. And an optical fiber fixing member for fixing an optical fiber optically coupled to the optical semiconductor element on one side and a lead terminal for inputting a drive signal to the optical semiconductor element on the other side. An optical semiconductor element housing package, comprising: a frame; and a screwing portion provided at a center of each long side of the base so as to protrude outward.

According to the present invention, with the above structure, a screwing portion is provided in a direction orthogonal to a direction connecting the optical semiconductor element and the optical fiber, so that stress at the time of screwing works in the orthogonal direction. The warp of the substrate in the direction perpendicular to the optical fiber is corrected, but the downwardly convex warp generated in the direction connecting the optical semiconductor element and the optical fiber is not returned by screwing. Therefore, since the height of the optical semiconductor element and the height of the optical fiber do not change at the time of screw fixing, the positional alignment between the optical semiconductor element and the optical fiber by the screw fixing does not change. Further, in the present invention, since the screw fixing position is near the optical semiconductor element, the difference in height between the optical semiconductor element and the screw fixing part is smaller than that of the conventional optical package. Therefore, when screwing is performed, it is possible to reduce the deviation of the position alignment between the optical semiconductor element and the optical fiber.

Further, since the alignment of the optical semiconductor element and the optical fiber at the time of fixing by screwing is not deviated, it becomes possible to integrate the screwing portion with the base, thereby reducing the number of parts and brazing silver. Such assembling steps are also reduced. Therefore, the position accuracy of the screwed portion is improved, the position of the optical package at the time of fixing and after the fixing is stabilized, the optical package can be provided at low cost, and furthermore, the problems such as generation of voids in the silver brazing portion are eliminated. Reliability is improved. Also, since the screwed portion can be arranged so as to be hidden below the lead terminal, the occupied area of the optical package is reduced,
The optical package is downsized. Further, by providing a screw hole in the screw fixing portion and fixing the optical package from below (back surface side) of the optical package, the lead terminal can be easily fixed without disturbing the optical package.

In the present invention, preferably, the screwing portion is arranged on a straight line orthogonal to a straight line connecting the optical semiconductor element and the optical fiber. This allows
By providing a screw portion on a line S2 (FIG. 1) orthogonal to a line S1 (FIG. 1) connecting the optical semiconductor element and the optical fiber,
The stress at the time of screw fixing works in the direction of the line S2, and the change in the height of the optical semiconductor element and the height of the optical fiber at the time of screw fixing can be eliminated more reliably.

In the present invention, preferably, when the width of the screwed portion in the long side direction of the base is L1 and the length of the base in the long side direction is Ln, L1 ≦ 0.
35Ln, and the center of the screwing portion is provided within a range of ± 0.45Ln in the long side direction from the center of the long side of the base.

With the above structure, as shown in FIGS. 5 and 6, when L1 ≦ 0.35Ln, the stress acting in the long side direction when the base is fixed is reduced, and the warpage in the long side direction is returned. Can be substantially eliminated. Also, as shown in FIGS. 5 and 7, by providing the center of the screwing portion within a range of ± 0.45 Ln in the long side direction from the center of the long side of the base, when the base is fixed, Can be substantially eliminated because the heights of both end portions are different and the optical axis is easily shifted.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical package according to the present invention will be described below. FIG. 1 is a plan view showing an embodiment of the optical package of the present invention, FIG. 2 is a side sectional view of the optical package, and FIG.
FIG. 3 is a front sectional view of the optical package excluding the optical semiconductor element 4 and the Peltier element 5.

In these figures, reference numeral 1 denotes a substantially rectangular base (substrate) having a mounting portion 1a on which an optical semiconductor element 4 is mounted, and 2 denotes a substrate joined to the base 1 so as to surround the mounting portion 1a. And an optical fiber fixing member 8 for fixing an optical fiber 12 coupled to the optical semiconductor element 4 to a side portion on a short side of the base 1.
And a frame provided with a lead terminal 11 for inputting a drive signal to the optical semiconductor element 4 on the long side.

Reference numeral 4 denotes an optical semiconductor device such as a semiconductor laser, a photodiode, or an LED (light emission diode). Reference numeral 5 denotes a Peltier device for cooling the optical semiconductor device 4. Reference numeral 6 denotes a Cu—W alloy or aluminum nitride sintered body. An insulating terminal member (feed-through terminal member) made of ceramics and having a lead terminal 11 and a metallized wiring layer 9 for connecting the lead terminal 11 to the optical semiconductor element 4; Reference numeral 8 denotes a cylindrical optical fiber fixing member. Reference numeral 10 denotes bonding wires for connecting the metallized wiring layer 9 to the input / output electrodes of the optical semiconductor element 4, the electrodes of the Peltier element, and the electrodes of various electronic components. Reference numeral 13 denotes a flange member having a through-hole for inserting and fixing an end of the optical fiber 12, reference numeral 14 denotes a window member made of a transparent material such as glass, and reference numeral 15 denotes an outwardly projecting portion at the center of each long side of the base 1. A screwing portion 15a is provided for fixing a screw hole or the like formed in the screwing portion.

