JP3176334B2 - Package for storing optical semiconductor element and method for manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device housing package for housing an optical semiconductor device, and more particularly to an optical semiconductor device having an improved terminal portion for connecting electrodes of a thermoelectric cooling device on which the optical semiconductor device is mounted. The present invention relates to an element storage package.

[0002]

2. Description of the Related Art Conventionally, as shown in a sectional view of FIG. 5 and an exploded perspective view of FIG. And a flat substrate 21 having a mounting portion 21a on the center of the upper surface of which the optical semiconductor element 30 is mounted via a Peltier element 31 as a thermoelectric cooling element, and a metal such as an iron-nickel-cobalt alloy. And an optical fiber fixing member 22 for fixing the optical fiber 32 to the side wall, which is joined to the upper surface of the base 21 so as to surround the mounting portion 21a.
And a side wall member 23 having a notch 23a and a ceramic such as an aluminum oxide sintered body.
And a ceramic terminal portion 25 on which a number of metallized wiring layers 24 are formed and adhered to the inside and outside of the side wall member 23. A sealing ring 26 made of metal and joined to the upper surfaces of the side wall member 23 and the ceramic terminal portion 25; and a sealing ring 26 made of metal such as an iron-nickel-cobalt alloy.
And a metallized wiring layer 24 made of a metal such as an iron-nickel alloy.
And an external lead terminal 28 attached to a portion outside the side wall member 23 through a brazing material such as silver brazing.
An optical semiconductor device 30 is placed between the mounting portion 21a of the Peltier device 31
The electrodes of the optical semiconductor element 30 are electrically connected to the metallized wiring layer 24 of the ceramic terminal section 25 via bonding wires 33, and then the sealing ring
A lid 27 is attached to the upper surface of 26 by welding or the like, and the base 21, the side wall member 23, the ceramic terminal portion 25, the sealing ring 26, and the lid 27
The optical semiconductor element 30 is accommodated in a container consisting of
The optical semiconductor device as a product is obtained by fixing the optical fiber 32 to the side wall member 23 by joining the 32 by welding or an adhesive.

Such an optical semiconductor device is used for high-speed optical communication and the like by exciting light to an optical semiconductor element 30 by an electric signal supplied from an external electric circuit and transmitting the light to the outside via an optical fiber 32. Function as an optical semiconductor device.

In this optical semiconductor device, a Peltier element 31 is disposed between the optical semiconductor element 30 and the base 21 in order to radiate heat generated during operation of the optical semiconductor element 30 to the outside. The lead wire 34 connected to the electrode of the Peltier element 31 is connected to the metallized wiring layer 24 of the ceramic terminal 25.
To the external lead terminals 28,
Power is supplied to the Peltier element 31 from the outside via the metallization wiring layer 24 and the lead wire 34, and the Peltier element 31 is operated as a heat pump for transferring heat from the optical semiconductor element 30 to the base 21, and the optical semiconductor element 30 is operated. The generated heat is forcibly transmitted to the base 21 via the Peltier element 31 and is radiated from the base 21 to the atmosphere, so that the temperature of the optical semiconductor element 30 is always constant, so that the optical semiconductor element 30 always operates stably. I am trying to do it.

[0005]

However, according to the conventional optical semiconductor element housing package, the size of the metallized wiring layer 24 formed on the ceramic terminal portion 25 has been increased due to recent miniaturization of the optical semiconductor device. The interval is, for example, about 1 mm
Since the following narrowing and the work of soldering the lead wire 34 connected to the electrode of the Peltier element 31 to the metallized wiring layer 24 of the ceramic terminal section 25 are generally performed manually, When soldering the lead wire 34 connected to the electrode of the element 31 to the metallized wiring layer 24 of the ceramic terminal part 25, a part of the solder pool formed between the metallized wiring layer 24 and the lead wire 34 works. Contact with the adjacent metallized wiring layer 24 due to excessive solder or the like due to the variation causes a solder bridge, and as a result,
The metallized wiring layer 24 to which the lead wire 34 connected to the electrode of the Peltier element 31 is soldered and the metallized wiring layer 24 adjacent thereto are electrically short-circuited by a solder bridge, and the Peltier element 31 and the inside are There is a problem that it becomes impossible to normally operate the optical semiconductor element 30 to be housed.

The lead wire 34 connected to the electrode of the Peltier element 31 is connected to the metallized wiring layer 24 of the ceramic terminal 25.
It is also conceivable to prevent a short circuit between adjacent metallized wiring layers 24 by a solder bridge by welding with a welding method such as a spot welding method, but generally, a metallized layer adhered to the surface of the ceramic terminal portion 25 is considered. It is difficult to weld the lead wire 34 to the wiring layer 24 by spot welding or the like.

The present invention has been devised in view of the above-mentioned problems, and a lead wire connected to an electrode of a thermoelectric cooling element such as a Peltier element is connected to a metallized wiring layer of a ceramic terminal portion and an adjacent metallized wiring layer. And an optical semiconductor element housing package capable of always operating normally the thermoelectric cooling element and the optical semiconductor element housed therein, and an optical semiconductor element housing package therefor. It is intended to provide a manufacturing method .

[0008]

According to the present invention, there is provided a package for storing an optical semiconductor element, wherein the optical semiconductor element has a mounting portion on the center of the upper surface via a thermoelectric cooling element, and a top surface of the base. The frame-shaped side wall member made of metal joined so as to surround the mounting portion, and the electrode of the thermoelectric cooling element has a lead wire at a portion penetrating the side wall member and located inside the side wall member. An optical semiconductor element housing package comprising: a ceramic terminal portion having a metallized wiring layer electrically connected to the package via a metallized wiring layer; and a lid bonded to an upper surface of the side wall member. A metal terminal to which a lead wire is connected is brazed by projecting one end of the metal terminal from the ceramic terminal portion to the inside of the side wall member. In addition, the method for manufacturing an optical semiconductor element housing package of the present invention includes a base having a mounting portion on which an optical semiconductor element is mounted via a thermoelectric cooling element at a central portion of an upper surface, a frame-shaped metal and a side wall. A side wall member provided with a notch portion, a ceramic terminal portion having a metallized wiring layer penetrating the side wall member, joined to the notch portion of the side wall member, and a ceramic terminal portion located outside the side wall member of the metallized wiring layer A lead frame in which an external lead terminal joined to a portion and a metal terminal joined to a portion located inside and connected to the electrode of the thermoelectric cooling element via a lead wire are integrally connected by a support frame. And after joining the external lead terminal and the metal terminal of the lead frame to the corresponding metallized wiring layer of the ceramic terminal portion,
The support frame is cut from the external lead terminal and the metal terminal so that the external lead terminal projects outward from the ceramic terminal portion and the metal terminal projects inward. A step of electrically isolating the terminals and a step of joining the frame body so as to surround the mounting portion on the upper surface of the base, and a step of joining the ceramic terminal section to the notch of the frame body. It is characterized by having.

According to the package for housing an optical semiconductor element of the present invention, one end of the metal terminal to which the lead wire is joined is connected to the metallized wiring layer to which the electrode of the thermoelectric cooling element is electrically connected via the lead wire. Since the brazing is made to protrude from the ceramic terminal portion to the inside of the side wall member, a lead wire can be easily connected to the metal terminal by welding.

Further, according to the package for housing an optical semiconductor element of the present invention, one end of the metal terminal brazed to the metallized wiring layer to which the electrode of the thermoelectric cooling element is connected projects from the ceramic terminal portion to the inside of the side wall member. Therefore, if the lead wire is welded to the protruding portion of the metal terminal, a large amount of heat of the welding is not absorbed by the ceramic terminal portion, so that the lead wire is efficiently welded to the metal terminal in a short time. be able to.