In the present invention, the base 1 has a mounting portion 1a for mounting the optical semiconductor element 4 in the center region of the upper surface thereof. The mounting portion 1a includes the optical semiconductor element 4, the temperature sensor and the like. Various electronic components are bonded and fixed via the Peltier element 5 and the substrate 6. The base 1 is preferably made of a Cu-W alloy or the like. The Cu-W alloy has good heat dissipation properties, and has a thermal expansion coefficient similar to that of an Fe-Ni-Co alloy or ceramics used for other members. It is suitable in this respect. This Cu-W
The alloy is made of tungsten powder having an average particle size of about 10 μm.
While being pressed under a pressure of about 00 kgf / cm ² , it was fired at a temperature of about 2300 ° C. in a reducing atmosphere to obtain a porous tungsten sintered body, and then Cu heated and melted at a temperature of 1100 ° C. It is produced by impregnating a porous portion of a tungsten sintered body using a capillary phenomenon.

A box-shaped frame 2 is joined to the upper surface of the base 1 via a metal brazing material such as silver brazing so as to surround the mounting portion 1a. A terminal member 7 and an optical fiber fixing member 8 are provided through the side wall. The frame 2 has a function of forming a space for accommodating the optical semiconductor element 4 therein and supporting the insulating terminal member 7 and the optical fiber fixing member 8. This frame 2
Fe-Ni-Co alloy (Kovar) or the like
A square pipe is manufactured from a Ni-Co alloy ingot by a known drawing method, and the square pipe is cut and subjected to metal working such as a cutting method or a pressing method to form a predetermined frame shape. The frame 2 may be an insulator such as ceramics. The insulating terminal members 7 attached to the opposing side walls of the frame 2 corresponding to the long sides of the base 1 are made of alumina (Al) having excellent heat conductivity and electrical insulation.
₂ O ₃ ) It is preferable to be made of an electrically insulating material such as ceramics, and a metallized wiring layer 9 which is led out from the inside of the frame 2 to the outside and is connected to the lead terminal 11 is provided.

The insulating terminal member 7 has a function of connecting the optical semiconductor device 4, the Peltier device 5 and various electronic components housed in the optical package to an external drive circuit and the like. When the insulating terminal member 7 is made of, for example, alumina ceramics, alumina, silicon oxide (SiO ₂ ), calcium oxide (CaO), magnesium oxide (MgO)
A raw material powder such as a resin binder and a solvent are added and mixed to form a slurry, and this is formed into a sheet by a known doctor blade method or the like to produce a plurality of ceramic green sheets. Are punched, and these are laminated, and 1550
It is produced by firing at a high temperature of about ° C.

One end of the metallized wiring layer 9 formed on the insulated terminal member 7 has a bonding wire 10 connected to an electrode of the optical semiconductor element 4, an electrode of the Peltier element 5, and electrodes of various electronic components (not shown). The other end is connected to the lead terminal 11 via a metal brazing material such as silver brazing. By connecting the lead terminal 11 to an external drive circuit or the like, the optical semiconductor element 4, the Peltier element 5, and various electronic components are connected to the outside. And
The metallized wiring layer 9 is formed by firing a metal paste containing a powder of a high melting point metal such as W, Mo, Mn.
A metal paste obtained by adding an organic resin binder or a solvent to a metal powder such as a powder or a Mn powder is printed and applied in a predetermined pattern on a ceramic green sheet for the insulating terminal member 7 by a known screen printing method or the like. By baking, the insulating terminal member 7 is adhered and formed at a predetermined position.

The lead terminal 11 is made of Fe-Ni
-It is made of a metal such as a Co alloy or an Fe-Ni alloy, and serves to electrically connect the optical semiconductor element 4 to an external drive circuit or the like. The lead terminal 11 is formed in a predetermined shape by performing a punching process, an etching process, or the like on a plate material made of, for example, an Fe—Ni—Co alloy.

Further, the frame 2 corresponding to the short side of the base 1
A cylindrical optical fiber fixing member 8 for fixing the optical fiber 12 is attached to the side wall of the frame 2 so as to pass through the inside and outside of the frame 2. A flange member 13 having the end of the optical fiber 12 inserted and fixed in the through hole is joined to the outside end of the optical package of the optical fiber fixing member 8 by an adhesive, welding, or the like, so that the optical semiconductor element 4 and the optical semiconductor element 4 are connected to each other. The optical fibers 12 are optically coupled and fixed with the optical axes aligned (FIG. 2). Thus, by installing and fixing the optical fiber 12, it becomes possible to transmit the laser light oscillated by the optical semiconductor element 4 to the outside or to receive the light from the outside by the optical semiconductor element 4. The optical fiber fixing member 8 is a cylindrical member made of a metal such as an Fe-Ni-Co alloy, and a window member 14 made of a translucent material such as sapphire or glass is attached to the inner end of the optical package. The optical semiconductor element 4 and the optical fiber 1 through the window member 14.
Light is transmitted between the two.