If a lead wire is soldered to the protruding portion of the metal terminal, a solder pool is formed between the protruding portion of the metal terminal and the lead wire even if there is an excessive amount of solder. Therefore, a lead wire can be connected without generating a solder bridge between adjacent metallized wiring layers and causing a short circuit.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a package for housing an optical semiconductor device according to the present invention.

FIGS. 1 and 2 are a cross-sectional view and an exploded perspective view, respectively, showing an embodiment of the package for housing an optical semiconductor element according to the present invention. Is a lid. These base 1 and frame 2
The lid 3 constitutes a container for housing the optical semiconductor element 4 and a thermoelectric cooling element 5 such as a Peltier element.

The substrate 1 is a substantially rectangular flat plate made of a metal such as a copper-tungsten alloy or an iron-nickel-cobalt alloy or a ceramic such as an aluminum nitride sintered body or an aluminum oxide sintered body. The mounting portion 1a has a mounting portion 1a on which the optical semiconductor device 4 is mounted. The optical semiconductor device 4 is provided on the mounting portion 1a with a thermoelectric cooling element 5 interposed therebetween, such as a gold-silicon brazing material. Adhesively fixed.

When the substrate 1 is made of, for example, a copper-tungsten alloy, tungsten powder (particle size: about 10 μm) is
It is pressed at a pressure of kgf / cm ² and calcined in a reducing atmosphere at a temperature of about 2300 ° C. to obtain a porous tungsten sintered body. It is manufactured by impregnating a porous portion of a tungsten sintered body using a capillary phenomenon. On the upper surface of the base 1, a side wall member 6 made of a metal such as an iron-nickel-cobalt alloy and an aluminum oxide sintered body or an aluminum nitride sintered body are provided so as to surround the mounting portion 1a. A frame body 2 composed of a ceramic terminal portion 7 made of ceramics and a sealing ring 8 made of a metal such as an iron-nickel-cobalt alloy is attached. A space for accommodating the thermoelectric cooling element 5 is formed.

In the frame 2, the side wall member 6, the ceramic terminal portion 7, and the sealing ring 8 are joined to each other via a brazing material such as silver brazing. It is attached to the base 1 by being joined via a material.

The side wall member 6 is a substantially rectangular frame-like body shorter than the base 1 when viewed from above, and functions to support the ceramic terminal portion 3 and an optical fiber fixing member 9 described later.

When the side wall member 6 is made of, for example, an iron-nickel-cobalt alloy, it is formed in a predetermined frame shape by subjecting an ingot of the iron-nickel-cobalt alloy to a conventionally known metal working.

On one short side wall of the side wall member 6, an optical fiber fixing member 9 through which an optical fiber 10 for transmitting and receiving an optical signal to and from an optical semiconductor element 4 housed therein is inserted and fixed. It is attached via a brazing material such as silver brazing.

The optical fiber fixing member 9 is a substantially cylindrical body made of a metal such as an iron-nickel-cobalt alloy.
An inner end of the side wall member 6 is closed with a window member 11 made of a light-transmitting material such as sapphire or glass, and an optical fiber 10 is inserted and fixed from the outer end.

The optical fiber 10 has a metal flange 10a attached to its end in advance, and a metal flange 10a.
The optical signal 10a is fixed to the side wall member 6 by welding the optical fiber 10a to the optical fiber fixing member 9 using, for example, a laser welding method. Transfer is possible.

The side wall member 6 is provided with notches 6a on the upper surfaces of both long side walls, respectively. In these notches 6a, the ceramic terminal portions 7 are provided with a brazing material such as silver brazing material. Are joined through.

The ceramic terminal portion 7 is made of a ceramic such as an aluminum oxide sintered body as shown in FIG.
And a plurality of metallized wiring layers for electrically connecting the inside and outside of the frame 2 from the upper surface of the protrusion 7a to the protrusion 7b. 12 is formed so as to penetrate the frame body 2, and is further provided on the upper and lower surfaces and side surfaces of the ceramic terminal portion 7 for joining the ceramic terminal portion 7 to the side wall member 6 and the sealing ring 8. A metallized metal layer 13 serving as a metal is formed by deposition.

The ceramic terminal portion 7 functions as a part of the frame 2 to airtightly partition the inside and the outside of the side wall member 6 and to provide a conductive path connecting the inside and the outside of the frame 2. Each electrode of the optical semiconductor element 4 is electrically connected to a portion attached to the portion 7a via a bonding wire 14, and a lead wire 15 connected to an electrode of the thermoelectric cooling element 5 is electrically connected. An external lead terminal 16 for connection to an external electric circuit is attached to a portion of the metallized wiring layer 12 which is attached to the protruding portion 7b via a brazing material such as silver brazing.

When the ceramic terminal portion 7 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a plasticizer, a dispersant, a solvent, and the like are added to the raw material powder such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide. A plurality of ceramic green sheets are obtained by adding and mixing to form a slurry and forming a sheet by employing a conventionally known doctor blade method, and thereafter, these ceramic green sheets are appropriately punched. Apply and paste the metal paste to be the metallized wiring layer 12 by printing and laminating. Finally, print and apply the metal paste to be the metallized metal layer 13 to this laminate and bake it at a temperature of about 1600 ° C. in a reducing atmosphere. Produced by

The metal paste to be the metallized wiring layer 12 and the metallized metal layer 13 is obtained by adding a suitable organic binder or a solvent to a high melting point metal powder such as tungsten, molybdenum, manganese or the like and mixing it to form a paste. The ceramic green sheet and its laminate are printed and applied by printing using a conventionally known screen printing method.

Further, the ceramic terminal portion 7 is provided with an iron-nickel-cobalt alloy or an iron-nickel-cobalt alloy at a portion on the protruding portion 7a of the metallized wiring layer 12 to which the lead wire 15 connected to the electrode of the thermoelectric cooling element 5 is connected. A metal terminal 17 made of a metal such as a nickel alloy is joined via a brazing material such as silver solder so that one end of the metal terminal 17 projects inward from the ceramic terminal portion 7. The metal terminal 17 serves as a base metal member for connecting the lead wire 15 connected to the electrode of the thermoelectric cooling element 5 to the metallized wiring layer 12, and the lead wire is provided at a portion of the metal terminal 17 projecting from the ceramic terminal portion 7. By welding or soldering 15, the lead wire 15 is electrically connected to the metallized metal layer 12.

Since the metal terminal 17 is made of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, the lead wire 15 can be easily welded to the metal terminal 17. If welded to 17, lead wire 15
Can be electrically connected to the metallized wiring layer 12 without causing a short circuit between the metallized wiring layer 12 and the adjacent metallized wiring layer 12. Also, by welding the lead wire 15 to a portion of the metal terminal 17 projecting from the ceramic terminal portion 7, a large amount of welding heat can be effectively prevented from being absorbed by the ceramic terminal portion 7. 17 can be welded efficiently in a short time. Further, when the lead wire 15 is soldered to a portion of the metal terminal 17 protruding from the ceramic terminal portion 7, even if there is an excessive amount of solder, the solder puddle is formed between the portion of the metal terminal 17 protruding from the ceramic terminal portion 7 and the lead wire. Since this is formed between the metallization wiring layer 15 and the metallization wiring layer 12, the pool does not come into contact with the adjacent metallized wiring layer 12 to cause an electrical short circuit.

If the metal terminal 17 is formed of the same material as that of the external lead terminal 16, the external lead terminal 16 will be described later.
When the metal terminal 17 is brazed to the metallized wiring layer 12 of the ceramic terminal portion 7, the metal terminal 17 can be brazed to the metallized wiring layer 12 at the same time.
Is preferably formed of the same material as the external lead terminal 16.