In the present invention, a screw portion 15 integral with the base 1 is provided at the center of each long side of the substantially rectangular base 1 so as to protrude outward. Screw stop 15
Is for fixing the optical semiconductor device to an external member such as an external circuit board. A fixing portion 15a such as a notch, a through hole, or a screw hole is provided in a part thereof, and a screw is inserted into the fixing portion 15a. Then, the screwing portion 15 is screwed to the external member, and the optical semiconductor device is fixed to the external member.

In the present invention, as shown in FIG. 1, it is preferable that the screwing portion 15 is disposed on a straight line S2 orthogonal to the straight line S1 connecting the optical semiconductor element 4 and the optical fiber 12. As a result, the stress at the time of fixing by screwing works in the direction of the straight line S2, so that the warp in the long side direction of the base 1 does not return at the time of fixing, and the height of the optical semiconductor element at the time of fixing by screwing and the optical fiber Changes in height can be eliminated.

In the present invention, as shown in FIG. 5, when the width of the screwing portion 15 in the long side direction of the base 1 is L1 and the length of the base 1 in the long side direction is Ln, L1 ≦ 0. 35Ln
It is preferable that the center O1 of the screwing portion 15 is provided within a range of ± 0.45 Ln in the long side direction from the center On of the long side of the base. With this configuration, FIG.
As shown in the side view of the base 1 in (b), the stress acting in the long side direction when the base 1 is fixed can be reduced, and the phenomenon of returning the warp in the long side direction can be substantially eliminated. FIG.
(A) shows the state of the base body 1 before fixing, (b) shows the state in which the warp in the long side direction has returned after fixing (arrows in the figure), and 16 in the figure shows the surface of the external member. It is. More preferably, 0.1Ln ≦ L1, and in this case, the base 1 can be securely fixed.

As shown in the side views of the base 1 in FIGS. 7A and 7B, the center O1 of the screwed portion 15 is ± 0.45Ln from the center On of the long side of the base in the long side direction. By providing it within the range, when the base 1 is fixed, the disadvantage that the heights of both ends in the long side direction are different and the optical axis is easily shifted can be substantially eliminated. 7A shows a state of the base 1 before fixing, and FIG. 7B shows a state where the heights of both ends in the long side direction of the base 1 after fixing are different (arrows in the figure). More preferably, the center O1 of the screwing portion 15 is ± 0.25L from the center On of the long side of the base in the long side direction.
n, more preferably within the range of ± 0.10 Ln. In this case, the pair of screwing portions 15 provided on each long side of the base 1 may be within the above range, and may not be arranged on the straight line S2. That is,
They may be arranged on a line inclined with respect to the line S2.

Further, as another embodiment of the present invention, the screwed portion 15 is made thinner than the base 1 or the screwed portion 1 is made thinner.
By forming a groove in the long side direction at the base on the side of the base 1 of 5, the stress at the time of screwing can be reduced. Further, the screwed portion 15 may be separately made of a material having a low Young's modulus and may be joined to the base 1 by brazing or the like. In this case, the stress at the time of screwing can be reduced. Fixing part 15a of screwing part 15
If a screw hole is provided by cutting a screw,
It is preferable to make a groove rather than making it thinner. In this case, the optical package can be firmly fixed by sufficiently forming the screw thread, and the spread of the brazing material when the frame 2 and the base 1 are brazed. It is suppressed and the threads are not filled with brazing material.

As a further embodiment of the present invention, as shown in FIG.
Preferably, a is curved so as to bypass the screwing portion 15, and in this case, screwing from above the optical package can be performed very easily.

Thus, according to the present invention, the downwardly convex warpage generated in the direction connecting the optical semiconductor element and the optical fiber is not returned by screwing, and the height and optical height of the optical semiconductor element at the time of screwing are fixed. Since the height of the fiber does not change, the position alignment between the optical semiconductor element and the optical fiber by screwing and fixing is not disturbed. In addition, since the screw fixing position is near the optical semiconductor element, the difference in height between the optical semiconductor element and the screw fixing part is smaller than that of the conventional optical package. The misalignment of the position alignment of the fiber can be reduced.

The present invention is not limited to the above embodiment,
Various changes may be made without departing from the scope of the present invention.