One end of the metal terminal 17 protruding from the ceramic terminal portion 7 protrudes upward or downward in addition to the direction parallel to the metallized wiring layer 14 as shown in FIGS. Alternatively, it may be bent right and left, and the direction may be appropriately set according to the specifications of the optical semiconductor device.

The metallized wiring layer 12 of the ceramic terminal 7
External lead terminal 16 attached to the portion on the protrusion 7b
Is made of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, and serves to connect the optical semiconductor element 4 and the thermoelectric cooling element 5 housed therein to an external electric circuit,
By electrically connecting the external lead terminals 16 to the wiring conductors of the external electric circuit, the optical semiconductor element 4 and the thermoelectric cooling element 5 housed inside are electrically connected to the external electric circuit.

The metal terminal 17 and the external lead terminal 16
In order to braze the metallized wiring layer 12 of the ceramic terminal portion 7, as shown in the top view of FIG. 4, a plurality of external lead terminals 16 and metal terminals 17 are integrally connected by a support frame 18. While preparing the frame A, the external lead terminals 16 and the metal terminals 17 of the lead frame A are prepared.
Is brazed to the corresponding metallized wiring layer 12 of the ceramic terminal portion 7 via a brazing material such as silver brazing. Thereafter, the lead frame A is cut at a portion indicated by a broken line, and the external lead terminals 16 and the metal terminals 17 are cut. Is preferably employed.

A frame-shaped sealing ring 8 made of a metal such as an iron-nickel-cobalt alloy is joined to the upper surface of the side wall member 6 and the upper surface of the ceramic terminal portion 7 via a brazing material such as silver brazing. I have.

The sealing ring 8 acts as a base metal for welding the lid 3 to the frame 2, and the lid 3 is provided on the upper surface with a welding method such as seam welding or a brazing material such as silver solder. It is joined by an intermediate brazing method.

The lid 3 joined to the upper surface of the sealing ring 8
Is a substantially rectangular flat plate made of a metal such as an iron-nickel-cobalt alloy. The lid 3 is joined to a sealing ring 8 to form a container comprising the base 1, the frame 2 and the lid 3. The optical semiconductor element 4 and the thermoelectric cooling element 5 are hermetically sealed inside.

Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 4 is bonded and fixed to the mounting portion 1a of the base 1 with the thermoelectric cooling element 6 interposed therebetween. The lead wire 15 connected to the electrode 6 is joined to the metal terminal 17 by welding or soldering, and each electrode of the optical semiconductor element 4 is connected to the metallized wiring layer 12 via the bonding wire 14. The optical semiconductor element 4 and the thermoelectric cooling element 5 are hermetically accommodated in a container composed of the base 1, the frame 2 and the lid 3, and finally the optical fiber fixing member 9 Fiber 10
By fixing the optical semiconductor device, an optical semiconductor device as a final product capable of transmitting and receiving an optical signal between the optical semiconductor element 4 housed therein through the optical fiber 10 and the outside is obtained.

The package for housing an optical semiconductor element of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the frame 2 is formed of the side wall member 6 made of metal, the ceramic terminal portion 7 and the sealing ring 8 made of metal. It may be formed of ceramics integrally formed at the same time as the terminal portion 7, and in this case, the frame 2 need not have the sealing ring 8 made of metal.

[0038]

According to the package for housing an optical semiconductor element of the present invention, the lead wire is joined to the metallized wiring layer of the ceramic terminal portion to which the electrode of the thermoelectric cooling element is electrically connected via the lead wire. Since the metal terminal is brazed with one end protruding from the ceramic terminal portion to the inside of the side wall member, by connecting a lead wire to this metal terminal, welding can be performed without causing a short circuit between adjacent metallized wiring layers. Alternatively, they can be easily connected by solder or the like, and as a result, the thermoelectric cooling element and the optical semiconductor element housed therein can always be operated normally and stably.