[0035]

According to the present invention, a screwing portion is provided at the center of each long side of the base so as to protrude outward, so that the screwing is performed in a direction orthogonal to the direction connecting the optical semiconductor element and the optical fiber. A portion is provided, and the stress at the time of screw fixing works in the orthogonal direction, so that the warping of the base in the orthogonal direction is corrected by the stress at the time of screw fixing, but connects the optical semiconductor element and the optical fiber. The downward convex warpage generated in the direction is not returned by screwing and fixing. Therefore, since the height of the optical semiconductor element and the height of the optical fiber do not change at the time of screw fixing, the positional alignment between the optical semiconductor element and the optical fiber by the screw fixing does not change. Further, in the present invention, since the screw fixing position is near the optical semiconductor element, the difference in height between the optical semiconductor element and the screw fixing part is smaller than that of the conventional optical package. Therefore, when screwing is performed, it is possible to reduce the deviation of the position alignment between the optical semiconductor element and the optical fiber.

In addition, since the alignment of the optical semiconductor element and the optical fiber at the time of fixing by screwing is not disturbed, the screwing portion can be integrated with the base, thereby reducing the number of parts and brazing silver. Such assembling steps are also reduced. Therefore, the position accuracy of the screwed portion is improved, the position of the optical package at the time of fixing and after the fixing is stabilized, the optical package can be provided at low cost, and furthermore, the problems such as generation of voids in the silver brazing portion are eliminated. Reliability is improved. Also, since the screwed portion can be arranged so as to be hidden below the lead terminal, the occupied area of the optical package is reduced,
The optical package is downsized. Further, by providing a screw hole in the screw fixing portion and fixing the optical package from below (back surface side) of the optical package, the lead terminal can be easily fixed without disturbing the optical package.

Further, according to the present invention, the screwed portion can be arranged on a straight line orthogonal to the straight line connecting the optical semiconductor element and the optical fiber, so that the stress at the time of screwing fixed works in the direction of the orthogonal straight line. In addition, changes in the height of the optical semiconductor element and the height of the optical fiber when screwing and fixing can be eliminated more reliably.

Further, according to the present invention, when the width of the screwing portion in the long side direction of the base is L1, and the length of the base in the long side direction is Ln, L1 ≦ 0.35Ln, and the center of the screwing portion is ± 0.45 Ln in the long side direction from the center of the long side of the base
This can reduce the stress acting in the long-side direction when the base is fixed, thereby substantially eliminating the phenomenon of returning the warp in the long-side direction. In addition, it is possible to substantially eliminate the disadvantage that the heights of both ends in the long side direction are different and the optical axis is easily shifted.

[Brief description of the drawings]

FIG. 1 is a plan view of an optical package according to the present invention without a cover.

FIG. 2 is a side sectional view of the optical package of the present invention.

FIG. 3 is a front sectional view of the optical package of the present invention, from which an optical semiconductor element and a Peltier element are removed.

4A and 4B show a conventional optical package, wherein FIG. 4A is a perspective view of the optical package without a cover, and FIG. 4B is a plan view of a base and a frame portion in FIG.

FIG. 5 is a plan view of a base portion of the optical package of the present invention.

FIG. 6A is a side view of the base before fixing, and FIG. 6B is a side view showing a state in which the warpage of the base has returned after fixing.

FIG. 7A is a side view of the base before fixing, and FIG. 7B is a side view showing a state where the heights of both ends in the long side direction of the base have changed after fixing.

FIG. 8 is a plan view showing another embodiment of the present invention, in which a lead terminal adjacent to a screw portion is curved so as to bypass the screw portion.

[Explanation of symbols]

 1: base 1a: mounting section 2: frame 4: optical semiconductor element 5: Peltier element 7: insulating terminal member 8: optical fiber fixing member 11: lead terminal 12: optical fiber 15: screw fixing section 15a: fixing section

Claims (3)

[Claims] An optical semiconductor device having a mounting portion on which an optical semiconductor element is mounted; and a base which is joined to the substrate so as to surround the mounting portion, and the optical semiconductor device and the optical device are formed on a side portion. A frame member provided with an optical fiber fixing member for fixing an optical fiber to be optically coupled and a lead terminal for inputting a drive signal to the optical semiconductor element on another side, and a center of each long side of the base. A package for storing an optical semiconductor element, wherein a screwing portion is provided so as to protrude outward from the portion. 2. The optical semiconductor element housing package according to claim 1, wherein said screwing portion is arranged on a straight line orthogonal to a straight line connecting said optical semiconductor element and said optical fiber. 3. When the width of the screwing portion in the long side direction of the base is L1 and the length of the base in the long side direction is Ln, L1 ≦ 0.35Ln, and The center is ±± from the center of the long side of the substrate in the long side direction.
3. The package for housing an optical semiconductor element according to claim 1, wherein the package is provided within a range of 0.45 Ln.