Further, according to the optical semiconductor element housing package of the present invention, one end of the metal terminal brazed to the metallized wiring layer to which the electrode of the thermoelectric cooling element is connected projects from the ceramic terminal portion to the inside of the side wall member. Therefore, if the lead wire is welded to the protruding part of the metal terminal, the heat of welding will not be absorbed in a large amount by the ceramic terminal part, so the lead wire can be efficiently welded to the metal terminal in a short time. can do. Also, if a lead wire is soldered to the protruding portion of the metal terminal, even if there is an excessive amount of solder, a pool of solder is formed between the protruding portion of the metal terminal and the lead wire. It is also possible to solder the lead wires without generating a solder bridge between the metallized wiring layers to be short-circuited.

According to the method of manufacturing an optical semiconductor element housing package of the present invention, when the external lead terminal is joined to the metallized wiring layer of the ceramic terminal portion, the metal terminal is joined to the metallized wiring layer at the same time. It becomes possible. As described above, according to the present invention, the lead wire connected to the electrode of the thermoelectric cooling element is connected to the metallized wiring layer of the ceramic terminal portion without causing an electrical short circuit between the metallized wiring layer and the adjacent metallized wiring layer. As a result, it was possible to provide an optical semiconductor element housing package capable of constantly operating the thermoelectric cooling element and the optical semiconductor element housed therein, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of an optical semiconductor element housing package of the present invention.

FIG. 2 is an exploded perspective view of the optical semiconductor element housing package shown in FIG.

FIG. 3 is a perspective view of an essential part of the package for housing an optical semiconductor element shown in FIG. 1;

FIG. 4 is a top view for explaining the method for manufacturing the optical semiconductor element housing package shown in FIG.

FIG. 5 is a sectional view of a conventional package for housing an optical semiconductor element.

FIG. 6 is an exploded perspective view of the conventional optical semiconductor element housing package shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Placement part 2 ... Frame 3 ... Lid 4 ... Optical semiconductor element 5 ... Thermoelectric cooling element 7 ... Ceramic terminal part 12 ... Metallization Wiring layer 15: Lead wire 17: Metal terminal

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) H01L 23/38 H01L 23/02 H01S 5/022 H01S 5/024

Claims (2)

(57) [Claims] 1. A base having a mounting portion on which an optical semiconductor element is mounted via a thermoelectric cooling element at a central portion of an upper surface, and a metal joined to the upper surface of the base so as to surround the mounting portion. A ceramic terminal having a frame-shaped side wall member made of: and a metallized wiring layer through which the electrode of the thermoelectric cooling element is electrically connected via a lead wire at a position located inside the side wall member and parts, wherein an optical semiconductor element storage package comprising a lid body that is joined to the upper surface of the side wall member, the metallized wiring layer, the Li
An optical semiconductor element housing package, wherein a metal terminal to which a lead wire is connected is brazed by projecting one end of the metal terminal from the ceramic terminal portion to the inside of the side wall member . 2. A base having a mounting portion on which an optical semiconductor element is mounted via a thermoelectric cooling element at a central portion of an upper surface, a side wall member made of a frame-shaped metal and having a cutout formed on a side wall, and the side wall. A ceramic terminal portion having a metallized wiring layer penetrating the side wall member joined to the notch portion of the member, and an external lead terminal joined to a portion of the metallized wiring layer located outside the side wall member and an inner side. The electrode of the thermoelectric cooling element to be joined to the site located
A step of preparing a lead frame in which the metal terminals to be connected are integrally connected by a support frame; and connecting the external lead terminals and the metal terminals of the lead frame to the corresponding metallized wiring layers of the ceramic terminal portion. After joining, the external lead terminal is
Metal terminal protrudes outward from the jack terminal
To manner, the external lead terminals and the metal terminals by cutting the support frame body from each of said outer lead terminals, and
A step of Ru electrically made independent of the metal terminal, thereby bonding the frame body so as to surround the mounting portion on the upper surface of the substrate, bonding the ceramic terminal portion to the cutout portion of the frame body And a method for manufacturing a package for housing an optical semiconductor element.